CN216749849U - Multi-chip integrated circuit packaging structure - Google Patents

Abstract

The utility model belongs to the technical field of chip integrated circuit processing, especially, be a multi-chip integrated circuit packaging structure, including the mounting bracket, one side of mounting bracket is fixed and is equipped with the removal base, the removal base includes mobile motor one, lead screw one, removes slip table, slide rail, mobile motor two, places the piece, the top of mounting bracket is equipped with packaging mechanism, packaging mechanism includes lifting sleeve, lift post, rotatory rack, gear, rotary motor, fixture, places the dish; through being provided with the removal base, remove the mobile motor on the base and rotate and place the piece and remove, can carry out the regulation of a plurality of positions to placing the chip on the piece, conveniently encapsulate a plurality of chips on the integrated circuit board, packaging mechanism and fixture, a plurality of sucking discs cooperation on the fixture can be accomplished simultaneously from placing the dish and take the encapsulation raw materials and encapsulate the chip on placing the piece, has improved the encapsulation efficiency to multi-chip integrated circuit.

Description

Multi-chip integrated circuit packaging structure

Technical Field

The utility model belongs to the technical field of chip integrated circuit processing, concretely relates to multi-chip integrated circuit packaging structure.

Background

In the fabrication of integrated circuits, chips are obtained by the steps of wafer fabrication, forming integrated circuits, and dicing wafers. After the integrated circuit of the wafer is manufactured, the chips formed by cutting the wafer can be electrically connected to the loader outwards; the carrier can be a lead frame or a substrate, and the chip can be electrically connected to the carrier by wire bonding or flip chip bonding. If the chip and the carrier are electrically connected by wire bonding, the step of filling the encapsulant is performed to form a chip package. The chip packaging technology is a process technology for wrapping a chip to avoid the chip from contacting with the outside and preventing the chip from being damaged by the outside. Impurities and undesirable gases in the air, and even water vapor, can corrode the precision circuitry on the chip, thereby causing degradation of electrical performance. Different packaging technologies are widely different in manufacturing processes and technologies, and play a crucial role in performance of the memory chip after packaging. With the rapid development of photoelectric and micro-electrical manufacturing technology, electronic products are always developing in the direction of being smaller, lighter and cheaper, and therefore the packaging form of chip elements is continuously improved; the traditional chip packaging structure has low packaging efficiency and can not package an integrated circuit board with a plurality of chips, and therefore, a multi-chip integrated circuit packaging structure is provided for solving the problems.

SUMMERY OF THE UTILITY MODEL

In order to solve at least one of the above problems, the present invention provides a multi-chip integrated circuit package structure.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a multi-chip integrated circuit packaging structure is designed, and comprises a mounting frame, wherein a movable base is fixedly arranged on one side of the mounting frame, a first movable motor is fixedly arranged on one side of the movable base, a first screw rod is fixedly arranged on one side of the first movable motor, the first screw rod penetrates through the movable base, the first screw rod is rotationally connected with the movable base, a movable sliding table is arranged on the movable base in a sliding manner, the movable sliding table is in threaded connection with the first screw rod, a sliding rail is fixedly arranged at the top of the movable sliding table, a second movable motor is arranged on one side of the sliding rail, a placing block is arranged on the sliding rail in a sliding manner, a packaging mechanism is arranged at the top of the mounting frame, a lifting sleeve is arranged on the packaging mechanism, the lifting sleeve penetrates through the mounting frame, a lifting column is arranged on the lifting sleeve in a sliding manner, a rotary rack is sleeved on the lifting column, a gear is arranged on one side of the rotary rack, one side of gear is fixed and is equipped with the rotary motor, the fixed fixture that is equipped with in rotary motor's bottom, one side of fixture is equipped with places the dish.

Preferably, the bottom of the mounting rack is fixedly provided with a supporting base.

Preferably, a plurality of clamps are fixedly arranged on the placing block, and an integrated circuit board is arranged on one side of each clamp.

Preferably, the last clamping disk that is equipped with of fixture, the bottom of clamping disk is fixed and is equipped with a plurality of sleeves, and is a plurality of all slide on the sleeve and be equipped with the centre gripping post, the bottom of centre gripping post is fixed and is equipped with the sucking disc.

Preferably, a second screw rod is fixedly arranged on one side of the second mobile motor, and the second screw rod is in threaded connection with the placing block.

Compared with the prior art, the beneficial effects of the utility model are that:

the device is provided with a movable base, a first screw rod is driven to rotate by a rotation of a movable motor on the movable base, the first screw rod drives a movable sliding table to move on the movable base, a second screw rod is driven to rotate by a rotation of a second movable motor on the movable sliding table, a placing block is driven to move by a rotation of the second screw rod, the structure is matched to adjust a plurality of positions of chips on the placing block, so that a plurality of chips on an integrated circuit board can be conveniently packaged, a packaging mechanism is arranged, a lifting sleeve on the packaging mechanism is communicated with an external air source to push a lifting column to move, the lifting column is driven to move to drive a clamping mechanism to move, a rotary motor on the clamping mechanism is rotated to drive a gear to rotate, the gear is rotated to drive a rotary rack to rotate, the lifting column is driven to rotate to further drive the clamping mechanism to rotate, a plurality of sleeves are fixed at the bottom of a clamping disc on the clamping mechanism, and the sleeves are communicated with the external air source to push the clamping column to move, the sucking disc on the centre gripping post can adsorb the raw materials that the encapsulation needs, and the lift post removes and drives its removal and encapsulate the chip, and a plurality of sucking discs cooperation can be accomplished simultaneously from placing the dish and take the encapsulation raw materials and encapsulate the chip on placing the piece, has improved the encapsulation efficiency to multi-chip integrated circuit.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic axial view of a multi-chip IC package structure according to the present invention;

FIG. 2 is a schematic left-side sectional view of a multi-chip integrated circuit package structure according to the present invention;

FIG. 3 is a schematic cross-sectional view of a clamping mechanism of a multi-chip IC package structure according to the present invention;

FIG. 4 is a schematic cross-sectional view of a placement mechanism for a multi-chip integrated circuit package structure according to the present invention;

FIG. 5 is a schematic cross-sectional front view of a multi-chip IC package structure according to the present invention;

fig. 6 is a schematic sectional view of a moving mechanism of a multi-chip integrated circuit package structure according to the present invention.

In the figure: the integrated circuit board packaging device comprises a 100 mounting frame, a 110 supporting base, a 200 moving base, a 210 moving motor I, a 211 screw rod I, a 212 moving sliding table, a 220 moving motor II, a 221 screw rod II, a 222 sliding rail, a 300 packaging mechanism, a 310 lifting sleeve, a 311 lifting column, a 312 rotating rack, a 320 rotating motor, a 321 gear, a 330 clamping mechanism, a 331 clamping disk, a 332 sleeve, a 333 clamping column, a 334 sucker, a 340 placing disk, a 400 placing block, a 410 clamp and a 411 integrated circuit board.

Detailed Description

In the embodiments of the present invention, the terms "first", "second", and the like are used for distinguishing different elements from each other in a descriptive sense, but do not denote any spatial arrangement, temporal order, or the like of the elements, and the elements should not be limited by these terms. The term "and/or" includes any and all combinations of one or more of the associated listed terms. The terms "comprising," "including," "having," and the like, refer to the presence of stated features, elements, components, or groups, but do not preclude the presence or addition of one or more other features, elements, components, or groups thereof.

In order to make the technical solutions of the present invention clearer and clearer for those skilled in the art, the present invention will be described in further detail with reference to the following embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.

Referring to fig. 1-6, the present invention provides the following technical solutions: a multi-chip integrated circuit packaging structure comprises a mounting frame 100, wherein a movable base 200 is fixedly arranged on one side of the mounting frame 100, a first movable motor 210 is fixedly arranged on one side of the movable base 200, a first lead screw 211 is fixedly arranged on one side of the first movable motor 210, the first lead screw 211 penetrates through the movable base 200, the first lead screw 211 is rotatably connected with the movable base 200, a movable sliding table 212 is slidably arranged on the movable base 200, the movable sliding table 212 is in threaded connection with the first lead screw 211, a sliding rail 222 is fixedly arranged at the top of the movable sliding table 212, a second movable motor 220 is arranged on one side of the sliding rail 222, a placing block 400 is slidably arranged on the sliding rail 222, a packaging mechanism 300 is arranged at the top of the mounting frame 100, a lifting sleeve 310 is arranged on the packaging mechanism 300, the lifting sleeve 310 penetrates through the mounting frame 100, a lifting column 311 is slidably arranged on the lifting sleeve 310, a rotating rack 312 is sleeved on the lifting column 311, a gear 321 is arranged on one side of the rotating rack 312, a rotating motor 320 is fixedly arranged on one side of the gear 321, a clamping mechanism 330 is fixedly arranged at the bottom of the rotating motor 320, and a placing disc 340 is arranged on one side of the clamping mechanism 330; through the arrangement of the movable base 200, a first movable motor 210 on the movable base 200 rotates to drive a first screw rod 211 to rotate, the first screw rod 211 rotates to drive a movable sliding table 212 to move on the movable base 200, a second movable motor 220 on the movable sliding table 212 rotates to drive a second screw rod 221 to rotate, the second screw rod 221 rotates to drive a placing block 400 to move, the structure is matched to adjust a plurality of positions of chips on the placing block 400, so that a plurality of chips on an integrated circuit board can be conveniently packaged, a packaging mechanism 300 is arranged, a lifting sleeve 310 on the packaging mechanism 300 is introduced with an external air source to push a lifting column 311 to move, the lifting column 311 moves to drive a clamping mechanism 330 to move, a rotary motor 320 on the clamping mechanism 330 rotates to drive a gear 321 to rotate, the gear 321 rotates to drive a rotary rack 312 to rotate, the rotary rack 312 rotates to drive the lifting column 311 to rotate, and further drives the clamping mechanism 330 to rotate, a plurality of sleeves 332 are fixed in clamping disk 331 bottom on fixture 330, sleeve 332 lets in external air supply and can promote the removal of centre gripping post 333, sucking disc 334 on the centre gripping post 333 can adsorb the raw materials that the encapsulation needs, lift post 311 removes and drives its removal and encapsulate the chip, the cooperation of a plurality of sucking discs 334 can be accomplished simultaneously from placing dish 340 and take the encapsulation raw materials and encapsulate the chip on placing piece 400, improved the packaging efficiency to multi-chip integrated circuit.

Specifically, a support base 110 is fixedly arranged at the bottom of the mounting frame 100; the supporting base 110 is provided to support the entire apparatus.

Specifically, a plurality of clamps 410 are fixedly arranged on the placing block 400, and an integrated circuit board 411 is arranged on one side of each clamp 410; the jig 410 is provided for fixing the integrated circuit board 411.

Specifically, the clamping mechanism 330 is provided with a clamping disc 331, the bottom of the clamping disc 331 is fixedly provided with a plurality of sleeves 332, the sleeves 332 are provided with clamping columns 333 in a sliding manner, and the bottom of the clamping columns 333 is fixedly provided with suckers 334.

Specifically, a second screw rod 221 is fixedly arranged on one side of the second moving motor 220, and the second screw rod 221 is in threaded connection with the placing block 400.

The utility model discloses a theory of operation and use flow: placing an integrated circuit board 411 on a placing block 400 and fixing the integrated circuit board by a fixture 410, placing raw materials required for packaging in a placing disc 340, starting a device, wherein a first moving motor 210 on a moving base 200 rotates to drive a first screw rod 211 to rotate, the first screw rod 211 rotates to drive a moving sliding table 212 to move on the moving base 200, a second moving motor 220 on the moving sliding table 212 rotates to drive a second screw rod 221 to rotate, the second screw rod 221 rotates to drive the placing block 400 to move, the structure can be matched to adjust a plurality of positions of chips on the placing block 400, so as to package a plurality of chips on the integrated circuit board conveniently, a lifting sleeve 310 on a packaging mechanism 300 is introduced with an external air source to push a lifting column 311 to move, the lifting column 311 moves to drive a clamping mechanism 330 to move, a rotating motor 320 on the clamping mechanism 330 rotates to drive a gear 321 to rotate, the gear 321 rotates to drive a rotating rack 312 to rotate, rotatory rack 312 rotates and drives lift post 311 and rotate, further drive fixture 330 and rotate, a plurality of fixed sleeves 332 in clamping disk 331 bottom on the fixture 330, sleeve 332 lets in external air supply and can promote the removal of clamping post 333, sucking disc 334 on the clamping post 333 can adsorb the raw materials that the encapsulation needs, lift post 311 removes and drives its removal and encapsulate the chip, a plurality of sucking discs 334 cooperation can be accomplished simultaneously and take the encapsulation raw materials from placing dish 340 and encapsulate the chip on placing piece 400, the efficiency of packaging to multi-chip integrated circuit has been improved.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the principle of the present invention should be included in the protection scope of the present invention.

Claims (5)

1. A multi-chip integrated circuit package structure is characterized in that: comprises a mounting frame (100), one side of the mounting frame (100) is fixedly provided with a movable base (200), one side of the movable base (200) is fixedly provided with a first movable motor (210), one side of the first movable motor (210) is fixedly provided with a first screw rod (211), the first screw rod (211) penetrates through the movable base (200), the first screw rod (211) is rotatably connected with the movable base (200), the movable base (200) is provided with a movable sliding table (212) in a sliding manner, the movable sliding table (212) is in threaded connection with the first screw rod (211), the top of the movable sliding table (212) is fixedly provided with a sliding rail (222), one side of the sliding rail (222) is provided with a second movable motor (220), the sliding rail (222) is provided with a placing block (400) in a sliding manner, the top of the mounting frame (100) is provided with a packaging mechanism (300), and the packaging mechanism (300) is provided with a lifting sleeve (310), lifting sleeve (310) runs through mounting bracket (100), it is equipped with lift post (311) to slide on lifting sleeve (310), it is equipped with rotatory rack (312) to cup joint on lift post (311), one side of rotatory rack (312) is equipped with gear (321), one side of gear (321) is fixed and is equipped with rotating motor (320), the fixed fixture (330) that is equipped with in bottom of rotating motor (320), one side of fixture (330) is equipped with places dish (340).

2. The multi-chip integrated circuit package structure of claim 1, wherein: the bottom of the mounting rack (100) is fixedly provided with a supporting base (110).

3. The multi-chip integrated circuit package structure of claim 1, wherein: a plurality of clamps (410) are fixedly arranged on the placing block (400), and an integrated circuit board (411) is arranged on one side of each clamp (410).

4. The multi-chip integrated circuit package structure of claim 1, wherein: be equipped with clamping disk (331) on fixture (330), the bottom of clamping disk (331) is fixed to be equipped with a plurality of sleeves (332), and is a plurality of all slide on sleeve (332) and be equipped with centre gripping post (333), the fixed sucking disc (334) that is equipped with in bottom of centre gripping post (333).

5. The multi-chip integrated circuit package structure of claim 1, wherein: and a second screw rod (221) is fixedly arranged on one side of the second moving motor (220), and the second screw rod (221) is in threaded connection with the placing block (400).

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