CN110581474A - Resistance to compression heat dissipation bus duct - Google Patents

Resistance to compression heat dissipation bus duct Download PDF

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Publication number
CN110581474A
CN110581474A CN201910806277.6A CN201910806277A CN110581474A CN 110581474 A CN110581474 A CN 110581474A CN 201910806277 A CN201910806277 A CN 201910806277A CN 110581474 A CN110581474 A CN 110581474A
Authority
CN
China
Prior art keywords
heat dissipation
bus duct
water tank
water
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201910806277.6A
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Chinese (zh)
Inventor
孙和平
朱恩龙
马琴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianyuan Huawei Group Co Ltd
Original Assignee
Tianyuan Huawei Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianyuan Huawei Group Co Ltd filed Critical Tianyuan Huawei Group Co Ltd
Priority to CN201910806277.6A priority Critical patent/CN110581474A/en
Publication of CN110581474A publication Critical patent/CN110581474A/en
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G5/00Installations of bus-bars
    • H02G5/06Totally-enclosed installations, e.g. in metal casings
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G5/00Installations of bus-bars
    • H02G5/10Cooling

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a compression-resistant heat dissipation bus duct which comprises a bottom plate, a cover plate, a copper bar and a heat dissipation device, wherein the bottom plate is provided with a plurality of through holes; the front side and the rear side of the upper surface of the bottom plate are respectively provided with a side plate, the side surfaces of the two side plates are respectively provided with an M-shaped reinforcing rib, the middle part of the lower surface of the bottom plate is provided with a base, the upper ends of the side surfaces of the two side plates are respectively provided with a sliding rod, the inner side surface of the cover plate is provided with two sliding grooves, and the two sliding grooves are connected with the sliding rods; the number of the copper bars is four, and two ends of the four copper bars are fixed at two ends of the inner side surfaces of the two side plates through four heat conduction phase isolation seats; the heat abstractor includes water pipe booster pump and water tank, the left side at the base lower surface is established to the water tank, the left end of water pipe is connected with the delivery port of water tank leading flank, the right-hand member of water pipe is connected with the water inlet of water tank leading flank, and this resistance to compression heat dissipation bus duct can be with the quick giving off of the heat that the bus duct produced in the use, and the radiating effect, the radiating rate is fast.

Description

Resistance to compression heat dissipation bus duct
Technical Field
the invention relates to the technical field of bus ducts, in particular to a compression-resistant heat dissipation bus duct.
background
the bus duct is a closed metal device consisting of copper and aluminum bus posts and used for distributing high power for each element of a decentralized system, electric wires and cables are increasingly replaced in indoor low-voltage power transmission main line engineering projects, the bus duct is of a closed structure and can emit heat in the power-on process, if the bus duct is not timely radiated, the bus duct can be burnt, the conventional bus duct only radiates heat through an aluminum substrate, a large amount of heat generated in the use process of the bus duct cannot be rapidly radiated by the aluminum substrate, so that the temperature in the bus duct is still high, and the radiating effect is extremely poor.
The current resistance to compression heat absorption bus duct that application number is 201520868635.3 discloses sets up last closing plate into the arc, and lower closing plate embeds the strengthening rib, has strengthened the compressive capacity, and JRF aluminium oxide ceramic layer has the heat absorption function, can transmit the heat to the heat absorption cotton, dispels the heat fast through the good heat dissipation function of aluminium base board, and aluminium base board still is equipped with the recess, has strengthened the radiating effect. In addition, the heat generated between the conductors can be buffered, noise is prevented from being generated, and stable current transmission is guaranteed.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a compression-resistant heat dissipation bus duct which can quickly dissipate heat generated by the bus duct in the using process, has a high heat dissipation effect and a high heat dissipation speed, and can effectively solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: a compression-resistant heat dissipation bus duct comprises a bottom plate, a cover plate, a copper bar and a heat dissipation device;
A bottom plate: side plates are arranged on the front side and the rear side of the upper surface of the bottom plate, M-shaped reinforcing ribs are arranged on the side surfaces of the two side plates, a base is arranged in the middle of the lower surface of the bottom plate, and sliding rods are arranged at the upper ends of the side surfaces of the two side plates;
cover plate: the cover plate is a U-shaped plate, two sliding grooves are formed in the inner side face of the cover plate, and the two sliding grooves are connected with the sliding rod in a sliding mode;
Copper bar arranging: the number of the copper bars is four, and two ends of the four copper bars are fixed at two ends of the inner side surfaces of the two side plates through four heat conduction phase isolation seats;
a heat dissipation device: the heat dissipation device comprises a water pipe, a booster pump and a water tank, wherein the water tank is arranged on the left side of the lower surface of the base, the left end of the water pipe is connected with a water outlet in the front side surface of the water tank, the right end of the water pipe is connected with a water inlet in the front side surface of the water tank, the middle part of the water pipe is S-shaped, the side surface in the middle part of the water pipe is fixedly connected with the lower surface of the bottom plate, the booster pump is arranged on the water pipe, and the side surface of the booster pump is;
Wherein: still include the singlechip, the singlechip is established on the right side of base lower surface, and the input of singlechip is connected with external power source's output electricity, the output of singlechip is connected with the input electricity of booster pump, separates the looks seat through heat conduction and can give bottom plate and curb plate with the quick transmission of the heat that the copper bar produced to carry out the hydrologic cycle through heat abstractor and give off the heat on bottom plate and the curb plate fast, the radiating effect is good, and the radiating rate is fast.
Further, still include the mount pad, the mount pad is equipped with two, and two mount pads are established respectively in the left and right sides on apron upper surface, can make things convenient for the installation and the fixed of bus duct through the mount pad.
Further, still include the fin, the fin is established in the left and right sides of water tank, and the array has the fin of being no less than thirty on the left and right sides of water tank, can give off the heat that cooling water transmitted to the water tank through the fin, makes the quick cooling of water in the water tank.
Further, still include exhaust fan and fixed plate, the middle part at the base lower surface is established to the fixed plate, the exhaust fan is equipped with two, and two exhaust fans are established respectively in two logical grooves of fixed plate side, and the input of two exhaust fans is connected with the output electricity of singlechip, can accelerate the radiating rate of fin through the exhaust fan.
further, still include connecting plug and connection socket, connecting plug is equipped with four, and four connecting plugs establish respectively at the left end of four copper bars, and the right-hand member of four copper bars be equipped with the connection socket of four connecting plug one-to-ones, can make things convenient for the connection of two bus ducts through connecting plug and connection socket's cooperation.
Further, still include the sponge that absorbs water, the sponge that absorbs water is the annular, and the sponge that absorbs water parcel in the outside of water pipe, can prevent through the sponge that absorbs water that the water pipe is outside to produce the comdenstion water and influence the work of bus duct.
further, still include the polyester film, the polyester film is equipped with four, and four polyester films wrap up respectively in the outside of four copper bars, through the insulating nature between the polyester film multiplicable two copper bars.
Compared with the prior art, the invention has the beneficial effects that: this resistance to compression heat dissipation bus duct has following benefit:
1. separate the looks seat through the heat conduction and can be with the quick transmission of the heat that the copper bar produced for bottom plate and curb plate to carry out the hydrologic cycle through heat abstractor and give off the heat on bottom plate and the curb plate fast, the radiating effect is good, and the radiating rate is fast.
2. can make things convenient for the installation and the fixed of bus duct through the mount pad, can give off the heat that cooling water transmitted on the water tank through the fin, make the quick cooling of water in the water tank to can accelerate the radiating rate of fin through the exhaust fan.
3. The connection of two bus ducts can be made things convenient for through the cooperation of connecting plug and connection socket, can prevent through the sponge that absorbs water that the outside comdenstion water that produces of water pipe and influence the work of bus duct, through the insulating nature between the multiplicable two copper bars of polyester film.
drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic view of the backside structure of the present invention;
FIG. 3 is a schematic side view of the present invention;
FIG. 4 is a schematic sectional view of a water pipe according to the present invention;
FIG. 5 is a schematic cross-sectional view of the copper bar of the present invention; .
in the figure: the heat-conducting heat-insulating exhaust fan comprises a base plate 1, side plates 2, a cover plate 3, a heat-conducting phase-separating seat 4, a copper bar 5, a base 6, a reinforcing rib 7, a heat-radiating device 8, a water pipe 81, a booster pump 82, a water tank 83, a connecting plug 9, a mounting seat 10, a sliding chute 11, a connecting socket 12, a sliding rod 13, a heat radiating fin 14, an exhaust fan 15, a fixing plate 16, a single chip microcomputer 17, a water-absorbing sponge 18 and a polyester film 19.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
referring to fig. 1-5, the present invention provides the following technical solutions:
the first embodiment is as follows:
A compression-resistant heat dissipation bus duct comprises a bottom plate 1, a cover plate 3, a copper bar 5 and a heat dissipation device 8; bottom plate 1: the front side and the rear side of the upper surface of the bottom plate 1 are respectively provided with a side plate 2, the side surfaces of the two side plates 2 are respectively provided with an M-shaped reinforcing rib 7, the middle part of the lower surface of the bottom plate 1 is provided with a base 6, and the upper ends of the side surfaces of the two side plates 2 are respectively provided with a sliding rod 13; and (3) cover plate: the cover plate 3 is a U-shaped plate, two sliding grooves 11 are formed in the inner side face of the cover plate 3, and the two sliding grooves 11 are connected with the sliding rod 13 in a sliding mode; copper bar 5: four copper bars 5 are arranged, and two ends of the four copper bars 5 are fixed at two ends of the inner side surfaces of the two side plates 2 through four heat conduction phase isolation seats 4; the heat dissipation device 8: the heat dissipation device 8 comprises a water pipe 81, a booster pump 82 and a water tank 83, the water tank 83 is arranged on the left side of the lower surface of the base 6, the left end of the water pipe 81 is connected with a water outlet on the front side surface of the water tank 83, the right end of the water pipe 81 is connected with a water inlet on the front side surface of the water tank 83, the middle part of the water pipe 81 is S-shaped, the side surface of the middle part of the water pipe 81 is fixedly connected with the lower surface of the bottom plate 1, the booster pump 82 is arranged on the water pipe 81, and the side; wherein: still include singlechip 17, singlechip 17 establishes the right side at 6 lower surfaces of base, and singlechip 17's input is connected with external power source's output electricity, singlechip 17's output is connected with booster pump 82's input electricity, separate looks seat 4 through the heat conduction and can give bottom plate 1 and curb plate 2 with the quick transmission of the heat that copper bar 5 produced, and carry out the hydrologic cycle through heat abstractor 8 and give off the heat on bottom plate 1 and the curb plate 2 fast, the radiating effect is good, the radiating rate is fast.
Example two:
The difference between this embodiment and the first embodiment is:
In this embodiment, the number of the mounting seats 10 is two, the two mounting seats 10 are respectively arranged on the left side and the right side of the upper surface of the cover plate 3, the radiating fins 14 are arranged on the left side and the right side of the water tank 83, the radiating fins 14 which are not less than thirty are arrayed on the left side and the right side of the water tank 83, the fixing plate 16 is arranged in the middle of the lower surface of the base 6, the number of the exhaust fans 15 is two, the two exhaust fans 15 are respectively arranged in the two through grooves on the side of the fixing plate 16, and the input ends of the two exhaust fans.
Specifically, the installation and fixation of the bus duct can be facilitated by arranging the installation seat 10, the heat of cooling water transferred to the water tank 83 can be dissipated by the radiating fins 14, so that the water in the water tank 83 can be rapidly cooled, and the radiating speed of the radiating fins 14 can be increased by the exhaust fan 15
Example three:
the difference between this embodiment and the first embodiment is:
In this embodiment, connecting plug 9 is equipped with four, and four connecting plug 9 are established respectively at the left end of four copper bar 5, and the right-hand member of four copper bar 5 be equipped with the connection socket 12 of four connecting plug 9 one-to-ones, and the sponge 18 that absorbs water is the annular, and the sponge 18 parcel that just absorbs water is in the outside of water pipe 81, and polyester film 19 is equipped with four, and four polyester film 19 parcel respectively are in the outside of four copper bar 5.
Specifically, the connection of two bus ducts can be facilitated by the matching of the connecting plug 9 and the connecting socket 12, the water pipe 81 can be prevented from generating condensed water outside through the water absorption sponge 18 to influence the work of the bus ducts, and the insulation between the two copper bars 5 can be increased through the polyester film 19
when in use: the cover plate 3 is fixed at a position for installing a bus duct through the mounting seat 10, the slide bar 13 on the side plate 2 is inserted into the chute 11 on the cover plate 3, an external power supply is switched on, the bus duct is connected with the connecting plug 9 through the connecting socket 12 on the other bus duct, the bus duct can be used, when the copper bar 5 generates a large amount of heat in the power-on process, the heat generated by the copper bar 5 is transmitted to the bottom plate 1 and the side plate 2 through the heat-conducting phase-separating seat 4, the booster pump 82 is controlled to work through the singlechip 17, so that cooling water in the water tank 83 circulates through the water pipe 81, the heat is circularly dissipated, the cooling water can be transmitted to the water tank 83 through the radiating fins 14 to be dissipated, meanwhile, the exhaust fan 15 is controlled to work through the singlechip 17, the heat on the radiating fins 14 is rapidly dissipated, and condensed water formed, the use of the bus duct is prevented from being influenced by the condensed water, and the insulativity between the two copper bars 5 can be increased through the polyester film 19.
It should be noted that the booster pump 82 used in this embodiment is proposed to use a small booster pump of the company ltd, pumping industry group, the specific model is HG24-09E, the single chip microcomputer 17 is proposed to use a micro single chip microcomputer of the company ltd, technotc, shenzhen, the specific model is MCU-attiy 85, and the single chip microcomputer 17 controls the booster pump 82 and the exhaust fan 15 to operate by a method commonly used in the prior art.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. the utility model provides a resistance to compression heat dissipation bus duct which characterized in that: comprises a bottom plate (1), a cover plate (3), a copper bar (5) and a heat dissipation device (8);
base plate (1): the front side and the rear side of the upper surface of the bottom plate (1) are respectively provided with a side plate (2), the side surfaces of the two side plates (2) are respectively provided with an M-shaped reinforcing rib (7), the middle part of the lower surface of the bottom plate (1) is provided with a base (6), and the upper ends of the side surfaces of the two side plates (2) are respectively provided with a sliding rod (13);
cover plate (3): the cover plate (3) is a U-shaped plate, two sliding grooves (11) are formed in the inner side face of the cover plate (3), and the two sliding grooves (11) are connected with the sliding rod (13) in a sliding mode;
Copper bar (5): the number of the copper bars (5) is four, and two ends of the four copper bars (5) are fixed at two ends of the inner side surfaces of the two side plates (2) through four heat conduction phase isolation seats (4);
Heat sink (8): the heat dissipation device (8) comprises a water pipe (81), a booster pump (82) and a water tank (83), the water tank (83) is arranged on the left side of the lower surface of the base (6), the left end of the water pipe (81) is connected with a water outlet of the front side surface of the water tank (83), the right end of the water pipe (81) is connected with a water inlet of the front side surface of the water tank (83), the middle of the water pipe (81) is S-shaped, the side surface of the middle of the water pipe (81) is fixedly connected with the lower surface of the bottom plate (1), the booster pump (82) is arranged on the water pipe (81), and the side surface of the booster pump (82) is fixedly connected with the front side surface of the water tank (;
wherein: still include singlechip (17), establish on the right side of base (6) lower surface singlechip (17), and the input of singlechip (17) is connected with external power source's output electricity, the output of singlechip (17) is connected with the input of booster pump (82) electricity.
2. The pressure-resistant heat dissipation bus duct of claim 1, wherein: the novel cover plate is characterized by further comprising two installation seats (10), wherein the two installation seats (10) are respectively arranged on the left side and the right side of the upper surface of the cover plate (3).
3. the pressure-resistant heat dissipation bus duct of claim 1, wherein: the radiator is characterized by further comprising radiating fins (14), wherein the radiating fins (14) are arranged on the left side surface and the right side surface of the water tank (83), and at least thirty radiating fins (14) are arrayed on the left side surface and the right side surface of the water tank (83).
4. The pressure-resistant heat dissipation bus duct of claim 1, wherein: still include exhaust fan (15) and fixed plate (16), the middle part at base (6) lower surface is established in fixed plate (16), exhaust fan (15) are equipped with two, and two exhaust fan (15) are established respectively in two logical grooves of fixed plate (16) side, and the input of two exhaust fan (15) is connected with the output electricity of singlechip (17).
5. the pressure-resistant heat dissipation bus duct of claim 1, wherein: still include connecting plug (9) and connecting socket (12), connecting plug (9) are equipped with four, and the left end at four copper bar (5) is established respectively in four connecting plug (9), and the right-hand member of four copper bar (5) is equipped with connecting socket (12) with four connecting plug (9) one-to-one.
6. The pressure-resistant heat dissipation bus duct of claim 1, wherein: the water absorption device is characterized by further comprising a water absorption sponge (18), wherein the water absorption sponge (18) is annular, and the water absorption sponge (18) is wrapped on the outer side of the water pipe (81).
7. The pressure-resistant heat dissipation bus duct of claim 1, wherein: the copper bar is characterized by further comprising four polyester films (19), wherein the four polyester films (19) are respectively wrapped on the outer sides of the four copper bars (5).
CN201910806277.6A 2019-08-29 2019-08-29 Resistance to compression heat dissipation bus duct Withdrawn CN110581474A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910806277.6A CN110581474A (en) 2019-08-29 2019-08-29 Resistance to compression heat dissipation bus duct

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910806277.6A CN110581474A (en) 2019-08-29 2019-08-29 Resistance to compression heat dissipation bus duct

Publications (1)

Publication Number Publication Date
CN110581474A true CN110581474A (en) 2019-12-17

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ID=68812192

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CN201910806277.6A Withdrawn CN110581474A (en) 2019-08-29 2019-08-29 Resistance to compression heat dissipation bus duct

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112383006A (en) * 2020-10-22 2021-02-19 江苏向荣电气有限公司 Intelligent bus duct with protective structure
CN112383007A (en) * 2020-10-22 2021-02-19 江苏向荣电气有限公司 Intelligent bus duct with good heat dissipation effect
CN113675803A (en) * 2021-08-26 2021-11-19 李涛 Resistance to compression heat dissipation bus duct
CN115036869A (en) * 2022-05-23 2022-09-09 广东瀛楷电气自动化科技有限公司 Heat radiator for intensive bus duct
CN115296237A (en) * 2022-10-09 2022-11-04 四川西高电气有限公司 Automatic radiating bus duct circulates

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112383006A (en) * 2020-10-22 2021-02-19 江苏向荣电气有限公司 Intelligent bus duct with protective structure
CN112383007A (en) * 2020-10-22 2021-02-19 江苏向荣电气有限公司 Intelligent bus duct with good heat dissipation effect
CN112383007B (en) * 2020-10-22 2021-12-07 江苏向荣电气有限公司 Intelligent bus duct with good heat dissipation effect
CN113675803A (en) * 2021-08-26 2021-11-19 李涛 Resistance to compression heat dissipation bus duct
CN115036869A (en) * 2022-05-23 2022-09-09 广东瀛楷电气自动化科技有限公司 Heat radiator for intensive bus duct
CN115036869B (en) * 2022-05-23 2023-08-22 广东瀛楷电气自动化科技有限公司 Heat abstractor of intensive bus duct
CN115296237A (en) * 2022-10-09 2022-11-04 四川西高电气有限公司 Automatic radiating bus duct circulates

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Application publication date: 20191217