CN218891711U - Cleaning device of grinding workbench and wafer grinding device - Google Patents

Cleaning device of grinding workbench and wafer grinding device Download PDF

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Publication number
CN218891711U
CN218891711U CN202223524446.3U CN202223524446U CN218891711U CN 218891711 U CN218891711 U CN 218891711U CN 202223524446 U CN202223524446 U CN 202223524446U CN 218891711 U CN218891711 U CN 218891711U
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cleaning
grinding
cleaning brush
fixing member
cam plate
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CN202223524446.3U
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赵长福
刘远航
马旭
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Huahaiqingke Co Ltd
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Huahaiqingke Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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Abstract

The utility model discloses a cleaning device of a grinding workbench and a wafer grinding device, wherein the cleaning device comprises a rotating piece, a fixing piece is arranged at the bottom of the rotating piece, a cleaning brush is arranged at the lower part of the fixing piece, and the rotating piece drives the fixing piece and the cleaning brush thereon to rotate around the central axis of the rotating piece; the cleaning brush is provided with a moving mechanism, and the moving mechanism can drive the cleaning brush to move along the horizontal direction so as to clean the grinding workbench.

Description

Cleaning device of grinding workbench and wafer grinding device
Technical Field
The utility model belongs to the technical field of wafer grinding, and particularly relates to a cleaning device of a grinding workbench and a wafer grinding device.
Background
In the subsequent process stage of integrated circuit/semiconductor (Integrated Circuit, IC) fabrication, in order to reduce the package mounting height, reduce the chip package volume, improve the thermal diffusion efficiency, electrical performance, mechanical performance, and reduce the processing amount of the chip, the wafer needs to be ground before the subsequent package, and the thickness of the ground chip can even reach less than 5% of the initial thickness.
In the process of grinding the wafer, the porous ceramic on the grinding workbench is used for adsorbing the wafer by vacuum, the upper surface of the porous ceramic is used as a wafer positioning surface, and the shape of the surface of the porous ceramic directly influences the shape of the ground wafer. If particles exist on the surface of the porous ceramic, under the action of negative pressure, wafers at the particles can warp or crack, and the grinding quality of the surfaces of the wafers is seriously affected; in addition, if the particles plug the micropores on the porous ceramic, the vacuum adsorption effect of the porous ceramic is lost.
In the prior art, the surface of the grinding workbench is cleaned by adopting a manual cleaning or automatic cleaning mode, so that the surface shape and good air permeability of the porous ceramic are ensured, and the grinding quality of the wafer is improved. However, the existing cleaning device for the grinding workbench has the problems of poor cleaning effect and low cleaning efficiency, and the processing quality and processing efficiency of wafer grinding are affected to a certain extent.
Disclosure of Invention
The embodiment of the utility model provides a cleaning device for a grinding workbench and a wafer grinding device, which aim to at least solve one of the technical problems in the prior art.
A first aspect of an embodiment of the present utility model provides a cleaning device for a grinding workbench, including a rotating member, wherein a fixing member is configured at a bottom of the rotating member, a cleaning brush is disposed at a lower portion of the fixing member, and the rotating member drives the fixing member and the cleaning brush thereon to rotate around a central axis of the rotating member; the cleaning brush is provided with a moving mechanism, and the moving mechanism can drive the cleaning brush to move along the horizontal direction so as to clean the grinding workbench.
In some embodiments, the moving mechanism comprises a cam plate, the cam plate gap being disposed outside of the rotating member; the inside of the fixing piece is connected with an installation seat in a sliding manner, the installation seat is abutted to the cam disc through a connecting piece, and the cleaning brush is arranged below the installation seat; the rotating fixing member moves the connecting member along the outer peripheral side of the cam plate to drive the mounting base and the cleaning brush thereon to horizontally move.
In some embodiments, a horizontally disposed return spring is disposed inside the fixing member, and one end of the return spring abuts against the mounting seat and the other end abuts against the fixing member.
In some embodiments, the mounting base is disposed on the fixing member by a sliding rail.
In some embodiments, the fixing member has a disk-like structure, the number of the washing brushes is plural, and the washing brushes are uniformly distributed along a circumferential direction of the fixing member.
In some embodiments, the cam plate is coaxially disposed outside the rotary member, and an outer peripheral side of the cam plate is provided with at least one protruding structure; the number of the protruding structures is the same as the number of the cleaning brushes.
In some embodiments, the fixture is further configured with an oilstone and a nozzle, the oilstone being disposed between adjacent cleaning brushes; the number of the nozzles is a plurality of, and the nozzles are arranged between the cleaning brush and the oilstone at intervals.
In some embodiments, the moving mechanism comprises a voice coil motor, a stator of the voice coil motor is arranged on the fixing piece, a rotor of the voice coil motor is fixed on a mounting seat through a connecting piece, and the mounting seat is connected to the fixing piece in a sliding manner; the cleaning brush is arranged below the mounting seat, and the voice coil motor can drive the mounting seat and the cleaning brush on the mounting seat to horizontally move.
In some embodiments, the moving mechanism comprises an electromagnetic linear motor, and a rotor of the electromagnetic linear motor is connected with the cleaning brush to drive the cleaning brush to move horizontally.
A second aspect of an embodiment of the present utility model provides a wafer grinding apparatus, including:
a turntable on which a grinding table is arranged to adsorb a wafer to be ground;
the grinding assembly is arranged above the grinding workbench to grind the wafer;
the cleaning device is also included to clean the grinding workbench.
The beneficial effects of the utility model include:
a. the cleaning device is provided with a moving mechanism, and the moving mechanism can drive the cleaning brush to move horizontally so as to move horizontally while the cleaning brush rotates around the central axis of the rotating piece, thereby improving the cleaning effect and the working efficiency of the grinding workbench;
b. the moving mechanism may include a cam plate to achieve horizontal movement of the washing brush by the cam structure;
c. the moving mechanism can comprise a linear moving module, such as a voice coil motor, so as to drive the cleaning brush to horizontally move, and the parameters of the linear moving module can be adjusted according to working conditions so as to adjust the moving displacement and the moving frequency of the cleaning brush, thereby realizing good cleaning effect.
Drawings
The advantages of the present utility model will become more apparent and more readily appreciated from the detailed description given in conjunction with the following drawings, which are meant to be illustrative only and not limiting of the scope of the utility model, wherein:
FIG. 1 is a schematic view of a cleaning apparatus according to an embodiment of the present utility model;
FIG. 2 is a schematic view of a cam plate provided in an embodiment of the present utility model;
FIG. 3 is a bottom view of the cleaning device shown in FIG. 1;
FIG. 4 is a schematic view of a cleaning apparatus according to another embodiment of the present utility model;
fig. 5 is a schematic diagram of a wafer grinding apparatus according to an embodiment of the utility model.
Detailed Description
The following describes the technical scheme of the present utility model in detail with reference to specific embodiments and drawings thereof. The examples described herein are specific embodiments of the present utility model for illustrating the concept of the present utility model; the description is intended to be illustrative and exemplary in nature and should not be construed as limiting the scope of the utility model in its aspects. In addition to the embodiments described herein, those skilled in the art can adopt other obvious solutions based on the disclosure of the claims of the present application and the specification thereof, including those adopting any obvious substitutions and modifications to the embodiments described herein.
The drawings in the present specification are schematic views, which assist in explaining the concept of the present utility model, and schematically show the shapes of the respective parts and their interrelationships. It should be understood that for the purpose of clearly showing the structure of various parts of embodiments of the present utility model, the drawings are not drawn to the same scale and like reference numerals are used to designate like parts in the drawings.
In the present utility model, the Wafer (W) is also called a Substrate (Substrate), a Wafer, a die, etc., and the meaning and actual function are equivalent.
The disclosed embodiments relate generally to wafer grinding apparatus used in the semiconductor device manufacturing industry, and more particularly, to a cleaning apparatus for cleaning a grinding table.
Fig. 1 is a schematic view of a cleaning apparatus 100 according to an embodiment of the present utility model, where the cleaning apparatus 100 includes a rotating member 10, and the rotating member 10 is configured with a rotating motor, not shown, and the rotating member 10 and a component connected to the rotating member 10 can be rotated by the rotating motor.
Further, a fixing member 20 is disposed at the bottom of the rotary member 10, and a cleaning brush 30 is disposed at the lower portion of the fixing member 20. That is, the rotating member 10 can drive the fixing member 20 and the cleaning brush 30 thereon to rotate, and the cleaning brush 30 abuts against the upper surface of the grinding table to brush away particles such as grinding dust remaining on the grinding table, thereby cleaning the grinding table.
The existing cleaning brush 30 is arranged at the bottom of the fixing member 20, and the arrangement position is relatively fixed; although the upper surface of the grinding table can be covered entirely by the driving of the rotary member 10, the brush force of the brush 30 is insufficient, and there is a problem of low work efficiency.
In order to solve the above-mentioned technical problems, the cleaning device 100 provided by the present utility model further includes a moving mechanism 40, where the moving mechanism 40 is connected to the cleaning brush 30, and is capable of driving the cleaning brush 30 to move along the horizontal direction. That is, the cleaning brush 30 moves in the horizontal direction while rotating with the central axis of the rotary member 10 as a reference, so as to efficiently remove the residual particulate matters of the grinding table, ensure the cleaning effect, and improve the cleaning efficiency.
In the embodiment shown in fig. 1, the moving mechanism 40 includes a cam plate 41, and the cam plate 41 is disposed at a gap outside the rotary 10. Specifically, the housing structure 11 is disposed outside the rotary member 10, the mounting flange 12 is disposed at the bottom of the housing structure 11, and the cam plate 41 is fixed to the lower portion of the mounting flange 12. I.e. the cam disc 41 is relatively fixed and does not rotate synchronously with the rotary member 10. A gap is provided between the cam plate 41 and the rotary member 10 to prevent the chips generated by the mutual friction between the two from interfering with the grinding operation of the wafer.
Further, the fixing member 20 is provided with a mount 42, and the mount 42 is slidably connected to the inside of the fixing member 20. The upper part of the mount 42 is abutted against the cam plate 41 via the connector 43, and the brush 30 is provided at the lower part of the mount 42.
Specifically, a stopper 43a is disposed at the upper portion of the connecting element 43, and the stopper 43a abuts against the outer peripheral side of the cam plate 41. When the rotary member 10 rotates about the central axis, the stopper 43a of the connecting member 43 is always in contact with the outer peripheral wall of the cam plate 41. That is, the cam plate 41 can push the connecting piece 43 and the mounting seat 42 to slide, and then drive the cleaning brush 30 at the lower part of the mounting seat 42 to move.
In fig. 1, the fixing member 20 includes a first fixing member 21, and the first fixing member 21 is disposed at a lower portion of the rotary member 10. The first fixing member 21 is internally provided with a slide rail 44, the slide rail 44 is disposed along a horizontal direction, and the mounting seat 42 is connected to the slide rail 44 through a slider. The rotary member 10 rotates around the central axis to push the connecting member 43 to move through the limiting portion 43a, and further drive the mounting base 42 to move horizontally along the length direction of the sliding rail 44.
Further, the first fixing member 21 is further provided with a horizontally disposed guide rod 45, and a horizontal through hole is disposed in the mount 42, and the guide rod 45 is disposed in the through hole of the mount 42 so as to be spaced apart from the horizontal movement of the mount 42.
Further, a return spring 46 is disposed in the first fixing member 21, the return spring 46 is fitted around the outer peripheral side of the guide rod 45, one end of the return spring 46 abuts against one side of the mount 42, and the other end of the return spring 46 abuts against the first fixing member 21, so that the mount 42 and the cleaning brush 30 fixed thereto are returned.
Fig. 2 is a schematic view of a cam plate 41 according to an embodiment of the present utility model, wherein the cam plate 41 is coaxially and intermittently disposed at the lower portion of the rotary member 10 shown in fig. 1. Further, the cam plate 41 is provided with three boss structures 41a on the outer peripheral side.
When the rotary member 10 rotates around the central axis, the protrusion structure 41a of the cam plate 41 abuts against the stopper portion 43a of the connecting member 43, so that the cleaning brush 30 moves toward the outside of the fixed member 20. At this time, the return spring 46 is in a compressed state.
When the stopper 43a contacts the highest point of the projection 41a, the return spring 46 is compressed to the shortest. The rotating member 10 continues to rotate, and the limiting part 43a contacts with the low point of the protrusion structure 41a, and the return spring 46 is elastically outwardly sprung to push the brush 30 to move toward the inside of the fixing member 20. In the present utility model, the highest point of the cam structure 41a refers to a position corresponding to the maximum value of the distance between the outer side wall of the cam plate 41 and the center thereof, and the lower point of the boss structure 41a refers to a position corresponding to the non-maximum value of the distance between the outer side wall of the cam plate 41 and the center thereof.
Fig. 3 is a bottom view of the cleaning device 100 shown in fig. 1, and the fixing member 20 of the cleaning device 100 has a disk-like structure on which three cleaning brushes 30 are provided. The washing brushes 30 are uniformly distributed along the circumferential direction of the fixture 20. The cleaning brushes 30 disposed at intervals can be moved in the radial direction of the fixture 20 by the driving of the moving structure 40 shown in fig. 1 to enhance the cleaning effect of the cleaning brushes 30.
It will be appreciated that the number of brushes 30 may be other numbers, such as 2, 4, 5, etc., which are evenly distributed and horizontally movable along the radius of the fixed member 20 to ensure the cleaning effect of the grinding table.
Further, fig. 2 shows that the number of the protruding structures 41a on the cam plate 41 matches the number of the cleaning brushes 30. I.e. the number of connectors 43 fixed to the washing brush 30 is equal to the number of washing brushes 30.
In the embodiment shown in fig. 3, the fixture 20 is further provided with an oilstone 50, wherein the oilstone 50 is disposed between adjacent washing brushes 30 to remove particulate matter from the surface of the grinding table. In fig. 3, the number of the oilstones 50 is 3, which are uniformly distributed along the circumferential direction of the fixing member 20.
In fig. 3, the fixture 20 is further provided with a plurality of nozzles 60, and the nozzles 60 are arranged between the cleaning brush 30 and the oilstone 50 at intervals to supply cleaning liquid for cleaning the grinding table.
Further, the nozzles 60 are arranged at intervals in a straight line direction to provide sufficient cleaning liquid for brushing the cleaning brush 30 and the oilstone 50, and ensure the cleaning effect and the cleaning efficiency of the grinding table. In some embodiments, the nozzle 60 may also spray a mixture of cleaning liquid and gas, such as a mixture of deionized water and inert gas, to enhance the impact force of the fluid on the surface of the grinding table, and to sufficiently remove the particles on the surface of the grinding table, thereby improving the cleaning effect.
In the embodiment shown in fig. 1, the fixing member 20 of the cleaning device 100 further includes a disc-shaped second fixing member 22, and the second fixing member 22 is disposed on the upper side of the first fixing member 21. Wherein the cleaning brush 30 and the oilstone 50 are disposed at the first fixing member 21, and the nozzle 60 is disposed at the second fixing member 22. The first fixture 21 is provided with a through hole, and the nozzle 60 is provided toward the lower side through the through hole of the first fixture 21 to spray the cleaning liquid toward the grinding table. In some embodiments, the oilstone 50 may be integrally provided with the first fixing member 21, i.e., the first fixing member 21 may be entirely made of oilstone.
In fig. 1, the second fixing member 22 is provided with a process hole 22a, and the connecting member 43 is disposed in the process hole 22a in a gap manner; the connecting piece 43 is vertically fixed to the mounting base 42, and extends upward through the process hole 22a, and the limiting portion 43a on the connecting piece abuts against the outer periphery side of the cam plate 41. The cam plate 41 drives the mounting seat 42 to horizontally move through the connecting piece 43, and the reciprocating movement of the cleaning brush 30 is realized under the action of the return spring 46.
In fig. 1, the cleaning apparatus 100 is further provided with a shield 70 in order to prevent the cleaning particles from being sputtered to the moving parts of the cleaning apparatus 100. Specifically, the shield 70 is a housing structure that is detachably coupled to the outside of the mounting flange 12 to shield moving parts on the cleaning device 100.
Fig. 4 is a schematic diagram of a cleaning device 100 according to another embodiment of the present utility model, in which the cleaning device 100 is also configured with a moving mechanism 40 to drive the cleaning brush 30 disposed on the fixing member 20 to move horizontally.
In fig. 4, the moving mechanism 40 includes a voice coil motor 41', a stator of the voice coil motor 41' is provided to the second fixing member 22, and a mover of the voice coil motor 41' is fixed to the mount 42 through a connecting member 43. The mounting base 42 is slidably connected to the first fixing member 21 through a sliding rail 44. The fixing means of the fixing member 20 and the cleaning brush 30, the oilstone 50 and the nozzle 60 thereon in fig. 4 are substantially the same as those of the technical solution shown in fig. 1, and will not be repeated here.
When the voice coil motor 41' operates, the mover thereon can drive the mounting seat 42 and the cleaning brush 30 thereon to move through the connecting piece 43, so as to realize that the cleaning brush 30 moves along the radial direction of the fixing piece 20, thereby improving the cleaning effect and the cleaning efficiency of the cleaning brush 30 and efficiently removing the residual particles on the surface of the grinding workbench. The outer peripheral side of the rotary member 10 is provided with an electrically conductive slip ring to supply electric power to the operation of the voice coil motor 41'.
In fig. 4, the number of the cleaning brushes 30 is plural, and they are uniformly distributed along the circumferential direction of the fixing member 20. Wherein each brush 30 is provided with a voice coil motor 41' to achieve horizontal movement of the brush 30.
In the present utility model, the number and arrangement positions of the corresponding convex structures 41a (shown in fig. 2) of the cam plate 41 shown in fig. 1 are fixed, that is, the moving distance and the moving frequency of the cleaning brush 30 are relatively fixed.
The embodiment shown in fig. 4 has the advantage of being flexible in operation compared to the embodiment shown in fig. 1: when the grinding table is clean, a craftsman can adjust the moving distance and the moving frequency of the cleaning brush 30 by controlling the frequency and the current of the voice coil motor 41' according to the working condition requirement, so as to ensure a good cleaning effect.
As an embodiment of the present utility model, the moving mechanism 40 may be configured with other forms of motors to drive the brush 30 to move horizontally. As an aspect of the present embodiment, the moving mechanism 40 may include an electromagnetic linear motor whose mover is connected to the brush 30 to drive the brush 30 to move horizontally, improving the cleaning efficiency of the grinding table.
In addition, the utility model also provides a wafer grinding device 1000, and fig. 5 is a schematic diagram of the wafer grinding device 1000 according to an embodiment of the utility model. The wafer grinding apparatus 1000 includes:
the turntable 200, the turntable 200 is arranged at the upper part of the lathe bed of the wafer grinding device 1000, and three grinding work tables 300 are arranged above the turntable 200 to absorb the wafer to be ground; the turntable 200 can drive the grinding table 300 thereon to rotate around the central axis to switch the position of the grinding table 300;
the grinding assembly 400 is arranged on the column of the lathe bed and is positioned above the grinding workbench 300, and the grinding wheel of the grinding assembly 400 can grind the wafer;
and the cleaning device 100 described above, the cleaning device 100 is provided with the cleaning brush 30 that can be horizontally moved to clean the grinding table 300.
In the embodiment shown in fig. 5, a support 510 is disposed above the bed of the wafer grinding apparatus 1000, and the cleaning apparatus 100 is disposed on the support 510. Further, the support frame 510 is configured with a vertical movement module 520 and a horizontal movement module 530. Wherein, vertical movement module 520 sets up in the upper portion of horizontal movement module 530, and belt cleaning device 100 sets up in the lateral part of vertical movement module 520 for belt cleaning device 100 can be along vertical direction and horizontal direction removal, with the position of adjusting belt cleaning device 100's cleaning brush 30, oilstone 50 and nozzle 60 for grinding workstation 300, realizes good cleaning effect.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. The cleaning device of the grinding workbench is characterized by comprising a rotating piece, wherein the bottom of the rotating piece is provided with a fixing piece, the lower part of the fixing piece is provided with a cleaning brush, and the rotating piece drives the fixing piece and the cleaning brush on the fixing piece to rotate around the central axis of the rotating piece; the cleaning brush is provided with a moving mechanism, and the moving mechanism can drive the cleaning brush to move along the horizontal direction so as to clean the grinding workbench.
2. The cleaning apparatus defined in claim 1, wherein the movement mechanism comprises a cam plate, the cam plate gap being disposed outside of the rotating member; the inside of the fixing piece is connected with an installation seat in a sliding manner, the installation seat is abutted to the cam disc through a connecting piece, and the cleaning brush is arranged below the installation seat; the rotating fixing member moves the connecting member along the outer peripheral side of the cam plate to drive the mounting base and the cleaning brush thereon to horizontally move.
3. The cleaning device according to claim 2, wherein a horizontally disposed return spring is disposed in the fixing member, and one end of the return spring abuts against the mounting base and the other end abuts against the fixing member.
4. The cleaning apparatus defined in claim 2, wherein the mounting base is disposed on the securing member via a slide rail.
5. The cleaning device according to claim 1, wherein the fixing member has a disk-like structure, the number of the cleaning brushes is plural, and the cleaning brushes are uniformly distributed along a circumferential direction of the fixing member.
6. The cleaning apparatus according to claim 2, wherein the cam plate is coaxially provided on an outer side of the rotary member, and an outer peripheral side of the cam plate is provided with at least one protruding structure; the number of the protruding structures is the same as the number of the cleaning brushes.
7. The cleaning apparatus defined in claim 1, wherein the fixture is further provided with an oilstone and a nozzle, the oilstone being disposed between adjacent cleaning brushes; the number of the nozzles is a plurality of, and the nozzles are arranged between the cleaning brush and the oilstone at intervals.
8. The cleaning device according to claim 1, wherein the moving mechanism comprises a voice coil motor, a stator of the voice coil motor is arranged on the fixing member, a rotor of the voice coil motor is fixed on a mounting seat through a connecting member, and the mounting seat is slidably connected to the fixing member; the cleaning brush is arranged below the mounting seat, and the voice coil motor can drive the mounting seat and the cleaning brush on the mounting seat to horizontally move.
9. The cleaning apparatus of claim 1, wherein the moving mechanism comprises an electromagnetic linear motor, and a mover of the electromagnetic linear motor is connected to the cleaning brush to drive the cleaning brush to move horizontally.
10. A wafer grinding apparatus, comprising:
a turntable on which a grinding table is arranged to adsorb a wafer to be ground;
the grinding assembly is arranged above the grinding workbench to grind the wafer;
a cleaning device according to any one of claims 1 to 9 for cleaning a grinding table.
CN202223524446.3U 2022-12-29 2022-12-29 Cleaning device of grinding workbench and wafer grinding device Active CN218891711U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223524446.3U CN218891711U (en) 2022-12-29 2022-12-29 Cleaning device of grinding workbench and wafer grinding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223524446.3U CN218891711U (en) 2022-12-29 2022-12-29 Cleaning device of grinding workbench and wafer grinding device

Publications (1)

Publication Number Publication Date
CN218891711U true CN218891711U (en) 2023-04-21

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223524446.3U Active CN218891711U (en) 2022-12-29 2022-12-29 Cleaning device of grinding workbench and wafer grinding device

Country Status (1)

Country Link
CN (1) CN218891711U (en)

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