CN220086028U - Power transient suppression diode with good heat dissipation effect - Google Patents
Power transient suppression diode with good heat dissipation effect Download PDFInfo
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- CN220086028U CN220086028U CN202221745321.0U CN202221745321U CN220086028U CN 220086028 U CN220086028 U CN 220086028U CN 202221745321 U CN202221745321 U CN 202221745321U CN 220086028 U CN220086028 U CN 220086028U
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- heat
- base
- transient suppression
- suppression diode
- heat dissipation
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 18
- 230000000694 effects Effects 0.000 title claims abstract description 12
- 230000001629 suppression Effects 0.000 title claims abstract description 12
- 230000001052 transient effect Effects 0.000 title claims abstract description 12
- 238000010521 absorption reaction Methods 0.000 claims abstract description 25
- 239000004020 conductor Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000009825 accumulation Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a power transient suppression diode with good heat dissipation effect, which comprises a base, wherein a chip is arranged in the base, pins are arranged on the upper side and the lower side of the chip, the outer ends of the pins extend to the outside of the base in a penetrating way, a heat absorption shell is arranged on the outside of the base and is clamped on the surface of the base, positioning plates are arranged on the left side and the right side of an inner cavity of the base, and heat dissipation fins are fixedly arranged on the inner side of the positioning plates. The heat transfer pads are additionally arranged at the upper end and the lower end of the base, heat generated inside can be conducted out by matching with the heat conducting plates, the heat absorbing shell is additionally arranged on the side face of the base, and the heat absorbed by the inner heat radiating fins can be transferred into the heat absorbing shell and radiated out.
Description
Technical Field
The utility model relates to the technical field of diodes, in particular to a power transient suppression diode with good heat dissipation effect.
Background
The diode is a semiconductor component, is originally used as an indicator light, a display panel and the like, is also used as illumination along with the appearance of a white light LED, has higher and higher requirements on the diode along with the wide use of the diode, is usually manufactured by adding pins on a chip and adding a layer of protective layer, and can generate a large amount of heat on an internal chip when the diode works, and has poor heat dissipation performance, cannot be rapidly discharged due to internal heat accumulation and can damage the diode when serious.
Disclosure of Invention
The utility model aims to provide a power transient suppression diode with good heat dissipation effect, which has the advantage of rapid heat dissipation, and solves the problems that the existing diode structure is poor in heat dissipation performance, internal heat cannot be rapidly discharged due to accumulation, and the diode is damaged in severe cases.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a power transient suppression diode that radiating effect is good, includes the base, the inside of base is provided with the chip, the upper and lower both sides of chip all are provided with the pin, the outside that the outer end of pin runs through and extends to the base, the outside of base is provided with the heat absorption shell, the surface at the base is in the heat absorption shell joint, the left and right sides of base inner chamber all is provided with the locating plate, the inboard fixed mounting of locating plate has heat radiation fins, the upper and lower both sides of base inner chamber all sealing mounting has the heat conduction board, the outside fixed mounting of heat conduction board has the heat transfer pad, the one end of pin is located the inside of heat transfer pad.
Preferably, the inner wall of the heat absorption shell is fixedly provided with a heat conduction rod, and the inner end of the heat conduction rod penetrates through the base and is in contact with the surface of the positioning plate.
Preferably, the upper side and the lower side of the inner wall of the heat absorption shell are fixedly provided with heat conduction gaskets, and the inner ends of the heat conduction gaskets are connected with the positioning plates in a fitting mode.
Preferably, the positioning plate is made of a heat conducting material and is designed integrally with the radiating fins.
Preferably, the whole heat absorption shell is half arc-shaped, and the joint part of joint part and base is the fretwork design.
Compared with the prior art, the utility model has the following beneficial effects:
1. the heat transfer pads are added at the upper end and the lower end of the base, heat generated inside can be conducted out by matching with the heat conducting plates, the heat absorbing shell is added on the side face of the base, and the heat absorbed by the inner heat radiating fins can be transferred into the heat absorbing shell and radiated out.
2. According to the utility model, the heat conducting gasket is added in the heat absorbing shell and is attached to the positioning plate, so that heat transmitted by the positioning plate can be quickly absorbed in the heat absorbing shell and emitted out through the meshes on the surface of the heat absorbing shell, and the heat conducting rod can assist in reinforcing the heat absorbing capacity of the positioning plate, so that the heat cannot be left in a large range in the interior, and the heat dissipation efficiency of the diode is improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a cross-sectional view of the structure of the present utility model;
fig. 3 is a top view of the heat absorbing shell structure of the present utility model.
In the figure: 1. a base; 2. a chip; 3. pins; 4. a heat absorbing housing; 5. a heat conduction rod; 6. a positioning plate; 7. a heat radiation fin; 8. a heat conductive plate; 9. a heat transfer pad; 10. a thermally conductive gasket.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, a power transient suppression diode with good heat dissipation effect comprises a base 1, a chip 2 is arranged in the base 1, pins 3 are arranged on the upper side and the lower side of the chip 2, the outer ends of the pins 3 penetrate and extend to the outside of the base 1, a heat absorption shell 4 is arranged on the outside of the base 1, a heat conduction rod 5 is fixedly arranged on the inner wall of the heat absorption shell 4, the inner end of the heat conduction rod 5 penetrates through the base 1 and contacts with the surface of a positioning plate 6, a heat conduction gasket 10 is fixedly arranged on the upper side and the lower side of the inner wall of the heat absorption shell 4, the inner end of the heat conduction gasket 10 is in fit connection with the positioning plate 6, the whole heat absorption shell 4 is in a semi-arc shape, the joint part of the heat absorption shell 4 and the base 1 is in a hollow design, the heat absorption gasket 10 is additionally arranged in the heat absorption shell 4 and is fit with the positioning plate 6, and heat transmitted by the positioning plate 6 can be quickly absorbed into the inside of the shell 4, the heat absorption capacity of the positioning plate 6 can be enhanced in an auxiliary manner by the heat conducting rod 5 through the mesh holes on the surface, so that the heat can not be left in a large range in the interior, the heat dissipation efficiency of the interior of the diode is improved, the heat absorption shell 4 is clamped on the surface of the base 1, the positioning plate 6 is arranged on the left side and the right side of the inner cavity of the base 1, the positioning plate 6 is made of a heat conducting material and is integrally designed with the heat radiating fins 7, the heat radiating fins 7 are fixedly arranged on the inner side of the positioning plate 6, the heat conducting plates 8 are hermetically arranged on the upper side and the lower side of the inner cavity of the base 1, the heat conducting pads 9 are fixedly arranged on the outer side of the heat conducting plates 8, one ends of the pins 3 are positioned in the heat conducting pads 9, the heat generated in the interior can be led out by the cooperation with the heat conducting plates 8 through the addition of the heat conducting pads 9 on the upper end and the lower end of the base 1, the heat absorption shell 4 is additionally arranged on the side of the base 1, the heat absorbed by the inner radiating fins 7 can be transferred to the inside of the heat absorbing shell 4 and dissipated, the structure can radiate the inside of the base 1 in an omnibearing manner, heat is prevented from remaining inside, the used structural components are heat-resistant materials, the heat can be rapidly led out, meanwhile, the problems that the heat dissipation performance of the existing diode structure is poor, the heat inside cannot be rapidly discharged due to accumulation are solved, and the diode can be damaged in severe cases are solved.
During the use, through increase heat transfer pad 9 at the upper and lower both ends of base 1, the usable is derived the heat that produces inside with the cooperation of heat-conducting plate 8, and base 1 side increases heat absorption shell 4 moreover, the heat transfer of accessible inside heat radiation fin 7 absorption is to the inside of heat absorption shell 4 and give off, this structure can be to the inside omnidirectional heat dissipation of base 1, avoid heat to remain in the inside, through increase heat conduction gasket 10 at the inside of heat absorption shell 4, and laminate it with locating plate 6, can absorb the heat of locating plate 6 transmission to the inside of heat absorption shell 4 fast, and give off through the mesh on surface, and heat conduction rod 5 can assist the enhancement to the heat absorption ability of locating plate 6, make the heat can not cause a large scale to remain in inside, and then improve the radiating efficiency to the diode inside.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a power transient suppression diode that radiating effect is good, includes base (1), its characterized in that: the inside of base (1) is provided with chip (2), the upper and lower both sides of chip (2) all are provided with pin (3), the outside that runs through of pin (3) extends to the outside of base (1), the outside of base (1) is provided with heat absorption shell (4), heat absorption shell (4) joint is at the surface of base (1), the left and right sides of base (1) inner chamber all is provided with locating plate (6), the inboard fixed mounting of locating plate (6) has radiator fin (7), the upper and lower both sides of base (1) inner chamber all seal-mounting has heat-conducting plate (8), the outside fixed mounting of heat-conducting plate (8) has heat transfer pad (9), the one end of pin (3) is located the inside of heat transfer pad (9).
2. The power transient suppression diode with good heat dissipation effect as recited in claim 1, wherein: the inner wall of the heat absorption shell (4) is fixedly provided with a heat conduction rod (5), and the inner end of the heat conduction rod (5) penetrates through the base (1) and is in contact with the surface of the positioning plate (6).
3. The power transient suppression diode with good heat dissipation effect as recited in claim 1, wherein: the heat-conducting gasket (10) is fixedly installed on the upper side and the lower side of the inner wall of the heat-absorbing shell (4), and the inner end of the heat-conducting gasket (10) is connected with the positioning plate (6) in a fitting mode.
4. The power transient suppression diode with good heat dissipation effect as recited in claim 1, wherein: the positioning plate (6) is made of heat conducting materials and is designed integrally with the radiating fins (7).
5. The power transient suppression diode with good heat dissipation effect as recited in claim 1, wherein: the heat absorbing shell (4) is integrally arranged in a semi-arc shape, and the connection part of the clamping part and the base (1) is in a hollowed-out design.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221745321.0U CN220086028U (en) | 2022-07-08 | 2022-07-08 | Power transient suppression diode with good heat dissipation effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221745321.0U CN220086028U (en) | 2022-07-08 | 2022-07-08 | Power transient suppression diode with good heat dissipation effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220086028U true CN220086028U (en) | 2023-11-24 |
Family
ID=88815689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221745321.0U Active CN220086028U (en) | 2022-07-08 | 2022-07-08 | Power transient suppression diode with good heat dissipation effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220086028U (en) |
-
2022
- 2022-07-08 CN CN202221745321.0U patent/CN220086028U/en active Active
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