CN216915203U

CN216915203U - Ceramic wafer surface coating positioning mechanism

Info

Publication number: CN216915203U
Application number: CN202220609296.7U
Authority: CN
Inventors: 李学明; 陈宏伟
Original assignee: Zhejiang Jiakang Electronics Co ltd
Current assignee: Zhejiang Jiakang Electronics Co ltd
Priority date: 2022-03-21
Filing date: 2022-03-21
Publication date: 2022-07-08
Anticipated expiration: 2032-03-21

Abstract

The utility model discloses a ceramic chip surface coating positioning mechanism, which is characterized by comprising: a base station; the clamping mechanism is arranged on the base platform and comprises a first adjusting mechanism and a clamping unit, and the first adjusting mechanism controls the clamping unit to adjust the position; and the coating mechanism is arranged on the base platform and comprises a second adjusting mechanism and a coating unit, the second adjusting mechanism controls the coating unit to adjust the position, the coating unit comprises a silk screen, and the silk screen corresponds to the clamping unit during coating.

Description

Ceramic wafer surface coating positioning mechanism

Technical Field

The utility model relates to a ceramic chip surface coating positioning mechanism.

Background

When the pattern is coated on the surface of the annular ceramic chip through the coating, the ceramic chip needs to be clamped and fixed, and then the pattern on the silk screen is correctly and clearly coated on the designated position on the surface of the ceramic chip through the silk screen. Clamping device and silk screen among the prior art are fixed usually, therefore, can't adjust the position of coating, thickness and thickness homogeneity, lead to the pattern quality of coating to guarantee. The positions of the clamping device and the silk screen are relatively fixed, so that when the feeding and the discharging are caused, obstruction is possibly caused by the silk screen, and the working efficiency is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects in the prior art and provide the ceramic chip surface coating and positioning mechanism with reasonable structural design.

The technical scheme adopted by the embodiment of the utility model for solving the problems is as follows: the utility model provides a potsherd surface coating positioning mechanism which characterized in that includes:

a base station;

the clamping mechanism is arranged on the base platform and comprises a first adjusting mechanism and a clamping unit, and the first adjusting mechanism controls the clamping unit to adjust the position; and

and the coating mechanism is arranged on the base station and comprises a second adjusting mechanism and a coating unit, the second adjusting mechanism controls the coating unit to adjust the position, the coating unit comprises a silk screen, and the silk screen corresponds to the clamping unit during coating.

The clamping unit comprises a bearing part and a plurality of clamping parts, the clamping parts are arranged around the bearing part, and the clamping parts are configured to move and adjust along the radial direction of the bearing part.

According to the embodiment of the utility model, the clamping part is controlled by the power element to move in the radial direction of the bearing part.

The first adjusting mechanism comprises a rotary adjusting unit, a lifting unit and a movable adjusting unit, wherein the lifting unit is arranged on the movable adjusting unit, the rotary adjusting unit is arranged on the lifting unit, and the lifting unit is connected with the clamping mechanism.

The rotary adjusting unit comprises a rotary platform, an actuating rod, an adjusting rod and an adjusting seat, wherein the clamping mechanism is arranged on the rotary platform, the actuating rod is fixed on the rotary platform, the adjusting rod is in threaded connection with the adjusting seat and is matched with the actuating rod, and the actuating rod can be pushed when the adjusting rod rotates so as to enable the rotary platform to rotate.

The lifting unit comprises a lifting platform and a lifting adjusting unit, and the lifting adjusting unit controls the lifting platform to lift.

The mobile adjusting unit comprises a mobile platform, a slide rail and a driving unit, wherein the slide rail is arranged on the base platform, a slide block matched with the slide rail is arranged on the mobile platform, and the driving unit is connected with the mobile platform and controls the mobile platform to move along the slide rail.

The first adjusting mechanism comprises an X-axis moving unit and a Y-axis moving unit, wherein the X-axis moving unit is arranged on the base, and the Y-axis moving unit is arranged on the X-axis moving unit.

The first adjusting mechanism comprises a rotating unit, the rotating unit comprises a panel, a rotating shaft and a Z-axis lifting unit, one end of the panel is arranged on the Z-axis lifting unit, and the other end of the panel is rotatably matched with the Y-axis moving unit through the rotating shaft.

The Z-axis lifting unit comprises a screw, a screw seat and a Z-axis lifting seat, wherein the screw seat is fixed on the base platform, one end of the screw is matched with the screw seat, the other end of the screw is in threaded connection with the Z-axis lifting seat, and the Z-axis lifting seat is lifted when the screw is rotated.

The X-axis moving unit comprises an X-axis sliding rail, an X-axis moving platform and an X-axis moving adjusting unit, wherein the X-axis moving platform can be matched with the X-axis sliding rail in an oriented moving mode, and the X-axis moving adjusting unit controls the X-axis moving platform to move relative to the X-axis sliding rail.

The Y-axis moving unit comprises a Y-axis sliding rail, a Y-axis moving platform and a Y-axis moving adjusting unit, wherein the Y-axis moving platform can be matched with the Y-axis sliding rail in an oriented moving mode, and the Y-axis moving adjusting unit controls the Y-axis moving platform to move relative to the Y-axis sliding rail.

Compared with the prior art, the utility model has one or more of the following advantages or effects: the structure is simple, and the design is reasonable; the first adjusting mechanism can complete the lifting, rotation and movement of the ceramic wafer through the rotation adjusting unit, the lifting unit and the movement adjusting unit so as to accurately position, ensure the position precision of the coating pattern and automatically complete feeding and discharging; the second adjusting mechanism can adjust the position of the silk screen in the XY direction, so that the silk screen can be accurately aligned with the ceramic chip, and the position accuracy of the coating pattern on the ceramic chip is further ensured; the arrangement of the rotating unit can enable the silk screen to rotate and adjust a certain angle so as to be relatively parallel to the surface of the ceramic plate, thereby ensuring the uniformity of the thickness of the coating.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic perspective view of a positioning mechanism for coating a surface of a ceramic sheet according to an embodiment of the present invention.

Fig. 2 is an enlarged view at a in fig. 1.

Fig. 3 is an enlarged view at B in fig. 1.

Fig. 4 is an enlarged view at C in fig. 1.

Fig. 5 is a schematic perspective view of a positioning mechanism for coating the surface of the ceramic sheet according to an embodiment of the present invention.

Fig. 6 is a three-dimensional structure schematic diagram of a ceramic chip surface coating positioning mechanism in the embodiment of the utility model.

Detailed Description

The present invention will be described in further detail below by way of examples with reference to the accompanying drawings, which are illustrative of the present invention and are not to be construed as limiting the present invention.

Referring to fig. 1 to 6, the positioning mechanism for coating the surface of the ceramic sheet according to the present embodiment includes a base 1, a clamping mechanism 2, and a coating mechanism 3.

The base 1 in this embodiment can provide a flat surface for mounting.

The clamping mechanism 2 in this embodiment is disposed on the base 1, and includes a first adjusting mechanism 21 and a clamping unit 22, where the first adjusting mechanism 21 controls the clamping unit 22 to adjust a position.

The coating mechanism 3 in the present embodiment is provided on the base 1, and includes a second adjustment mechanism 31 and a coating unit 32, the second adjustment mechanism 31 controls the coating unit 32 to adjust the position, the coating unit 32 includes a screen 3201, and the screen 3201 corresponds to the clamping unit 22 at the time of coating.

The clamping unit 22 of the present embodiment includes a bearing portion 221 and a plurality of clamping portions 222, the plurality of clamping portions 222 are disposed around the bearing portion 221, and the clamping portions 222 are configured to move and adjust along a radial direction of the bearing portion 221. When the ceramic wafer is placed on the supporting portion 221, the plurality of groups of clamping portions 222 move along the radial direction of the supporting portion 221 and can clamp the ceramic wafer to complete the fixation of the ceramic wafer.

In this embodiment, the clamping portion 222 is controlled by a power element to move in the radial direction of the bearing portion 221. The power element may be a pneumatic element, and the working principle thereof is the prior art, which is not described herein.

In this embodiment, the first adjusting mechanism 21 includes a rotation adjusting unit 211, a lifting unit 212 and a movement adjusting unit 213, the lifting unit 212 is disposed on the movement adjusting unit 213, the rotation adjusting unit 211 is disposed on the lifting unit 212, and the lifting unit 212 is connected to the clamping mechanism 2. The first adjusting mechanism 21 can complete the lifting, rotating and moving of the ceramic wafer through the rotation adjusting unit 211, the lifting unit 212 and the movement adjusting unit 213, so as to perform positioning accurately.

In this embodiment, the rotation adjustment unit 211 includes a rotation platform 2111, an actuating rod 2112, an adjustment rod 2113, and an adjustment seat 2114, the clamping mechanism 2 is disposed on the rotation platform 2111, the actuating rod 2112 is fixed on the rotation platform 2111, the adjustment rod 2113 is connected to the adjustment seat 2114 through a thread and is matched with the actuating rod 2112, and the adjustment rod 2113 can push the actuating rod 2112 when rotating, so as to rotate the rotation platform 2111. Specifically, when the adjusting rod 2113 is screwed, the adjusting rod feeds in one direction, so that the actuating rod 2112 is pushed, the actuating rod 2112 can drive the rotating platform 2112 to rotate, and finally the rotation adjustment of the ceramic plate can be realized. The ceramic wafer can be finely adjusted in a manner of threaded connection through the adjusting rod 2113, and the adjusting precision is high.

The adjusting rods 2113 in this embodiment are provided in two sets, and are respectively disposed at two sides of the actuating rod 2112.

The lifting unit 212 of this embodiment includes a lifting platform 2121 and a lifting adjusting unit 2122, and the lifting adjusting unit 2122 controls the lifting platform 2121 to lift. Thereby the height of the position of the ceramic plate can be adjusted.

The elevation adjustment unit 2122 in this embodiment may be a thread adjustment structure, a cylinder structure, or a connecting rod structure in the prior art, and is not described herein again.

In this embodiment, the movement adjusting unit 213 includes a moving platform 2131, slide rails 2132 and a driving unit 2133, wherein the slide rails 2132 are disposed on the base platform 1, the moving platform 2131 is provided with slide blocks which are engaged with the slide rails 2132, and the driving unit 2133 is connected to the moving platform 2131 and controls the moving platform 2131 to move along the slide rails 2132. The driving unit 2133 in this embodiment may be realized by a cylinder structure, a screw structure, or the like.

The driving unit 2133 in this embodiment includes a lead screw 21331, a motor 21332, and a slide block 21333. The sliding block 21333 is connected with the screw 21331 through screw threads, and the output shaft of the motor 21332 is connected with the screw 21331. When the motor 21332 controls the lead screw 21331 to rotate, the sliding block 21333 realizes sliding, and the sliding block 21333 is connected with the movable platform 2131, so that the movable platform 2131 can move, and feeding or discharging of ceramic plates is realized.

The second adjusting mechanism 31 of the present embodiment includes an X-axis moving unit 311 and a Y-axis moving unit 312, wherein the X-axis moving unit 311 is disposed on the base 1, and the Y-axis moving unit 312 is disposed on the X-axis moving unit 311. The second adjusting mechanism 31 can adjust the position of the screen 3201 in the XY direction, so that the screen can be accurately aligned with the ceramic sheet, and the positional accuracy of the coating pattern on the ceramic sheet is ensured.

In this embodiment, the second adjusting mechanism 31 further includes a rotating unit 313, the rotating unit 313 includes a panel 3131, a rotating shaft 3132 and a Z-axis lifting unit 3133, one end of the panel 3131 is disposed on the Z-axis lifting unit 3133, and the other end of the panel 3131 is rotatably engaged with the Y-axis moving unit 312 via the rotating shaft 3132. In this embodiment, the wire mesh 3201 is fixed on the panel 3131, and the panel 3131 rotates relative to the center of the rotation shaft 3132 through the adjustment of the Z-axis lifting unit 3133, so that the wire mesh 3201 is relatively parallel to the surface of the ceramic wafer, thereby ensuring the uniformity of the thickness of the coating.

In this embodiment, the Z-axis lifting unit 3133 includes a screw 31331, a screw base 31332, and a Z-axis lifting base 31333, the screw base 31332 is fixed to the base 1, one end of the screw 31331 is engaged with the screw base 31332, and the other end is in threaded connection with the Z-axis lifting base 31333, and when the screw 31331 is rotated, the Z-axis lifting base 31333 is lifted. And the Z-axis lifting base 31333 is coupled to the face plate 3131, so that one end of the face plate 3131 can be lifted. In this embodiment, the Z-axis lifting unit 3133 may also adopt a cylinder structure, a gear structure, a connecting rod structure, etc. in the prior art, which is not described herein again.

In this embodiment, the X-axis moving unit 311 includes an X-axis sliding rail 3111, an X-axis moving platform 3112 and an X-axis movement adjusting unit 3113, the X-axis moving platform 3112 is engaged on the X-axis sliding rail 3111 in an oriented manner, and the X-axis movement adjusting unit 3113 controls the X-axis moving platform 3112 to move relative to the X-axis sliding rail 3111. The X-axis slide rail 3111 is fixed to the base 1.

In this embodiment, the X-axis moving platform 3112 is moved by an X-axis threaded adjusting lever 3114, and when the X-axis threaded adjusting lever 3114 is rotated, the X-axis moving platform 3112 can be finely adjusted in the X-axis direction. The adjustment of the movement of the X-axis moving platform 3112 by the X-axis threaded adjustment lever 3114 is prior art and will not be described in detail herein.

In this embodiment, the X-axis moving unit 311 may further include an X-axis dial indicator 3115, and the X-axis dial indicator 3115 is disposed on the base 1 and is engaged with the X-axis moving unit 311. The X-axis dial gauge 3115 may display position information of the X-axis moving unit 311 for the operator to make operation adjustments.

The Y-axis moving unit 312 of this embodiment includes a Y-axis sliding rail 3121, a Y-axis moving platform 3122, and a Y-axis moving adjustment unit 3123, the Y-axis moving platform 3122 is movably engaged with the Y-axis sliding rail 3121 in an oriented manner, the Y-axis sliding rail 3121 is disposed on the X-axis moving unit 311, and the Y-axis moving adjustment unit 3123 controls the Y-axis moving platform 3122 to move relative to the Y-axis sliding rail 3121.

In this embodiment, the Y-axis moving platform 3122 is moved by a Y-axis threaded adjusting lever 3124, and when the Y-axis threaded adjusting lever 3124 is rotated, the Y-axis moving platform 3122 can be finely adjusted in the Y-axis direction. The adjustment of the movement of the Y-axis moving platform 3122 by the Y-axis screw adjustment lever 3124 is prior art and will not be described in detail herein.

In this embodiment, the Y-axis moving unit 312 may further include a Y-axis dial indicator 3125, where the Y-axis dial indicator 3125 is disposed on the Y-axis moving unit 312 and cooperates with the XY-axis moving unit 311. The Y-axis dial gauge 3125 may display position information of the Y-axis moving unit 312 with respect to the X-axis moving unit 311 for the operator to make operation adjustments.

The above description of the present invention is intended to be illustrative. Various modifications, additions and substitutions for the specific embodiments described may be made by those skilled in the art without departing from the scope of the utility model as defined in the accompanying claims.

Claims

1. The utility model provides a ceramic wafer surface coating positioning mechanism which characterized in that includes:

a base station;

the coating mechanism is arranged on the base platform and comprises a second adjusting mechanism and a coating unit, the second adjusting mechanism controls the coating unit to adjust the position, the coating unit comprises a silk screen, and the silk screen corresponds to the clamping unit during coating.

2. The ceramic wafer surface coating positioning mechanism of claim 1, characterized in that: the clamping unit comprises a bearing part and a plurality of clamping parts, the clamping parts are arranged around the bearing part, and the clamping parts are configured to move and adjust along the radial direction of the bearing part.

3. The ceramic wafer surface coating positioning mechanism of claim 1, characterized in that: the first adjusting mechanism comprises a rotary adjusting unit, a lifting unit and a movable adjusting unit, the lifting unit is arranged on the movable adjusting unit, the rotary adjusting unit is arranged on the lifting unit, and the lifting unit is connected with the clamping mechanism.

4. The ceramic wafer surface coating positioning mechanism of claim 3, characterized in that: the rotary adjusting unit comprises a rotary platform, an actuating rod, an adjusting rod and an adjusting seat, the clamping mechanism is arranged on the rotary platform, the actuating rod is fixed on the rotary platform, the adjusting rod is in threaded connection with the adjusting seat and matched with the actuating rod, and the actuating rod can be pushed when the adjusting rod rotates so as to enable the rotary platform to rotate.

5. The ceramic wafer surface coating positioning mechanism of claim 4, characterized in that: the lifting unit comprises a lifting platform and a lifting adjusting unit, and the lifting adjusting unit controls the lifting platform to lift.

6. The ceramic wafer surface coating positioning mechanism of claim 3, characterized in that: the movable adjusting unit comprises a movable platform, a slide rail and a driving unit, the slide rail is arranged on the base platform, a slide block matched with the slide rail is arranged on the movable platform, and the driving unit is connected with the movable platform and controls the movable platform to move along the slide rail.

7. The ceramic wafer surface coating positioning mechanism of claim 1, characterized in that: the first adjusting mechanism comprises an X-axis moving unit, a Y-axis moving unit and a rotating unit, the X-axis moving unit is arranged on the base platform, and the Y-axis moving unit is arranged on the X-axis moving unit; the rotating unit comprises a panel, a rotating shaft and a Z-axis lifting unit, one end of the panel is arranged on the Z-axis lifting unit, and the other end of the panel is rotatably matched with the Y-axis moving unit through the rotating shaft.

8. The ceramic wafer surface coating positioning mechanism of claim 7, characterized in that: z axle lift unit includes screw rod, screw rod seat and Z axle lift seat, the screw rod seat be fixed extremely on the base station, the one end of screw rod with the cooperation of screw rod seat, and its other end then with Z axle lift seat threaded connection rotates during the screw rod, Z axle lift seat realizes going up and down.

9. The ceramic wafer surface coating positioning mechanism of claim 7, characterized in that: the X-axis moving unit comprises an X-axis sliding rail, an X-axis moving platform and an X-axis moving adjusting unit, the X-axis moving platform can be matched with the X-axis sliding rail in an oriented moving mode, and the X-axis moving adjusting unit controls the X-axis moving platform to move relative to the X-axis sliding rail.

10. The ceramic wafer surface coating positioning mechanism of claim 7, characterized in that: the Y-axis moving unit comprises a Y-axis sliding rail, a Y-axis moving platform and a Y-axis moving adjusting unit, the Y-axis moving platform can be matched on the Y-axis sliding rail in an oriented moving mode, and the Y-axis moving adjusting unit controls the Y-axis moving platform to move relative to the Y-axis sliding rail.