CN212970251U - Multifunctional circuit board - Google Patents

Multifunctional circuit board Download PDF

Info

Publication number
CN212970251U
CN212970251U CN202022026348.1U CN202022026348U CN212970251U CN 212970251 U CN212970251 U CN 212970251U CN 202022026348 U CN202022026348 U CN 202022026348U CN 212970251 U CN212970251 U CN 212970251U
Authority
CN
China
Prior art keywords
circuit board
heat exchange
damping component
multifunctional
board body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202022026348.1U
Other languages
Chinese (zh)
Inventor
程爱平
许志军
曾祥全
徐国芳
刘伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quzhou Tianying Electronics Co ltd
Original Assignee
Quzhou Tianying Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quzhou Tianying Electronics Co ltd filed Critical Quzhou Tianying Electronics Co ltd
Priority to CN202022026348.1U priority Critical patent/CN212970251U/en
Application granted granted Critical
Publication of CN212970251U publication Critical patent/CN212970251U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The utility model provides a multifunctional circuit board, include: the circuit board comprises a circuit board body, electronic components, a transverse damping component, a longitudinal damping component, a radiating fin and a protective box body; the longitudinal damping assembly is fixedly arranged at the bottom of the protective box body; the radiating fins are arranged at the upper end of the longitudinal damping component; the circuit board body is arranged at the upper end of the radiating fin; the electronic component is arranged on the circuit board body; the transverse damping component is arranged at the side end of the circuit board body; the inner side wall of the protection box body is also provided with a fixed block; the transverse damping component is fixedly connected with the fixed block; the utility model discloses a mode that horizontal damper assembly and vertical damper assembly combined together can play good cushioning effect to the circuit board, secondly, adopts fin and liquid heat dissipation to combine together, can effectively dispel the heat to the circuit board.

Description

Multifunctional circuit board
Technical Field
The utility model relates to a circuit board field, in particular to multifunctional circuit board.
Background
The conventional circuit board has certain defects in use, is not ideal in shockproof effect, is easy to damage, is easy to distort and deform after being heated, influences conductivity and poor in heat dissipation performance, so that the circuit board is easy to heat up, brings certain adverse effects in the use process, and therefore the shockproof circuit board is provided.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a multifunctional circuit board reaches shockproof, the good purpose of radiating effect.
The utility model discloses technical scheme as follows:
a multifunctional circuit board comprising: the circuit board comprises a circuit board body, electronic components, a transverse damping component, a longitudinal damping component, a radiating fin and a protective box body; the longitudinal damping assembly is fixedly arranged at the bottom of the protective box body; the radiating fins are arranged at the upper end of the longitudinal damping component; the circuit board body is arranged at the upper end of the radiating fin; the electronic component is arranged on the circuit board body; the transverse damping component is arranged at the side end of the circuit board body; the inner side wall of the protection box body is also provided with a fixed block; and the transverse damping assembly is fixedly connected with the fixed block.
Preferably, the upper end of the protection box body is provided with a drying filter screen.
Preferably, the circuit board body is internally provided with a heat dissipation groove, a first heat exchange shell and an inner cavity; the first heat exchange shell is arranged in the inner cavity.
Preferably, the longitudinal shock absorbing assembly comprises: the second heat exchange shell, the mounting groove and the shock-absorbing rubber pad; the mounting groove is formed in the shock-absorbing rubber pad; the mounting groove is used for mounting the second heat exchange shell.
Further, the outer layers of the first heat exchange shell and the second heat exchange shell are provided with reinforced films; and heat exchange liquid is arranged in the first heat exchange shell and the second heat exchange shell.
Furthermore, at least 2 first heat exchange shells and at least 2 second heat exchange shells are arranged; the heat exchange liquid is water or alcohol.
Preferably, the lateral shock absorbing assembly comprises: the damping device comprises a T-shaped block, a fixing plate, a spring, a damping pad, an annular groove and a cylinder; the T-shaped block is fixed on one side of the fixing plate; the annular groove is fixed on the other side of the fixing plate; the shock pad is arranged in the annular groove and fixed on the fixing plate; the spring is fixed on the fixing plate and is fixedly connected with the circuit board body; the cylinder is fixed on one side of the circuit board body and penetrates through the annular groove.
Further, a fixing groove is formed in the fixing block; the T-shaped block is inserted into the fixing groove.
Preferably, the heat sink is made of a high thermal conductive substrate.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses a mode that horizontal damper assembly and vertical damper assembly combined together can play good cushioning effect to the circuit board, secondly, adopts fin and liquid heat dissipation to combine together, can effectively dispel the heat to the circuit board.
Drawings
Fig. 1 is a schematic structural diagram of a multifunctional circuit board of the present invention;
fig. 2 is a schematic structural view of a T-shaped block of a multifunctional circuit board according to the present invention;
fig. 3 is a fixing block of the multifunctional circuit board of the present invention;
reference numerals: 1. the circuit board body, 2, electronic components, 3, horizontal damper, 4, vertical damper, 5, the fin, 6, the radiating groove, 7, first heat transfer casing, 8, second heat transfer casing, 9, the protection box body, 10, dry filter screen, 11, the fixed block, 12, T-shaped piece, 13, the fixed plate, 14, the spring, 15, the shock pad, 16, the ring channel, 17, the cylinder, 18, the inner chamber, 19, the mounting groove, 20, the shock pad, 21, the fixed slot.
Detailed Description
In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following detailed description will be given with reference to the accompanying drawings and specific embodiments. In the following description, feature details such as specific configurations and components are provided only to help a full understanding of the embodiments of the present invention. Thus, it will be apparent to those skilled in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the invention. In addition, descriptions of well-known functions and constructions are omitted for clarity and conciseness.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
In various embodiments of the present invention, it should be understood that the sequence numbers of the following processes do not mean the execution sequence, and the execution sequence of the processes should be determined by the functions and the internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.
It should be understood that the term "and/or" herein is merely one type of association relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
In the embodiments provided herein, it should be understood that "B corresponding to a" means that B is associated with a from which B can be determined. It should also be understood that determining B from a does not mean determining B from a alone, but may be determined from a and/or other information.
With reference to fig. 1-3, the present invention provides a multifunctional circuit board, including: the circuit board comprises a circuit board body 1, an electronic component 2, a transverse damping component 3, a longitudinal damping component 4, a radiating fin 5 and a protective box body 9, wherein an insulating layer is coated on the outer side of the circuit board body 1 and is made of aluminum oxide; the longitudinal shock absorption assembly 4 is fixedly arranged at the bottom of the protective box body 9, and the radiating fin 5 is arranged at the upper end of the longitudinal shock absorption assembly 4, wherein the radiating fin 5 is made of a high-heat-conductivity base material and can conduct out 80% -90% of heat of the circuit board body 1; the circuit board body 1 is arranged on the radiating fin 5, and the electronic component 2 is arranged on the circuit board body 1; the transverse damping component 3 is arranged at the side end of the circuit board body 1; the inside wall of the protection box body 9 is also provided with a fixing block 11, a fixing groove 21 is arranged in the fixing block 11, and the transverse damping component 3 is fixedly connected with the fixing groove 21.
Further illustrated, the lateral shock absorbing assembly 3 comprises: t-shaped block 12, fixing plate 13, spring 14, shock pad 15, annular groove 16 and cylinder 17; the T-shaped block 12 is fixed on one side of the fixing plate 13; the annular groove 16 is fixed on the other side of the fixing plate 13; the shock pad 15 is arranged in the annular groove 16 and fixed on the fixing plate 13; the spring 14 is fixed on the fixing plate 13 and is fixedly connected with the circuit board body 1; the cylinder 17 is fixed to the circuit board body 1 side and passes through the annular groove 16. The transverse shock absorption component 3 is used for relieving transverse shock of the circuit board, and achieves the effect of double shock absorption by combining the spring 14 and the shock absorption pad 15.
Further explaining, the longitudinal shock absorbing assembly 4 adopts a plurality of shock absorbing rubber pads 20 for alleviating longitudinal shock of the circuit board.
In one embodiment, the circuit board body 1 is internally provided with a heat dissipation groove 6, a first heat exchange shell 7 and an inner cavity 18; the first heat exchange housing is disposed within the inner chamber 18.
In one embodiment, the longitudinal shock absorbing assembly 4 comprises: the second heat exchange shell 8, the mounting groove 19 and the shock-absorbing rubber gasket 20; an installation groove 19 is arranged in the shock-absorbing rubber pad 20; the mounting groove 19 is used for mounting the second heat exchange shell 8.
Further, the outer layers of the first heat exchange shell 7 and the second heat exchange shell 8 are both provided with a reinforced film; all be equipped with heat transfer liquid in first heat transfer casing 7, the second heat transfer casing 8, wherein, the reinforcing film can increase the intensity of heat transfer casing, makes the structure that has the heat transfer casing remain stable, avoids the heat transfer casing excessive expansion and influences the structure of circuit board.
Further, at least 2 first heat exchange shells 7 and at least 2 second heat exchange shells 8 are arranged; the heat exchange liquid is water or alcohol, and a part of heat of the circuit board is absorbed by the heat exchange liquid, so that the heat dissipation effect is achieved.
In one embodiment, the upper end of the protective casing 9 is provided with a drying filter screen 10, and the drying filter screen 10 can filter and dry dust in the air.
The utility model discloses a theory of operation:
when vibration occurs, the spring 14 and the shock pad 15 in the transverse shock absorption assembly 3 are combined to relieve the transverse shock of the circuit board, and the shock absorption rubber pad 20 of the longitudinal shock absorption assembly 4 relieves the longitudinal shock of the circuit board;
when the circuit board works, heat generated by the LED circuit board body 1 and the electronic component 2 is conducted out by the radiating fins 5 on one hand, and is absorbed by liquid in the first heat exchange shell 7 and the second heat exchange shell 8 on the other hand, so that the circuit board is radiated; when the circuit board does not work, the heat absorbed by the liquid in the first heat exchange shell 7 and the second heat exchange shell 8 is conducted away by the circuit board body 1.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (9)

1. A multifunctional circuit board is characterized in that: the method comprises the following steps: the circuit board comprises a circuit board body (1), electronic components (2), a transverse damping component (3), a longitudinal damping component (4), a radiating fin (5) and a protective box body (9); the longitudinal damping assembly (4) is fixedly arranged at the bottom of the protective box body (9); the radiating fins (5) are arranged at the upper end of the longitudinal damping component (4); the circuit board body (1) is arranged at the upper end of the radiating fin (5); the electronic component (2) is arranged on the circuit board body (1); the transverse damping component (3) is arranged at the side end of the circuit board body (1); the inner side wall of the protective box body (9) is also provided with a fixed block (11); the transverse damping component (3) is fixedly connected with the fixing block (11).
2. The multifunctional circuit board of claim 1, wherein: and a drying filter screen (10) is arranged at the upper end of the protection box body (9).
3. The multifunctional circuit board of claim 1, wherein: a heat dissipation groove (6), a first heat exchange shell (7) and an inner cavity (18) are arranged in the circuit board body (1); the first heat exchange housing is disposed within the inner chamber (18).
4. The multifunctional circuit board of claim 3, wherein: the longitudinal shock-absorbing assembly (4) comprises: the second heat exchange shell (8), the mounting groove (19) and the shock-absorbing rubber pad (20); the shock-absorbing rubber pad (20) is internally provided with the mounting groove (19); the mounting groove (19) is used for mounting the second heat exchange shell (8).
5. The multifunctional circuit board of claim 4, wherein: the outer layers of the first heat exchange shell (7) and the second heat exchange shell (8) are respectively provided with a reinforcing film; and heat exchange liquid is arranged in the first heat exchange shell (7) and the second heat exchange shell (8).
6. The multifunctional circuit board of claim 5, wherein: at least 2 first heat exchange shells (7) and at least 2 second heat exchange shells (8) are arranged; the heat exchange liquid is water or alcohol.
7. The multifunctional circuit board of claim 1, wherein: the lateral shock-absorbing assembly (3) comprises: the damping device comprises a T-shaped block (12), a fixing plate (13), a spring (14), a damping pad (15), an annular groove (16) and a cylinder (17); the T-shaped block (12) is fixed on one side of the fixing plate (13); the annular groove (16) is fixed on the other side of the fixing plate (13); the shock absorption pad (15) is arranged in the annular groove (16) and fixed on the fixing plate (13); the spring (14) is fixed on the fixing plate (13) and is fixedly connected with the circuit board body (1); the cylinder (17) is fixed on one side of the circuit board body (1) and penetrates through the annular groove (16).
8. The multifunctional circuit board of claim 7, wherein: a fixing groove (21) is arranged in the fixing block (11); the T-shaped block (12) is inserted into the fixing groove (21).
9. The multifunctional circuit board of claim 1, wherein: the radiating fin (5) is made of a high-heat-conductivity base material.
CN202022026348.1U 2020-09-16 2020-09-16 Multifunctional circuit board Active CN212970251U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022026348.1U CN212970251U (en) 2020-09-16 2020-09-16 Multifunctional circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022026348.1U CN212970251U (en) 2020-09-16 2020-09-16 Multifunctional circuit board

Publications (1)

Publication Number Publication Date
CN212970251U true CN212970251U (en) 2021-04-13

Family

ID=75369879

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022026348.1U Active CN212970251U (en) 2020-09-16 2020-09-16 Multifunctional circuit board

Country Status (1)

Country Link
CN (1) CN212970251U (en)

Similar Documents

Publication Publication Date Title
CN212970251U (en) Multifunctional circuit board
CN201490181U (en) Chip heat radiation device
CN207731659U (en) A kind of hard disc structure of the electronic information with shock-damping structure
CN208029221U (en) A kind of lightweight shell enhancing shielding for unmanned plane figure transmission module and reinforce radiating
CN214897979U (en) Transformer with heat dissipation performance
CN212671940U (en) Diesel generating set protective housing
CN212648003U (en) Novel transformer
CN208924090U (en) A kind of LLC resonant converter
JP3152577U (en) Heat dissipation structure for communication equipment case
CN208401012U (en) A kind of heat dissipation type coaxial load component
CN220086028U (en) Power transient suppression diode with good heat dissipation effect
CN110750143A (en) Big data server with efficient heat dissipation function
CN206759927U (en) A kind of novel shielding device
CN218920817U (en) High-precision communication filter shell
CN107438347B (en) Heat dissipation device
CN218525469U (en) Graphene supercapacitor
CN217485433U (en) Can show ammeter structure that promotes chip radiating effect
CN113825373A (en) Mobile phone heat dissipation structure and mobile phone with same
CN219046591U (en) Circuit board chip radiating shell
CN219780747U (en) Automobile central domain controller and automobile thereof
CN211210303U (en) Power supply cabinet
CN218272824U (en) Heat radiation structure of optical module
CN216291944U (en) Heat abstractor of internet data equipment
CN213586813U (en) 4W double-carrier positioning portable equipment
CN217362883U (en) High-efficient heat dissipation converter

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant