CN205600498U - High -speed machining and automatic measure integration equipment - Google Patents
High -speed machining and automatic measure integration equipment Download PDFInfo
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- CN205600498U CN205600498U CN201620015083.6U CN201620015083U CN205600498U CN 205600498 U CN205600498 U CN 205600498U CN 201620015083 U CN201620015083 U CN 201620015083U CN 205600498 U CN205600498 U CN 205600498U
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- main shaft
- work piece
- workpiece spindle
- porous ceramics
- workpiece
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Abstract
The utility model provides a high -speed machining and automatic measure integration equipment. It includes main shaft, diamond grinding wheel, work piece axle and porous ceramic dish, and work piece hub connection ultrasonic vibration device, ultrasonic vibration device vibration transmission are to the diamond grinding wheel, and the work piece adopts the absorption formula to fix on the porous ceramic dish, main shaft and work piece axle disalignment, respectively by the main shaft drive the diamond grinding wheel, that the work piece axle drives the porous ceramic dish is rotatory at the horizontal direction, and work piece axle below links to each other with the guide rail, can be on the horizontal direction reciprocating motion. The utility model discloses mainly solve the hard brittle material and get rid of inefficiency, intermediate demand measuring thickness, result in production efficiency to hang down the scheduling problem.
Description
Technical field
The open a kind of process equipment of this utility model, is specifically related to a kind of High-speed machining and automatically measures integration apparatus.
Background technology
Hard brittle material, especially non-metal insulating material and semi-conducting material, such as optical glass, monocrystal silicon, sapphire etc.,
Due to the character of its uniqueness, have at electronics, optics, Aero-Space, national defence and the numerous areas such as civilian and be increasingly widely applied.
But, owing to its hardness is high, fragility is big, not only working (machining) efficiency is relatively low, and when processing sheet product, is particularly susceptible and occurs collapsing
The limit even phenomenon of fragmentation, cause that yield rate is low, production cost is high.
Such as, in LED application aspect or consumer electronics product application aspect, Sapphire wafer surface quality is had relatively
High requirement.Generally sapphire wafer is after grinding removal damage layer, the most all can use the side of chemically mechanical polishing (CMP)
Method realizes the global planarizartion of wafer.Owing to sapphire hardness is big, the grinding efficiency of tradition lapping mode is relatively low, and wafer surface
Easily occur scratching, polishing process is not easy remove.Therefore, the surface quality of grinding wafers directly affects the one-tenth of following process
Product rate and efficiency.Further, since in process of lapping, in the middle of the enclosed environment that wafer is between upper lower burrs, wafer removal amount
It is difficult to accurately control, in order to prevent resulting in defective products because wafer processing capacity is excessive, in the course of processing, it will usually have one
Secondary or repeatedly job interruption, opens dish to check wafer thickness.Therefore, for improving working (machining) efficiency, reduce processing cost,
Improving equipment and technique, while improving working (machining) efficiency, minimizing intermediate detection link is also that the another one of solution problem is important
Approach.
Summary of the invention
The purpose of this utility model is to provide a kind of, intermediate demand detection thickness low mainly for hard brittle material removal efficiency
Degree, causes the High-speed machining of the problems such as production efficiency is low and automatically measures integration apparatus.
The purpose of this utility model is achieved in that this device structure and the most obvious district of traditional polishing grinding equipment
Not being that upper lower burrs is not coaxial, its primary structure includes main shaft, skive, workpiece spindle and porous ceramics dish, workpiece spindle
Connecting ultrasonic vibration installation, in ultrasonic vibration installation conduct vibrations to skive, workpiece uses adsorption-type to be fixed on porous
On ceramic disk, main shaft is the most coaxial with workpiece spindle, is driven skive, workpiece spindle to drive porous ceramics dish at water by main shaft respectively
Square to rotation, and it is connected with guide rail below workpiece spindle, can move back and forth in the horizontal direction.
This utility model the most so some features:
1, described skive uses knot block structure, and diamond segment is evenly distributed on emery wheel edge, between caking
Leave gap.
2, described absorption of workpieces formula fixed form can be pneumatic type or water pump type, and the porous ceramics dish of fixing workpiece is many
Hole pottery.
3, described workpiece spindle makees supersonic vibration vertically, and frequency of vibration is 17000 ~ 23000Hz.
4, described boart boart wheel speed is 1500 ~ 3000rpm, and workpiece spindle rotating speed is 10 ~ 60rpm.
5, described main shaft is jumped with workpiece spindle axle and footpath is jumped and controlled within 5 μm, and the depth of parallelism controls within 5 μm.
6, described workpiece spindle is 50 ~ 200mm/min along guide rail horizontal movement velocity, and mobile range is 20 ~ 100mm.
7, described online thickness measure can use contact or contactless in one.
The beneficial effects of the utility model have:
1. skive uses caking formula, and chip removal is effective, is difficult to scuffing occur, and wafer surface quality is good.
2. workpiece uses the fixing loading and unloading speed that can improve of suction type, and then improves work efficiency, and workpiece is fixed simultaneously
Convenient with pipetting.
3. using high speed rotating to combine supersonic vibration mode thinning to workpiece, surface quality is good, and working (machining) efficiency is high.Tradition
The removal rate of lapping mode about 1 μm/min, this utility model equipment removal rate is more than 10 μm/min, and < 0.03 μm, can for roughness Ra
To reach the processing effect that copper dish grinds.
4. rotating with ceramic disk except skive in the course of processing, workpiece spindle moves in the horizontal direction, can be effective
Improve the uniformity of surface of the work, reduce thickness deviation.
Grind skive and ceramic disk out-of-alignment to design, measure in conjunction with real-time thickness, can avoid processed
Journey dimension overproof, improves yield.
Accompanying drawing explanation
Fig. 1 is this utility model structural representation.
Detailed description of the invention
Below in conjunction with the accompanying drawings this utility model is described in detail.In conjunction with Fig. 1, the position marked in figure is followed successively by master
Axle 1, emery wheel 2, the diamond layer 3 of wheel face, workpiece spindle 4, porous ceramics dish 5, workpiece 6, online thickness measurement equipment 7.This sets
With traditional polishing grinding equipment, standby structure most obvious difference is that upper lower burrs is the most coaxial, primary structure includes: main shaft 1, gold
Diamond grinding wheel 2, workpiece spindle 4 and porous ceramics dish 5.Workpiece spindle 1 connects and has ultrasonic vibration installation, Under Ultrasonic Vibration can be made vertically
Dynamic, in conduct vibrations to emery wheel 2, the clearance of material 6 can be accelerated, the diamond layer 3 of wheel face is knot block structure, uniformly
It is distributed in the edge of emery wheel 2, leaves enough gaps between caking, in order to chip removal.Workpiece 6 uses pneumatic or water pump suction type solid
It is scheduled on porous ceramics dish 5.Main shaft 1 is the most coaxial with workpiece spindle 4, is driven emery wheel 2, workpiece spindle 4 to drive ceramic disk by main shaft 1 respectively
5 rotate with the speed of r1 and r2 in the horizontal direction, and are connected with guide rail below workpiece spindle 4, can do with speed V in the horizontal direction
Move back and forth.Online thickness measurement equipment 7 can use contact or contactless in one.
Above content is the further description being done this utility model, it is impossible to assert bright concrete of this utility model
Implement to be only limited to these explanations.From the point of view of there are the personnel of art rudimentary knowledge of the present invention, can be easy to this reality
Changing with novel and revise, these changes and amendment all should be considered as belonging to claims that this utility model is submitted to
The scope of patent protection determined.
Claims (3)
1. a High-speed machining with automatically measure integration apparatus, it is characterised in that it includes main shaft, skive, workpiece spindle
With porous ceramics dish, workpiece spindle connects ultrasonic vibration installation, and in ultrasonic vibration installation conduct vibrations to skive, workpiece is adopted
Being fixed on porous ceramics dish with adsorption-type, main shaft is the most coaxial with workpiece spindle, is driven skive, workpiece spindle by main shaft respectively
Drive porous ceramics dish to rotate in the horizontal direction, and be connected with guide rail below workpiece spindle, it is possible to move back and forth in the horizontal direction.
A kind of High-speed machining the most according to claim 1 with automatically measure integration apparatus, it is characterised in that described gold
Diamond grinding wheel uses knot block structure, and diamond segment is evenly distributed on emery wheel edge, leaves gap between caking.
A kind of High-speed machining the most according to claim 2 with automatically measure integration apparatus, it is characterised in that described work
Part adsorption-type fixed form can be pneumatic type or water pump type, and the porous ceramics dish of fixing workpiece is porous ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620015083.6U CN205600498U (en) | 2016-01-08 | 2016-01-08 | High -speed machining and automatic measure integration equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620015083.6U CN205600498U (en) | 2016-01-08 | 2016-01-08 | High -speed machining and automatic measure integration equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205600498U true CN205600498U (en) | 2016-09-28 |
Family
ID=56960782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620015083.6U Active CN205600498U (en) | 2016-01-08 | 2016-01-08 | High -speed machining and automatic measure integration equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205600498U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105619236A (en) * | 2016-01-08 | 2016-06-01 | 哈尔滨秋冠光电科技有限公司 | High-speed machining and automatic measuring integrated equipment |
-
2016
- 2016-01-08 CN CN201620015083.6U patent/CN205600498U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105619236A (en) * | 2016-01-08 | 2016-06-01 | 哈尔滨秋冠光电科技有限公司 | High-speed machining and automatic measuring integrated equipment |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |