CN213795780U - Grinding device for circular monocrystalline silicon wafer - Google Patents
Grinding device for circular monocrystalline silicon wafer Download PDFInfo
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- CN213795780U CN213795780U CN202021929410.1U CN202021929410U CN213795780U CN 213795780 U CN213795780 U CN 213795780U CN 202021929410 U CN202021929410 U CN 202021929410U CN 213795780 U CN213795780 U CN 213795780U
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Abstract
The utility model provides a grinding device of circular monocrystalline silicon piece, including supporting seat, motor an of setting on the support of supporting seat, set up the bottom plate of supporting seat near many slide rails in the support one side, slide the slip box of setting on many slide rails, set up motor b in the slip box inner chamber and set up the hydraulic telescoping cylinder in the installation intracavity of keeping away from the support one side at the bottom plate, be provided with the emery wheel on motor a's the output, the support is provided with the fan in being close to the one side of bottom plate, the flexible end of hydraulic telescoping cylinder is connected with the bottom of slip box, be provided with monocrystalline silicon section fixing device on motor b's the output, through setting up the fan on the support, dispel the heat to the monocrystalline silicon section in the grinding, in time blow away the grinding simultaneously and produce a large amount of pieces.
Description
Technical Field
The utility model relates to a circular monocrystalline silicon piece processing technology field, concretely relates to grinding device of circular monocrystalline silicon piece.
Background
The monocrystalline silicon wafer is a crystal with a basically complete lattice structure, has different properties in different directions, is a good semiconductor material, is widely used for manufacturing semiconductor devices, solar cells and the like, is an active non-metallic element, is an important component of a crystal material, and is at the front of the development of new materials.
Grinding of the monocrystalline silicon wafer is taken as an important step for preparing the monocrystalline silicon wafer, a large amount of heat can be generated in the continuous grinding process between the silicon wafer and the grinding wheel, and the silicon wafer is heated due to the fact that the heat is difficult to dissipate due to continuous long-time contact between the silicon wafer and the grinding wheel, so that the stability of the silicon wafer is adversely affected; on the other hand, the grinding of the silicon wafer and the grinding wheel generates a large amount of scraps, and the scraps can cause poor grinding effect and low efficiency if not removed in time. And adopt among the prior art to close the motor usually and make whole equipment rest then carry out the chip removal and heat dissipation cooling, greatly reduced the work efficiency of chamfer equipment like this.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a grinding device of circular monocrystalline silicon piece solves above-mentioned prior art's defect.
The utility model discloses a following technical scheme realizes:
the utility model provides a grinding processingequipment of circular monocrystalline silicon piece, includes the supporting seat, set up motor an on the support of supporting seat, set up the bottom plate of supporting seat and be close to many slide rails on the support one side, slide the slip box that sets up on many slide rails, set up motor b in the slip box inner chamber and set up the hydraulic telescoping cylinder in the installation intracavity that the support was kept away from to the bottom plate in the support one side, be provided with the emery wheel on motor a's the output, be provided with the fan on the one side that the support is close to the bottom plate, the flexible end of hydraulic telescoping cylinder is connected with the bottom of slip box, be provided with monocrystalline silicon section fixing device on motor b's the output.
Through set up the fan on the support, dispel the heat to the monocrystalline silicon section that is in the grinding, it is a production a large amount of pieces to blow away the grinding in time simultaneously.
The monocrystalline silicon slice to be processed is installed on the monocrystalline silicon slice fixing device, the motor b drives the monocrystalline silicon slice to rotate, the motor a drives the grinding wheel to rotate, and the hydraulic telescopic cylinder drives the sliding box to vertically upwards move along the sliding rail, so that the edge of the monocrystalline silicon slice is ground.
Further, the section of the grinding wheel is in an inverted cone shape.
Further, the fan can adjust the orientation angle.
Furthermore, a plurality of supporting legs are arranged on one surface, away from the support, of the bottom plate of the supporting seat.
Further, the bottom plate (13) is made of high-strength steel.
Furthermore, the telescopic end of the hydraulic telescopic cylinder (5) is detachably connected with the bottom of the sliding box (12) through a bolt, the installation cavity is detachably arranged on the bottom plate, and the hydraulic telescopic cylinder is fixed at the bottom of the inner cavity of the installation cavity through a bolt.
Compared with the prior art, the utility model, following advantage and beneficial effect have:
the utility model relates to a grinding device of circular monocrystalline silicon piece, through set up the fan on the support, dispel the heat to the monocrystalline silicon section that is in the grinding, it is a large amount of pieces that produce to blow away the grinding in time simultaneously.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the present invention.
Reference numbers and corresponding part names in the drawings: the device comprises a support seat 1, a motor a2, a fan 3, a motor b4, a hydraulic telescopic cylinder 5, a slide rail 11, a slide box 12, a bottom plate 13, a support 14, a grinding wheel 21, a monocrystalline silicon slice fixing device 41 and an installation cavity 131.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The invention will be further described with reference to the accompanying drawings, but the scope of the invention is not limited to the following description.
Example 1
As shown in fig. 1, the utility model relates to a grinding device of circular monocrystalline silicon piece, including supporting seat 1, motor a2 of setting on support 14 of supporting seat 1, the bottom plate 13 of setting at supporting seat 1 is close to many slide rails 11 on the support 14 one side, slide box 12, the motor b4 of setting in slide box 12 inner chamber and the hydraulic stretching cylinder 5 of setting in the installation cavity 131 of keeping away from support 14 one side at bottom plate 13 of sliding setting on many slide rails 11, be provided with emery wheel 21 on the output of motor a2, be provided with fan 3 on the one side that support 14 is close to bottom plate 13, the flexible end of hydraulic stretching cylinder 5 is connected with the bottom of slide box 12, be provided with monocrystalline silicon section fixing device 41 on the output of motor b 4.
By providing the fan 14 on the support 14, the monocrystalline silicon slice under grinding is cooled, and a large amount of chips are generated by timely blowing away the grinding.
The monocrystalline silicon slice to be processed is installed on the monocrystalline silicon slice fixing device 41, the motor b4 drives the monocrystalline silicon slice to rotate, the motor a2 drives the grinding wheel 21 to rotate, and the hydraulic telescopic cylinder 5 drives the sliding box 12 to vertically move upwards along the sliding rail 11, so that the edge of the monocrystalline silicon slice is ground.
Example 2
Based on embodiment 1, the grinding wheel 21 has a reverse tapered cross section.
The fan 3 can be adjusted in orientation angle.
A plurality of supporting feet are arranged on one surface of the bottom plate 13 of the base 1, which is far away from the bracket 14.
The installation cavity 131 is detachably arranged on the bottom plate 13, and the hydraulic telescopic cylinder 5 is fixed to the bottom of the inner cavity of the installation cavity 131 through bolts.
The utility model relates to a grinding device of circular monocrystalline silicon piece through set up fan 14 on support 14, dispels the heat to the monocrystalline silicon section that is in the grinding, and it is a large amount of pieces that produce to blow away the grinding in time simultaneously.
The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above description is only the embodiments of the present invention, and is not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (7)
1. A grinding device for a round monocrystalline silicon piece is characterized by comprising a supporting seat (1), a motor a (2) arranged on a support (14) of the supporting seat (1), a plurality of slide rails (11) arranged on one surface, close to the support (14), of a bottom plate (13) of the supporting seat (1), a slide box (12) arranged on the slide rails (11) in a sliding manner, a motor b (4) arranged in an inner cavity of the slide box (12) and a hydraulic telescopic cylinder (5) arranged in an installation cavity (131) on one surface, far away from the support (14), of the bottom plate (13), a grinding wheel (21) is arranged at the output end of the motor a (2), a fan (3) is arranged on one surface of the bracket (14) close to the bottom plate (13), the telescopic end of the hydraulic telescopic cylinder (5) is connected with the bottom of the sliding box (12), and a monocrystalline silicon slice fixing device (41) is arranged on the output end of the motor b (4).
2. The apparatus for grinding a circular single crystal silicon wafer as claimed in claim 1, wherein said grinding wheel (21) has a reverse tapered cross section.
3. The apparatus for grinding a circular single crystal silicon wafer as claimed in claim 1, wherein said fan (3) is adjustable in orientation angle.
4. The grinding processing device of the round monocrystalline silicon piece according to claim 1, characterized in that a plurality of supporting feet are arranged on one surface of the bottom plate (13) of the supporting base (1) far away from the bracket (14).
5. The apparatus for grinding a circular single crystal silicon wafer as claimed in claim 1, wherein said base plate (13) is made of high strength steel.
6. The grinding processing device for the round monocrystalline silicon piece is characterized in that the telescopic end of the hydraulic telescopic cylinder (5) is detachably connected with the bottom of the sliding box (12) through a bolt.
7. The grinding processing device for the round monocrystalline silicon piece is characterized in that the mounting cavity (131) is detachably arranged on the bottom plate (13), and the hydraulic telescopic cylinder (5) is fixed at the bottom of the inner cavity of the mounting cavity (131) through bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021929410.1U CN213795780U (en) | 2020-09-07 | 2020-09-07 | Grinding device for circular monocrystalline silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021929410.1U CN213795780U (en) | 2020-09-07 | 2020-09-07 | Grinding device for circular monocrystalline silicon wafer |
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| Publication Number | Publication Date |
|---|---|
| CN213795780U true CN213795780U (en) | 2021-07-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021929410.1U Active CN213795780U (en) | 2020-09-07 | 2020-09-07 | Grinding device for circular monocrystalline silicon wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115476237A (en) * | 2022-09-30 | 2022-12-16 | 浙江海纳半导体股份有限公司 | Automatic turn-over grinding equipment for monocrystalline silicon wafers |
-
2020
- 2020-09-07 CN CN202021929410.1U patent/CN213795780U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115476237A (en) * | 2022-09-30 | 2022-12-16 | 浙江海纳半导体股份有限公司 | Automatic turn-over grinding equipment for monocrystalline silicon wafers |
| CN115476237B (en) * | 2022-09-30 | 2024-03-08 | 浙江海纳半导体股份有限公司 | Automatic turn-over grinding equipment for monocrystalline silicon piece |
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