CN216389274U - Die bonding ring correction mechanism of full-automatic wafer sorting machine - Google Patents
Die bonding ring correction mechanism of full-automatic wafer sorting machine Download PDFInfo
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- CN216389274U CN216389274U CN202122534583.4U CN202122534583U CN216389274U CN 216389274 U CN216389274 U CN 216389274U CN 202122534583 U CN202122534583 U CN 202122534583U CN 216389274 U CN216389274 U CN 216389274U
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- die bonding
- bonding ring
- motor
- axis motion
- fixing block
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model aims to provide a die bonding ring correction mechanism of a full-automatic wafer sorting machine, which is used for realizing the positioning through a transverse shaft and a vertical shaft and realizing the rotary accurate positioning through a circular die bonding ring. The die bonding machine comprises a Y-axis motion motor, wherein a motor shaft of the Y-axis motion motor is provided with a lead screw transmission structure, a moving block of the lead screw transmission structure is provided with a die bonding ring fixing block, the die bonding ring fixing block is provided with a die bonding ring driving motor, and a transmission belt is sleeved on the motor shaft of the die bonding ring driving motor and the die bonding ring; a wafer fixing disc is arranged on one side of the die bonding ring, and a shaft rotating structure is arranged between the die bonding ring and the die bonding ring fixing block; the Y-axis motion motor and the die bonding ring fixing block are arranged on an X-axis motion motor and horizontally moved by the X-axis motion motor. The utility model drives the die bonding ring to rotate and calibrate the wafer by the die bonding ring driving motor, and takes away the wafer by the next procedure, thereby realizing precise procedure connection. The method is suitable for application in a wafer sorting machine.
Description
Technical Field
The utility model relates to a wafer sorting machine, in particular to a correcting mechanism of a full-automatic wafer sorting machine.
Background
In the prior art, a wafer sorting machine needs to sort different electronic data wafers after passing a test, hundreds or thousands of different data wafers are attached to a substrate, and a plurality of substrates are vertically placed in a substrate slot. The prior art has automatic sorting facilities, however, because sorting facilities among the prior art has the technical problem that solid crystal ring aligning gear's precision is poor, appear rectifying inaccurate defect easily when the wafer is selected separately, because the wafer volume is tiny, solid crystal ring aligning gear can not accurate position to get the crystalline substance fixed be the technical defect that equipment among the prior art exists, the automatic equipment of getting the wafer process at present has the technical defect that the precision is poor, become the technical problem that technical staff in the field await the solution promptly.
Disclosure of Invention
The utility model aims to overcome the technical problems of inaccurate correction and complex equipment of a wafer sorting machine in the prior art, and provides a die bonding ring correction mechanism of a full-automatic wafer sorting machine, which realizes rotary accurate positioning through positioning of a transverse shaft and a vertical shaft and through a circular die bonding ring.
In order to achieve the technical purpose, the technical scheme of the utility model is as follows:
the die bonding ring correction mechanism of the full-automatic wafer sorting machine comprises a Y-axis motion motor, wherein a screw rod transmission structure is arranged on a motor shaft of the Y-axis motion motor, a die bonding ring fixing block is arranged on a moving block of the screw rod transmission structure, a die bonding ring driving motor is arranged on the die bonding ring fixing block, and a transmission belt is sleeved on the motor shaft of the die bonding ring driving motor and the die bonding ring; a wafer fixing disc is arranged on one side of the die bonding ring, and a shaft rotating structure is arranged between the die bonding ring and the die bonding ring fixing block; the Y-axis motion motor and the die bonding ring fixing block are arranged on an X-axis motion motor and horizontally moved by the X-axis motion motor.
Furthermore, a die bonding ring back plate is arranged on the die bonding ring fixing block, and the die bonding ring is arranged on the die bonding ring back plate through a bearing.
The beneficial technical effects of the utility model are as follows: the horizontal movement of the Y-axis movement motor and the die bonding ring is realized through the horizontal movement of the X-axis movement motor; the Y-axis motion motor plays a role in vertical lifting and positioning of the die bonding ring. The die bonding ring driving motor drives the die bonding ring to rotate to calibrate the wafer, and the wafer is taken away in the next procedure, so that the connection of precise procedures is realized.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Detailed Description
Example 1
In the implementation of the utility model, the die bonding ring correction mechanism of the full-automatic wafer sorting machine comprises a Y-axis motion motor 100, a motor shaft of the Y-axis motion motor 100 is provided with a lead screw transmission structure, a moving block of the lead screw transmission structure is provided with a die bonding ring fixing block 101, the lead screw rotation structure comprises a lead screw connected with the motor shaft, the lead screw rotates in a lead screw hole of the moving block moving forward and backward, and the lead screw is driven to rotate by positive and negative rotation of the motor shaft so as to push the moving block to move forward and backward; a die bonding ring driving motor 300 is arranged on the die bonding ring fixing block 101, and a transmission belt 301 is sleeved on a motor shaft of the die bonding ring driving motor 300 and the die bonding ring 302; a wafer fixing disc 400 is arranged on one side of the die bonding ring 302, a die bonding ring back plate 102 is arranged on the die bonding ring fixing block 101, and the die bonding ring is arranged on the die bonding ring back plate through a bearing. In practice, the wafer fixing tray 400 is provided with wafers arranged regularly; a shaft rotating structure is arranged between the die bonding ring 302 and the die bonding ring fixing block 101; the Y-axis motion motor 100 and the die bonding ring fixing block 101 are arranged on an X-axis motion motor 200 and horizontally moved by the X-axis motion motor 200. According to the utility model, through the horizontal movement of the X-axis movement motor, the die bonding ring is horizontally moved to accurately calibrate a station in the horizontal direction; the Y-axis motion motor plays a role in vertical lifting and positioning of the die bonding ring and plays a role in vertical accurate station calibration. The die bonding ring driving motor drives the die bonding ring to rotate to calibrate the wafer, and the wafer is taken away in the next procedure, so that the connection of precise procedures is realized.
Example 2
In operation, with reference to fig. 1, a wafer mounting plate 400 is provided with wafers arranged in a regular pattern; a shaft rotating structure is arranged between the die bonding ring 302 and the die bonding ring fixing block 101; the Y-axis motion motor 100 and the die bonding ring fixing block 101 are arranged on an X-axis motion motor 200 and horizontally moved by the X-axis motion motor 200. The wafer fixing disk 400 is arranged in the clamping mechanisms 500 at the two sides, the clamping mechanisms 500 at the two sides comprise a left clamping groove and a right clamping groove which are used for accommodating the two sides of the wafer fixing disk 400, the clamping mechanisms 500 at the two sides are connected with the intelligent clamping cylinder 501, the intelligent clamping cylinder 501 is arranged on the wafer fixing ring back plate 102 and drives the clamping mechanisms 500 at the two sides to move back and forth, the fine adjustment of the station is realized, and in the implementation, the intelligent clamping cylinder 501 can move back and forth and slide on the annular slide rail of the wafer fixing ring back plate 102 to move along with the rotation of the wafer fixing disk 400.
Claims (2)
1. The full-automatic wafer sorting machine die bonding ring correcting mechanism is characterized in that: the die bonding machine comprises a Y-axis motion motor, wherein a motor shaft of the Y-axis motion motor is provided with a lead screw transmission structure, a moving block of the lead screw transmission structure is provided with a die bonding ring fixing block, the die bonding ring fixing block is provided with a die bonding ring driving motor, and a transmission belt is sleeved on the motor shaft of the die bonding ring driving motor and the die bonding ring; a wafer fixing disc is arranged on one side of the die bonding ring, and a shaft rotating structure is arranged between the die bonding ring and the die bonding ring fixing block; the Y-axis motion motor and the die bonding ring fixing block are arranged on an X-axis motion motor and horizontally moved by the X-axis motion motor.
2. The die attach ring alignment mechanism of a fully automatic wafer handler of claim 1, wherein: the die bonding ring fixing block is provided with a die bonding ring back plate, and the die bonding ring is arranged on the die bonding ring back plate through a bearing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122534583.4U CN216389274U (en) | 2021-10-21 | 2021-10-21 | Die bonding ring correction mechanism of full-automatic wafer sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122534583.4U CN216389274U (en) | 2021-10-21 | 2021-10-21 | Die bonding ring correction mechanism of full-automatic wafer sorting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216389274U true CN216389274U (en) | 2022-04-26 |
Family
ID=81245735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122534583.4U Active CN216389274U (en) | 2021-10-21 | 2021-10-21 | Die bonding ring correction mechanism of full-automatic wafer sorting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216389274U (en) |
-
2021
- 2021-10-21 CN CN202122534583.4U patent/CN216389274U/en active Active
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