CN209435093U - Power supply - Google Patents
Power supply Download PDFInfo
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- CN209435093U CN209435093U CN201920141244.XU CN201920141244U CN209435093U CN 209435093 U CN209435093 U CN 209435093U CN 201920141244 U CN201920141244 U CN 201920141244U CN 209435093 U CN209435093 U CN 209435093U
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- Prior art keywords
- power supply
- installation
- power
- die cast
- pinboard
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Abstract
The utility model discloses a kind of power supply, and the power supply includes die cast, the first power panel, installation pinboard；The outer surface of the die cast is equipped with the radiation tooth for matching second source plate heat dissipation capacity, and the inside of the die cast is equipped with the second installation hole location for installing second source plate；The installation pinboard is fixedly connected by the second installation hole location with the die cast, and the first installation hole location for installing the first power panel is additionally provided on the installation pinboard；First power panel is mounted on the installation pinboard by the first installation hole location；Heat-conducting silicone grease or thermally conductive silicon wafer are coated between first power panel and installation pinboard；Encapsulating has power supply casting glue on the heat-generating electronic elements of first power panel.The utility model has the effect of not redesigning shell to be suitable for more powerful power supply.
Description
Technical field
The utility model relates to power technique fields, in particular to a kind of power supply.
Background technique
Power supply is commonly used in receiving alternating current, and after conversion, the electric energy of specification needed for exporting external equipment.Due to
During electric energy converts, power supply can generate thermal energy, and therefore, power supply usually requires the structure of increase heat dissipation to radiate.Example
Rough structure such as is set on the surface of shell, increases surface area, such as radiation tooth.
In general, the heat dissipation effect in order to guarantee power supply, needs to carry out heat dissipation matching.Such as the shell of the power supply of 1500W
Body needs to design N number of radiation tooth, and the shell of the power supply of 3000W needs to design M radiation tooth.Wherein, usually above-mentioned N will be less than
M, so that the heat dissipation performance of the shell of the power supply of 3000W is more preferable.
But at present since the shell of power supply is usually die cast, then when early period devises low power shell, if
Need more powerful power supply, then before the shell of smaller power will be unable to using and needing to redesign shell to be suitable for
The more powerful power supply.Longer so as to cause new product release timeliness, required new resources are more.
Utility model content
The main purpose of the utility model is to provide a kind of power supply, it is intended to which it is more high-power to be suitable for not redesign shell
Power supply.
To achieve the above object, the utility model proposes a kind of power supply, which is characterized in that the power supply includes compression casting shell
Body, the first power panel, installation pinboard；
The outer surface of the die cast is equipped with the radiation tooth for matching second source plate heat dissipation capacity, the die cast
Inside be equipped with for install second source plate second installation hole location；
The installation pinboard is fixedly connected by the second installation hole location with the die cast, and the installation
The first installation hole location for installing the first power panel is additionally provided on pinboard；
First power panel is mounted on the installation pinboard by the first installation hole location；
Heat-conducting silicone grease or thermally conductive silicon wafer are coated between first power panel and installation pinboard；
Encapsulating has power supply casting glue on the heat-generating electronic elements of first power panel.
Optionally, the die cast uses aluminum material.
Optionally, the power of the second source plate is 1500W, and the power of first power panel is 3000W.
Optionally, the efficiency of first power panel is more than or equal to 95%, and heat consumption is less than 150W.
Optionally, the heat-conducting silicone grease or thermally conductive silicon wafer are more than or equal to 5.0 material using thermal coefficient.
Optionally, the material of the installation pinboard is red copper.
Power supply provided by the utility model enables the first power panel to be mounted on for installing by installing pinboard
In the die cast of second source plate.And pass through setting heat-conducting silicone grease or thermally conductive silicon wafer, and the fever to the first power panel
Element carries out encapsulating, so as to enhance heat dissipation.So that being used for the die cast of second source plate, the first power supply can be suitable for
Plate, so as to obtain the power supply for being suitable for the first power panel on the basis of not redesigning shell.To reduce new product
Timeliness is listed, the demand of new resources is reduced.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of the utility model power supply；
Fig. 2 is structural schematic diagram of the power supply shown in FIG. 1 at another visual angle.
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only used for explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being related to " first ", " second " etc. in the present invention is used for description purposes only, and cannot understand
For its relative importance of indication or suggestion or implicitly indicate the quantity of indicated technical characteristic.Define as a result, " first ",
The feature of " second " can explicitly or implicitly include at least one of the features.In addition, the technical side between each embodiment
Case can be combined with each other, but must be based on can be realized by those of ordinary skill in the art, when the combination of technical solution
Conflicting or cannot achieve when occur will be understood that the combination of this technical solution is not present, also not in the requires of the utility model
Protection scope within.
Embodiment one
Present embodiments provide a kind of power supply.
Incorporated by reference to referring to Fig. 1 and Fig. 2, in the present embodiment, the power supply includes die cast 100, the first power panel
200, pinboard 300 is installed.Wherein, die cast 100 is for providing fixed installation site, provides installation space, in protection
Portion's component.First power panel 200 is for receiving external alternating current, after conversion, the electric energy of specification needed for exporting external equipment.
The installation hole location for installing pinboard 300 including two specifications, for being connected respectively at die cast 100, and with the first power supply
Plate 200 connects.
In the present embodiment, the outer surface of the die cast 100 is equipped with for matching dissipating for second source plate heat dissipation capacity
Hot tooth 110, the inside of the die cast 100 are equipped with the second installation hole location (not shown) for installing second source plate.Its
In, matched radiation tooth 110 is second source plate heat dissipation capacity.In the present embodiment, the power of second source plate is less than the first electricity
The power of source plate, then the heat dissipation capacity demand of second source plate is again smaller than the first power panel.Therefore, the radiation tooth in the present embodiment
110 can be satisfied the radiating requirements of second source plate, but the heat dissipation that radiation tooth 110 is not able to satisfy the first power panel needs
It asks, such as the length of radiation tooth 110 is inadequate.But since radiation tooth 110 is integrally formed with die cast 100, if desired
Modification, then need to modify the manufacture mold of die cast 100, the low efficiency of the modification, and not resilient.Therefore, the modification
Low efficiency, it is at high cost.
In the present embodiment, the installation pinboard 300 is solid by the second installation hole location and the die cast 100
Fixed connection, and the first installation hole location being additionally provided on the installation pinboard 300 for installing the first power panel 200 (is not shown
Out).Wherein, the installation material of pinboard 300 itself can select the higher material of radiating efficiency, so as to enhance heat transfer
Property, the thermal energy for accelerating the first power panel 200 is transferred in die cast 100.
In the present embodiment, first power panel 200 is mounted on the installation pinboard 300 by the first installation hole location
On.
In the present embodiment, heat-conducting silicone grease or thermally conductive is coated between first power panel 200 and installation pinboard 300
Silicon wafer (not shown).Wherein, heat-conducting silicone grease or thermally conductive silicon wafer can be filled between the first power panel and installation pinboard 300
In gap, to increase contact area, and heat transfer efficiency is improved.
In the present embodiment, encapsulating has power supply casting glue on the heat-generating electronic elements of first power panel 200.Wherein,
The part of the first power panel 200 is subjected to encapsulating processing using power supply casting glue, seals all heaters of the first power panel 200
Part enables power supply to generate heat consumption and is evenly distributed, and sufficiently spreads apart, and heat dissipation effect is greatly enhanced.
Power supply provided by the present embodiment enables the first power panel 200 to be mounted on and is used for by installation pinboard 300
In the die cast 100 for installing second source plate.And by setting heat-conducting silicone grease or thermally conductive silicon wafer, and to the first power panel
200 heater element carries out encapsulating, so as to enhance heat dissipation.So that being used for the die cast 100, Neng Goushi of second source plate
For the first power panel 200, so as to obtain the electricity for being suitable for the first power panel 200 on the basis of not redesigning shell
Source.To reduce new product release timeliness, the demand of new resources is reduced.
Further, in the present embodiment, the die cast 100 uses aluminum material.In the present embodiment, pass through setting
Die cast 100 is aluminum material, so that power supply has lower weight, and has preferable heat conduction efficiency.
Further, in the present embodiment, the power of the second source plate is 1500W, first power panel 200
Power is 3000W.I.e. in the present embodiment, die cast 100 designs molding according to the radiating requirements of 1500W power supply, and heat dissipation is set
Meter amount of redundancy is not enough to cope with the demand of the first power panel 200.
Further, in the present embodiment, the efficiency of first power panel 200 is more than or equal to 95%, and heat consumption is less than
150W.Wherein, in the present embodiment, by improving the efficiency of the first power panel 200, so as to reduce the first power panel 200
Heat condition.And then reduce the radiating requirements of the first power panel 200.
Further, in the present embodiment, the heat-conducting silicone grease or thermally conductive silicon wafer use thermal coefficient to be more than or equal to 5.0
Material.Wherein, in the present embodiment, by selecting higher heat-conducting silicone grease or thermally conductive silicon wafer to the thermal efficiency, so as into one
Step accelerates heat transfer efficiency.
Further, in the present embodiment, the material of the installation pinboard 300 is red copper.Wherein, relative in tradition
In scheme, aluminium sheet is used, and coefficient of heat transfer is 138w/ (m.k)；In the present embodiment, by using copper plate, to radiate and be
Number reaches 401w/ (m.k), so as to make thermal coefficient improve nearly 3 times, so as to further speed up heat transfer efficiency.
From the foregoing, it will be observed that power supply provided by the present embodiment:
Using " high fever power consumption source+existing low heat emission ability die cast+height heat dissipation pinboard+high thermal conductivity auxiliary material+encapsulating
The combination of heat-conducting glue " realizes compatible design of the 1500W power supply version to 3000W power supply version；
Also, development cost is reduced, die sinking expense etc. is saved；
Also, reduces the development cycle, product is made to enter market faster, improve the market competitiveness；
Also, multi version realizes shell compatible design, enhances the uniformity of series of products；
Also, reduces the operation pressure, small lot supply of material demand can be met, be the unified planning and exploitation of subsequent serial product
Win more times.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
It is all under the inventive concept of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
It changes, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (6)
1. a kind of power supply, which is characterized in that the power supply includes die cast, the first power panel, installation pinboard；
The outer surface of the die cast is equipped with radiation tooth for matching second source plate heat dissipation capacity, the die cast it is interior
Portion is equipped with the second installation hole location for installing second source plate；
The installation pinboard is fixedly connected by the second installation hole location with the die cast, and the installation is transferred
The first installation hole location for installing the first power panel is additionally provided on plate；
First power panel is mounted on the installation pinboard by the first installation hole location；
Heat-conducting silicone grease or thermally conductive silicon wafer are coated between first power panel and installation pinboard；
Encapsulating has power supply casting glue on the heat-generating electronic elements of first power panel.
2. power supply as described in claim 1, which is characterized in that the die cast uses aluminum material.
3. power supply as claimed in claim 2, which is characterized in that the power of the second source plate is 1500W, first electricity
The power of source plate is 3000W.
4. power supply as claimed in claim 3, which is characterized in that the efficiency of first power panel is more than or equal to 95%, heat consumption
Less than 150W.
5. power supply as claimed in claim 2, which is characterized in that the heat-conducting silicone grease or thermally conductive silicon wafer are greater than using thermal coefficient
Material equal to 5.0.
6. power supply as claimed in claim 5, which is characterized in that the material of the installation pinboard is red copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920141244.XU CN209435093U (en) | 2019-01-28 | 2019-01-28 | Power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920141244.XU CN209435093U (en) | 2019-01-28 | 2019-01-28 | Power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209435093U true CN209435093U (en) | 2019-09-24 |
Family
ID=67977614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920141244.XU Active CN209435093U (en) | 2019-01-28 | 2019-01-28 | Power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209435093U (en) |
-
2019
- 2019-01-28 CN CN201920141244.XU patent/CN209435093U/en active Active
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