CN216752230U

CN216752230U - Multilayer circuit board applied to backlight module

Info

Publication number: CN216752230U
Application number: CN202220126716.6U
Authority: CN
Inventors: 张东锋
Original assignee: Digital Printed Circuit Board Co Ltd
Current assignee: Digital Printed Circuit Board Co Ltd
Priority date: 2022-01-18
Filing date: 2022-01-18
Publication date: 2022-06-14
Anticipated expiration: 2032-01-18

Abstract

The utility model provides a multilayer circuit board applied to a backlight module, which comprises an upper board, a middle interlayer and a lower board, wherein a first copper foil circuit layer is arranged at the upper end of the upper board, a first waterproof glue layer covers the upper end of the first copper foil circuit layer, a reflecting film covers the upper end of the first waterproof glue layer, a second copper foil circuit layer is arranged at the lower end of the lower board, a second waterproof glue layer covers the lower end of the second copper foil circuit layer, an electronic element is arranged on the upper board, and a layer of waterproof sealant covers the outer side of the upper end of a pin of the electronic element. The multilayer circuit board is suitable for the backlight module, has a good waterproof effect, and the reflecting film is added on the upper end face of the multilayer circuit board to replace a reflecting sheet of the traditional backlight module, so that the size of the backlight module can be reduced, and the development of light and thin products is facilitated.

Description

Multilayer circuit board applied to backlight module

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a multilayer circuit board applied to a backlight module.

Background

The backlight module generally includes a circuit board, an LED light source disposed on the circuit board, a light guide plate disposed at one side of the LED light source, a diffusion plate, and the like. In order to prevent light leakage, a reflective plate is usually disposed on the back of the circuit board to reflect light, and this structure results in a thicker backlight module, which is not in line with the trend of light and thin products. On the other hand, for a part of circuit boards applied to the backlight module, certain waterproof performance is required, and the circuit board in the prior art cannot meet the waterproof requirement.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, the present invention provides a multilayer circuit board applied to a backlight module, which has a good waterproof effect, and a reflective film is added on the upper end surface of the multilayer circuit board to replace the reflective sheet of the conventional backlight module, so that the size of the backlight module can be reduced, and the development of light and thin products is facilitated.

In order to achieve the purpose, the utility model is solved by the following technical scheme:

the utility model provides a be applied to backlight unit's multilayer circuit board, multilayer circuit board includes top plate, intermediate layer, lower floor's board, the top plate upper end is equipped with first copper foil circuit layer, first copper foil circuit layer coats and is stamped first waterproof glue layer, first waterproof glue layer coats and is stamped the reflectance coating, the plywood lower extreme is equipped with second copper foil circuit layer down, first copper foil circuit layer with be connected with electrically conductive hole between the second copper foil circuit layer, second copper foil circuit layer lower extreme covers has second waterproof glue layer, be equipped with the pad on the second copper foil circuit layer, be equipped with electronic component on the top plate, electronic component's pin passes welding behind top plate, intermediate layer, the lower plywood on the pad, electronic component's the pin upper end outside has still to cover one deck waterproof sealant.

Specifically, the edge of multilayer circuit board still covers has third prevention glue film.

Specifically, the conductive hole is filled with hole plugging resin.

Specifically, middle intermediate layer is including the first PP layer, heat-conducting layer, the second PP layer of stacking in proper order, first PP layer leans on upper plate one side to set up.

Specifically, the thickness of the second waterproof glue layer is larger than 1 mm.

The beneficial effects of the utility model are:

the multilayer circuit board is suitable for a backlight module, the upper end and the lower end of the multilayer circuit board are respectively provided with the first waterproof glue layer and the second waterproof glue layer, the edge of the multilayer circuit board is also covered with the third waterproof glue layer, the multilayer circuit board has a good waterproof effect, the reflecting film is additionally arranged on the upper end face of the multilayer circuit board, the reflecting sheet of the traditional backlight module is replaced, the size of the backlight module can be reduced, and the development of light and thin products is facilitated.

Drawings

Fig. 1 is a schematic structural diagram of a multilayer circuit board applied to a backlight module according to the present invention.

The reference signs are: the waterproof packaging structure comprises an upper plate 1, a middle interlayer 2, a first PP layer 21, a heat conduction layer 22, a second PP layer 23, a lower plate 3, a first copper foil circuit layer 4, a first waterproof glue layer 5, a reflection film 6, a second copper foil circuit layer 7, a conductive hole 8, a second waterproof glue layer 9, an electronic element 10, waterproof sealant 11, a third waterproof glue layer 12 and hole plugging resin 13.

Detailed Description

The present invention will be described in further detail with reference to examples and drawings, but the embodiments of the present invention are not limited thereto.

As shown in fig. 1:

a multilayer circuit board applied to a backlight module can be combined with a light guide plate, a diffusion plate and the like to form the backlight module, the multilayer circuit board comprises an upper board 1, a middle interlayer 2 and a lower board 3, a first copper foil circuit layer 4 is arranged at the upper end of the upper board 1, a first waterproof glue layer 5 covers the upper end of the first copper foil circuit layer 4, a reflecting film 6 covers the upper end of the first waterproof glue layer 5, a second copper foil circuit layer 7 is arranged at the lower end of the lower board 3, a conductive hole 8 is connected between the first copper foil circuit layer 4 and the second copper foil circuit layer 7, a second waterproof glue layer 9 covers the lower end of the second copper foil circuit layer 7, a bonding pad is arranged on the second copper foil circuit layer 7, an electronic element 10 is arranged on the upper board 1, a pin of the electronic element 10 penetrates through the upper board 1, the middle interlayer 2 and the lower board 3 and then is welded on the bonding pad, the electronic element 10 is an LED light source, part of light emitted by the LED light source irradiates the surface of the reflecting film 6, through the reflection of reflection coating 6, reentrant to penetrate in the light guide plate, just so need not to set up the reflector plate alone, can reduce backlight unit's thickness, in order to fully protect electronic component 10's pin, electronic component 10's pin upper end outside still covers one deck waterproof sealant 11.

Preferably, in order to improve the waterproof performance of the edge of the multilayer circuit board, the edge of the multilayer circuit board is further covered with a third waterproof glue layer 12.

Preferably, the conductive via 8 is filled with a via resin 13.

Preferably, the intermediate layer 2 includes a first PP layer 21, a heat conduction layer 22, and a second PP layer 23 stacked in sequence, and the first PP layer 21 is disposed close to the upper plate 1.

Preferably, the thickness of the second waterproof glue layer 9 is more than 1 mm.

The above examples only show 1 embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a be applied to backlight unit's multilayer circuit board, a serial communication port, multilayer circuit board includes upper plate (1), intermediate layer (2), lower floor's board (3), upper plate (1) upper end is equipped with first copper foil circuit layer (4), first copper foil circuit layer (4) upper end covers has first waterproof glue film (5), first waterproof glue film (5) upper end covers there is reflectance coating (6), lower floor's board (3) lower extreme is equipped with second copper foil circuit layer (7), first copper foil circuit layer (4) with be connected with electrically conductive hole (8) between second copper foil circuit layer (7), second copper foil circuit layer (7) lower extreme covers has second waterproof glue film (9), be equipped with the pad on second copper foil circuit layer (7), be equipped with electronic component (10) on upper plate (1), the pin of electronic component (10) passes upper plate (1), The middle interlayer (2) and the lower layer plate (3) are welded on the welding pad, and a layer of waterproof sealant (11) covers the outer side of the upper end of the pin of the electronic element (10).

2. The multilayer circuit board applied to a backlight module as set forth in claim 1, wherein the edge of the multilayer circuit board is further covered with a third waterproof glue layer (12).

3. The multilayer circuit board applied to a backlight module as claimed in claim 1, wherein the conductive holes (8) are filled with a hole plugging resin (13).

4. The multilayer circuit board applied to a backlight module as claimed in claim 1, wherein the middle interlayer (2) comprises a first PP layer (21), a heat conducting layer (22) and a second PP layer (23) which are sequentially stacked, and the first PP layer (21) is disposed close to one side of the upper plate (1).

5. The multilayer circuit board applied to the backlight module as claimed in claim 1, wherein the thickness of the second waterproof glue layer (9) is greater than 1 mm.