CN113964284B - Film packaging equipment and film packaging method - Google Patents
Film packaging equipment and film packaging method Download PDFInfo
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- CN113964284B CN113964284B CN202111154701.7A CN202111154701A CN113964284B CN 113964284 B CN113964284 B CN 113964284B CN 202111154701 A CN202111154701 A CN 202111154701A CN 113964284 B CN113964284 B CN 113964284B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 109
- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000010408 film Substances 0.000 claims abstract description 95
- 238000001816 cooling Methods 0.000 claims abstract description 83
- 238000007789 sealing Methods 0.000 claims abstract description 80
- 238000003825 pressing Methods 0.000 claims abstract description 32
- 230000000694 effects Effects 0.000 claims abstract description 23
- 239000010409 thin film Substances 0.000 claims abstract description 20
- 239000000110 cooling liquid Substances 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims description 21
- 238000005538 encapsulation Methods 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 238000007493 shaping process Methods 0.000 claims description 9
- 229920006280 packaging film Polymers 0.000 claims description 6
- 239000012785 packaging film Substances 0.000 claims description 6
- 230000009471 action Effects 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 13
- 229920000647 polyepoxide Polymers 0.000 abstract description 13
- 239000000758 substrate Substances 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 5
- 239000007787 solid Substances 0.000 abstract description 5
- 238000002844 melting Methods 0.000 abstract description 4
- 230000008018 melting Effects 0.000 abstract description 4
- 230000004888 barrier function Effects 0.000 description 8
- 238000012858 packaging process Methods 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Package Closures (AREA)
Abstract
The invention belongs to the technical field of packaging structures and packaging methods: in particular to a film packaging structure and a film packaging method; in the prior art, the OLED device package is formed by bonding a rigid substrate and a cover plate by epoxy resin, but the solid net structure formed by curing the OLED device package is easy to generate larger internal stress to crack and embrittle the epoxy resin, so that the sealing performance of the film package is reduced; the direct film material is melted and packaged on the surface of the device, and a high temperature of hundreds of DEG C for melting the film material is generated in the process, so that the performance of the packaged device is influenced; according to the invention, the track of the thin film packaging device is displayed on the table top of the packaging table by the bearing sheet and the heat conducting rod which are arranged on the packaging table and the pressing of the pressing frame, so that the cooling performance of the cooling liquid in the heat conducting tank is transferred to the device on the corresponding bearing sheet only through the heat conducting rod, the heat of the packaged device is controlled in real time, and the thin film packaging effect on the device is maintained.
Description
Technical Field
The invention belongs to the technical field of packaging equipment and packaging methods: in particular to a film packaging device and a film packaging method.
Background
The organic light-emitting diode (OLED) has the characteristics of ultra-thin property, full solid state high light-emitting brightness and efficiency, excellent color saturation, wide visual angle, quick response, wide application prospect, application temperature range of 40 ℃ below zero to 70 ℃ above zero, and the like, but water vapor and oxygen have negative effects on the performance and service life of the OLED, the problem is usually solved by adopting thin film encapsulation, the traditional OLED device encapsulation is that a rigid substrate and a cover plate are bonded by epoxy resin, the whole encapsulation process is filled with inert gas, the epoxy resin has excellent bonding performance, the solid net structure formed by curing is easy to generate larger internal stress to crack and embrittle the epoxy resin, and the sealing property of the thin film encapsulation is reduced; and the direct film material is melted and packaged on the surface of the device, and a high temperature of hundreds of DEG C is generated in the process for melting the film material, so that the performance of the packaged device is influenced, and the packaged device needs to be subjected to instant heat control to maintain the stability of the performance of the device.
A chinese patent with application number CN201511028107.8 provides a thin film package structure, which includes a plurality of planarization layers and barrier layers stacked and spaced apart on a substrate; the projection area of the barrier layer on the substrate is not smaller than the projection area of the barrier layer on the substrate; and the projection of the barrier layer on the substrate covers the part of the edge of the barrier layer projected on the substrate; gaps between adjacent barrier layers are not fully exposed to the external environment, so that transverse penetration of water and oxygen is effectively blocked, and the packaging effect is good; according to the thin film packaging method, the back barrier layer is covered on the front barrier layer by the mask compensation method, so that the number of masks can be effectively reduced, and the cost of the masks is reduced; in addition, a plurality of preparation chambers can be shared, so that the production time is effectively saved, and the productivity is improved; meanwhile, the flexibility of the equipment is improved; however, the film packaging structure does not solve the problem that the high temperature of the heat seal causes damage to the device packaged by the film when the film is packaged, and can not package different devices.
In view of the above, the present invention provides a thin film packaging apparatus and a thin film packaging method, which solve the above-mentioned technical problems.
Disclosure of Invention
In order to make up the defects of the prior art, the invention provides film packaging equipment, which is used for cooling a film packaged device while packaging the film by arranging a condensation pool, so that the damage to the film packaged device caused by overhigh temperature during heat sealing is avoided.
The technical scheme adopted by the invention for solving the technical problems is that the film packaging equipment comprises a packaging machine and a controller, wherein a base frame and a packaging table are arranged in the packaging machine; a packaging table is arranged in the base frame; a heat conduction pool which is fixedly connected is arranged below the packaging table, and cooling liquid is filled in the heat conduction pool; the top of the spring is fixedly connected with a bearing sheet, the bottom surface of the bearing sheet is fixedly connected with a heat conducting rod, and the bottom of the heat conducting rod extends into the heat conducting pool through the through hole; the bearing sheets at the top ends of the springs are distributed on the table top of the packaging table in a clearance way and form bearing surfaces; a pressing frame is fixedly connected to the base frame above the packaging table, and the pressing frame stretches and presses the table top of the packaging table under the action of the controller; an electric sliding rod is arranged on the outer side of the packaging table, the top end of the electric sliding rod is fixed on the base frame, a fixedly connected mechanical arm is arranged on a sliding block of the electric sliding rod, a solar frame is fixedly arranged at the tail end of the mechanical arm, and a heat sealing wheel is rotatably arranged on the solar frame; the controller is used for adjusting the operation of the packaging machine;
in the prior art, the OLED device is packaged by bonding a rigid substrate and a cover plate by epoxy resin, and the whole packaging process is filled with inert gas, so that the epoxy resin has excellent bonding performance, but a solid net structure formed by curing the epoxy resin is easy to generate larger internal stress to crack and embrittle the epoxy resin, so that the sealing performance of the film package is reduced; the direct film material is melted and packaged on the surface of the device, and a high temperature of hundreds of DEG C is generated in the process for melting the film material, so that the performance of the packaged device is influenced, and the packaged device needs to be subjected to instant heat control to maintain the stability of the performance of the device;
therefore, when the device to be packaged is placed on the packaging table in operation, the controller controls the pressing frame to press downwards so as to overcome the elasticity of the spring, the bearing sheet below the device is pressed downwards, the packaging track of the device to be packaged is displayed, the sensor at the top of the base frame immediately transmits the packaging track of the device to be packaged to the controller by detecting the distance between the sensor and the bearing sheet, the mechanical arm is controlled to move so as to move the heat sealing wheel to the packaging track, and then the heat sealing wheel is controlled to heat-seal the device to be packaged according to the packaging track, when the device is heat-sealed, the spring at the bottom of the bearing sheet below the device is downwards pressed by the pressing frame so as to drive the lower end of the heat conducting rod fixedly connected to the lower end of the bearing sheet to extend into the cooling liquid of the heat conducting pool, and the heat of the heat-sealed device on the bearing sheet is immediately transmitted into the cooling liquid through the heat conducting rod, so that the device is prevented from being damaged by performance caused by high temperature during heat sealing; after the packaging is finished, the mechanical arm is controlled to move, the heat sealing wheel is moved to an initial position, the pressing frame is controlled to move upwards immediately, and the device with the film packaged is taken out;
according to the invention, the track of the thin film packaging device is displayed on the table top of the packaging table by the bearing sheet and the heat conducting rod which are arranged on the packaging table and matched with the pressing of the pressing frame, so that the cooling performance of the cooling liquid in the heat conducting pool is transferred to the device on the corresponding bearing sheet only through the heat conducting rod, and the heat of the packaged device is controlled in real time.
Preferably, the solar frame is also rotatably provided with a cooling wheel, the lower surface of the cooling wheel and the lower surface of the heat sealing wheel are on the same horizontal plane, the diameter of the cooling wheel is larger than that of the heat sealing wheel, and the width of the cooling wheel is wider than that of the heat sealing wheel; the cooling wheel is wider than the heat sealing wheel, and is pressed to a bearing sheet which is not contacted with the heat sealing wheel at the outer side of a track pressed by the heat sealing wheel through the larger width of the cooling wheel during heat sealing, the bearing sheet pressed by the cooling wheel downwards extrudes a spring connected with the bearing sheet against the self elasticity, a heat conducting rod stretches into a heat conducting pool, the bearing sheet is cooled through the heat conducting rod, the temperature of the cooling wheel is controlled in real time through heat conduction, and the temperature rise of the cooling wheel in the continuous packaging process is prevented; the cooling wheel is positioned at the rear of the moving track of the heat sealing wheel, and is used for cooling and shaping the film packaged by the heat sealing wheel so as to achieve better packaging effect, and the larger diameter of the cooling wheel enhances the contact area of the cooling wheel after the film is packaged, so that the heat dissipation performance of the cooling wheel is further improved, and the effect of film packaging is maintained.
Preferably, the solar rack is fixedly connected with a blade, and the blade is obliquely arranged at the outer side of the heat sealing wheel; the tip of the blade is also provided with a flange which is parallel to the surface of the bearing sheet; when the heat sealing wheel does not work, the blade moves along with the heat sealing wheel, the cutter point stretches into the film fused and packaged on the surface of the device so as to achieve the effect of cutting the film, the cutting is completed when the film is heat-sealed, the tip of the blade is parallel to the flange of the bearing piece, the film at the cutting part is in a pressed state, when the blade cuts the film, the phenomenon of pulling when the blade cuts the film is avoided, and the flatness of the edge of the film cut by the blade is maintained.
Preferably, the mechanical arm is fixedly connected with a cooling fan, and the cooling fan is inclined towards the blade and the cooling wheel; the cooling fan is arranged to cool the blade when the blade works, so that the film at the cutting part of the blade is prevented from being adhered to the blade due to the fact that the temperature of the film at the cutting part of the blade is too high during heat sealing, the effect of cutting the film is poor; the cooling fan is inclined towards the cooling wheel, and has a cooling effect on the cooling wheel, so that the temperature of the cooling wheel is ensured to be always kept in a low-temperature state, and the cooling effect is maintained.
Preferably, the lower end of the cooling fan is fixedly connected with fins, the lower end of each fin is fixedly connected with an aluminum sheet, and the lower end of each aluminum sheet is fixedly connected to the blade; the fin arranged at the lower end of the cooling fan is connected with the blade through the aluminum sheet and used for playing a role in heat conduction to the blade, radiating the blade in a compound heat exchange mode, combining the cooling fan on the fin, ensuring that the blade is in a low-temperature state when cutting films, and simultaneously playing a cooling and shaping effect on the films contacted during cutting.
The invention relates to a film packaging method, which uses the film packaging equipment and comprises the following steps:
s1: determining a device to be packaged by a film, selecting a proper packaging film according to the requirement of the device, and preparing the device and the film;
s2: placing the device on a packaging table, adjusting the position of the device right below a pressing frame on a base frame, and then placing a packaging film on the device; the pressing frame is controlled to press downwards, the spring below the bearing sheet moves downwards by 2-4 mm against the elasticity, the bearing sheet moves downwards, the lower end of the heat conducting rod connected with the lower end of the bearing sheet stretches into the heat conducting pool, and the heat conducting pool controls the temperature of the bearing sheet to be between 30 ℃ and 50 ℃ through the heat conducting rod;
s3: the packaging track of the device is detected, the mechanical arm is controlled to move the solar frame, the temperature change interval of the heat sealing wheel on the solar frame is between 110 ℃ and 160 ℃, the temperature of the heat sealing wheel is set according to the types of the films, the heat sealing wheel packages the films, meanwhile, the blades on the side edges of the heat sealing wheel cut the films, and the blades radiate heat through the heat radiation fan and the fins, so that the situation that the temperature of the films at the cut part is too high in the cutting process of the blades and adhesion occurs is avoided; after the heat sealing wheel is used for heat sealing, the cooling wheel carries out cooling shaping on the film packaging track so as to achieve a better film packaging effect, and after cooling is finished, the mechanical arm is controlled to move away the solar rack;
s4: after the film encapsulation is finished, the pressing frame is moved upwards, the spring is restored to the original height, and then the encapsulated device is taken away.
The beneficial effects of the invention are as follows:
1. according to the invention, the device is pressed down through the spring and the carrier arranged on the packaging table top by the pressing frame above the packaging table top, and the packaging track is detected by infrared rays, so that different devices can be subjected to film packaging, equipment does not need to be replaced, and resources and working sites can be saved.
1. According to the invention, the condensing table is arranged, the heat conducting rod fixedly connected to the packaging table is extruded, the lower end of the heat conducting rod stretches into the condensing tank, the temperature of the packaging table surface is reduced through the heat conducting rod, the device to be packaged is prevented from being damaged due to high temperature during heat sealing, and the effect of film packaging is not influenced.
2. According to the invention, the thin film is cut while being heat-sealed by the blade, so that the thin film is heat-sealed and cut at the same time, the angle between the blade and the heat sealing wheel is set, when the blade cuts the thin film, the device is prevented from being scratched, and the blade is kept at a low temperature under the action of the cooling fan, so that the effect is better when the blade cuts.
Drawings
The invention is further described below with reference to the drawings and embodiments:
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a perspective view of a daily rack component of the present invention;
FIG. 3 is a cross-sectional perspective view of the encapsulation station of the present invention;
FIG. 4 is a flow chart of a thin film encapsulation method of the present invention;
in the figure: 1. a base frame; 11. a pressing frame; 2. a packaging table; 21. a heat conduction pool; 22. a spring; 23. a carrier sheet; 24. a heat conduction rod; 4. an electric slide bar; 51. a mechanical arm; 52. a sun-shaped frame; 53. a heat sealing wheel; 54. a cooling wheel; 55. a blade; 551. a flange; 56. an aluminum sheet; 57. a heat radiation fan; 58. and (5) fins.
Detailed Description
The invention is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
As shown in fig. 1 and 3, the film packaging device of the invention comprises a packaging machine and a controller, wherein a base frame 1 and a packaging table 2 are arranged in the packaging machine; a packaging table 2 is arranged in the base frame 1; a heat conduction pool 21 is fixedly connected below the packaging table 2, and cooling liquid is filled in the heat conduction pool 21; the table top of the packaging table 2 is provided with densely arranged through holes, the upper end of a port of each through hole is provided with a fixedly connected spring 22, the springs 22 and the through holes are coaxial, the top ends of the springs 22 are fixedly connected with a bearing sheet 23, the bottom surface of the bearing sheet 23 is fixedly connected with a heat conducting rod 24, and the bottom of the heat conducting rod 24 extends into the heat conducting pool 21 through the through hole; the bearing sheets 23 at the top ends of the springs 22 are distributed on the table top of the packaging table 2 in a clearance way and form a bearing surface; a pressing frame 11 is fixedly connected to the base frame 1 above the packaging table 2, and the pressing frame 11 stretches and presses the table top of the packaging table 2 under the action of a controller; an electric sliding rod 4 is arranged on the outer side of the packaging table 2, the top end of the electric sliding rod 4 is fixed on the base frame 1, a fixedly connected mechanical arm 51 is arranged on a sliding block of the electric sliding rod 4, a daily-shaped frame 52 is fixedly arranged at the tail end of the mechanical arm 51, and a heat sealing wheel 53 is rotatably arranged on the daily-shaped frame 52; the controller is used for adjusting the operation of the packaging machine;
in the prior art, the OLED device is packaged by bonding a rigid substrate and a cover plate by epoxy resin, and the whole packaging process is filled with inert gas, so that the epoxy resin has excellent bonding performance, but a solid net structure formed by curing the epoxy resin is easy to generate larger internal stress to crack and embrittle the epoxy resin, so that the sealing performance of the film package is reduced; the direct film material is melted and packaged on the surface of the device, and a high temperature of hundreds of DEG C is generated in the process for melting the film material, so that the performance of the packaged device is influenced, and the packaged device needs to be subjected to instant heat control to maintain the stability of the performance of the device;
therefore, when the device to be packaged is placed on the packaging table 2 in operation, the controller controls the pressing frame 11 to press downwards so as to overcome the elasticity of the spring 22, the bearing sheet 23 below the device is pressed downwards, the packaging track of the device to be packaged is displayed, then the sensor at the top of the base frame 1 transmits the packaging track of the device to be packaged to the controller by detecting the distance between the sensor and the bearing sheet 23, the mechanical arm 51 is further controlled to move so as to move the heat sealing wheel 53 to the packaging track, and then the heat sealing wheel 53 is controlled to heat-seal the device to be packaged according to the packaging track, when the device is heat-sealed, the spring 22 at the bottom of the Fang Cheng slide 23 below the device is downwards pressed downwards by the pressing frame 11 so as to drive the lower end of the heat conducting rod 24 fixedly connected to the lower end of the bearing sheet 23 to extend into the cooling liquid of the heat conducting pool 21, and the heat of the device on the bearing sheet 23 is immediately conducted into the cooling liquid through the heat conducting rod 24, so that the device is prevented from being damaged by high temperature; after the encapsulation is finished, the mechanical arm 51 is controlled to move, the heat sealing wheel 53 is moved to an initial position, the pressing frame 11 is controlled to move upwards immediately, and the device with the encapsulated film is taken out;
according to the invention, the track of the thin film packaging device is displayed on the table top of the packaging table 2 through the bearing sheet 23 and the heat conducting rod 24 which are arranged on the packaging table 2 and the pressing of the pressing frame 11, so that the cooling performance of the cooling liquid in the heat conducting pool 21 is transferred to the device on the corresponding bearing sheet 23 only through the heat conducting rod 24, and the heat of the packaged device is controlled immediately.
As an embodiment of the present invention, the solar-type frame 52 is further rotatably provided with a cooling wheel 54, the lower surface of the cooling wheel 54 is on the same horizontal plane with the lower surface of the heat-sealing wheel 53, the diameter of the cooling wheel 54 is larger than that of the heat-sealing wheel 53, and the width of the cooling wheel 54 is wider than that of the heat-sealing wheel 53; the cooling wheel 54 is wider than the heat sealing wheel 53, and during heat sealing, the cooling wheel 54 is wider than the heat sealing wheel 53, the cooling wheel 54 presses the carrier sheet 23 which is pressed by the heat sealing wheel 53 and is not contacted with the heat sealing wheel 53 outside the track, the carrier sheet 23 pressed by the cooling wheel 54 presses down the spring 22 connected with the carrier sheet 23 against the self elastic force, the heat conducting rod 24 stretches into the heat conducting pool 21, the carrier sheet 23 is cooled through the heat conducting rod 24, the temperature of the cooling wheel 54 is controlled in real time through heat conduction, and the temperature of the cooling wheel 54 is prevented from rising in the continuous packaging process; the cooling wheel 54 is positioned at the rear of the moving track of the heat sealing wheel 53, and is used for cooling and shaping the film packaged by the heat sealing wheel 53 so as to achieve a better packaging effect, and the larger diameter of the cooling wheel 54 enhances the contact area of the film after packaging, further improves the heat dissipation performance and maintains the film packaging effect.
As an embodiment of the present invention, the solar frame 52 is fixedly connected with a blade 55, and the blade 55 is obliquely installed at the outer side of the heat sealing wheel 53; the tips of the blades 55 are also provided with flanges 551, the flanges 551 being parallel to the surface of the carrier sheet 23; when the heat sealing wheel 53 does not work, the blade 55 moves along with the heat sealing wheel 53, and the cutter tip extends into the film melt-packaged on the surface of the device so as to achieve the effect of cutting the film, the cutting is completed when the film is heat-sealed, the tip of the blade 55 is parallel to the flange 551 of the carrier piece 23, the film at the cutting position is in a pressed state, when the blade 55 cuts the film, the phenomenon of pulling during cutting the film is avoided, and the flatness of the edge of the cut film by the blade 55 is kept.
As an embodiment of the present invention, a cooling fan 57 is fixedly connected to the mechanical arm 51, and the cooling fan 57 is inclined toward the blade 55 and the cooling wheel 54; when the blade 55 works, the heat dissipation fan 57 dissipates heat of the blade 55, in order to prevent the film at the cutting part of the blade 55 from being adhered to the blade 55 due to overhigh temperature during heat sealing, so that the effect of cutting the film is poor; the cooling fan 57 is inclined toward the cooling wheel 54, and also has a cooling effect on the cooling wheel 54, ensuring that the temperature of the cooling wheel 54 is always maintained at a low temperature state to maintain the cooling effect thereof.
As an embodiment of the present invention, the lower end of the heat dissipation fan 57 is fixedly connected with a fin 58, the lower end of the fin 58 is fixedly connected with an aluminum sheet 56, and the lower end of the aluminum sheet 56 is fixedly connected with the blade 55; the fin 58 arranged at the lower end of the cooling fan 57 is connected with the blade 55 through the aluminum sheet 56 and is used for playing a role in heat conduction to the blade 55, cooling the blade 55 in a compound heat exchange mode, and combining with the cooling fan 57 on the fin 58, ensuring that the blade 55 is in a low-temperature state when cutting films, and simultaneously playing a cooling and shaping effect on the films contacted during cutting.
The invention relates to a film packaging method, which uses the film packaging equipment and comprises the following steps:
s1: determining a device to be packaged by a film, selecting a proper packaging film according to the requirement of the device, and preparing the device and the film;
s2: placing the device on the packaging table 2, adjusting the position of the device right below the pressing frame 11 on the base frame 1, and then placing the packaging film on the device; the pressing frame 11 is controlled to press downwards, the spring 22 below the carrying sheet 23 moves downwards by 2-4 mm against the elasticity, the carrying sheet 23 moves downwards, the lower end of the heat conducting rod 24 connected with the lower end of the carrying sheet 23 stretches into the heat conducting pool 21, and the heat conducting pool 21 controls the temperature of the carrying sheet 23 to be between 30 ℃ and 50 ℃ through the heat conducting rod 24;
s3: the packaging track of the device is detected, the mechanical arm 51 is controlled to move the solar frame 52, the temperature change interval of the heat sealing wheel 53 on the solar frame 52 is between 110 ℃ and 160 ℃, the temperature of the heat sealing wheel 53 is set according to the types of the films, the heat sealing wheel 53 packages the films, meanwhile, the blades 55 on the side edges of the heat sealing wheel 53 cut the films, the blades 55 radiate heat through the heat radiation fan 57 and the fins 58, and the phenomenon that the temperature of the cut films is too high in the cutting process of the blades 55 and adhesion occurs is avoided; after the heat sealing wheel 53 heat seals, the cooling wheel 54 carries out cooling shaping on the film packaging track so as to achieve better film packaging effect, and after cooling is finished, the mechanical arm 51 is controlled to move away the solar-type frame 52;
s4: after the film encapsulation is completed, the pressing frame 11 is moved upwards, the spring 22 is restored to the original height, and the encapsulated device is taken away.
The specific working procedure is as follows:
when the device to be packaged is operated, the device to be packaged is placed on the packaging table 2, the controller controls the pressing frame 11 to press downwards so as to overcome the elasticity of the spring 22, the bearing sheet 23 below the device is pressed downwards, the packaging track of the device to be packaged is displayed, the sensor at the top of the base frame 1 immediately transmits the packaging track of the device to be packaged to the controller by detecting the distance between the sensor and the bearing sheet 23, the mechanical arm 51 is further controlled to move, the heat sealing wheel 53 is moved to the packaging track, the heat sealing wheel 53 is immediately controlled to heat-seal the device to be packaged according to the packaging track, and when the device is heat-sealed, the spring 22 at the bottom of the Fang Cheng slide 23 below the device is downwards pressed by the pressing frame 11 so as to drive the lower end of the heat conducting rod 24 fixedly connected to the lower end of the bearing sheet 23 to extend into the cooling liquid of the heat conducting pool 21, the heat of the device to be heat-sealed on the bearing sheet 23 is immediately conducted into the cooling liquid through the heat conducting rod 24, and performance damage caused by high temperature of the device is avoided; after the encapsulation is finished, the mechanical arm 51 is controlled to move, the heat sealing wheel 53 is moved to an initial position, the pressing frame 11 is controlled to move upwards immediately, and the device with the encapsulated film is taken out; during heat sealing, the heat-sealing roller 54 is pressed to the carrier sheet 23 which is not contacted by the heat-sealing roller 53 at the outer side of the track pressed by the heat-sealing roller 53 through the larger width of the heat-sealing roller 54, the carrier sheet 23 pressed by the heat-sealing roller 54 downwards extrudes the spring 22 connected with the carrier sheet 23 against the self elastic force, the heat-conducting rod 24 stretches into the heat-conducting pool 21, the carrier sheet 23 is cooled through the heat-conducting rod 24, the temperature of the heat-sealing roller 54 is controlled in real time through heat conduction, and the temperature of the heat-sealing roller 54 is prevented from rising in the continuous packaging process; the cooling wheel 54 is positioned at the rear of the moving track of the heat sealing wheel 53 and is used for cooling and shaping the film packaged by the heat sealing wheel 53; the fin 58 arranged at the lower end of the cooling fan 57 is connected with the blade 55 through the aluminum sheet 56 and is used for playing a role in heat conduction to the blade 55, cooling the blade 55 in a compound heat exchange mode, and combining with the cooling fan 57 on the fin 58, ensuring that the blade 55 is in a low-temperature state when cutting films, and simultaneously playing a role in cooling and shaping the films contacted during cutting.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which is defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. A thin film encapsulation apparatus, characterized in that: the packaging machine comprises a packaging machine and a controller, wherein a base frame (1) and a packaging table (2) are arranged in the packaging machine; a packaging table (2) is arranged in the base frame (1); a heat conduction pool (21) which is fixedly connected is arranged below the packaging table (2), and cooling liquid is filled in the heat conduction pool (21); densely arranged through holes are formed in the table top of the packaging table (2), springs (22) are fixedly connected to the upper ends of ports of the through holes, the springs (22) are coaxial with the through holes, a bearing sheet (23) is fixedly connected to the top end of each spring (22), a heat conducting rod (24) is fixedly connected to the bottom surface of each bearing sheet (23), and the bottoms of the heat conducting rods (24) extend into the heat conducting pool (21) through the through holes; the bearing sheets (23) at the top ends of the springs (22) are arranged at intervals on the table top of the packaging table (2) and form bearing surfaces; a pressing frame (11) is fixedly connected to the base frame (1) above the packaging table (2), and the pressing frame (11) stretches and presses the table top of the packaging table (2) under the action of the controller; an electric sliding rod (4) is arranged on the outer side of the packaging table (2), the top end of the electric sliding rod (4) is fixed on the base frame (1), a fixedly connected mechanical arm (51) is arranged on a sliding block of the electric sliding rod (4), a daily-shaped frame (52) is fixedly arranged at the tail end of the mechanical arm (51), and a heat sealing wheel (53) is rotatably arranged on the daily-shaped frame (52); the controller is used for adjusting the operation of the packaging machine.
2. A thin film encapsulation apparatus as recited in claim 1, wherein: the solar-type frame (52) is also rotatably provided with a cooling wheel (54), the lower surface of the cooling wheel (54) and the lower surface of the heat sealing wheel (53) are arranged on the same horizontal plane, the diameter of the cooling wheel (54) is larger than that of the heat sealing wheel (53), and the width of the cooling wheel (54) is wider than that of the heat sealing wheel (53); the cooling wheel (54) is wider than the heat sealing wheel (53).
3. A thin film encapsulation apparatus as recited in claim 2, wherein: the solar rack (52) is fixedly connected with a blade (55), and the blade (55) is obliquely arranged at the outer side of the heat sealing wheel (53); the tips of the blades (55) are also provided with flanges (551), the flanges (551) being parallel to the surface of the carrier sheet (23).
4. A thin film encapsulation apparatus as recited in claim 1, wherein: and the mechanical arm (51) is fixedly connected with a cooling fan (57), and the cooling fan (57) is inclined towards the blade (55) and the cooling wheel (54).
5. A thin film encapsulation apparatus as recited in claim 4, wherein: the lower extreme fixedly connected with fin (58) of radiator fan (57), fin (58) lower extreme fixedly connected with aluminum sheet (56), the lower extreme fixedly connected with of aluminum sheet (56) is on blade (55).
6. A film encapsulation method, characterized in that: the method using the thin film encapsulation apparatus of any one of claims 1-5, the method comprising the steps of: s1: determining a device to be packaged by a film, selecting a proper packaging film according to the requirement of the device, and preparing the device and the film; s2: placing the device on a packaging table (2), adjusting the position of the device right below a pressing frame (11) on a base frame (1), and then placing a packaging film on the device; the pressing frame (11) is controlled to press downwards, a spring (22) below the carrying sheet (23) moves downwards by 2-4 mm against the elasticity, the carrying sheet (23) moves downwards, the lower end of a heat conducting rod (24) connected with the lower end of the carrying sheet (23) stretches into the heat conducting pool (21), and the heat conducting pool (21) controls the temperature of the carrying sheet (23) to be between 30 ℃ and 50 ℃ through the heat conducting rod (24); s3: the packaging track of the device is detected, the mechanical arm (51) is controlled to move the solar frame (52) immediately, the temperature change interval of the heat sealing wheel (53) on the solar frame (52) is between 110 ℃ and 160 ℃, the temperature of the heat sealing wheel (53) is set according to the type of the film, the heat sealing wheel (53) packages the film, meanwhile, the blade (55) on the side edge of the heat sealing wheel (53) cuts the film, the blade (55) radiates heat through the heat radiation fan (57) and the fins (58), and the phenomenon that the film temperature of a cut part is too high in the cutting process of the blade (55) is avoided, so that adhesion occurs; after the heat sealing wheel (53) is used for heat sealing, the cooling wheel (54) is used for cooling and shaping the film packaging track so as to achieve a better film packaging effect, and after cooling is finished, the mechanical arm (51) is controlled to move away the solar rack (52); s4: after the film encapsulation is finished, the pressing frame (11) is moved upwards, the spring (22) is restored to the original height, and then the encapsulated device is taken away.
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| CN202111154701.7A CN113964284B (en) | 2021-09-29 | 2021-09-29 | Film packaging equipment and film packaging method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111154701.7A CN113964284B (en) | 2021-09-29 | 2021-09-29 | Film packaging equipment and film packaging method |
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| KR20110080963A (en) * | 2010-01-07 | 2011-07-13 | 충북대학교 산학협력단 | Thermoelectric cooler for printed circuit board with flip chip bonding |
| CN109887863A (en) * | 2019-01-31 | 2019-06-14 | 任飞 | A kind of integrated antenna package plate and its erector |
| CN111430578A (en) * | 2020-04-29 | 2020-07-17 | 江苏集萃有机光电技术研究所有限公司 | O L ED device packaging clamp and O L ED device packaging method |
| CN111785664A (en) * | 2020-07-14 | 2020-10-16 | 段晓丽 | IC semiconductor chip packaging equipment |
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2021
- 2021-09-29 CN CN202111154701.7A patent/CN113964284B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110080963A (en) * | 2010-01-07 | 2011-07-13 | 충북대학교 산학협력단 | Thermoelectric cooler for printed circuit board with flip chip bonding |
| CN109887863A (en) * | 2019-01-31 | 2019-06-14 | 任飞 | A kind of integrated antenna package plate and its erector |
| CN111430578A (en) * | 2020-04-29 | 2020-07-17 | 江苏集萃有机光电技术研究所有限公司 | O L ED device packaging clamp and O L ED device packaging method |
| CN111785664A (en) * | 2020-07-14 | 2020-10-16 | 段晓丽 | IC semiconductor chip packaging equipment |
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Effective date of registration: 20231220 Address after: 411199 Xiangtan Economic Development Zone Heping Street, Xiangtan City, Hunan Province, No. 6 Bonded Sixth Road, Xiangtan Comprehensive Bonded Zone Standard Factory Building 1 # 1st Floor, Xiangtan Comprehensive Bonded Zone Applicant after: Hunan Yongyang New Materials Co.,Ltd. Address before: 223900 1003, building 9, Guangxia Huayuan, No. 24, Renmin South Road, Sihong County, Suqian City, Jiangsu Province Applicant before: Zan Lideng |
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