CN206401291U - Flip-chip patch device - Google Patents
Flip-chip patch device Download PDFInfo
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- CN206401291U CN206401291U CN201621425111.8U CN201621425111U CN206401291U CN 206401291 U CN206401291 U CN 206401291U CN 201621425111 U CN201621425111 U CN 201621425111U CN 206401291 U CN206401291 U CN 206401291U
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- chip
- rotating disk
- area
- absorption
- flip
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Abstract
The utility model provides a kind of flip-chip patch device, the equipment includes chip-stored area and chip Chip Area, chip-stored area is oppositely arranged with chip Chip Area, between chip-stored area and chip Chip Area, the direction of chip-stored area to chip Chip Area is provided with the first rotating disk and the second rotating disk, first rotating disk and the second rotating disk include rotating shaft and the multiple chip absorption devices set around the shaft circumference, the chip of first rotating disk absorption chip storage area, the chip absorption device of first rotating disk and the contact surface of chip are the surface that chip has pad, second rotating disk draws the chip adsorbed by the first rotating disk and chip is placed on into chip Chip Area, chip has the surface of pad towards chip Chip Area, and then realize flip-chip paster.The utility model advantage is that two rotating disk alternating sorbent chips so that when chip carries out paster in chip Chip Area with upside-down mounting paster, can simplify the preamble technique of upside-down mounting paster, raising paster efficiency just.
Description
Technical field
The utility model is related to field of semiconductor package, more particularly to a kind of flip-chip patch device.
Background technology
High-tech electronic product is just towards small, light, thin trend development.In contrast, by cost and otherwise
The area of market pressure, lead frame or encapsulating carrier plate develops towards large-sized direction on the contrary.Current most popular fan-out-type
Encapsulation technology, is based particularly on the encapsulation technology of large area encapsulating carrier plate, and the area of its package carrier has reached tradition envelope
Load body（Such as lead frame）10 times to 20 times or so.In face of this technological trend, it is each for how improving load/paster efficiency
Individual each top device fabrication commercial city of the whole world is the problem of considering.In semiconductor packages, it is necessary to by chip movement to carry out
Various techniques, such as die bond.But chip volume is smaller and broken, artificial moving chip is more difficult.
, typically can be predetermined being placed into after chip pick-up using special chip fetching device in order to solve the above problems
Position.Shown in Figure 1, a kind of existing chip fetching device 100 mainly includes the first suction nozzle 103 and the second suction nozzle 105.Core
Piece memory block 101 is used for depositing chip to be drawn, and chip rest area 102 is used for placing the device of chip to be laid, for example, sent out
It is used for the metallic support of chip placement in optical diode.First suction nozzle 103 from the absorption chip 104 of chip-stored area 101, this
When, the back side of chip 104 is exposed outside；180 degree is horizontally rotated after the absorption chip of first suction nozzle 103 by axle of vertical line A, will
The chip 104 is transported to the top of the second suction nozzle 105；The absorption chip 104 of second suction nozzle 105, now, chip 104 it is positive naked
Expose outside；Second suction nozzle 105 rotates 180 degree vertically using horizontal line B as axle, makes just being placed facing to chip for the chip 104
Area 102, and to the chip placement 104 of chip rest area 102, realize flip-chip, so circulation repeatedly, by chip from chip-stored
Area 101 is persistently placed into chip rest area 102.Such chip fetching device has the disadvantage that：Operational efficiency is relatively low, paster
Precision is also reduced, and limits overall production efficiency.
Therefore, a kind of chip patch device of high-efficiency high-precision is needed badly.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of flip-chip patch device, and it can efficiently be pasted
Piece, improves the operating efficiency of flip-chip paster.
In order to solve the above problems, the utility model provides a kind of flip-chip patch device, including chip-stored area
And chip Chip Area, the chip-stored area is oppositely arranged with the chip Chip Area, in the chip-stored area and the core
Between piece Chip Area, the direction of chip-stored area to chip Chip Area is provided with the first rotating disk and the second rotating disk, described first
Rotating disk and the second rotating disk include rotating shaft and the multiple chip absorption devices set around the shaft circumference, first rotating disk
The chip of absorption chip storage area, the chip absorption device of the first rotating disk and the contact surface of chip are the table that chip has pad
Face, second rotating disk draws the chip adsorbed by first rotating disk and the chip is placed on into chip Chip Area, described
Chip has the surface of pad towards the chip Chip Area, and then realizes flip-chip paster.
Further, the chip absorption device of first rotating disk and second rotating disk is symmetrical arranged.
Further, during the chip absorption device of first rotating disk and second rotating disk is in centered on each autorotation disk
The heart is symmetrical arranged.
Further, the chip absorption device quantity of first rotating disk and second rotating disk is identical.
Further, the chip absorption device is connected by a telescopic arm with the rotating disk, and the telescopic arm is flexible with drive
The chip absorption device is moved to stretch.
Further, first rotating disk is opposite with the second rotating disk rotation direction.
Further, in addition to the first supervising device, the second supervising device and the 3rd supervising device, first supervising device
The first rotating disk side is arranged on, the positional information of the chip for obtaining the absorption of the first rotating disk, and give second by the feedback of the information
Rotating disk；Second supervising device is arranged on the second rotating disk side, the positional information of the chip for obtaining the absorption of the second rotating disk,
And patch location is compensated accordingly；3rd supervising device is arranged on above chip Chip Area, for obtaining chip
The information of patch location is treated in Chip Area, and patch location is accordingly compensated.
The utility model has the advantage of paste between chip-stored area and chip Chip Area along chip-stored area to chip
The direction of section sets the first rotating disk and the second rotating disk, two rotating disk alternating sorbent chips so that chip enters in chip Chip Area
During row paster, the preamble technique of upside-down mounting paster with upside-down mounting paster, can be simplified just, improve paster efficiency.
Brief description of the drawings
Fig. 1 is the structural representation of existing upside-down mounting patch device；
Fig. 2 is the structural representation of the utility model flip-chip one embodiment of patch device；
Fig. 3 is the structural representation of another embodiment of the utility model flip-chip patch device.
Embodiment
The embodiment of the flip-chip patch device provided below in conjunction with the accompanying drawings the utility model is done specifically
It is bright.
Referring to Fig. 2, the utility model flip-chip patch device includes chip-stored area 201 and chip Chip Area 202.Institute
Stating chip-stored area 201 is used for storage chip, in this embodiment, and the chip-stored area 201 is cutting film, cutting
Good chip 300 is attached in the cutting film.The chip Chip Area 202 is used to receive chip, the chip Chip Area 202
Can be the structures well known to those skilled in the art available for flip-chip such as support plate, lead frame, the utility model is to this
Do not limit.The chip-stored area 201 is oppositely arranged with the chip Chip Area 202, for example, vertically opposite setting or level phase
To setting, in this embodiment, the chip-stored area 201 hangs down with the in the vertical direction of chip Chip Area 202
Directly it is oppositely arranged.
Between the chip-stored area 201 and the chip Chip Area 202, along chip-stored area 201 to chip paster
The direction in area 202 is provided with the first rotating disk 203 and the second rotating disk 204.First rotating disk 203 includes rotating shaft 2031 and around institute
State multiple chip absorption devices 2032 of the circumference of rotating shaft 2031 setting.Second rotating disk 204 includes rotating shaft 2041 and around institute
State multiple chip absorption devices 2042 of the circumference of rotating shaft 2041 setting.Rotating shaft as described herein refers not only to driving rotating disk rotation
Axle, it can also be with variously-shaped, as long as rotation and carrying chip absorption device are disclosure satisfy that, for example, it can be wrapped
A flat surface is included, the chip absorption device is arranged on the circumference of the flat surface.
The rotating shaft 2031 of first rotating disk is rotated so that a direction of chip absorption device 2032 of first rotating disk
Chip-stored area 201, the chip absorption device 2032 is flexible to draw the chip 300 placed in the chip-stored area 201, institute
Multiple chip absorption devices 2032 absorption chip 300 successively can be made by stating the rotation of rotating shaft 2031 of the first rotating disk.The chip pick-up
Device 2032 can be a vacuum suction suction nozzle, and those skilled in the art can obtain its structure from the prior art.Preferably, it is described
Chip absorption device 2032 passes through a telescopic arm（Do not indicated in accompanying drawing）It is connected with first rotating disk 203, the telescopic arm is stretched
Contract to drive the chip absorption device 2032 to stretch.
The rotating shaft 2041 of second rotating disk is rotated so that a direction of chip absorption device 2042 of second rotating disk
First rotating disk 203, the chip absorption device 2042 is flexible to draw the chip 300 that first rotating disk 203 is drawn, described second
The rotating shaft 2041 of rotating disk, which is rotated, can make multiple chip absorption devices 2042 absorption chip 300 successively.The chip absorption device
2042 can be a vacuum suction suction nozzle, and those skilled in the art can obtain its structure from the prior art.Preferably, the chip
Suction means 2042 passes through a telescopic arm（Do not indicated in accompanying drawing）Be connected with second rotating disk 204, the telescopic arm it is flexible with
The chip absorption device 2042 is driven to stretch.
The chip absorption device 2032 of first rotating disk 203 and the surface that the contact surface of chip is that chip has pad,
The absorption chip of chip absorption device 2032 of i.e. described first rotating disk has the surface of pad, has the surface phase of pad with chip
To chip back exposure outside.The chip absorption device 2042 of second rotating disk draws the chip pick-up of first rotating disk
Chip 300 on device 2032, the chip absorption device 2042 of second rotating disk is to have with chip with the contact surface of chip
The relative chip back in the surface of pad, i.e., the absorption chip back of chip absorption device 2042 of described second rotating disk, chip tool
There is the surface exposure of pad outside.The chip 300 of absorption is placed on chip Chip Area 202, the chip tool by the second rotating disk 203
There is the surface of pad towards the chip Chip Area, the chip back exposure relative with the surface that chip has pad is entered outside
And realize flip-chip paster.
Further, the chip absorption device of first rotating disk 203 and second rotating disk 204 is symmetrical arranged.It is preferred that
Ground, chip absorption device is centrosymmetric setting centered on each autorotation disk, and centrosymmetric advantage is, with a core
Piece suction means certainly exists another chip absorption device in the position of 180 degree angle, then when two chip absorption devices can
Different work are carried out simultaneously, improve production efficiency.For example, in an absorption chip of chip absorption device 2032 of the first rotating disk
During the chip of memory block 201, the inevitable court of another chip absorption device 2032 being centrosymmetric with the chip absorption device 2032
To the second rotating disk 204, now, a chip absorption device 2042 of second rotating disk draws first turn towards the second rotating disk
The chip of the chip absorption device 2032 of disk, and another chip absorption device being centrosymmetric with the chip absorption device 2042
2042 is inevitable towards chip Chip Area 202, towards the chip absorption device 2042 of chip Chip Area 202 to chip Chip Area 202
Chip placement 300, seen from the above description, the first rotating disk absorption chip, the second rotating disk absorption chip and chip placement can be simultaneously
Carry out, drastically increase the efficiency of flip-chip paster.
Further, the chip absorption device quantity of first rotating disk 203 and second rotating disk 204 is identical, can be achieved
Paster free of discontinuities.First rotating disk 203 is opposite with the rotation direction of the second rotating disk 204, it is possible to decrease to two rotating disk synchronizations
The requirement of property.Plane and the chip pick-up of second rotating disk 204 where the chip absorption device of first rotating disk 203 are filled
Plane where putting is parallel or vertical, for example, in fig. 2, two planes are parallel, in figure 3, two planes are vertical.
Further, the flip-chip patch device also includes the first supervising device 205, the second supervising device 206 and the
Three supervising devices 207.Wherein described first supervising device 205, the second supervising device 206 and the 3rd supervising device 207 can be
CCD, or other supervising devices well known to those skilled in the art, herein without limiting.
First supervising device 205 is arranged on the side of the first rotating disk 203, for obtaining the absorption of the first rotating disk 203
The positional information of chip, and the second rotating disk 204 is given by the feedback of the information, in this embodiment, the first monitoring dress
Put 205 chip absorption devices 2032 for closing on the second rotating disk 204 of direction to set, to obtain the position of the chip absorption device 2032
Information, and the positional information is fed back into second rotating disk 204, second rotating disk 204 adjusts core according to the feedback information
The absorption position of piece suction means, so as to improve the absorption precision of the second rotating disk.
Second supervising device 206 is arranged on the side of the second rotating disk 204, the core for obtaining the absorption of the second rotating disk 204
The positional information of piece 300, and patch location is compensated accordingly, for example, the chip offset obtained according to supervising device 206
Information is finely adjusted to the shift position of chip Chip Area 202）.
3rd supervising device 207 is arranged on the top of chip Chip Area 202, waits to paste for obtaining chip Chip Area 202
The information of piece position, and patch location is accordingly compensated, for example, because chip Chip Area 202 has one in itself when making
Fixed accuracy error, the 3rd supervising device 207 can obtain the accuracy error of chip Chip Area 202 itself and compensate.
The utility model flip-chip patch device is between chip-stored area and chip Chip Area along chip-stored area 201
Direction to chip Chip Area 202 sets the first rotating disk and the second rotating disk, due to two rotating disk alternating sorbent chips so that chip
When carrying out paster in chip Chip Area, the preamble technique of upside-down mounting paster with upside-down mounting paster, can be simplified just, improve paster effect
Rate.Meanwhile, the first supervising device 205, the second supervising device 206, the synergy of the 3rd supervising device 207 can avoid chip
The paster loss of significance that 300 transmitting range length are brought, improves paster precision.
The utility model also provides a kind of method using the flip-chip patch device pasting chip.Methods described bag
Include following steps：
Step（1）First rotating disk 203 is rotated, and multiple chip absorption devices 2032 of the first rotating disk are successively from the core
Piece memory block absorption chip, the chip absorption device 2032 of the first rotating disk is that chip has pad with the contact surface of chip 300
Surface, i.e., the absorption chip of chip absorption device 2032 of described first rotating disk has the surface of pad, has pad with chip
The relative chip back exposure in surface is outside.
Step（2）The chip absorption device 2042 of second rotating disk is successively from the chip absorption device 2032 of first rotating disk
Upper absorption chip, the chip absorption device 2042 of the second rotating disk is relative with the surface that chip has pad with the contact surface of chip
Chip back, i.e., the absorption chip back of chip absorption device 2042 of described second rotating disk, chip has the surface of pad sudden and violent
Expose outside.Preferably, while 2032 absorption chip of chip absorption device of the first rotating disk, the chip of the second rotating disk is inhaled
Device 2042 is taken to adsorb chip 300 from another chip absorption device 2032 of first rotating disk successively.
Step（3）The chip of absorption is placed on chip Chip Area 202 by the chip absorption device 2042 of the second rotating disk successively,
The chip has the surface of pad towards chip Chip Area, and the chip back relative with the surface that chip has pad is exposed to
Outside, and then flip-chip paster is realized.Preferably, the second rotating disk an absorption chip of chip absorption device 2042 it is same
When, the chip of absorption is placed on chip Chip Area 202 by another chip absorption device 2042 of the second rotating disk successively.
Further, methods described also includes following monitoring step：
First supervising device 205 obtains the positional information of the chip of the first rotating disk 203 absorption, and by the feedback of the information
To the second rotating disk 204；Second rotating disk 204 adjusts chip absorption device according to the feedack of the first supervising device 205 and inhaled
Fetch bit is put, to improve the precision of the absorption chip of the second rotating disk 204；Second supervising device 206 obtains the second rotating disk 204 and adsorbed
Chip positional information, and adjust the second rotating disk 204 chip to be placed chip absorption device position, to improve paster
Precision；3rd supervising device 207 obtains chip Chip Area 202 and treats the information of patch location, and adjusts chip Chip Area 202
Chip to be placed position, in order to improve paster precision.
Described above is only preferred embodiment of the present utility model, it is noted that for the common skill of the art
Art personnel, on the premise of the utility model principle is not departed from, can also make some improvements and modifications, these improvements and modifications
Also it should be regarded as protection domain of the present utility model.
Claims (7)
1. a kind of flip-chip patch device, including chip-stored area and chip Chip Area, it is characterised in that the chip-stored
Area is oppositely arranged with the chip Chip Area, between the chip-stored area and the chip Chip Area, along chip-stored area
Direction to chip Chip Area is provided with the first rotating disk and the second rotating disk, first rotating disk and the second rotating disk include rotating shaft and
The multiple chip absorption devices set around the shaft circumference, the chip of the first rotating disk absorption chip storage area, first
The chip absorption device of rotating disk and the contact surface of chip are the surface that chip has pad, and second rotating disk is drawn by described the
The chip is simultaneously placed on chip Chip Area by the chip of one rotating disk absorption, and the chip has the surface of pad towards the core
Piece Chip Area, and then realize flip-chip paster.
2. flip-chip patch device according to claim 1, it is characterised in that first rotating disk and described second turn
The chip absorption device of disk is symmetrical arranged.
3. flip-chip patch device according to claim 1, it is characterised in that first rotating disk and described second turn
The chip absorption device of disk is centrosymmetric setting centered on each autorotation disk.
4. flip-chip patch device according to claim 1, it is characterised in that first rotating disk and described second turn
The chip absorption device quantity of disk is identical.
5. flip-chip patch device according to claim 1, it is characterised in that the chip absorption device is stretched by one
Contracting arm is connected with the rotating disk, and the telescopic arm stretches to drive the chip absorption device to stretch.
6. flip-chip patch device according to claim 1, it is characterised in that first rotating disk and described second turn
Disk rotation direction is opposite.
7. flip-chip patch device according to claim 1, it is characterised in that also including the first supervising device, second
Supervising device and the 3rd supervising device, first supervising device are arranged on the first rotating disk side, are inhaled for obtaining the first rotating disk
The positional information of attached chip, and give the second rotating disk by the feedback of the information；Second supervising device is arranged on the second rotating disk one
Side, the positional information of the chip for obtaining the absorption of the second rotating disk, and patch location is compensated accordingly；3rd prison
Control device is arranged on above chip Chip Area, the information of patch location is treated for obtaining chip Chip Area, and patch location is entered
The corresponding compensation of row.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621425111.8U CN206401291U (en) | 2016-12-23 | 2016-12-23 | Flip-chip patch device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621425111.8U CN206401291U (en) | 2016-12-23 | 2016-12-23 | Flip-chip patch device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206401291U true CN206401291U (en) | 2017-08-11 |
Family
ID=59512277
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621425111.8U Active CN206401291U (en) | 2016-12-23 | 2016-12-23 | Flip-chip patch device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206401291U (en) |
-
2016
- 2016-12-23 CN CN201621425111.8U patent/CN206401291U/en active Active
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