CN216134637U - Rigid-flex board with high heat dispersion - Google Patents

Rigid-flex board with high heat dispersion Download PDF

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Publication number
CN216134637U
CN216134637U CN202121277813.7U CN202121277813U CN216134637U CN 216134637 U CN216134637 U CN 216134637U CN 202121277813 U CN202121277813 U CN 202121277813U CN 216134637 U CN216134637 U CN 216134637U
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Prior art keywords
rigid
cooling
printed circuit
circuit board
high heat
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CN202121277813.7U
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Chinese (zh)
Inventor
焦锋
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Shenzhen Rongzhuoxin Kuaijie Electronic Technology Co ltd
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Shenzhen Rongzhuoxin Kuaijie Electronic Technology Co ltd
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Abstract

The utility model discloses a rigid-flex board with high heat dissipation performance, which comprises a hard board, wherein one side of the hard board is fixedly connected with a soft board, one end of the hard board is provided with a cooling assembly, the cooling assembly comprises a water inlet pipe, a water outlet pipe, a cooling pipe, a mounting plate, a radiating fin and a fixing part, the mounting plate is fixedly connected to one end of the hard board, the radiating fin is arranged on the side wall of the mounting plate, and one side of the hard board is provided with a connecting plate; according to the technical scheme provided by the utility model, the rigid-flex printed circuit board is cooled by arranging the cooling component, the cooling oil is injected from the water inlet pipe, the cooling oil circularly flows in the cooling pipe to cool the rigid-flex printed circuit board, and the cooling oil after absorbing heat is discharged from the cooling pipe through the water outlet pipe, so that the effect of circular cooling is achieved, and the service life of the printed circuit board cannot be influenced by overhigh temperature.

Description

Rigid-flex board with high heat dispersion
Technical Field
The utility model relates to the technical field of combined plates, in particular to a rigid-flex combined plate with high heat dissipation performance.
Background
The rigid-flex printed circuit board is formed by combining a flexible bottom layer and a rigid bottom layer in a thin layer shape and then laminating the flexible bottom layer and the rigid bottom layer into a single component. The rigid-flex printed circuit board changes the traditional planar design concept, expands the three-dimensional 3-dimensional space concept, brings great convenience to product design and brings great challenges.
The prior art has the following defects or problems:
1. with the continuous progress of the integration technology, the packaging density of electronic components and electronic equipment is higher and higher, the trend causes more heat to be generated in a limited volume, and if the heat dissipation is not timely, the working temperature of the components is rapidly increased due to excessive accumulated heat, so that the working life and the reliability of the components are influenced;
2. due to their good mechanical strength, substrates can usually be mounted only in a flat manner, which requires both precise connection of the substrates and space saving for high-precision devices with limited installation space.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a rigid-flex printed circuit board with high heat dissipation performance aiming at the defects in the prior art so as to solve the problems in the prior art.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a rigid-flex board with high heat dissipating ability, includes the hardboard, hardboard one side fixedly connected with soft board, hardboard one end is provided with cooling module, cooling module includes inlet tube, outlet pipe, cooling tube, mounting panel, fin and mounting, mounting panel fixed connection is in hardboard one end, the fin sets up the mounting panel lateral wall, hardboard one side is provided with the connecting plate.
Optionally, inlet tube fixed connection be in mounting panel one end, outlet pipe fixed connection be in mounting panel one end, cooling tube fixed connection inlet tube one end with between the outlet pipe one end.
Optionally, the cooling pipe evenly distributed is in inside the mounting panel, just a part of the cooling pipe is located inside the hardboard, the cooling pipe passes through mounting fixed connection in hardboard one end.
Optionally, the side wall of the mounting plate is provided with a plurality of grooves, and the plurality of protrusions between the grooves form the heat sink.
Optionally, a through hole is formed in one end of the connecting plate.
Optionally, a connecting groove is formed in the middle of one side of the hard plate, and a threaded hole is formed in the inner wall of the connecting groove.
Optionally, the inner wall of one end of the connecting groove is fixedly connected with a buffer spring, and one end of the buffer spring is fixedly connected with a buffer plate.
Compared with the prior art, the utility model provides the rigid-flex printed circuit board with high heat dissipation performance, which has the following beneficial effects:
1. the rigid-flex combined plate is cooled by arranging the cooling assembly, cooling oil is injected from the water inlet pipe, the cooling oil circularly flows in the cooling pipe to cool the rigid plate, and the cooling oil after absorbing heat is discharged from the cooling pipe through the water outlet pipe, so that the effect of circular cooling is achieved, and the service life of the combined plate is not influenced by overhigh temperature;
2. the rigid-flex combined board can be connected seamlessly by arranging the connecting board and the connecting groove, so that excessive space is not occupied, and accurate connection can be realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view of the present invention;
FIG. 3 is an enlarged view of the utility model at A in FIG. 2.
In the figure: 1. hard plates; 2. a soft board; 3. mounting a plate; 4. a water inlet pipe; 5. a water outlet pipe; 6. a cooling tube; 7. a connecting plate; 8. a through hole; 9. a heat sink; 10. a groove; 11. a fixing member; 12. connecting grooves; 13. a threaded hole; 14. a buffer spring; 15. a buffer plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be further noted that, unless otherwise specifically stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, connected through an intermediate medium, or connected through the insides of two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1-3, in this embodiment: the utility model provides a rigid-flex board with high heat dissipating ability, including hardboard 1, 1 one side fixedly connected with soft board 2 of hardboard, 1 one end of hardboard is provided with cooling module, cooling module includes inlet tube 4, outlet pipe 5, cooling tube 6, mounting panel 3, fin 9 and mounting 11, 3 fixed connection in 1 one end of hardboard of mounting panel, fin 9 sets up at 3 lateral walls of mounting panel, 1 one side of hardboard is provided with connecting plate 7, come to cool off the hardboard through setting up cooling module, flow through the coolant oil at 6 inner loop of cooling tube and cool down hardboard 1, make the binding board can not influence life because of too high temperature.
Further, a water inlet pipe 4 is fixedly connected to one end of the mounting plate 3, a water outlet pipe 5 is fixedly connected to one end of the mounting plate 3, and a cooling pipe 6 is fixedly connected between one end of the water inlet pipe 4 and one end of the water outlet pipe 5; the cooling oil is injected into the cooling pipe 6 through the water inlet pipe 4, and the cooling oil after absorbing heat is discharged from the cooling pipe 6 through the water outlet pipe 5, so that the effect of circulating cooling is achieved.
Further, the cooling pipes 6 are uniformly distributed inside the mounting plate 3, a part of the cooling pipes 6 are located inside the hard plate 1, and the cooling pipes 6 are fixedly connected to one end of the hard plate 1 through fixing pieces 11; by arranging a part of the cooling pipe 6 in the hard sheet 1, the cooling oil in the cooling pipe 6 can absorb heat better.
Furthermore, the side wall of the mounting plate 3 is provided with a plurality of grooves 10, and the protrusions among the grooves 10 form radiating fins 9; the cooling tube 6 in the mounting plate 3 can be cooled by arranging the cooling fins 9, so that the temperature of the cooling tube 6 is prevented from being too high.
Furthermore, a through hole 8 is formed in one end of the connecting plate 7; through set up through-hole 8 on connecting plate 7, make through-hole 8 can be through connecting plate 7 to screw hole 13 in its connecting groove 12, fix two rigid-flex boards through inserting the bolt in screw hole 13 again.
Furthermore, the middle part of one side of the hard board 1 is provided with a connecting groove 12, and the inner wall of the connecting groove 12 is provided with a threaded hole 13; the hard boards 1 can be accurately connected by providing the connecting grooves 12 and the connecting plates 7 in the hard boards 1.
Further, a buffer spring 14 is fixedly connected to the inner wall of one end of the connecting groove 12, and a buffer plate 15 is fixedly connected to one end of the buffer spring 14; by arranging the buffer spring 14 and the buffer plate 15 in the connecting groove 12, the hard board 1 is not damaged by excessive force when the connecting plate 7 is inserted into the connecting groove 12.
The working principle and the using process of the utility model are as follows: when the rigid-flex printed circuit board is used, the rigid-flex printed circuit board is cooled by a cooling assembly arranged on the rigid-flex printed circuit board 1, cooling oil is injected from a water inlet pipe 4, the cooling oil circularly flows in a cooling pipe 6 to cool the rigid-flex printed circuit board 1, the cooling oil after heat absorption is discharged from the cooling pipe 6 through a water outlet pipe 5, so that the effect of circular cooling is achieved, the rigid-flex printed circuit board cannot influence the service life due to overhigh temperature, the rigid-flex printed circuit board 1 can be accurately connected by arranging a connecting groove 12 and a connecting plate 7 in the rigid-flex printed circuit board 1, the rigid-flex printed circuit board 1 cannot be damaged due to overlarge power when the connecting plate 7 is inserted into the connecting groove 12 by arranging a buffer spring 14 and a buffer plate 15 in the connecting groove 12, the through hole 8 is arranged on the connecting plate 7, the through hole 8 can pass through a threaded hole 13 in the connecting plate 7 to the connecting groove 12, and then the two rigid-flex printed circuit boards are fixed by inserting a bolt in the threaded hole 13, not only does not occupy too much space, but also can be precisely connected.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (7)

1. The utility model provides a rigid-flex printed circuit board with high heat dissipating ability which characterized in that: including hardboard (1), hardboard (1) one side fixedly connected with soft board (2), hardboard (1) one end is provided with cooling module, cooling module includes inlet tube (4), outlet pipe (5), cooling tube (6), mounting panel (3), fin (9) and mounting (11), mounting panel (3) fixed connection is in hardboard (1) one end, fin (9) set up mounting panel (3) lateral wall, hardboard (1) one side is provided with connecting plate (7).
2. A rigid-flex printed circuit board having high heat dissipation performance according to claim 1, wherein: inlet tube (4) fixed connection be in mounting panel (3) one end, outlet pipe (5) fixed connection be in mounting panel (3) one end, cooling tube (6) fixed connection inlet tube (4) one end with between outlet pipe (5) one end.
3. A rigid-flex printed circuit board having high heat dissipation performance according to claim 1, wherein: cooling tube (6) evenly distributed is in inside mounting panel (3), just cooling tube (6) some is located inside hardboard (1), cooling tube (6) pass through mounting (11) fixed connection be in hardboard (1) one end.
4. A rigid-flex printed circuit board having high heat dissipation performance according to claim 1, wherein: a plurality of grooves (10) are formed in the side wall of the mounting plate (3), and the heat radiating fins (9) are formed by the protrusions between the grooves (10).
5. A rigid-flex printed circuit board having high heat dissipation performance according to claim 1, wherein: a through hole (8) is formed in one end of the connecting plate (7).
6. A rigid-flex printed circuit board having high heat dissipation performance according to claim 1, wherein: the middle part of one side of the hard board (1) is provided with a connecting groove (12), and the inner wall of the connecting groove (12) is provided with a threaded hole (13).
7. The rigid-flex printed circuit board having high heat dissipation performance according to claim 6, wherein: the buffer structure is characterized in that a buffer spring (14) is fixedly connected to the inner wall of one end of the connecting groove (12), and a buffer plate (15) is fixedly connected to one end of the buffer spring (14).
CN202121277813.7U 2021-06-08 2021-06-08 Rigid-flex board with high heat dispersion Active CN216134637U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121277813.7U CN216134637U (en) 2021-06-08 2021-06-08 Rigid-flex board with high heat dispersion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121277813.7U CN216134637U (en) 2021-06-08 2021-06-08 Rigid-flex board with high heat dispersion

Publications (1)

Publication Number Publication Date
CN216134637U true CN216134637U (en) 2022-03-25

Family

ID=80766317

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121277813.7U Active CN216134637U (en) 2021-06-08 2021-06-08 Rigid-flex board with high heat dispersion

Country Status (1)

Country Link
CN (1) CN216134637U (en)

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