CN216098264U

CN216098264U - Chemical mechanical polishing machine for polishing ball head workpiece

Info

Publication number: CN216098264U
Application number: CN202022786123.6U
Authority: CN
Inventors: 夏宜龙; 黎秋月; 魏东; 李良宇; 焦彬; 刘圣杰
Original assignee: Csic Anpel Instrument Co ltd Hubei
Current assignee: Csic Anpel Instrument Co ltd Hubei
Priority date: 2020-11-27
Filing date: 2020-11-27
Publication date: 2022-03-22
Anticipated expiration: 2030-11-27

Abstract

The utility model discloses a chemical mechanical polishing machine for polishing a ball head workpiece, which adopts the composite motion of autorotation motion and swing motion of a polishing mould module to provide all-directional polishing for the surface of the ball head workpiece to be polished, can obtain the optimal polishing effect by setting the ratio of autorotation speed to swing speed, and the polishing mould module is used for polishing the structures of the ball head workpieces with different diameters.

Description

Chemical mechanical polishing machine for polishing ball head workpiece

Technical Field

The utility model relates to the technical field of mechanical polishing, in particular to a chemical mechanical polishing machine for polishing a ball head workpiece.

Background

The concept of chemical mechanical polishing (chemical mechanical polishing) technology was first proposed by Monsanto in 1965. This technique was originally used to obtain high quality glass surfaces and was later widely used in the semiconductor industry, first to polish single crystal silicon wafers, and IBM corporation succeeded in applying the CMP global planarization technique to the production of 64M DRAM in 1991. The CMP technology has since been rapidly developed and becomes the main planarization technology in the semiconductor fabrication process. Chemical mechanical polishing is a polishing method combining chemical polishing and mechanical polishing, and the quality of the process after polishing depends on the balance of the two methods. The traditional chemical polishing can realize global planarization, but the chemical polishing rate is slow, the traditional mechanical polishing rate is fast, but scratches can be left on the surface of a workpiece, the two methods are combined, the surface of the workpiece is softened by chemical reaction, and then is mechanically removed, so that higher removal rate can be obtained, and the global planarization of the workpiece can be realized after polishing.

The factors affecting chemical mechanical polishing include the composition of the polishing slurry, the processing conditions during polishing, the choice of polishing pad, and the initial condition of the workpiece. Different polishing solutions can generate different chemical reactions with the workpiece to influence the speed of forming the soft layer, so that the material removal rate of the workpiece is influenced, the grinding materials in the polishing solutions are mainly used for mechanically removing the soft layer, and different grinding materials have great influence on the surface quality of the polished workpiece; the processing conditions mainly comprise polishing pressure, a relative motion form between the workpiece and the polishing pad, and the mechanical removal rate can be improved by selecting proper polishing pressure and motion form; the polishing pad is mainly used for bringing polishing liquid between a workpiece and the polishing pad, the surface of the polishing pad is provided with a large number of micropores, and the shape of the micropores on the polishing pad can influence the contact area between the polishing pad and the workpiece and the formation of a liquid film between the polishing pad and the workpiece; different machining processes are selected according to the initial state of the workpiece, the surface state and the shape of the workpiece, and finally high surface quality is obtained.

At present, the ball head workpiece is ground and polished only by a rotary grinding and polishing structure, and for the ball head workpiece, the polishing process of the rotary grinding and polishing structure by autorotation cannot be comprehensively ground and polished according to the shape of the ball head, so that the polishing efficiency is low and the quality of the obtained polished surface is not high.

Therefore, a high-efficiency and high-quality polishing device specially for ball workpieces is needed.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present invention provides a chemical mechanical polishing machine for polishing a ball head workpiece, which can perform all-directional polishing with respect to the shape of the ball head workpiece, and has high polishing efficiency and high quality of the polished surface.

In order to achieve the purpose, the technical scheme of the utility model is as follows: the polishing machine comprises a polishing die module and a torque data acquisition module.

The grinding and polishing die module comprises a grinding and polishing die, a self-rotating platform, a self-rotating motor, a swing rod, a slide block, a ball screw and a stepping motor; the grinding and polishing mould is a ball socket mould for polishing a ball head workpiece, and is provided with a spherical groove, and a ball socket polishing pad is arranged in the spherical groove; the grinding and polishing mould is arranged on the rotation platform, and the rotation motor is arranged at the bottom of the rotation platform and used for controlling the rotation motion of the rotation platform; a swing rod perpendicular to the rotation platform is arranged below the rotation platform, and the lower part of the swing rod is connected with a slide block through a ball bearing; the ball screw is controlled by the stepping motor to reciprocate back and forth, the ball screw is connected with the sliding block through a connecting rod and used for pushing the sliding block to reciprocate back and forth, and the sliding block drives the oscillating rod to swing;

the torque data acquisition module comprises a torque sensor and a data acquisition card; the ball head workpiece is fixed at one end of the torque sensor and does not rotate in the grinding and polishing process; the torque sensor is used for detecting the friction torque between the ball head workpiece and the ball socket polishing pad in real time in the polishing process; the data acquisition card acquires and outputs the friction torque detected by the torque sensor in real time.

Further, the ball and socket polishing pad comprises a set number of fan-shaped pads with the same size, and the sum of central angles of all the fan-shaped pads is 360 degrees; the fan-shaped pad is arranged in the spherical groove and attached to the inner wall of the spherical groove.

Further, the swing angle of the swing motion is 60 °.

Furthermore, the ball head workpiece is fixed at one end of the torque sensor in a flange or screw fastening mode.

Further, the rotation motor controls the rotation speed interval of the rotation platform to be 0-100 r/min, and the swing speed of the swing motion is 0-83 mm/s; the ratio of the rotation speed to the swing speed is set to a constant value.

Further, the number of the fanning pads is 12.

Furthermore, the torque sensor has a measuring range of 0-5 N.m and an output sensitivity of 2.0 mV/V.

Furthermore, the maximum adoption frequency of the data acquisition card is 10kS/s, and the output frequency is 150 Hz.

Has the advantages that:

1. the embodiment of the utility model provides a chemical mechanical polishing machine for polishing a ball head workpiece, which adopts the composite motion of autorotation motion and swing motion of a polishing mould module to provide all-around polishing for the surface of the ball head workpiece to be polished, can obtain the optimal polishing effect by setting the ratio of autorotation speed to swing speed, and the polishing mould module is used for polishing the structure of the ball head workpiece with different diameters.

2. According to the chemical mechanical polishing machine for polishing the ball head workpiece, provided by the embodiment of the utility model, the ball socket polishing pad in the ball socket mold is designed into the fan-shaped pad, and the fan-shaped pads form a petal-shaped mold structure, so that the polishing pad can be fully distributed in the mold as much as possible, and the polishing rate is improved.

Drawings

FIG. 1 is a schematic structural view of a chemical mechanical polishing machine for polishing a ball head workpiece according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a ball and socket mold in an embodiment of the utility model.

Detailed Description

The utility model is described in detail below by way of example with reference to the accompanying drawings.

Referring to fig. 1, the present invention provides a chemical mechanical polishing machine for polishing a ball head workpiece, which includes a polishing mold module and a torque data acquisition module.

The grinding and polishing die module comprises a grinding and polishing die, a rotation platform, a rotation motor, a swing rod, a slide block, a ball screw and a stepping motor.

The grinding and polishing mould is a ball socket mould for polishing a ball head workpiece, and is provided with a spherical groove, and a ball socket polishing pad is arranged in the spherical groove. The embodiment of the utility model provides a petal-type mould result, namely the ball socket polishing pad comprises a set number of fan-shaped pads with the same size, and the sum of central angles of all the fan-shaped pads is 360 degrees; the fan-shaped pad is arranged in the spherical groove and attached to the inner wall of the spherical groove to form a petal shape. The petal-type mould structure is adopted, so that the polishing pad can be fully distributed on the mould as much as possible, and the polishing rate is improved. The schematic structure of the polishing mold module is shown in fig. 2, and the number of the fan-shaped pads is 12. Wherein the polishing solution has certain corrosivity, so the part material that the mould module was used all need select acid and alkali-resistance's material, and at the in-process of polishing bulb work piece, compound motion can make the polishing solution spill, so add the apron on ball socket mould, prevent spilling of polishing solution.

The grinding and polishing mould is arranged on the rotation platform, and the rotation motor is arranged at the bottom of the rotation platform and used for controlling the rotation motion of the rotation platform. In the embodiment of the utility model, the autorotation speed interval of the autorotation platform is controlled to be 0-100 r/min according to the actual polishing effect on the ball head workpiece.

A swing rod perpendicular to the rotation platform is arranged below the rotation platform, and the lower part of the swing rod is connected with a slide block through a ball bearing; the ball screw is controlled by the stepping motor to reciprocate back and forth, the ball screw is connected with the sliding block through a connecting rod and used for pushing the sliding block to reciprocate back and forth, and the sliding block drives the oscillating rod to swing; in the embodiment of the utility model, according to the actual polishing effect on the ball head workpiece, the swing angle of the swing motion is controlled to be 60 degrees, and the swing speed of the swing motion is controlled to be 0-83 mm/s. In the polishing process of the ball head workpiece, the ratio of the autorotation speed to the swing speed is set to be a fixed value according to the polishing effect, so that better polishing quality can be obtained.

The torque data acquisition module comprises a torque sensor and a data acquisition card. The torque sensor is used for detecting the friction torque between a ball head workpiece and a ball socket polishing pad in real time in the polishing process, the range of the torque sensor in the embodiment of the utility model is 0-5 N.m, and the output sensitivity is 2.0 mV/V. In the embodiment of the utility model, a data acquisition card acquires and outputs the friction torque detected by the torque sensor in real time, and specifically, an NI6008 data acquisition card is adopted in the embodiment of the utility model, and the data acquisition card has 12 digital input ports and 8 analog input ports in total. The maximum adoption frequency of the data acquisition card is 10kS/s, and the output frequency is 150 Hz.

The ball head workpiece is fixed at one end of the torque sensor and does not rotate in the grinding and polishing process; according to the utility model, a workpiece loading structure is adopted to fix a ball head workpiece at one end of a torque sensor in a flange or screw fastening mode, an autonomously designed screw tap chuck is connected with a tapping and drilling integrated machine, the torque sensor and the screw tap chuck are connected with each other through a flange, and the ball head workpiece is connected through a flange clamping piece or a flange connecting piece.

In summary, the above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A chemical mechanical polishing machine for polishing a ball head workpiece is improved aiming at a rotary polishing structure of the ball head workpiece, the rotary polishing structure performs rotary polishing through autorotation, and is characterized by comprising a polishing die module and a torque data acquisition module;

the grinding and polishing die module comprises a grinding and polishing die, a self-rotating platform, a self-rotating motor, a swing rod, a slide block, a ball screw and a stepping motor; the grinding and polishing mould is a ball socket mould for polishing a ball head workpiece, and is provided with a spherical groove, and a ball socket polishing pad is arranged in the spherical groove; the grinding and polishing mould is arranged on the rotation platform, and the rotation motor is arranged at the bottom of the rotation platform and used for controlling the rotation motion of the rotation platform; a swing rod perpendicular to the rotation platform is arranged below the rotation platform, and the lower part of the swing rod is connected with the sliding block through a ball bearing; the ball screw is controlled by the stepping motor to reciprocate back and forth, the ball screw is connected with the sliding block through a connecting rod and is used for pushing the sliding block to reciprocate back and forth, and the sliding block drives the oscillating rod to swing;

the torque data acquisition module comprises a torque sensor and a data acquisition card; the ball head workpiece is fixed at one end of the torque sensor and does not rotate in the grinding and polishing process; the torque sensor is used for detecting the friction torque between the ball head workpiece and the ball socket polishing pad in real time in the polishing process; the data acquisition card acquires and outputs the friction torque detected by the torque sensor in real time;

the ball socket polishing pad comprises a set number of fan-shaped pads with the same size, and the sum of central angles of all the fan-shaped pads is 360 degrees; the fan-shaped pad is arranged in the spherical groove and attached to the inner wall of the spherical groove.

2. The lapping machine of claim 1, wherein the oscillating motion has an oscillation angle of 60 °.

3. The lapping machine of claim 1, wherein the ball-head workpiece is secured to one end of the torque sensor by flange or screw fastening.

4. The polishing machine according to claim 1, wherein the rotation motor controls the rotation speed of the rotation platform to be 0 to 100r/min, and the swing speed of the swing motion is 0 to 83 mm/s; the ratio of the rotation speed to the swing speed is set to a constant value.

5. The lapping machine of claim 1, wherein the number of fan pads is 12.

6. The lapping and polishing machine of claim 1, wherein the torque sensor has a span of 0-5N-m and an output sensitivity of 2.0 mV/V.

7. The lapping and polishing machine of claim 1, wherein the data acquisition card has a maximum frequency of 10kS/s and an output frequency of 150 Hz.