CN216491240U - Integrated circuit board convenient to location installation - Google Patents
Integrated circuit board convenient to location installation Download PDFInfo
- Publication number
- CN216491240U CN216491240U CN202123095930.4U CN202123095930U CN216491240U CN 216491240 U CN216491240 U CN 216491240U CN 202123095930 U CN202123095930 U CN 202123095930U CN 216491240 U CN216491240 U CN 216491240U
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- circuit board
- integrated circuit
- butt joint
- joint frame
- heat
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Abstract
The utility model discloses an integrated circuit board convenient to location installation, include: the circuit board comprises a circuit board body, wherein mounting holes are formed in the corners of the circuit board body, a butt joint frame is arranged inside the mounting holes, and one end of the butt joint frame is connected with a mounting plate; the built on stilts pad is connected the one end that the mounting panel was kept away from to the butt joint frame, and the surface of circuit board body is provided with the heat-resistant layer to the viscose layer sets up between circuit board body and heat-resistant layer, the surface of heat-resistant layer is provided with the protective layer. This integrated circuit board convenient to location installation adopts the heat-resistant layer of polytetrafluoroethylene material for integrated circuit board has heat resistance, and through the setting of built on stilts pad, thereby makes integrated circuit board have the radiating effect, cooperation size assorted stopper and spacing groove and non-slip raised, thereby makes integrated circuit board have location mounting structure, and it is protruding to fill up and cushion through being provided with the protection, thereby prevents that integrated circuit board's surface is impaired.
Description
Technical Field
The utility model relates to an integrated circuit board technical field specifically is an integrated circuit board convenient to location installation.
Background
The integrated circuit board is manufactured by manufacturing a plurality of transistors, resistors, capacitors and other components on a smaller single crystal silicon chip, and combining the components into a complete electronic circuit by a multilayer wiring or tunnel wiring method, and is widely applied to a plurality of electrical equipment.
The integrated circuit board also has the following problems:
1. the integrated circuit board has no heat dissipation effect;
2. the components on the integrated circuit board are not convenient to position and mount;
3. the surface of the integrated circuit board is easily damaged; therefore, improvements are made to the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an integrated circuit board convenient to location installation to solve the integrated circuit board on the existing market that above-mentioned background art provided and do not have the radiating effect, the easy impaired problem in surface of the last subassembly of integrated circuit board installation and integrated circuit board of being not convenient for fix a position.
In order to achieve the above object, the utility model provides a following technical scheme: an integrated circuit board for facilitating location-based mounting, comprising:
the circuit board comprises a circuit board body, wherein mounting holes are formed in the corners of the circuit board body, a butt joint frame is arranged inside the mounting holes, and one end of the butt joint frame is connected with a mounting plate;
the built on stilts pad is connected the one end that the mounting panel was kept away from to the butt joint frame, and the surface of circuit board body is provided with the heat-resistant layer to the viscose layer sets up between circuit board body and heat-resistant layer, the surface of heat-resistant layer is provided with the protective layer.
Preferably, the cross-sectional shape of butt joint frame is "T" style of calligraphy, the heat-resistant layer adopts the polytetrafluoroethylene material, through being provided with the heat-resistant layer of polytetrafluoroethylene material for integrated circuit board has heat resistance.
Preferably, the one side that built on stilts pad is close to the butt joint frame is provided with the stopper, and the butt joint frame is close to the one side that is close to built on stilts pad and offers the spacing groove with the stopper butt joint to the one side that built on stilts pad kept away from the butt joint frame is provided with anti-skidding arch, through being provided with anti-skidding arch, makes integrated circuit board be difficult for taking place the offset when butt joint with the assigned position.
Preferably, the stopper all is contained angle distribution such as with the spacing groove, and the butt joint size phase-match of stopper and spacing groove, through the butt joint size phase-match of stopper and spacing groove for the built on stilts pad can carry out accurate butt joint installation.
Preferably, one side that the mounting panel is close to the butt joint frame is provided with the buffering arch, and the buffering arch is the symmetric distribution about the central line of mounting panel, through the bellied setting of buffering for the screw is difficult for causing the damage to the surface of circuit board body.
Preferably, the bilateral symmetry of circuit board body is provided with the protection pad, and the protection pad is equidistant distribution, through the setting of protection pad for the difficult wearing and tearing in edge of circuit board body.
Compared with the prior art, the beneficial effects of the utility model are that: this integrated circuit board convenient to location installation adopts the heat-resistant layer of polytetrafluoroethylene material for integrated circuit board has heat resistance, and through the setting of built on stilts pad, thereby makes integrated circuit board have the radiating effect, cooperation size assorted stopper and spacing groove and non-slip raised, thereby makes integrated circuit board have location mounting structure, and it is protruding to fill up and cushion through being provided with the protection, thereby prevents that integrated circuit board's surface is impaired.
1. According to the integrated circuit board convenient to position and mount, a certain gap can be kept between the integrated circuit board and an appointed position through the arrangement of the overhead pad, so that the integrated circuit board has a certain heat dissipation effect, and due to the arrangement of the heat-resistant layer, the integrated circuit board has the heat dissipation effect because the polytetrafluoroethylene has the characteristic of high temperature resistance;
2. according to the integrated circuit board convenient to position and mount, the limit block at the top of the overhead pad is butted with the limit groove at the bottom of the butt joint frame, the butt joint size of the limit block and the limit groove is matched, so that the overhead pad can be precisely butted and mounted, and the integrated circuit board is not easy to shift when being butted with an appointed position through the anti-skid protrusions at the bottom of the overhead pad, so that the integrated circuit board has a positioning and mounting structure;
3. this integrated circuit board convenient to location installation will dock the frame and run through the mounting hole and dock with the mounting panel, through the setting of buffering arch and mounting panel for when the screw is installed the circuit board body in the assigned position, the screw is difficult for causing the damage to the surface of circuit board body, and through the setting of protection pad, makes the difficult wearing and tearing of edge of circuit board body, thereby prevents that integrated circuit board's surface is impaired.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is a schematic view of the cross-sectional structure of the present invention viewed from the bottom;
fig. 3 is a schematic cross-sectional structure view of the circuit board body of the present invention;
fig. 4 is a schematic view of the cross-sectional structure of the docking rack of the present invention viewed from the bottom.
In the figure: 1. a circuit board body; 2. mounting holes; 3. a docking rack; 4. mounting a plate; 5. an overhead pad; 6. a heat-resistant layer; 7. an adhesive layer; 8. a protective layer; 9. a limiting block; 10. a limiting groove; 11. anti-skid projections; 12. a buffer protrusion; 13. a protective pad.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: an integrated circuit board for facilitating location-based mounting, comprising: circuit board body 1, mounting hole 2 has been seted up at the turning of circuit board body 1, and the inside of mounting hole 2 is provided with butt joint frame 3, and the one end of butt joint frame 3 is connected with mounting panel 4, and built on stilts pad 5 is connected in the one end of keeping away from mounting panel 4 of butt joint frame 3, and circuit board body 1's surface is provided with heat-resistant layer 6 to viscose layer 7 sets up between circuit board body 1 and heat-resistant layer 6, and heat-resistant layer 6's surface is provided with protective layer 8.
The cross section of the butt joint frame 3 is T-shaped, and the heat-resistant layer 6 is made of polytetrafluoroethylene.
Through the setting of built on stilts pad 5 for integrated circuit board can keep certain clearance when with the assigned position, makes integrated circuit board have certain radiating effect, and through the setting of heat-resistant layer 6, because polytetrafluoroethylene has high temperature resistant characteristics, thereby makes integrated circuit board have radiating effect.
A limit block 9 is arranged on one side of the overhead pad 5 close to the butt joint frame 3, a limit groove 10 in butt joint with the limit block 9 is formed in one side of the butt joint frame 3 close to the overhead pad 5, and an anti-skid bulge 11 is arranged on one side of the overhead pad 5 far away from the butt joint frame 3; the limiting blocks 9 and the limiting grooves 10 are distributed at equal included angles, and the abutting sizes of the limiting blocks 9 and the limiting grooves 10 are matched.
The limiting block 9 at the top of the overhead pad 5 is butted with the limiting groove 10 at the bottom of the butt joint frame 3, the butt joint size of the limiting block 9 and the limiting groove 10 is matched, so that the overhead pad 5 can be accurately butted and installed, and the anti-skid protrusions 11 at the bottom of the overhead pad 5 enable the integrated circuit board to be difficult to shift when being butted with an appointed position, and the integrated circuit board is enabled to have a positioning and installing structure.
A buffering bulge 12 is arranged on one side of the mounting plate 4 close to the butt joint frame 3, and the buffering bulges 12 are symmetrically distributed about the central line of the mounting plate 4; the protection pads 13 are symmetrically arranged on two sides of the circuit board body 1, and the protection pads 13 are distributed at equal intervals.
To connect frame 3 to run through mounting hole 2 and dock with mounting panel 4, through the setting of buffering arch 12 and mounting panel 4 for when the screw was installed circuit board body 1 at the assigned position, the difficult damage that causes the surface of circuit board body 1 of screw, and through the setting of protection pad 13, make the difficult quilt wearing and tearing in edge of circuit board body 1, thereby prevent that integrated circuit board's surface is impaired.
To sum up, to connect frame 3 and run through mounting hole 2 and dock with mounting panel 4, through the setting of buffering arch 12 and protection pad 13, thereby prevent that integrated circuit board's surface from being impaired, to connect the stopper 9 at built on stilts pad 5 top and the spacing groove 10 of 3 bottoms of butt joint frame, through the anti-skidding arch 11 of built on stilts pad 5 bottom, make integrated circuit board difficult emergence offset when butt joint with the assigned position, through the setting of built on stilts pad 5, make integrated circuit board can keep certain clearance when with the assigned position, make integrated circuit board have certain radiating effect, and through the setting of heat-resistant layer 6, because polytetrafluoroethylene has high temperature resistant characteristics, thereby make integrated circuit board have radiating effect, the content that does not make detailed description in this description belongs to the prior art that the professional skilled person in the art publicly knows.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. An integrated circuit board for facilitating location-based mounting, comprising:
the circuit board comprises a circuit board body (1), wherein mounting holes (2) are formed in corners of the circuit board body (1), a butt joint frame (3) is arranged inside the mounting holes (2), and one end of the butt joint frame (3) is connected with a mounting plate (4);
the built on stilts pad (5) is connected the one end of mounting panel (4) is kept away from in butt joint frame (3), and the surface of circuit board body (1) is provided with heat-resistant layer (6) to viscose layer (7) set up between circuit board body (1) and heat-resistant layer (6), the surface of heat-resistant layer (6) is provided with protective layer (8).
2. An integrated circuit board for facilitating location mounting according to claim 1, wherein: the cross section of the butt joint frame (3) is T-shaped, and the heat-resistant layer (6) is made of polytetrafluoroethylene.
3. An integrated circuit board for facilitating location mounting according to claim 1, wherein: one side of the overhead pad (5) close to the butt joint frame (3) is provided with a limiting block (9), one side of the butt joint frame (3) close to the overhead pad (5) is provided with a limiting groove (10) in butt joint with the limiting block (9), and one side of the overhead pad (5) far away from the butt joint frame (3) is provided with an antiskid bulge (11).
4. An integrated circuit board for facilitating location mounting according to claim 3, wherein: stopper (9) all are equal contained angle distribution with spacing groove (10), and the butt joint size phase-match of stopper (9) and spacing groove (10).
5. An integrated circuit board for facilitating location mounting according to claim 1, wherein: one side of the mounting plate (4) close to the butt joint frame (3) is provided with a buffering bulge (12), and the buffering bulge (12) is symmetrically distributed about the central line of the mounting plate (4).
6. An integrated circuit board for facilitating location mounting according to claim 1, wherein: protection pads (13) are symmetrically arranged on two sides of the circuit board body (1), and the protection pads (13) are distributed at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123095930.4U CN216491240U (en) | 2021-12-10 | 2021-12-10 | Integrated circuit board convenient to location installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123095930.4U CN216491240U (en) | 2021-12-10 | 2021-12-10 | Integrated circuit board convenient to location installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216491240U true CN216491240U (en) | 2022-05-10 |
Family
ID=81422622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123095930.4U Active CN216491240U (en) | 2021-12-10 | 2021-12-10 | Integrated circuit board convenient to location installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216491240U (en) |
-
2021
- 2021-12-10 CN CN202123095930.4U patent/CN216491240U/en active Active
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