CN216527222U

CN216527222U - Electronic tag chip carrier tape module packaging structure

Info

Publication number: CN216527222U
Application number: CN202122228454.2U
Authority: CN
Inventors: 王云青
Original assignee: Suzhou Haoyan Electronic Technology Co ltd
Current assignee: Suzhou Haoyan Electronic Technology Co ltd
Priority date: 2021-09-15
Filing date: 2021-09-15
Publication date: 2022-05-13
Anticipated expiration: 2031-09-15

Abstract

The utility model discloses an electronic tag chip carrier tape module packaging structure, and relates to the technical field of chip packaging. The chip packaging device comprises a reel, wherein a chip carrier tape is wound in the reel, a sealing tape is coated on the upper surface of the chip carrier tape, grooves are uniformly distributed in the chip carrier tape, chip modules are fixedly mounted in the grooves, and fixing holes are uniformly distributed in two sides of the chip carrier tape. The chip module is wound and collected through the components such as the blocking piece, the winding shaft, the chip carrier tape and the like, so that the occupied space is greatly reduced, and convenience is brought to the subsequent work such as transportation, storage and the like; the cost of production and consumption is reduced under the condition of keeping the original protection performance through structural designs such as a sealing tape, a loading body, a functional bonding pad, a welding flux and the like.

Description

Electronic tag chip carrier tape module packaging structure

Technical Field

The utility model belongs to the technical field of chip packaging, and particularly relates to a packaging structure of an electronic tag chip carrier tape module.

Background

In the information society of today, products with high speed, high quality and versatility are sought, and the trend toward light, thin, short and small products in terms of appearance is advancing. In order to achieve the above purpose, many companies integrate systematic concepts when designing circuits, so that a single chip can have many functions, thereby saving the number of chips configured in electronic products and achieving the purpose of reducing circuit size. In addition, in terms of electronic packaging technology, in order to match the trend of light, thin, short, and small designs, the concept of package design of multi-chip module, the concept of package design of chip size package, the concept of stacked multi-chip package design, and the like have also been developed.

Patent specification CN202021222411.2 discloses a chip, a chip array structure and a package module, the utility model includes a chip, the chip includes a source region and a gate region located on the same side of the chip surface; and a barrier layer is arranged between the source region and the gate region and protrudes out of the surfaces of the source region and the gate region. The utility model discloses an occupation space is still great after the encapsulation, is not convenient for its transportation, storage, and simultaneously, the chip adopts the form of bare chip to paste the dress on the smart card carries the area, and the bare chip needs to use under purifying the environment to save under nitrogen gas environment, if preserve improper can cause the unable welded condition of pad, thereby its manufacturing cost and save cost are more expensive always.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

The utility model provides an electronic tag chip carrier tape module packaging structure aiming at the problems in the related art, so as to overcome the technical problems in the prior related art.

In order to solve the technical problems, the utility model is realized by the following technical scheme:

the utility model relates to an electronic tag chip carrier tape module packaging structure which comprises a reel, wherein a chip carrier tape is wound in the reel, a sealing tape is coated on the upper surface of the chip carrier tape, grooves are uniformly distributed in the chip carrier tape, a chip module is fixedly mounted in the grooves, and fixing holes are uniformly distributed in two sides of the chip carrier tape.

Furthermore, the reel is including the cladding axle, cladding axle both sides fixed mounting has the separation blade.

Further, the chip module comprises a loading body, a chip is fixedly installed in the loading body, and the bottom of the chip is fixedly installed on the upper surface of the loading body through coating adhesive.

Further, the chip top is equipped with a plurality of chip function pad, loading body upper surface fixed mounting has module function pad, chip function pad through the lead wire with module function pad electric connection, chip function pad with module function pad quantity equals, connects through the lead wire one-to-one.

Furthermore, the solder is fixedly arranged inside the loading body, a protruding welding block is fixedly connected to the bottom of the solder, and the protruding welding block is welded to the lower surface of the groove.

The utility model has the following beneficial effects:

1. the chip module is wound and collected through the components such as the blocking piece, the winding shaft, the chip carrier tape and the like, so that the occupied space is greatly reduced, and convenience is brought to the subsequent work such as transportation, storage and the like.

2. The cost of production and consumption is reduced under the condition of keeping the original protection performance through structural designs such as a sealing tape, a loading body, a functional bonding pad, a welding flux and the like.

Of course, it is not necessary for any product to practice the utility model to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive work.

FIG. 1 is an overall view of an embodiment of the present invention;

FIG. 2 is a partial chip carrier tape display of an embodiment of the present invention;

FIG. 3 is a view showing a reel structure according to an embodiment of the present invention;

fig. 4 is an internal structure diagram of a chip module according to an embodiment of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. coiling; 2. carrying a chip; 3. sealing a tape; 4. a groove; 5. a chip module; 6. a fixing hole; 11. a baffle plate; 12. winding a covering shaft; 51. loading a carrier; 52. a chip; 53. a binder; 54. a chip function pad; 55. a module function pad; 56. welding flux; 57. and (5) projecting the welding blocks.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by a person skilled in the art without any inventive work based on the embodiments of the present invention belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "open", "upper", "lower", "top", "middle", "inner", and the like, indicate positional or orientational relationships and are used merely for convenience in describing the utility model and for simplicity in description, and do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model.

Referring to fig. 1-4, the utility model relates to an electronic tag chip carrier tape module packaging structure, which comprises a reel 1, wherein a chip carrier tape 2 is wound in the reel 1, a sealing tape 3 is coated on the upper surface of the chip carrier tape 2, grooves 4 are uniformly distributed in the chip carrier tape 2, chip modules 5 are fixedly arranged in the grooves 4, and fixing holes 6 are uniformly distributed on two sides of the chip carrier tape 2.

In an embodiment, for above-mentioned reel 1, reel 1 is including the cladding axle 12, cladding axle 12 both sides fixed mounting has separation blade 11 to through being fixed in the cladding axle 12 with 2 one end of chip carrier band, rotatory cladding axle 12 twines chip carrier band 2 on cladding axle 12, the separation blade 11 of both sides is fixed the both sides of chip carrier band 2, the winding of chip carrier band 2 of being convenient for, and then the realization is collected chip carrier band 2 after the encapsulation, reduces its occupation space by a wide margin, it is convenient to bring for work such as transportation, storage.

In an embodiment, for the chip module 5, the chip module 5 includes a carrier 51, the chip 52 is fixedly mounted in the carrier 51, and the bottom of the chip 52 is fixedly mounted on the upper surface of the carrier 51 by coating an adhesive 53, so that the chip 52 is fixed on the carrier 51 by the adhesive 53, and further the position of the chip 52 in the chip module 5 is fixed, the chip 52 is prevented from shaking in the chip module 5 to cause damage, and meanwhile, the subsequent work is facilitated.

In an embodiment, for the chip 52, a plurality of chip function pads 54 are disposed on the top of the chip 52, module function pads 55 are fixedly mounted on the upper surface of the carrier 51, the chip function pads 54 are electrically connected to the module function pads 55 through leads, the number of the chip function pads 54 is equal to that of the module function pads 55, and the chip function pads 54 and the module function pads 55 are connected in a one-to-one correspondence through the leads, so that the chip 52 is electrically connected to the carrier 51 through the chip function pads 54 and the module function pads 55.

In one embodiment, for the carrier 51, the solder 56 is fixedly mounted inside the carrier 51, the bottom of the solder 56 is fixedly connected with the protruding solder bumps 57, the protruding solder bumps 57 are soldered to the lower surface of the groove 4, so that the carrier 51 is soldered to the lower surface of the groove 4 by the solder 56, the protruding solder bumps 57 increase the soldering area and the soldering firmness, and the module function pads 55 are tightly connected to the chip carrier tape 2 by the solder 56 and the protruding solder bumps 57. In addition, for specific applications, a lower cost alloy material may be used for the protruding solder bump 57.

Through the technical scheme, 1, the chip module 5 is wound and collected through the components such as the blocking piece 11, the winding shaft 12, the chip carrier tape 2 and the like, so that the occupied space is greatly reduced, and convenience is brought to the subsequent work of transportation, storage and the like; 2. the structural design of the sealing tape 3, the loading body 51, the functional pads, the solder 56 and the like realizes the reduction of the production and consumption cost of the sealing tape while maintaining the original protection performance.

In the description of the present specification, reference to the description of "one embodiment," "an example," "a specific example" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the utility model disclosed above are intended only to help illustrate the utility model. The preferred embodiments are not intended to be exhaustive or to limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and its practical application, to thereby enable others skilled in the art to best understand and utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides an electronic tags chip carrier band module packaging structure, includes reel (1), its characterized in that: reel (1) interior convolution has chip carrier band (2), chip carrier band (2) upper surface covers has sealing tape (3), the equipartition is fluted (4) in chip carrier band (2), fixed mounting has chip module (5) in recess (4), chip carrier band (2) both sides equipartition has fixed orifices (6).

2. The package structure of an electronic tag chip carrier tape module according to claim 1, wherein the reel (1) comprises a winding shaft (12), and the two sides of the winding shaft (12) are fixedly provided with the blocking pieces (11).

3. The package structure of claim 1, wherein the chip module (5) comprises a carrier (51), a chip (52) is fixedly mounted in the carrier (51), and the bottom of the chip (52) is fixedly mounted on the upper surface of the carrier (51) by coating an adhesive (53).

4. The package structure of an electronic tag chip carrier tape module as claimed in claim 3, wherein a plurality of chip function pads (54) are disposed on the top of the chip (52), the module function pads (55) are fixedly mounted on the upper surface of the carrier (51), the chip function pads (54) are electrically connected to the module function pads (55) through leads, and the number of the chip function pads (54) is equal to that of the module function pads (55) and the chip function pads (54) are connected in a one-to-one correspondence manner through the leads.

5. The package structure of an electronic tag chip carrier tape module as claimed in claim 4, wherein the carrier (51) is fixedly mounted with solder (56), a protruding solder block (57) is fixedly connected to the bottom of the solder (56), and the protruding solder block (57) is soldered to the lower surface of the groove (4).