CN220086020U - Semiconductor packaging clamping mechanism - Google Patents
Semiconductor packaging clamping mechanism Download PDFInfo
- Publication number
- CN220086020U CN220086020U CN202321652148.4U CN202321652148U CN220086020U CN 220086020 U CN220086020 U CN 220086020U CN 202321652148 U CN202321652148 U CN 202321652148U CN 220086020 U CN220086020 U CN 220086020U
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- disc
- fixedly connected
- sliding block
- sliding
- fixed shaft
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 62
- 238000004806 packaging method and process Methods 0.000 title abstract description 11
- 238000000034 method Methods 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 37
- 239000000463 material Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Abstract
The utility model belongs to the technical field of semiconductor processing, and particularly relates to a semiconductor packaging clamping mechanism, which comprises a workbench, wherein the upper end of a first disc is fixedly connected with a second self-locking motor and a second connecting shaft, the circumference surface of a sliding rod is slidably connected with a sliding block, the sliding block is slidably connected with a sliding hole, the upper end of the sliding block is fixedly connected with a clamping piece, the lower end of the sliding block is fixedly connected with a second fixed shaft, a connecting rod is rotationally connected with the second fixed shaft, the lower end of the workbench is fixedly connected with a first self-locking motor, and the output shaft end of the first self-locking motor is fixedly connected with the first disc; the utility model can rotate and adjust the position of the clamped and fixed semiconductor wafer without manual rotation of workers, is more convenient and rapid in the process, saves time, and facilitates the omnibearing processing and packaging operation of different positions of the semiconductor wafer along with the rotation of the semiconductor wafer.
Description
Technical Field
The utility model belongs to the technical field of semiconductor processing, and particularly relates to a semiconductor packaging clamping mechanism.
Background
Semiconductors refer to materials with conductivity between conductors and insulators at normal temperature, and have many applications in the fields of integrated circuit consumer electronics, communication systems, photovoltaic power generation lighting, high-power conversion, and the like. For example, a diode is a device fabricated by using a semiconductor, and the importance of the semiconductor is very great from the viewpoint of technology or economic development. Common semiconductor materials are silicon, gallium arsenide, and the like. Silicon is one of the most influential applications in various semiconductor materials. In the semiconductor manufacturing process, raw material silicon of a semiconductor is purified and then manufactured into a wafer, and the wafer is the most basic carrier of chips in various electronic devices.
At present, before the packaging processing is performed on the semiconductor wafer, the semiconductor wafer needs to be clamped and fixed to ensure that the semiconductor wafer can be stably processed and packaged, however, at present, after the semiconductor wafer is clamped and fixed, in the packaging process of the semiconductor wafer, the semiconductor wafer needs to be manually rotated to facilitate the omnibearing packaging, however, the process is troublesome, and the time is wasted due to manual rotation, so that the semiconductor packaging clamping mechanism is designed.
Disclosure of Invention
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a semiconductor encapsulation fixture, comprises a workbench, the upper end of workstation rotates and is connected with first disc, the upper end fixedly connected with second auto-lock motor and the second connecting axle of first disc, the output axle head fixedly connected with second disc of second auto-lock motor, the upper end fixedly connected with first fixed axle of second disc, the circumference of first fixed axle rotates and is connected with the connecting rod, the circumference fixedly connected with bracing piece of second connecting axle, the inside fixedly connected with first connecting axle of bracing piece, the upper end fixedly connected with of first connecting axle places the dish, the sliding hole has been seted up to the up end of placing the dish, the inside fixedly connected with slide bar of sliding hole, the circumference sliding connection of slide bar has the sliding block, sliding connection between sliding block and the sliding hole, the upper end fixedly connected with clamping piece of sliding block, the lower extreme fixedly connected with second fixed axle of sliding block, the connecting rod is connected with the second fixed axle, the lower extreme fixedly connected with first motor of workstation, the output of first auto-lock motor and first disc head fixedly connected with.
Optionally, the inner wall of holder fixedly connected with flexible protection pad.
Optionally, the central axis of the first fixed shaft is not coincident with the central axis of the second disc, and the first fixed shaft is located at an eccentric position of the second disc.
Optionally, the end surface of the sliding block, which is contacted with the sliding hole, is in a cross shape.
Optionally, the first connecting axle, bracing piece and second connecting axle all are provided with three, and even distribution is placing the lower extreme of dish, bracing piece and second connecting axle all are located the lower extreme of second disc, the first connecting axle is located the upper end of second disc, first connecting axle, bracing piece and second connecting axle are integrated into one piece structure.
Optionally, the workstation comprises platform and supporting seat, the lower extreme fixedly connected with supporting seat of platform, the supporting seat is semicircle arc, the supporting seat is provided with two sets of, and the symmetric distribution is in the lower extreme of platform.
Optionally, the sliding hole, the sliding block, the sliding rod, the clamping piece, the second fixed shaft, the first fixed shaft and the connecting rod are all provided with three, and are uniformly distributed at the upper end of the second disc.
The utility model has the beneficial effects that:
the second self-locking motor is started to drive the second disc to rotate, under the action of the second disc, the connecting rod drives the sliding block and the clamping piece to move along the sliding hole, the semiconductor wafer placed on the placing disc can be clamped and fixed along with the movement of the clamping piece, the semiconductor wafer can be stably placed on the placing disc under the action of the clamping piece, the clamped semiconductor wafer rotates under the action of the first self-locking motor, the position of the clamped and fixed semiconductor wafer can be adjusted in a rotating mode, workers are not required to manually rotate and adjust the position of the semiconductor wafer, the process is more convenient and rapid, time is saved, and the semiconductor wafer can be conveniently processed and packaged in all directions along with the rotation of the semiconductor wafer at different positions.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of the overall structure of a front view of the present utility model;
FIG. 2 is a schematic diagram of the overall structure of the split front view of the present utility model;
FIG. 3 is an enlarged schematic view of the structure of FIG. 2A according to the present utility model;
FIG. 4 is a schematic view of the hidden workbench of the present utility model in a bottom view;
fig. 5 is an enlarged schematic view of the structure B of fig. 4 according to the present utility model.
The symbols in the drawings illustrate:
1. a work table; 2. placing a tray; 3. a clamping member; 4. a flexible protective pad; 5. a sliding hole; 6. a first disc; 7. a first connecting shaft; 8. a second disc; 9. a first fixed shaft; 10. a connecting rod; 11. a support rod; 12. a slide bar; 13. a sliding block; 14. a first self-locking motor; 15. the second self-locking motor; 16. a second connecting shaft; 17. and a second fixed shaft.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to fig. 1-5 and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
A description will now be given of a semiconductor package holding mechanism provided in an embodiment of the present utility model. The utility model provides a semiconductor encapsulation fixture, including workstation 1, the upper end of workstation 1 rotates and is connected with first disc 6, the upper end fixedly connected with second auto-lock motor 15 and second connecting axle 16 of first disc 6, the output axle head fixedly connected with second disc 8 of second auto-lock motor 15, the upper end fixedly connected with first fixed axle 9 of second disc 8, the circumference of first fixed axle 9 rotates and is connected with connecting rod 10, the circumference fixedly connected with bracing piece 11 of second connecting axle 16, the inside fixedly connected with first connecting axle 7 of bracing piece 11, the upper end fixedly connected with of first connecting axle 7 places the dish 2, the sliding hole 5 has been seted up to the up of placing the up end of dish 2, the inside fixedly connected with slide bar 12 of sliding bar 12, the circumference sliding connection of slide bar 12 has sliding block 13, sliding connection between sliding block 13 and the sliding hole 5, the upper end fixedly connected with holder 3 of sliding block 13, the lower extreme fixedly connected with second fixed axle 17 of sliding block 13, connecting rod 10 and second fixed axle 17 rotate and are connected, the lower extreme fixedly connected with first motor 14 of workstation 1, the output of first auto-lock motor 14 and first disc 6.
When the semiconductor wafer packaging machine works, a semiconductor wafer to be packaged is placed on the placing disc 2, then the second self-locking motor 15 is started to drive the second disc 8 to rotate, the second disc 8 rotates to drive the first fixed shaft 9 to rotate, the first fixed shaft 9 rotates to drive the connecting rod 10 to rotate and move, the connecting rod 10 rotates and moves under the cooperation of the second fixed shaft 17, the sliding block 13 is pulled to move along the sliding rod 12, meanwhile, the sliding block 13 pulls the clamping piece 3 to move, the semiconductor wafer can be clamped and fixed along with the movement of the clamping piece 3, the semiconductor wafer can be stably positioned on the placing disc 2, then the first self-locking motor 14 is started to drive the first disc 6 to rotate, under the action of the first disc 6, the second disc 8, the placing disc 2 and the semiconductor wafer positioned on the placing disc 2 simultaneously rotate, and along with the rotation of the semiconductor wafer, different positions of the semiconductor wafer can be conveniently processed, and packaging operation can be conveniently carried out.
Optionally, the inner wall of the clamping member 3 is fixedly connected with a flexible protection pad 4.
When the clamping device is used for clamping a semiconductor wafer, the flexible protection pad 4 can be directly contacted with the semiconductor wafer during the clamping operation by the clamping piece 3, so that the semiconductor wafer can not be directly contacted with the hard clamping piece 3, the function of protecting the semiconductor wafer is further achieved, and the semiconductor wafer is prevented from being damaged in the clamping process.
Alternatively, the central axis of the first fixed shaft 9 is not coincident with the central axis of the second disk 8, and the first fixed shaft 9 is located at an eccentric position of the second disk 8.
During operation, the connecting rod 10 is driven by the first fixing shaft 9 to reciprocate along with the rotation of the second disc 8, so that the connecting rod 10 drives the clamping piece 3 to clamp and fix semiconductor wafers with different sizes under the action of the second fixing shaft 17.
Alternatively, the end face of the slide block 13 in contact with the slide hole 5 is shaped like a cross.
In operation, this allows the slider 13 to move stably inside the slide hole 5, and the slider 13 cannot be easily separated from the slide hole 5.
Optionally, the first connecting shaft 7, the supporting rod 11 and the second connecting shaft 16 are all provided with three, and are evenly distributed at the lower end of the placing disc 2, the supporting rod 11 and the second connecting shaft 16 are all located at the lower end of the second disc 8, the first connecting shaft 7 is located at the upper end of the second disc 8, and the first connecting shaft 7, the supporting rod 11 and the second connecting shaft 16 are of an integrated structure.
In operation, the placing plate 2 can be stably supported at the upper end of the first disc 6, and the rotation of the second disc 8 cannot be easily influenced due to the existence of the first connecting shaft 7, the second connecting shaft 16 and the supporting rod 11.
Optionally, the workbench 1 comprises a platform and a supporting seat, wherein the supporting seat is fixedly connected to the lower end of the platform, is semi-arc-shaped, is provided with two groups and is symmetrically distributed at the lower end of the platform.
In operation, this allows the table 1 to be stably supported on the ground.
Alternatively, the sliding hole 5, the sliding block 13, the sliding rod 12, the clamping member 3, the second fixed shaft 17, the first fixed shaft 9 and the connecting rod 10 are all three, and are uniformly distributed at the upper end of the second disc 8.
In operation, the semiconductor wafer on the placing tray 2 can be clamped and fixed by the clamping piece 3 more firmly and stably.
Working principle:
when the semiconductor wafer packaging machine is used, firstly, a semiconductor wafer to be packaged and processed is placed on the placing disc 2, then the second self-locking motor 15 is started to drive the second disc 8 to rotate, the second disc 8 rotates to drive the first fixed shaft 9 to rotate, the first fixed shaft 9 rotates to drive the connecting rod 10 to rotate and move, the connecting rod 10 rotates and moves under the cooperation of the second fixed shaft 17, the sliding block 13 is pulled to move along the sliding rod 12, meanwhile, the clamping piece 3 is pulled to move by the sliding block 13, the semiconductor wafer can be clamped and fixed along with the movement of the clamping piece 3, the semiconductor wafer can be stably placed on the placing disc 2, and in the clamping process, the semiconductor wafer can not directly contact with the hard clamping piece 3 but directly contact with the flexible protection pad 4, so that the semiconductor wafer is protected from being damaged in the clamping process, then the first self-locking motor 14 is started to drive the first disc 6 to rotate, and the second disc 8, the placing disc 2 and the semiconductor wafer can be simultaneously rotated along with the rotation of the first disc 6, and the semiconductor wafer can not be packaged and processed at the same position.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (7)
1. Semiconductor package fixture, including workstation (1), its characterized in that: the upper end of the workbench (1) is rotationally connected with a first disc (6), the upper end of the first disc (6) is fixedly connected with a second self-locking motor (15) and a second connecting shaft (16), the output shaft end of the second self-locking motor (15) is fixedly connected with a second disc (8), the upper end of the second disc (8) is fixedly connected with a first fixed shaft (9), the circumferential surface of the first fixed shaft (9) is rotationally connected with a connecting rod (10), the circumferential surface of the second connecting shaft (16) is fixedly connected with a supporting rod (11), the inner part of the supporting rod (11) is fixedly connected with a first connecting shaft (7), the upper end of the first connecting shaft (7) is fixedly connected with a placing disc (2), the upper end surface of the placing disc (2) is provided with a sliding hole (5), the inner part of the sliding hole (5) is fixedly connected with a sliding rod (12), the circumferential surface of the sliding rod (12) is slidingly connected with a sliding block (13), the sliding block (13) is slidingly connected with the sliding hole (5), the upper end of the sliding block (13) is fixedly connected with the second fixed shaft (17), the lower extreme fixedly connected with of workstation (1) is from the first auto-lock motor (14), the output axle head and the first disc (6) fixed connection of first auto-lock motor (14).
2. A semiconductor package clamping mechanism as recited in claim 1, wherein: the inner wall of the clamping piece (3) is fixedly connected with a flexible protection pad (4).
3. A semiconductor package clamping mechanism as recited in claim 1, wherein: the central axis of the first fixed shaft (9) is not coincident with the central axis of the second disc (8), and the first fixed shaft (9) is positioned at the eccentric position of the second disc (8).
4. A semiconductor package clamping mechanism as recited in claim 1, wherein: the end surface of the sliding block (13) contacted with the sliding hole (5) is in a cross shape.
5. A semiconductor package clamping mechanism as recited in claim 1, wherein: the utility model discloses a novel structure of a disc, including first connecting axle (7), bracing piece (11) and second connecting axle (16), and evenly distributed is in the lower extreme of placing dish (2), bracing piece (11) and second connecting axle (16) all are located the lower extreme of second disc (8), first connecting axle (7) are located the upper end of second disc (8), first connecting axle (7), bracing piece (11) and second connecting axle (16) are integrated into one piece.
6. A semiconductor package clamping mechanism as recited in claim 1, wherein: the workbench (1) consists of a platform and supporting seats, wherein the supporting seats are fixedly connected to the lower end of the platform and are semi-circular, and the supporting seats are arranged in two groups and symmetrically distributed at the lower end of the platform.
7. A semiconductor package clamping mechanism as recited in claim 1, wherein: the sliding hole (5), the sliding block (13), the sliding rod (12), the clamping piece (3), the second fixed shaft (17), the first fixed shaft (9) and the connecting rod (10) are all provided with three, and are uniformly distributed at the upper end of the second disc (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321652148.4U CN220086020U (en) | 2023-06-27 | 2023-06-27 | Semiconductor packaging clamping mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321652148.4U CN220086020U (en) | 2023-06-27 | 2023-06-27 | Semiconductor packaging clamping mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220086020U true CN220086020U (en) | 2023-11-24 |
Family
ID=88818993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321652148.4U Active CN220086020U (en) | 2023-06-27 | 2023-06-27 | Semiconductor packaging clamping mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220086020U (en) |
-
2023
- 2023-06-27 CN CN202321652148.4U patent/CN220086020U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |