CN217072114U

CN217072114U - Fixing device for silicon part processing

Info

Publication number: CN217072114U
Application number: CN202220529153.5U
Authority: CN
Inventors: 周荣华; 杨战营
Original assignee: Shanghai Shengyongcheng Semiconductor Technology Co ltd
Current assignee: Shanghai Shengyongcheng Semiconductor Technology Co ltd
Priority date: 2022-03-11
Filing date: 2022-03-11
Publication date: 2022-07-29
Anticipated expiration: 2032-03-11

Abstract

The utility model relates to a silicon processing technology field just discloses a fixing device for processing of silicon part, comprises a workbench, the upper end of workstation is provided with base plate and controller, the inside of base plate is provided with electrostatic chuck and conductive ceramic, the outside of base plate is provided with the wire. The fixing device for processing the silicon part is simple to operate, is convenient for taking products, does not need to consider the problems of deformation and allowance generated by wax sticking, and has great advantages particularly for thin part operation.

Description

Fixing device for silicon part processing

Technical Field

The utility model relates to a silicon processing technology field specifically is a fixing device for silicon parts processing.

Background

Silicon is an important material for manufacturing electronic devices, and is mainly used for manufacturing semiconductor circuits, and silicon wafers used for manufacturing silicon semiconductor circuits are called wafers, and the wafers are manufactured by grinding, polishing and slicing silicon crystal bars, and are thin overall.

At present, most of silicon parts are generally cooled and fixed by paraffin, part of the silicon parts are bench vices, and a vacuum pump adsorption method can be adopted for part of products.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a fixing device for silicon part processing to propose most silicon parts in solving above-mentioned background art and adding man-hour, generally adopt paraffin cooling fixed, the part adopts the bench vice, also can adopt the absorbent method of vacuum pump to some products, and these methods all have complex operation, and the step is more, need consider the deformation, the surplus to and thin part difficult processing and to the higher scheduling problem of technical requirement to the people.

In order to achieve the above object, the utility model provides a fixing device for silicon part processing, comprises a workbench, the upper end of workstation is provided with base plate and controller, the inside of base plate is provided with electrostatic chuck and conductive ceramics, the outside of base plate is provided with the wire, conductive ceramics's upper end is provided with the locating plate, the spread groove has been seted up to the upper end of base plate, the lower extreme of locating plate is provided with the connecting plate, the through-hole has been seted up to the inside of connecting plate, the outside of base plate is provided with the screw rod, the draw-in groove has been seted up to the inside of locating plate, the wafer has been placed to conductive ceramics's upper end.

Preferably, the substrate is located at the center of the upper end of the worktable, the substrate is made of an insulating material, the conductive ceramic is located at the upper end of the electrostatic chuck, and when a voltage is applied to the electrostatic chuck, charges move and are concentrated near the surface of the conductive ceramic.

Preferably, one end of the wire is electrically connected with the electrostatic chuck, the other end of the wire is electrically connected with the controller, and a user applies and disconnects voltage to the electrostatic chuck through the controller.

Preferably, the locating plate adopts insulating material, the upper end annular of spread groove base plate is provided with four, the inboard of connecting plate and spread groove is closely laminated, connecting plate and spread groove one-to-one, the connecting plate block plays limiting displacement to the locating plate in the spread groove.

Preferably, the screw rod is in threaded connection with the base plate, the screw rod extends to the inside of the through hole, the screw rod corresponds to the connecting plate one by one, the screw rod is rotated to the inside of the through hole, and the screw rod plays a role in fixing the positioning plate through the connecting plate.

Preferably, the clamping groove is located at the center of the positioning plate, the wafer is attached to the inner side of the clamping groove, the wafer is attached to the upper end of the conductive ceramic, and the wafer is placed inside the clamping groove and adsorbed together with the conductive ceramic under the influence of static electricity.

Compared with the prior art, the beneficial effects of the utility model are that:

this fixing device, be provided with the base plate, the inside of base plate is provided with electrostatic chuck and conductive ceramic, the upper end of base plate is provided with the locating plate, the locating plate can be according to the wafer size selection installation of processing, place the wafer in the inside draw-in groove of locating plate during the use, wafer bottom and conductive ceramic contact, the electrostatic chuck circular telegram, the electric charge removes to conductive ceramic's surface, adsorb the wafer through static, the person of facilitating the use processes, the locating plate then prevents that the wafer from taking place to remove, device easy operation, the product of being convenient for is taken, need not consider the surplus problem that warp and wax sticking produced, especially, there is very big advantage to the thin part operation.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic front view of the present invention;

FIG. 3 is a schematic top view of the present invention;

FIG. 4 is a schematic view of the internal structure of the substrate of the present invention;

fig. 5 is a schematic top view of the substrate of the present invention;

fig. 6 is an enlarged schematic view of a portion a in fig. 4 according to the present invention.

Wherein: 1. a work table; 2. a substrate; 3. a controller; 4. an electrostatic chuck; 5. a conductive ceramic; 6. a wire; 7. positioning a plate; 8. connecting grooves; 9. a connecting plate; 10. a through hole; 11. a screw; 12. a card slot; 13. and (5) a wafer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the fixing device for processing silicon parts provided by the present invention mainly comprises a worktable 1, a substrate 2, a controller 3, an electrostatic chuck 4, a conductive ceramic 5, a positioning plate 7, a screw 11, etc.

Wherein, the upper end of the working table 1 is provided with a base plate 2 and a controller 3.

An electrostatic chuck 4 and a conductive ceramic 5 are provided in the substrate 2, and the entire substrate 2 is positioned at the center of the upper end of the table 1. Preferably, the substrate 2 is made of an insulating material.

Further, the conductive ceramic 5 is located at the upper end of the electrostatic chuck 4, the outer side of the substrate 2 is provided with a wire 6, one end of the wire 6 is electrically connected with the electrostatic chuck 4, the other end of the wire 6 is electrically connected with the controller 3, when voltage is applied to the electrostatic chuck 4, electric charges move and are concentrated near the surface of the conductive ceramic 5, and a user applies and disconnects the voltage to the electrostatic chuck 4 through the controller 3.

Further referring to fig. 5, in the present scheme, a positioning plate 7 is disposed at the upper end of the conductive ceramic 5, a connecting groove 8 is disposed at the upper end of the substrate 2, and a connecting plate 9 is disposed at the lower end of the positioning plate 7. This locating plate 7 adopts insulating material, and the upper end annular of spread groove 8 base plate 2 is provided with four, and connecting plate 9 closely laminates with spread groove 8's inboard, and connecting plate 9 and spread groove 8 one-to-one have seted up through-hole 10 in the inside of connecting plate 9.

Further referring to fig. 4, in the present scheme, a screw 11 is arranged on the outer side of the base plate 2, the screw 11 is in threaded connection with the base plate 2, the screw 11 extends into the through hole 10, the screw 11 corresponds to the connecting plate 9 one by one, the connecting plate 9 is clamped in the connecting groove 8, a limiting effect is performed on the positioning plate 7, the screw 11 is rotated to the inside of the through hole 10, and the screw 11 fixes the positioning plate 7 through the connecting plate 9;

further referring to fig. 6, a clamping groove 12 is formed in the positioning plate 7, the wafer 13 is placed at the upper end of the conductive ceramic 5, the clamping groove 12 is located at the center of the positioning plate 7, the wafer 13 is attached to the inner side of the clamping groove 12, the wafer 13 is attached to the upper end of the conductive ceramic 5, the wafer 13 is placed in the clamping groove 12, and the wafer is adsorbed together with the conductive ceramic 5 under the influence of static electricity.

The application and operation of the fixing device will be described in detail with reference to the accompanying drawings.

When the fixing device for silicon part processing works, firstly, the corresponding positioning plate 7 is selected according to the diameter of a wafer 13, the screw rod 11 is rotated outwards, the connecting plate 9 at the bottom of the positioning plate 7 is aligned and slides into the connecting groove 8, the positioning plate 7 is attached to the upper end of the conductive ceramic 5, then the screw rod 11 is rotated to move into the through hole 10, and the screw rod 11 plays a role in fixing the positioning plate 7 through the connecting plate 9.

The power of the controller 3 is switched on, the wafer 13 is placed into the clamping groove 12, the bottom of the wafer 13 is attached to the surface of the conductive ceramic 5, the electrostatic chuck 4 is applied with voltage through the controller 3, electric charges move and are concentrated near the surface of the conductive ceramic 5 and are influenced by positive and negative electric charges, the wafer 13 and the conductive ceramic 5 are adsorbed together, and the positioning plate 7 plays a limiting role in the wafer 13 and prevents the wafer 13 from moving in the machining process.

After the processing is finished, the power supply is cut off through the controller 3, then the wafer 13 can be taken out, the device is simple to operate, products can be taken conveniently, the problems of deformation and allowance generated by wax sticking are not considered, and the device has great advantages particularly for thin part operation.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A fixture for silicon part processing, comprising a table (1), characterized in that: the upper end of workstation (1) is provided with base plate (2) and controller (3), the inside of base plate (2) is provided with electrostatic chuck (4) and conductive ceramics (5), the outside of base plate (2) is provided with wire (6), the upper end of conductive ceramics (5) is provided with locating plate (7), spread groove (8) have been seted up to the upper end of base plate (2), the lower extreme of locating plate (7) is provided with connecting plate (9), through-hole (10) have been seted up to the inside of connecting plate (9), the outside of base plate (2) is provided with screw rod (11), draw-in groove (12) have been seted up to the inside of locating plate (7), wafer (13) have been placed to the upper end of conductive ceramics (5).

2. A fixture for silicon part processing according to claim 1, wherein: the base plate (2) is located at the center of the upper end of the workbench (1), the base plate (2) is made of an insulating material, and the conductive ceramic (5) is located at the upper end of the electrostatic chuck (4).

3. A fixture for silicon part processing according to claim 1, wherein: one end of the lead (6) is electrically connected with the electrostatic chuck (4), and the other end of the lead (6) is electrically connected with the controller (3).

4. A fixture for silicon part processing according to claim 1, wherein: the locating plate (7) is made of insulating materials, four connecting grooves (8) are formed in the upper end of the base plate (2) in an annular mode, the connecting plates (9) are tightly attached to the inner sides of the connecting grooves (8), and the connecting plates (9) correspond to the connecting grooves (8) one to one.

5. A fixture for silicon part processing according to claim 1, wherein: the screw rods (11) are in threaded connection with the base plate (2), the screw rods (11) extend into the through holes (10), and the screw rods (11) correspond to the connecting plates (9) one to one.

6. A fixture for silicon part processing according to claim 1, wherein: the clamping groove (12) is located at the center of the positioning plate (7), the wafer (13) is attached to the inner side of the clamping groove (12), and the wafer (13) is attached to the upper end of the conductive ceramic (5).