CN111785664A - IC semiconductor chip packaging equipment - Google Patents
IC semiconductor chip packaging equipment Download PDFInfo
- Publication number
- CN111785664A CN111785664A CN202010675230.3A CN202010675230A CN111785664A CN 111785664 A CN111785664 A CN 111785664A CN 202010675230 A CN202010675230 A CN 202010675230A CN 111785664 A CN111785664 A CN 111785664A
- Authority
- CN
- China
- Prior art keywords
- seat
- chip
- rack
- sleeve
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses IC semiconductor chip packaging equipment which comprises a rack, a conveyor, an electric sliding rail, a sliding seat, an adjusting plate and a servo motor, wherein the conveyor is arranged at the top of the rack; when the chip is adsorbed and transported by the adsorption component on the lifting plate, the air pressure rod drives the lifting plate and the adsorption component to move downwards until the sucker is contacted with the top side of the chip, then the connecting sliding pipe is driven to move upwards in the limiting sliding groove of the sleeve, the spring is compressed by the limiting block at the bottom end, the elastic contact between the adsorption component and the chip is ensured through the elastic deformation of the spring, the chip is protected, and the damage to the chip in the transporting process is avoided; meanwhile, when the chip is placed on the adjusting plate to be packaged, the threaded rod is driven to rotate through the work of the servo motor, the sleeve seat is further driven to move downwards on the threaded rod, the adjusting plate is driven to lift through the sliding rod seat, the height of the chip is further adjusted, and the chip with different thicknesses is convenient to package.
Description
Technical Field
The invention relates to the field of chip processing equipment, in particular to IC semiconductor chip packaging equipment.
Background
The shell for IC semiconductor IC chip has the functions of holding, fixing, sealing, protecting chip and strengthening electrothermal performance, and is also the bridge for communicating the chip inside world with external circuit. Therefore, the package plays an important role for both the CPU and other LSI integrated circuits.
The conventional IC semiconductor chip packaging equipment needs to carry the chip in the packaging process, and the traditional carrying placement is directly in hard contact with the chip, so that the surface of the chip is easily damaged; meanwhile, when the chip is carried to a fixed position for packaging, the height of the chip needs to be adjusted due to different thicknesses of different chips, otherwise, the problem of packaging failure easily occurs.
Disclosure of Invention
The invention aims to provide IC semiconductor chip packaging equipment, which aims to overcome the defect that the conventional IC semiconductor chip packaging equipment needs to carry a chip in the packaging process, and the traditional carrying and placing process is directly in hard contact with the chip, so that the surface of the chip is easily damaged; meanwhile, when the chip is carried to a fixed position for packaging, the height of the chip needs to be adjusted due to different thicknesses of different chips, otherwise, the technical problem of packaging failure is easy to occur.
The purpose of the invention can be realized by the following technical scheme:
an IC semiconductor chip packaging device comprises a rack, a conveyor, an electric slide rail, a slide seat, an air pressure rod, a lifting plate, an adsorption component, an adjusting plate and a servo motor, wherein the conveyor is installed at the top of the rack, a baffle seat is installed above the middle of the conveyor, the electric slide rail is installed on the inner wall of the baffle seat, the slide seat is installed on the outer side of the electric slide rail, the air pressure rod is installed on one side of the slide seat, the lifting plate is installed at the telescopic end of the air pressure rod, and the adsorption component is installed on the periphery of the outer side of the;
the utility model discloses a set of adjustable speed slide bar, including rack, servo motor, fixing base, threaded rod, slide bar seat top, regulation board, rack bottom and be located conveyer middle part one side and install the fixing base, the rack top just is located conveyer middle part one side and installs spacing seat, servo motor is installed to the fixing base bottom, the servo motor output just is located fixing base internally mounted and has the threaded rod, the threaded rod top is rotated with the rack bottom side and is connected, threaded rod outside slidable mounting has a cover seat, the slide bar seat is installed at cover seat top, and slide bar seat slidable mounting is in the threaded rod outside, slide bar seat top all is provided.
As a further scheme of the invention: the adsorption component comprises a sleeve, a connecting sliding pipe, a spring and a sucker, the sleeve penetrates through the lifting plate, the connecting sliding pipe is slidably mounted inside the sleeve, the sucker is mounted at the bottom end of the connecting sliding pipe, and the spring is sleeved outside the connecting sliding pipe and between the air hole and the sucker.
As a further scheme of the invention: the sleeve pipe top is seted up there is the gas pocket, sleeve pipe inside has seted up spacing spout, connect slide pipe top and bottom and all be provided with the stopper, and connect the slide pipe and pass through top stopper slidable mounting inside spacing spout.
As a further scheme of the invention: the sleeve seat is in threaded connection with the threaded rod.
As a further scheme of the invention: the four corners of the top of the limiting seat are provided with limiting angle seats, and the IC semiconductor chip is limited between the limiting angle seats.
The invention has the beneficial effects that: according to the chip adsorption device, through reasonable structural design, when the adsorption component on the lifting plate adsorbs and carries a chip, the air pressure rod drives the lifting plate and the adsorption component to move downwards until the sucker is contacted with the top side of the chip, then the connecting sliding pipe is driven to move upwards in the limiting sliding groove of the sleeve, the spring is compressed through the limiting block at the bottom end, the elastic contact between the adsorption component and the chip is ensured through the elastic deformation of the spring, the chip is protected, and the damage to the chip in the carrying process is avoided; meanwhile, when the chip is placed on the adjusting plate to be packaged, the threaded rod is driven to rotate through the work of the servo motor, the sleeve seat is further driven to move downwards on the threaded rod, the adjusting plate is driven to lift through the sliding rod seat, the height of the chip is further adjusted, and the chip with different thicknesses is convenient to package.
Drawings
In order to facilitate understanding for those skilled in the art, the present invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of an electric slide rail mounting structure according to the present invention;
FIG. 3 is a schematic view of a servo motor mounting structure according to the present invention;
FIG. 4 is a schematic view of the structure of the adsorption assembly of the present invention.
In the figure: 1. a rack; 2. a conveyor; 3. a blocking seat; 4. an electric slide rail; 5. a slide base; 6. a pneumatic rod; 7. a lifting plate; 8. an adsorption component; 9. an adjusting plate; 10. a limiting seat; 11. a slide bar seat; 12. a sleeve seat; 13. a threaded rod; 14. a fixed seat; 15. a servo motor; 16. a sleeve; 17. air holes; 18. a limiting chute; 19. connecting a sliding pipe; 20. a spring; 21. and (4) sucking discs.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, an IC semiconductor chip packaging apparatus includes a rack 1, a conveyor 2, an electric slide rail 4, a slide seat 5, a pneumatic rod 6, a lifting plate 7, an adsorption component 8, an adjusting plate 9 and a servo motor 15, wherein the conveyor 2 is installed at the top of the rack 1, a baffle seat 3 is installed above the middle part of the conveyor 2, the electric slide rail 4 is installed on the inner wall of the baffle seat 3, the slide seat 5 is installed on the outer side of the electric slide rail 4, the pneumatic rod 6 is installed on one side of the slide seat 5, the lifting plate 7 is installed at the telescopic end of the pneumatic rod 6, and the adsorption component 8 is installed around the outer side of;
1 bottom of rack and be located 2 middle part one sides of conveyer and install fixing base 14, 1 top of rack just is located 2 middle part one sides of conveyer and installs spacing seat 10, servo motor 15 is installed to fixing base 14 bottom, servo motor 15 output just is located 14 internally mounted of fixing base 13, threaded rod 13 top is rotated with 1 bottom side of rack and is connected, threaded rod 13 outside slidable mounting has cover seat 12, slide bar seat 11 is installed at cover seat 12 top, and slide bar seat 11 slidable mounting is in the threaded rod 13 outside, slide bar seat 11 top all is provided with the slide bar all around, and the slide bar top runs through rack 1 and spacing seat 10 and is connected with regulating plate 9 bottom side.
The adsorption component 8 comprises a sleeve 16, a connecting sliding pipe 19, a spring 20 and a sucker 21, the sleeve 16 penetrates through the lifting plate 7, the connecting sliding pipe 19 is installed inside the sleeve 16 in a sliding mode, the sucker 21 is installed at the bottom end of the connecting sliding pipe 19, the spring 20 is sleeved outside the connecting sliding pipe 19 and between the air hole 17 and the sucker 21, the connecting sliding pipe 19 moves up the limiting sliding groove 18 of the sleeve 16, the limiting block compression spring 20 at the bottom end is used, and elastic deformation of the spring 20 ensures elastic contact between the adsorption component 8 and a chip.
The gas pocket 17 has been seted up at sleeve pipe 16 top, and sleeve pipe 16 is inside to have seted up spacing spout 18, connects 19 tops of slide pipes and bottom and all is provided with the stopper, and connects slide pipes 19 through top stopper slidable mounting inside spacing spout 18, and the top stopper realizes connecting slide pipes 19 and sleeve pipe 16's sliding connection, and the spacing suit of spring 20 is realized to the bottom stopper.
The sleeve seat 12 is in threaded connection with the threaded rod 13, so that the sleeve seat 12 moves downwards on the threaded rod 13, and the adjusting plate 9 is driven to lift through the sliding rod seat 11.
Through reasonable structural design, when the adsorption component 8 on the lifting plate 7 adsorbs and carries a chip, the air pressure rod 6 drives the lifting plate 7 and the adsorption component 8 to move downwards until the sucking disc 21 is contacted with the top side of the chip, then drives the connecting sliding pipe 19 to move upwards in the limiting sliding groove 18 of the sleeve 16, the limiting block at the bottom end compresses the spring 20, the elastic contact between the adsorption component 8 and the chip is ensured through the elastic deformation of the spring 20, the chip is protected, and the chip is prevented from being damaged in the carrying process; meanwhile, when the chip is placed on the adjusting plate 9 for packaging, the servo motor 15 works to drive the threaded rod 13 to rotate, so that the sleeve seat 12 moves downwards on the threaded rod 13, the adjusting plate 9 is driven to lift through the sliding rod seat 11, the height of the chip is adjusted, and the chip with different thicknesses is packaged conveniently.
The working principle of the invention is as follows: the chip moves on the conveyor 2 and moves on the electric slide rail 4 through the slide carriage 5 until the lifting plate 7 is positioned above the conveyor 2, at the moment, the air pressure rod 6 drives the lifting plate 7 and the adsorption component 8 to move downwards until the suction cup 21 is contacted with the top side of the chip, then the connecting slide tube 19 is driven to move upwards in the limit slide groove 18 of the sleeve 16, the spring 20 is compressed by the limit block at the bottom end, the elastic contact between the adsorption component 8 and the chip is ensured by the elastic deformation of the spring 20, the chip is absorbed, then the slide carriage 5 moves to the upper part of the adjusting plate 9, when the chip is placed on the adjusting plate 9 for packaging, the servo motor 15 works to drive the threaded rod 13 to rotate, thereby realizing that the sleeve seat 12 moves downwards on the threaded rod 13, the adjusting plate 9 is driven by the slide rod seat 11 to lift and adjust, then, the chip limited between the limiting seats 10 is packaged, and the chip is moved to the conveyor 2 again for conveying through the same operation.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (5)
1. The IC semiconductor chip packaging equipment is characterized by comprising a rack (1), a conveyor (2), an electric slide rail (4), a slide seat (5), an air pressure rod (6), a lifting plate (7), an adsorption component (8), an adjusting plate (9) and a servo motor (15), wherein the conveyor (2) is installed at the top of the rack (1), a baffle seat (3) is installed above the middle part of the conveyor (2), the electric slide rail (4) is installed on the inner wall of the baffle seat (3), the slide seat (5) is installed on the outer side of the electric slide rail (4), the air pressure rod (6) is installed on one side of the slide seat (5), the lifting plate (7) is installed at the telescopic end of the air pressure rod (6), and the adsorption component (8) is installed on the periphery of the outer side of the lifting plate (7;
rack (1) bottom just is located conveyer (2) middle part one side and installs fixing base (14), rack (1) top just is located conveyer (2) middle part one side and installs spacing seat (10), servo motor (15) are installed to fixing base (14) bottom, servo motor (15) output just is located fixing base (14) internally mounted and has threaded rod (13), threaded rod (13) top is rotated with rack (1) bottom side and is connected, threaded rod (13) outside slidable mounting has cover seat (12), slide bar seat (11) are installed at cover seat (12) top, and slide bar seat (11) slidable mounting in the threaded rod (13) outside, all be provided with the slide bar around slide bar seat (11) top, and the slide bar top runs through rack (1) and spacing seat (10), and is connected with regulating plate (9) bottom side.
2. The IC semiconductor chip packaging device according to claim 1, wherein the adsorption component (8) comprises a sleeve (16), a connecting sliding tube (19), a spring (20) and a suction cup (21), the sleeve (16) penetrates through the lifting plate (7), the connecting sliding tube (19) is slidably mounted inside the sleeve (16), the suction cup (21) is mounted at the bottom end of the connecting sliding tube (19), and the spring (20) is sleeved outside the connecting sliding tube (19) and between the air hole (17) and the suction cup (21).
3. The IC semiconductor chip packaging device according to claim 2, wherein the top of the sleeve (16) is provided with an air hole (17), the sleeve (16) is internally provided with a limiting sliding groove (18), the top end and the bottom end of the connecting sliding tube (19) are both provided with limiting blocks, and the connecting sliding tube (19) is slidably mounted inside the limiting sliding groove (18) through the limiting block at the top end.
4. An IC semiconductor chip packaging apparatus according to claim 1, wherein the socket (12) and the threaded rod (13) are threadedly connected.
5. The IC semiconductor chip packaging device according to claim 1, wherein four corners of the top of the limiting seat (10) are provided with limiting corner seats, and the IC semiconductor chip is limited between the limiting corner seats.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010675230.3A CN111785664A (en) | 2020-07-14 | 2020-07-14 | IC semiconductor chip packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010675230.3A CN111785664A (en) | 2020-07-14 | 2020-07-14 | IC semiconductor chip packaging equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111785664A true CN111785664A (en) | 2020-10-16 |
Family
ID=72768572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010675230.3A Withdrawn CN111785664A (en) | 2020-07-14 | 2020-07-14 | IC semiconductor chip packaging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111785664A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112382598A (en) * | 2020-11-06 | 2021-02-19 | 莱西市亨元产业互联网中心 | 5G chip packaging equipment |
| CN112420585A (en) * | 2020-11-06 | 2021-02-26 | 莱西市亨元产业互联网中心 | 5G chip packaging method |
| CN113675130A (en) * | 2021-07-29 | 2021-11-19 | 江苏美斯其新材料科技有限公司 | Chip arranging machine for chip packaging and using method |
| CN113964284A (en) * | 2021-09-29 | 2022-01-21 | 咱利邓 | Thin film packaging structure and thin film packaging method |
| CN114121726A (en) * | 2021-11-05 | 2022-03-01 | 星源电子科技(深圳)有限公司 | Packaging system for processing Micro-LED chip |
| CN114256109A (en) * | 2021-12-22 | 2022-03-29 | 荣耀智能(山东)电子有限公司 | Packaging manufacturing equipment for multi-chip integrated circuit |
| CN114678298A (en) * | 2022-03-14 | 2022-06-28 | 珠海市众知科技有限公司 | Integrated circuit block pin packaging hardware |
| CN116884907A (en) * | 2023-08-30 | 2023-10-13 | 翼龙半导体设备(无锡)有限公司 | IC semiconductor chip packaging equipment |
-
2020
- 2020-07-14 CN CN202010675230.3A patent/CN111785664A/en not_active Withdrawn
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112382598A (en) * | 2020-11-06 | 2021-02-19 | 莱西市亨元产业互联网中心 | 5G chip packaging equipment |
| CN112420585A (en) * | 2020-11-06 | 2021-02-26 | 莱西市亨元产业互联网中心 | 5G chip packaging method |
| CN113675130A (en) * | 2021-07-29 | 2021-11-19 | 江苏美斯其新材料科技有限公司 | Chip arranging machine for chip packaging and using method |
| CN113675130B (en) * | 2021-07-29 | 2022-04-29 | 江苏美斯其新材料科技有限公司 | Chip arranging machine for chip packaging and using method |
| CN113964284A (en) * | 2021-09-29 | 2022-01-21 | 咱利邓 | Thin film packaging structure and thin film packaging method |
| CN113964284B (en) * | 2021-09-29 | 2024-01-16 | 湖南永洋新材料有限公司 | Film packaging equipment and film packaging method |
| CN114121726A (en) * | 2021-11-05 | 2022-03-01 | 星源电子科技(深圳)有限公司 | Packaging system for processing Micro-LED chip |
| CN114121726B (en) * | 2021-11-05 | 2024-09-06 | 星源电子科技(深圳)有限公司 | Packaging system for Micro-LED chip processing |
| CN114256109A (en) * | 2021-12-22 | 2022-03-29 | 荣耀智能(山东)电子有限公司 | Packaging manufacturing equipment for multi-chip integrated circuit |
| CN114678298A (en) * | 2022-03-14 | 2022-06-28 | 珠海市众知科技有限公司 | Integrated circuit block pin packaging hardware |
| CN116884907A (en) * | 2023-08-30 | 2023-10-13 | 翼龙半导体设备(无锡)有限公司 | IC semiconductor chip packaging equipment |
| CN116884907B (en) * | 2023-08-30 | 2024-04-12 | 翼龙半导体设备(无锡)有限公司 | IC semiconductor chip packaging equipment |
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| PB01 | Publication | ||
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20201016 |
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| WW01 | Invention patent application withdrawn after publication |