CN211629076U - Heterogeneous WiFiSiP packaging structure - Google Patents
Heterogeneous WiFiSiP packaging structure Download PDFInfo
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- CN211629076U CN211629076U CN202020263907.8U CN202020263907U CN211629076U CN 211629076 U CN211629076 U CN 211629076U CN 202020263907 U CN202020263907 U CN 202020263907U CN 211629076 U CN211629076 U CN 211629076U
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Abstract
The utility model discloses a heterogeneous wiFi SiP packaging structure, including the naked die of Flash, base plate, the naked die of wiFi and inductance region, the naked die of wiFi is installed on the base plate, and the top of the naked die of wiFi is equipped with the inductance region, and the naked die of Flash piles up on the non-inductance region of the naked die of wiFi, the utility model discloses a suitable processing piles up the encapsulation with the naked die of Flash and the naked die of wiFi, has reduced the overall size of wiFi SiP, and the design of simplified system, reduce cost improves the reliability, strengthens the competitiveness.
Description
Technical Field
The utility model relates to the field of electronic technology, specifically a heterogeneous WiFiSiP packaging structure.
Background
Flash stack package technology is common in SiP field, but most of them are applied in memory field, such as NAND Flash chip. When the existing WiFi chip is applied, a Flash chip is generally required to be configured for storing data, so a WiFi bare die and a Flash bare die are often integrated in WiFi SiP design. Due to the special design of the WiFi bare Die, devices cannot be placed in some areas on the top of the Die, so that the WiFi bare Die and the Flash bare Die are usually attached to a substrate in a Die by Die mode during WiFi SiP design, errors are avoided without adopting a stacking mode, and the WiFiSiP is large in size, high in cost increase, low in reliability and poor in competitiveness.
Due to the special design of the existing WiFi bare die, an inductance area is arranged at the top of the die, and if the bottom of the Flash bare die (the bottom of the Flash bare die is metal) is pressed to the inductance area, the Q value and the L value of an inductor can be influenced, so that the radio frequency performance of the WiFi is influenced, such as the problems of frequency deviation, gain reduction, linearity deterioration and the like.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heterogeneous WiFiSiP packaging structure to solve the problem of proposing among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a heterogeneous WiFiSiP packaging structure, includes the naked die of Flash, base plate, the naked die of wiFi and inductance area, the naked die of wiFi is installed on the base plate, and the top of the naked die of wiFi is equipped with the inductance area, and the naked die of Flash piles up on the non-inductance area of the naked die of wiFi.
As a further technical solution of the present invention: and the WiFi bare die is bonded with the substrate through silver adhesive.
As a further technical solution of the present invention: the Flash bare die and the WiFi bare die are connected through DAF glue.
As a further technical solution of the present invention: and the Flash bare die and the WiFi bare die are processed in a gold wire bonding mode.
As a further technical solution of the present invention: the bottom of the Flash bare die is metal.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a suitable processing piles up the encapsulation with the naked die of Flash and the naked die of wiFi, has reduced wiFi SiP's overall dimension, simplifies the system design, and reduce cost improves the reliability, strengthens the competitiveness.
Drawings
FIG. 1 is an internal top view of the WiFi SiP package of the present invention;
FIG. 2 is an internal side view of the WiFi SiP package of the present invention;
fig. 3 is a diagram of a conventional WiFi SiP package.
FIG. 4 is a schematic structural view of embodiment 2.
In the figure: 1-Flash bare die, 2-WiFi bare die, 3-inductance area, 4-substrate and 5-gold wire.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1: referring to fig. 1-4, a heterogeneous WiFi isip package structure includes a Flash bare die1, a substrate 4, a WiFi bare die2, and an inductance region 3, where the WiFi bare die2 is mounted on the substrate 4, the inductance region 3 is disposed on the top of the WiFi bare die2, and the Flash bare die is stacked 1 on the non-inductance region of the WiFi bare die 2.
The specific manufacturing method is as follows: grabbing the WiFi bare die2 from the cut wafer, attaching the WiFi bare die2 to a DA (digital-to-analog) die attaching area of the substrate 4, and adhering the WiFi bare die2 to the substrate 4 by using silver adhesive; stacking the Flash bare die1 on the WiFi bare die2, continuously adjusting the stacking position of the Flash bare die1 to avoid an inductance area 3 at the top of the WiFi bare die2, enabling the bonding mode of a gold wire 5 to be reasonable at the position, and connecting the Flash bare die1 and the WiFi bare die2 through DAFDie attachfilm glue; and finally, finishing signal connection between the WiFi bare die2 and the substrate 4 and between the WiFi bare die2 and the Flash bare die1 in a manner of bonding by gold wires 5. The utility model discloses a wiFi SiP packaging mode is under the prerequisite that does not influence the chip performance to the mode that the chip piled up realizes that the encapsulation size is more miniaturized.
Example 2: based on embodiment 1, as shown in fig. 4, the installation angle and position of Flash bare die1 do not need to be absolutely fixed, and may be vertically set or obliquely set.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (5)
1. The utility model provides a heterogeneous WiFiSiP packaging structure, includes Flash naked die (1), base plate (4), the naked die (2) of wiFi and inductance area (3), its characterized in that, the naked die (2) of wiFi is installed on base plate (4), and the top of the naked die (2) of wiFi is equipped with inductance area (3), and Flash naked die (1) is piled up on the non-inductance area of the naked die (2) of wiFi.
2. The package structure of claim 1, wherein the WiFi bare die (2) is bonded to the substrate (4) by silver paste.
3. The heterogeneous WiFiSiP packaging structure according to claim 2, wherein the Flash bare die (1) and the WiFi bare die (2) are connected by DAF glue.
4. The heterogeneous WiFiSiP packaging structure according to claim 1, wherein the Flash bare die (1) and the WiFi bare die (2) are bonded by a gold wire (5).
5. The heterogeneous WiFiSiP package structure according to claim 1, wherein the bottom of the Flash bare die (1) is metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020263907.8U CN211629076U (en) | 2020-03-06 | 2020-03-06 | Heterogeneous WiFiSiP packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020263907.8U CN211629076U (en) | 2020-03-06 | 2020-03-06 | Heterogeneous WiFiSiP packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211629076U true CN211629076U (en) | 2020-10-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020263907.8U Active CN211629076U (en) | 2020-03-06 | 2020-03-06 | Heterogeneous WiFiSiP packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211629076U (en) |
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2020
- 2020-03-06 CN CN202020263907.8U patent/CN211629076U/en active Active
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