CN216531902U

CN216531902U - High-impedance insulating metal substrate

Info

Publication number: CN216531902U
Application number: CN202122704800.XU
Authority: CN
Inventors: 黄景忠; 文红英
Original assignee: Zhaoqing Changlong Electronics Co ltd
Current assignee: Zhaoqing Changlong Electronics Co ltd
Priority date: 2021-11-05
Filing date: 2021-11-05
Publication date: 2022-05-13
Anticipated expiration: 2031-11-05

Abstract

The utility model discloses a high-impedance insulating metal substrate, which comprises a metal plate body, wherein two ends of the metal plate body are both provided with openings which are sunken inwards; the metal plate body comprises a metal layer, a heat conduction insulating layer arranged on the top of the metal layer and a conductive layer arranged on the top of the heat conduction insulating layer; the upper surface of the metal layer is provided with a plurality of grooves in a downward concave manner, and the lower surface of the heat-conducting insulating layer extends downwards to be provided with raised lines which are matched with the grooves in shape; through setting up the recess on the metal level for heat conduction insulation layer's lower surface is filled and is formed the sand grip in the recess, can make heat conduction insulation layer can be inseparabler with the combination of metal level, can increase the area of contact of heat conduction insulation layer and metal level again, promotes metal substrate's insulating properties and heat conductivility.

Description

High-impedance insulating metal substrate

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a high-impedance insulating metal substrate.

Background

The metal substrate consists of a heat conduction insulating layer, a metal plate and copper foil, and the copper foil is used for forming a circuit; the metal substrate commonly used at present usually uses an aluminum thin sheet or a copper thin sheet as a metal plate, and in order to make the metal substrate have good insulation and high thermal conductivity, the metal substrate in the prior art usually uses aluminum nitride or aluminum oxide as a thermal insulation layer.

The metal substrate with ultra-high thermal conductivity disclosed in the chinese patent application No. 201220419689.8 is composed of a thermal conductive insulating layer, a metal plate and a copper layer, wherein the thermal conductive insulating layer is a layer of aluminum nitride or aluminum oxide film formed on the surface of the metal plate by evaporation or sputtering; according to the patent, the aluminum nitride or the aluminum oxide is used as an insulating medium, so that the metal substrate has the advantages of good insulating property and high heat conductivity; however, the heat-conducting insulating layer and the metal plate are not tightly combined, the contact area between the heat-conducting insulating layer and the metal plate is small, and the insulation property and the heat conductivity of the metal substrate are reduced.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present invention is directed to a high-impedance insulated metal substrate with improved insulating performance and thermal conductivity, which improves the contact area between a thermal-conductive insulating layer and a metal plate.

In order to solve the technical problems, the technical scheme of the utility model is as follows: a high-impedance insulating metal substrate comprises a metal plate body, wherein two ends of the metal plate body are both provided with openings which are sunken inwards; the metal plate body comprises a metal layer, a heat conduction insulating layer arranged on the top of the metal layer and a conductive layer arranged on the top of the heat conduction insulating layer; the upper surface of metal level is provided with a plurality of recesses of sunken down, the lower surface of heat conduction insulation layer down extends be provided with the sand grip that the shape of recess suits.

Preferably, the bottom of the groove is semicircular.

Preferably, the openings are all arranged in a semicircular shape; set up the opening into semi-circular, can increase the surface of sheet metal body to can increase the area of contact of sheet metal body and air, promote the heat dispersion of sheet metal body.

Preferably, the material of the metal layer is copper or aluminum.

Preferably, the material of the heat conducting insulating layer is aluminum oxide or aluminum nitride; the heat conducting insulating layer is formed by adhering an aluminum oxide or aluminum nitride material on the metal layer by an evaporation or sputtering method; aluminum nitride and aluminum oxide materials, both of which have excellent thermal conductivity and insulation properties, are widely used in the electronics industry and the ceramics industry.

Preferably, the conductive layer is a copper foil conductive layer.

The technical effects of the utility model are mainly embodied as follows: through setting up the recess on the metal level for heat conduction insulation layer's lower surface is filled and is formed the sand grip in the recess, can make heat conduction insulation layer can be inseparabler with the metal level combination, can increase the area of contact of heat conduction insulation layer and metal level again, promotes metal substrate's insulating properties and heat conductivility.

Drawings

FIG. 1 is a schematic structural diagram of a high-impedance insulated metal substrate according to the present invention;

fig. 2 is a schematic view of a hierarchical structure of the metal plate body of fig. 1.

Detailed Description

The following detailed description of the embodiments of the present invention is provided in order to make the technical solution of the present invention easier to understand and understand.

In the present embodiment, it should be understood that the terms "middle", "upper", "lower", "top", "right", "left", "above", "back", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the present embodiment, if the connection or fixing manner between the components is not specifically described, the connection or fixing manner may be a bolt fixing manner, a pin connecting manner, or the like, which is commonly used in the prior art, and therefore, details thereof are not described in the present embodiment.

A high-impedance insulating metal substrate is shown in figures 1-2 and comprises a metal plate body 1, wherein two ends of the metal plate body 1 are both provided with openings 2 which are inwards recessed; the metal plate body 1 comprises a metal layer 11, a heat conduction insulating layer 12 arranged on the top of the metal layer 1, and a conductive layer 13 arranged on the top of the heat conduction insulating layer 12; the method is characterized in that: the upper surface of the metal layer 11 is provided with a plurality of parallel grooves 111 in a downward concave manner, and the lower surface of the heat-conducting insulating layer 12 is provided with raised strips 121 adapted to the shapes of the grooves 111 in a downward extending manner. The grooves 111 are embossed in the metal layer 111 by means of an embosser.

In this embodiment, the bottom of the groove 111 is semi-circular.

In the present embodiment, the openings 2 are all arranged in a semicircular shape. Set up opening 2 into semi-circular, can increase the surface of metal sheet body 1 to can increase the area of contact of metal sheet body 1 with the air, promote metal sheet body 1's heat dispersion.

In this embodiment, the material of the metal layer 11 is copper or aluminum.

In this embodiment, the material of the thermal insulation layer 12 is aluminum oxide or aluminum nitride. The thermal insulation layer 12 is formed by attaching an aluminum oxide or aluminum nitride material to the metal layer 11 by vapor deposition or sputtering. Aluminum nitride and aluminum oxide materials, both of which have excellent thermal conductivity and insulation properties, are widely used in the electronics industry and the ceramics industry.

In this embodiment, the conductive layer 13 is a copper foil conductive layer.

The above are only typical examples of the present invention, and besides, the present invention may have other embodiments, and all the technical solutions formed by equivalent substitutions or equivalent changes are within the scope of the present invention as claimed.

Claims

1. A high-impedance insulating metal substrate comprises a metal plate body, wherein two ends of the metal plate body are both provided with openings which are sunken inwards; the method is characterized in that: the metal plate body comprises a metal layer, a heat conduction insulating layer arranged on the top of the metal layer and a conductive layer arranged on the top of the heat conduction insulating layer; the upper surface of metal level is provided with a plurality of recesses of sunken down, the lower surface of heat conduction insulation layer down extends be provided with the sand grip that the shape of recess suits.

2. The high-impedance insulated metal substrate of claim 1, wherein: the bottom of the groove is in semicircular arrangement.

3. The high-impedance insulated metal substrate of claim 1, wherein: the openings are all arranged in a semicircular shape.

4. The high-impedance insulated metal substrate of claim 1, wherein: the metal layer is made of copper or aluminum.

5. The high-impedance insulated metal substrate of claim 1, wherein: the material of the heat conduction insulating layer is aluminum oxide or aluminum nitride.

6. The high-impedance insulated metal substrate of claim 1, wherein: the conducting layer is a copper foil conducting layer.