CN216311529U

CN216311529U - Frequency converter

Info

Publication number: CN216311529U
Application number: CN202121877939.8U
Authority: CN
Inventors: 金平; 胡松涛; 彭必辉
Original assignee: Zhejiang Holip Electronic Technology Co Ltd
Current assignee: Zhejiang Holip Electronic Technology Co Ltd
Priority date: 2021-08-12
Filing date: 2021-08-12
Publication date: 2022-04-15
Anticipated expiration: 2031-08-12

Abstract

The utility model provides a frequency converter, which comprises a case (1), a heat generating component (2), a radiator assembly (3') arranged in the case and a fan (5). The heat generating component is disposed on the heat sink assembly such that heat generated by the heat generating component is transferred to the heat sink assembly. When the fan rotates, air within the chassis is directed through the heat sink assembly, thereby carrying away heat from the heat sink assembly. The heat sink assembly includes: a first heat sink (31) on which a heat generating component is disposed; a second heat sink (32) disposed below the first heat sink; and a heat pipe (34) for transferring heat from the first heat sink to the second heat sink.

Description

Frequency converter

Technical Field

The utility model relates to a frequency converter, in particular to a high-power frequency converter with a double-layer radiator.

Background

The prior heat dissipation solution of the general high-power frequency converter mainly comprises the following schemes:

scheme 1: an aluminum extruded heat sink is employed, wherein the heat dissipation area of the heat sink is increased by increasing the length of the heat sink.

Scheme 2: the heat sink is an insert heat sink, wherein the heat dissipation area of the heat sink is increased by increasing the height and density of the heat dissipation fins.

Scheme 3: an aluminum extruded radiator and a heat pipe positioned on the aluminum extruded radiator are adopted to enhance the heat dissipation.

Scheme 4: an aluminum extrusion radiator, a heat pipe positioned on the aluminum extrusion radiator and a high air volume and high air pressure fan are adopted.

Scheme 5: a copper heat sink and a high speed fan were used.

Scheme 6: a water-cooled radiator is adopted.

The above solutions have their respective disadvantages, which are as follows:

in the scheme 1, the aluminum extruded radiator increases the radiating area of the radiator by increasing the length of the radiator, however, as the thermal resistance of the heat conduction of the radiator increases along with the increase of the length of the radiator, the heat transfer efficiency on the radiator is rapidly attenuated along with the increase of the length of the radiator to a certain degree, and the wind resistance is increased to influence the heat exchange.

In the scheme 2, the heat dissipation area of the heat sink is increased by increasing the height and density of the heat dissipation fins, and the heat sink is in compression joint with the aluminum substrate, so that thermal contact resistance exists and heat conduction is affected. In addition, when the height of the fins is increased to a certain extent, the thermal resistance is increased, and heat cannot be transferred to the tips of the heat dissipation fins, so that the heat dissipation efficiency of the tips of the heat dissipation fins is poor. Further, the denser the heat dissipating fins, the greater the wind resistance.

In the scheme 3, the height of the radiator cannot exceed 75mm due to the influence of the fin height ratio of the aluminum extruded radiator, otherwise, the radiator cannot be extruded. Therefore, the heat dissipation area can only be increased in the length direction of the heat sink, however, the heat sink has a problem of heat conduction attenuation in the length direction, and although the heat pipe can solve the problem to some extent, the increase of the length of the heat sink causes an increase of wind resistance, and also causes an increase of the length of the frequency converter.

In the scheme 4, the high-air-volume fan is high in noise and high in price. In addition, the current of the fan is large, resulting in an increase in the power load of the inverter switch.

In the case of the solution 5, the copper heat sink is expensive, and the weight of the copper heat sink is 3 times that of the aluminum heat sink with the same volume. In addition, according to the characteristics of the copper heat sink that heat is absorbed quickly and heat is dissipated slowly, a high-speed fan must be provided accordingly, resulting in further increase in cost.

In the case of the solution 6, the water-cooled radiator system is complicated in structure and high in cost, and thus is not suitable for use in a general-purpose inverter.

SUMMERY OF THE UTILITY MODEL

[ problem ] to provide a method for producing a semiconductor device

The present invention has been made to solve the above technical problems, and potentially other technical problems.

[ technical solution ] A

The utility model provides a frequency converter. The frequency converter comprises a case, a heat generating component, a heat sink component and at least one fan, wherein the heat generating component is arranged on the heat sink component, and heat generated by the heat generating component is transferred to the heat sink component. When the fan rotates, air in the chassis is directed to flow through the heat sink assembly, thereby carrying away heat on the heat sink assembly. The heat sink assembly includes: a first heat sink on which the heat generating component is disposed; a second heat sink disposed below the first heat sink; and at least one heat pipe for transferring heat from the first heat sink to the second heat sink.

Specifically, the first heat sink may include: the heat-generating component is arranged on the upper surface of the first heat-conducting substrate, and the first section of the heat-conducting pipe is embedded in the first heat-conducting substrate; and the first heat radiating fins extend downwards from the lower surface of the first heat conducting substrate, and a first air duct is formed between the adjacent first heat radiating fins. The second heat sink has the same configuration as the first heat sink. The second heat sink may include: a second heat conductive substrate in which a second section of the heat conductive pipe is embedded so as to transfer heat from the first heat conductive substrate to the second heat conductive substrate; and the second heat radiating fins extend downwards from the lower surface of the second heat conducting substrate, a second air duct is formed between the adjacent second heat radiating fins, and the extending direction of the second air duct is the same as that of the first air duct.

Optionally, an additional heating pipe may be further embedded in the first heat conducting substrate, and an extending direction of a main body of the additional heating pipe is the same as an extending direction of the first air duct. The extending direction of the first section of the heat conductive pipe may be perpendicular to the extending direction of the first air duct. The heat generating component may have a heat conductive plate attached to an upper surface of the first heat conductive substrate. A heat conductive silicone grease may be coated between the heat conductive plate and the upper surface of the first heat conductive substrate. Each heat conducting pipe is formed by arranging two U-shaped pipes opposite to each other, and arms of the two U-shaped pipes which are arranged opposite to each other form the first section and the second section respectively. The frequency converter may further include a support plate disposed within the case, the support plate supporting the heat sink assembly from below. The number of the fans may be two or more.

In particular, the heat generating component may comprise a rectifier bridge and/or an Insulated Gate Bipolar Transistor (IGBT).

[ technical effects ] of

By adopting the technical scheme of the utility model, at least the following beneficial effects are obtained:

1) although the height of the extruded radiator is limited by the height ratio of the fins, the scheme of the utility model expands towards the depth of the frequency converter or the height direction of the radiator fins, thereby increasing the heat radiation area of the radiator.

2) The rectifier bridge and/or IGBT of the high-power frequency converter can rapidly conduct away heat through the heat pipe under the condition that the power is increased so as to reduce the heat flux density of a heat source area, and the overload capacity of the frequency converter under the severe working condition environment is stronger.

3) The length of the radiator of the high-power frequency converter can be greatly shortened, so that the size of the frequency converter can be reduced.

4) The heat dissipation area of the radiator of the high-power frequency converter is increased, and the heat capacity is increased, so that the air quantity of a heat dissipation fan/fan of the frequency converter can be reduced, the rotating speed of the fan is reduced, the noise is reduced, the service life of the fan is prolonged, and the power load of a switch of the frequency converter is reduced.

5) By adopting the double-layer radiator, the cross-sectional area of the radiator is doubled. The air flow rate in the radiator assembly is accelerated, and the heat dissipation efficiency is improved.

Drawings

In order to facilitate understanding of the utility model, the utility model is described in more detail below on the basis of exemplary embodiments and with reference to the attached drawings. The same or similar reference numbers are used in the drawings to refer to the same or similar parts. It should be understood that the drawings are merely schematic and that the dimensions and proportions of elements in the drawings are not necessarily precise.

Fig. 1 is a schematic cross-sectional view of a conventional frequency converter;

fig. 2A and 2B are a schematic cross-sectional view and a top view, respectively, of a frequency converter according to an embodiment of the present invention;

fig. 3A and 3B are a perspective view and a cross-sectional view, respectively, of a heat generating component and a heat sink assembly in a frequency converter according to an embodiment of the present invention;

fig. 3C is a perspective view of a heat sink assembly in the inverter according to an embodiment of the present invention.

Detailed Description

Fig. 1 is a schematic cross-sectional view of a conventional frequency converter.

As shown in fig. 1, the inverter includes a case 1, a heat generating component 2, a heat sink 3 disposed in the case 1, a support plate 4, and a fan 5. A heat generating component 2, such as a rectifier bridge 21 and/or an Insulated Gate Bipolar Transistor (IGBT)22, is disposed on the heat sink 3 so that heat generated by the heat generating component 2 is transferred to the heat sink 3. The support plate 4 supports the heat sink 3. When the fan 5 rotates, air in the cabinet 1 is guided to flow through the radiator 3 in a direction indicated by an arrow a (substantially, a longitudinal direction of the radiator 3), thereby taking heat away from the radiator 3. The disadvantages of the prior frequency converter and the heat dissipation system thereof are as described above.

Fig. 2A and 2B are a schematic cross-sectional view and a top view, respectively, of a frequency converter according to an embodiment of the present invention. Fig. 3A and 3B are a perspective view and a cross-sectional view of a heat generating component 2 and a heat sink assembly 3' in a frequency converter according to an embodiment of the present invention, respectively. Fig. 3C is a perspective view of a heat sink assembly 3' in the frequency converter according to the embodiment of the present invention.

The frequency converter according to an embodiment of the utility model comprises a cabinet 1, heat generating components 2, a heat sink assembly 3 'arranged within the cabinet 1, a support plate 4' and at least one fan 5. A heat generating component 2, such as a rectifier bridge 21 and/or an Insulated Gate Bipolar Transistor (IGBT)22, is disposed on the heat sink assembly 3 'so that heat generated by the heat generating component 2 is transferred to the heat sink assembly 3'. When the fan 5 rotates, the air in the chassis 1 is guided to flow through the radiator module 3 ' in the direction indicated by the arrow B (approximately, the length direction of the radiator module 3 '), thereby taking away the heat on the radiator module 3 '. The height of the support plate 4' in the frequency converter according to the utility model as shown in fig. 2A is lower compared to the support plate 4 in the frequency converter shown in fig. 1. In addition, although fig. 2B shows a case where two fans 5 are provided, the number of fans 5 may be less or more than two in practice as needed.

As shown in fig. 2A to 3C, the heat sink assembly 3' includes a first heat sink 31, a second heat sink 32, and at least one heat conductive pipe 34. The heat generating component 2 is disposed on the first heat sink 31. The second heat sink 32 is disposed below the first heat sink 21 in the depth/height direction. The heat conductive pipe 34 is used to transfer heat from the first heat sink 31 to the second heat sink 32.

Specifically, the first heat sink 31 includes a first heat conductive substrate 311 and a plurality of first heat dissipation fins 312. The heat generating component 2 is disposed on the upper surface of the first heat conductive substrate 311. A first section (i.e., a horizontal section that is upper in the height direction as shown in fig. 3B) of the heat conductive pipe 34 is embedded in the first heat conductive substrate 31 l. The plurality of first heat dissipation fins 312 extend downward from the lower surface of the first heat conductive substrate 31l, and a first air passage is formed between the first heat dissipation fins 312 adjacent to each other. The first air duct extends in substantially the same direction as the length of the radiator module 3'.

The configuration of the second heat sink 32 is substantially the same as that of the first heat sink 31. Specifically, the second heat sink 32 includes a second heat conductive substrate 321 and a plurality of second heat dissipation fins 322. A second section (i.e., a horizontal section lower in the height direction as shown in fig. 3B) of the heat conductive pipe 34 is embedded in the second heat conductive substrate 321 so as to transfer heat from the first heat conductive substrate 311 to the second heat conductive substrate 321. A plurality of second heat dissipation fins 322 extend downward from the lower surface of the second heat conductive substrate 321, and a second air duct is formed between the second heat dissipation fins 322 adjacent to each other. The second air duct extends in the same direction as the first air duct and thus substantially in the same direction as the length of the radiator module 3'.

As shown in fig. 2A, 3A to 3C, the first section (and the second section) of the heat conductive pipe 34 extends substantially along the width direction of the heat sink assembly 3', and thus is perpendicular to the extending direction of the first air duct and the second air duct. In this way, the heat is facilitated to be diffused in the width direction of the radiator module 3' through the heat conductive pipes 34. As shown in fig. 3B, each of the heat conductive pipes 34 is formed by two U-shaped pipes disposed opposite to each other, and the arms of the two U-shaped pipes disposed opposite to each other constitute the first section and the second section, respectively.

In addition, an additional heating tube 33 may be embedded in the first heat conductive substrate 311. The extending direction of the main body of the additional heating pipe 33 is substantially the same as the extending direction of the first air passage. In this way, heat is facilitated to be diffused in the length direction of the first heat conductive substrate 311 by the additional heating pipe 33. Preferably, the additional heating tube 33 may be provided only below a component (e.g., the IGBT 22, not the rectifier bridge 21) of the heat generating component 2, which generates a relatively large amount of heat.

The heat-generating component 2 may have a heat-conducting plate 23, for example a copper substrate. The heat conductive plate 23 is fitted and fixed (for example, with screws) onto the upper surface of the first heat conductive substrate 311. Preferably, a heat conductive silicone grease is coated between the heat conductive plate 23 and the upper surface of the first heat conductive substrate 311.

Alternatively, the second heat sink 32 may not include the second heat conductive substrate 321, but only include the plurality of second heat dissipation fins 322. The heat conductive pipe 34 may be directly inserted into and penetrate each of the heat dissipating fins 322 to transfer heat to each of the heat dissipating fins 322.

By adopting the scheme of the utility model, at least the following beneficial effects can be obtained:

1) the heat dissipation efficiency is improved. Specifically, the two advantages of high heat conductivity coefficient of the heat pipe and the ultra-large specific heat capacity of the double-layer radiator are combined, so that the heat of the rectifier bridge and the IGBT is quickly diffused to the radiator (hot layer), and the radiating substrate of the rectifier bridge and the IGBT maintains lower heat flow density.

2) The length of the heat sink and thus the length of the frequency converter is minimized. In this way, the construction of a frequency converter of equal power can be made more compact.

3) The sectional area of the air duct of the radiator part of the frequency converter is increased, and the air flow speed (wind speed) in the main air duct is improved.

Although the technical objects, technical solutions and technical effects of the present invention have been described in detail hereinabove with reference to specific embodiments, it should be understood that the above embodiments are only illustrative and not restrictive. Any modification, equivalent replacement, or improvement made by those skilled in the art within the spirit and principle of the present invention is included in the protection scope of the present invention. For example, the heat dissipation system of the frequency converter in the utility model can also be applied to other devices with heat dissipation requirements, and is not limited to the frequency converter.

Claims

1. Frequency converter comprising a cabinet (1), heat generating components (2), a heat sink assembly (3') arranged in the cabinet, and at least one fan (5), the heat generating components being arranged on the heat sink assembly,

characterized in that the heat sink assembly comprises:

a first heat sink (31) on which the heat generating component is disposed;

a second heat sink (32) disposed below the first heat sink; and

at least one heat pipe (34) for transferring heat from the first heat sink to the second heat sink.

2. The frequency converter of claim 1, wherein the first heat sink comprises:

a first heat conductive substrate (311) on an upper surface of which the heat generating component is disposed, the first section of the heat conductive pipe being embedded in the first heat conductive substrate; and

a plurality of first heat dissipation fins (312) extending downward from a lower surface of the first heat conductive substrate, a first air duct being formed between adjacent first heat dissipation fins,

the second heat sink includes:

a second heat conductive substrate (321) in which a second section of the heat conductive pipe is embedded so as to transfer heat from the first heat conductive substrate to the second heat conductive substrate; and

and the second heat radiating fins (322) extend downwards from the lower surface of the second heat conducting base plate, a second air duct is formed between the adjacent second heat radiating fins, and the extending direction of the second air duct is the same as that of the first air duct.

3. The frequency converter according to claim 2, characterized in that an additional heating pipe (33) is further embedded in the first heat-conducting base plate, and the extension direction of the main body of the additional heating pipe is the same as the extension direction of the first air duct.

4. The frequency converter according to claim 2, wherein the first section of the heat conductive pipe extends in a direction perpendicular to the direction in which the first air duct extends.

5. The frequency converter according to any one of claims 2 to 4, wherein the heat generating component has a heat conductive plate attached to an upper surface of the first heat conductive substrate.

6. The frequency converter according to claim 5, wherein a thermally conductive silicone grease is applied between the thermally conductive plate and the upper surface of the first thermally conductive substrate.

7. Frequency converter according to any of claims 2 to 4, characterized in that the heat generating components comprise a rectifier bridge (21) and/or Insulated Gate Bipolar Transistors (IGBT).

8. A frequency converter according to claim 2, characterized in that each heat conducting tube is formed by two U-shaped tubes arranged opposite to each other, the arms of the two U-shaped tubes arranged opposite to each other forming said first section and said second section, respectively.

9. Frequency converter according to claim 1, characterized in that it further comprises a support plate (4') arranged inside the cabinet, said support plate supporting the heat sink assembly from below.

10. The frequency converter according to claim 1, wherein the number of the fans is two or more.