CN117681083B - Polishing grinding head, polishing and in-situ detection device and polishing processing method - Google Patents
Polishing grinding head, polishing and in-situ detection device and polishing processing method Download PDFInfo
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- CN117681083B CN117681083B CN202410150750.0A CN202410150750A CN117681083B CN 117681083 B CN117681083 B CN 117681083B CN 202410150750 A CN202410150750 A CN 202410150750A CN 117681083 B CN117681083 B CN 117681083B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
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Abstract
The invention relates to the technical field of optical element processing, in particular to a polishing grinding head, a polishing and in-situ detection device and a polishing processing method; the polishing grinding head comprises a clamping device, an elastic support body, a polishing grinding head main body and a clamping shell, wherein: the clamping device is connected with the polishing grinding head main body, an elastic installation space is arranged in the clamping device and/or the polishing grinding head main body, and an elastic support body is arranged between the clamping device and the polishing grinding head main body through the corresponding elastic installation space; the clamping shell is detachably sleeved on the clamping device and the polishing grinding head main body. According to the polishing grinding head, the elastic support body is arranged on the polishing grinding head, and the clamping device and the clamping shell are designed, so that the polishing grinding head can be detachably mounted, corresponding parts can be replaced conveniently, the parts can be reused, and the arranged support body can be used for buffering to a certain extent, so that a better polishing effect can be achieved through elastic polishing in an actual application scene.
Description
Technical Field
The invention relates to the technical field of optical element processing, and particularly provides a polishing grinding head, a polishing and in-situ detection device and a polishing processing method.
Background
The development of science and technology has put higher demands on imaging performance and quality of various optical systems, and has presented great challenges for conventional optical systems using only spherical and aspherical optical elements. The metal material has good processing characteristics, and the metal is used as the substrate of the optical element, so that the metal material has the advantages of higher surface quality, lower cost, suitability for mass production and the like. Therefore, the metal-based optical element is used as a representative of high-efficiency and high-quality manufacturing technology and has very wide application in various army and civil application fields such as laser communication, optical remote sensing, navigation and guidance, investigation and early warning.
The free-form surface optical element is adopted, and the asymmetric structural form of the free-form surface optical element is adopted, so that flexible space layout is provided, the degree of freedom is expanded and optimized, the off-axis aberration balance capacity is improved, and the view field adaptability is improved, so that the method gradually becomes a necessary trend. The wide application of free-form surface metal optical elements also puts forward more stringent requirements on ultra-precise advanced manufacturing technology and high-precision optical detection technology. In the related art, prior fabrication such as single point diamond ultra-precision turning is commonly used for high precision machining of metal-based optical elements. Although the surface shape precision of the optical element processed by the method is high, the feeding trace formed by the feeding of the diamond cutter is shown in figure 1, so that the scattering problem of visible light and ultraviolet light is unavoidable, and the performance of an optical system is affected. To remove the effect of the tool mark, the diamond turned optical element needs to be treated. A common way to remove the tool marks is to use a rotating and rotating asphalt disk to polish the component. On the one hand, the asphalt polishing membrane has good smoothing effect on the aspheric surface with plane, spherical surface, low steepness and small deviation. However, for high steepness, large deflection aspheric surfaces, even free-form surfaces, often due to inferior asphalt deformation, inconsistent polishing marks are produced, as shown in fig. 2, and the smoothing effect is not good.
In addition, the polishing grinding head for processing the optical element made of the metal material is in a non-detachable structure, and in the practical application scene, the whole polishing grinding head needs to be replaced when the polishing grinding head is worn, so that the structure is in a configuration which is not only wasteful in material and unfavorable for environmental protection, but also can increase the use cost.
Thus, the above-mentioned technical problems are to be solved.
Disclosure of Invention
The invention provides a polishing grinding head, a polishing and in-situ detection device and a polishing processing method for solving the problems.
The invention provides a polishing grinding head, which specifically comprises a clamping device, an elastic support body, a polishing grinding head main body and a clamping shell, wherein:
The clamping device is connected with the polishing grinding head main body, an elastic installation space is arranged in the clamping device and/or the polishing grinding head main body, and the elastic supporting body is arranged between the clamping device and the polishing grinding head main body through the corresponding elastic installation space;
the clamping shell is detachably sleeved on the clamping device and the polishing grinding head main body.
Preferably, at least a portion of the polishing head body is configured as a stepped cylindrical structure including a first cylinder, a second cylinder, and a third cylinder connected in sequence, and outer diameters of the first cylinder, the second cylinder, and the third cylinder are reduced in sequence, wherein:
the clamping device is internally provided with an elastic installation space, the bottom of the clamping device is configured to be capable of penetrating through the third cylinder and being abutted to the second cylinder, the clamping shell is configured to be capable of penetrating through the clamping device and the polishing grinding head main body, and the inner cavity of the clamping shell is clamped with the outer wall of the clamping device and the outer wall of the polishing grinding head main body.
Preferably, the elastic support body is a filling material with elasticity or a buffer spring.
Preferably, the polishing grinding head further comprises a polishing pad, the polishing pad is made of soft materials, at least the part of the clamping device is spherical, and the polishing pad is attached to the spherical part of the clamping device.
Preferably, the polishing grinding head main body and the clamping device are further provided with a diversion trench for conveying polishing liquid in a penetrating manner, wherein:
The guide groove is divided into a first outer diameter channel which is arranged on the polishing grinding head main body and used for inputting polishing liquid, a circular trapezoid-shaped channel which is communicated with the first outer diameter channel, and a second outer diameter channel which is arranged on the clamping device and communicated with the circular trapezoid-shaped channel, and the diameter of the first outer diameter channel is larger than that of the second outer diameter channel.
Preferably, the polishing grinding head is used for processing an optical element, and the optical element is made of a metal material.
The polishing and in-situ detection device provided by the second aspect of the invention is used for iterative processing and detection of optical elements and specifically comprises a polishing mechanism, a workbench, and an in-situ detection device and a detection positioning device which are arranged on the workbench, wherein the in-situ detection device and the detection positioning device are configured to be in reversible arrangement; the polishing mechanism includes a connecting device for connecting a moving mechanism, a polishing spindle, and a polishing head according to any one of the above first aspects of the present invention, the polishing head being mounted on the polishing spindle, wherein:
the workbench is used for placing and fixing the optical element to be processed;
the polishing main shaft is arranged on the connecting device, and the polishing grinding head is used for polishing an optical element to be processed on the workbench through the linkage of an external movement mechanism and the polishing main shaft;
The in-situ detection device comprises a detection support arranged on the workbench, a stripe display device arranged on the detection support and an image pickup device, wherein when an optical element on the workbench is detected, the in-situ detection device can be positioned on the detection positioning device, the stripe display device can reflect a displayed stripe to the optical element, and the image pickup device is used for picking up the optical element reflected with the stripe so as to perform in-situ detection.
Preferably, the in-situ detection device further comprises a first position fine adjustment mechanism and a second position fine adjustment mechanism, wherein:
the stripe display device is arranged on the detection support through the first position fine adjustment mechanism, and the first position fine adjustment mechanism can adjust the pitching and torsion angles of the stripe display device;
The image pickup device is arranged on the detection support through the second position fine adjustment mechanism, and the second position fine adjustment mechanism can adjust displacement in three directions of XYZ of the image pickup device, namely pitching and torsion angles.
Preferably, the in-situ detection device and the detection positioning device can be arranged in a turnover way;
The detection positioning device comprises a first positioning module and a second positioning module which are arranged on the workbench at intervals, and the in-situ detection device comprises a first positioning rod and a second positioning rod which are arranged on the detection support, wherein:
The device comprises a first positioning module, a second positioning module, a first positioning rod, a second positioning rod, a first positioning ball, a second positioning ball, an in-situ detection device, a first positioning rod, a second positioning rod, a first positioning module and a second positioning module, wherein the first positioning module and the second positioning module are respectively provided with a plurality of positioning balls with high precision, the first positioning ball is arranged at the bottom of the first positioning rod, the second positioning ball is arranged at the bottom of the second positioning rod, and when the in-situ detection device is turned and positioned on the detection positioning device, the bottom of the first positioning rod and the bottom of the second positioning rod are respectively matched and positioned with the plurality of positioning balls corresponding to the first positioning module and the second positioning module.
Preferably, the in-situ detection device further comprises a connecting rod connected to the detection bracket, a positioning piece for being matched with the in-situ detection device to turn over is further arranged on the workbench, and the connecting rod and the positioning piece can be turned over;
Or the polishing and in-situ detection device further comprises a hinge mechanism, and the connecting rod and the positioning piece can be overturned through the hinge mechanism.
Preferably, the polishing and in-situ detecting device further comprises a multi-axis motion mechanism, wherein the multi-axis motion mechanism comprises a robot with six degrees of freedom and is used for driving the polishing main shaft on the connecting device to perform multi-axis motion.
The polishing method provided in the third aspect of the present invention is specifically applied to the polishing and in-situ detection device according to any one of the second aspect of the present invention, and the method includes:
controlling the polishing mechanism to polish the optical element based on the optical element placed on the workbench;
When the polished optical element is required to be detected, the optical element is positioned on the detection positioning device at a processing position, the stripe display device reflects the displayed stripe to the optical element, and the image pickup device picks up the optical element reflected with the stripe so as to perform in-situ detection.
Preferably, the in-situ detection is performed, specifically including:
And determining whether the optical element meets preset parameters, and continuing polishing the optical element until the optical element meets the preset parameter requirements when the optical element does not meet the preset parameter requirements.
Preferably, controlling the polishing mechanism to polish the optical element includes:
and controlling the polishing grinding head to conduct autorotation polishing at a rotating speed of 800RPM-1200 RPM.
Compared with the prior art, the invention has the following beneficial effects:
The polishing grinding head provided by the invention can be applied to polishing processing of optical elements, and is specifically provided with a clamping device, an elastic support body, a polishing grinding head main body and a clamping shell, wherein: the clamping device is connected with the polishing grinding head main body, an elastic installation space is arranged in the clamping device and/or the polishing grinding head main body, and an elastic support body is arranged between the clamping device and the polishing grinding head main body through the corresponding elastic installation space; the clamping shell is detachably sleeved on the clamping device and the polishing grinding head main body. According to the polishing grinding head, the elastic supporting body is arranged on the polishing grinding head, the clamping device and the clamping shell are designed, the detachable installation of the polishing grinding head can be realized, corresponding components can be replaced conveniently, the components can be reused, in addition, the supporting body is arranged to have certain buffering, when the polishing grinding head is used for polishing a metal mirror such as a free curved surface/an aspheric surface, the polishing grinding head can be elastically filled and deformed by increasing pressure, so that the polishing grinding head is in close matching contact with the surface to be processed, better polishing effect can be realized through elastic polishing in a practical application scene, the polishing effect on the surface to be processed is improved, and the flexibility and the applicability of practical application are improved.
Additional features and advantages of embodiments of the application will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of embodiments of the application. The objectives and other advantages of embodiments of the application will be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a drawing of a diamond single point carriage feed trace detection of the prior art mentioned in accordance with the background of the invention;
FIG. 2 is a graph of measured belt breakage errors resulting from a prior art disc misalignment, according to the background of the invention;
FIG. 3 is a cross-sectional view of a polishing pad structure provided in accordance with an embodiment of the present invention;
FIG. 4 is an exploded view of a polishing grater structure provided in accordance with an embodiment of the present invention;
FIG. 5 is a schematic view showing a structure of a polishing head main body according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a flow guiding groove according to an embodiment of the present invention;
FIG. 7 is a schematic view of a polishing and in-situ detection apparatus according to an embodiment of the present invention during a polishing process;
FIG. 8 is a schematic view of a polishing and in-situ detection apparatus according to an embodiment of the present invention in an in-situ detection process;
FIG. 9 is a schematic perspective view of an in situ monitoring device according to an embodiment of the present invention;
fig. 10 is a tool mark detection diagram of an optical element polished by the polishing and in-situ detection apparatus according to an embodiment of the present invention.
Wherein reference numerals include:
10-a workbench;
20-a polishing mechanism; 21-connecting means; 22-polishing spindle; 23-polishing grinding head:
231-an elastic support; 231 a-a second outer diameter channel;
232-a polishing pad;
233-diversion trenches; 233 a-a first outer diameter channel; 233 b-a circular trapezoidal channel;
234-clamping device;
235-polishing grinding head body; 235 a-a first column; 235 b-a second column; 235 c-a third column;
236-a clamping housing;
30-in-situ detection device; 31-detecting a bracket; 32-a stripe display device; 33-an image pickup device; 34-a first position fine adjustment mechanism; 35-a second position fine adjustment mechanism; 36-a first positioning rod; 37-a second positioning rod; 38-connecting rods;
40-detecting and positioning device; 41-a first positioning module; 42-a second positioning module;
50-positioning pieces;
A 60-hinge mechanism;
70-a multi-axis motion mechanism;
a-optical element.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, like modules are denoted by like reference numerals. In the case of the same reference numerals, their names and functions are also the same. Therefore, a detailed description thereof will not be repeated.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not to be construed as limiting the invention.
Example 1
The polishing grinding head provided by the first aspect of the invention can be suitable for aspheric or free-form surface optical elements with large deviation and high steepness in an application scene, and can be particularly applied to polishing processing of a free-form surface metal mirror; specifically, as shown in fig. 3 and 4, the polishing head 23 includes a chucking device 234, an elastic support body 231, a polishing head main body 235, and a chucking housing 236, wherein:
The clamping device 234 is connected with the polishing grinding head main body 235, an elastic installation space is formed in the clamping device 234 and/or the polishing grinding head main body 235, an elastic supporting body 231 is arranged between the clamping device 234 and the polishing grinding head main body 235 through the corresponding elastic installation space, namely, the elastic installation space is formed in the clamping device 234, or the elastic installation space is formed in the polishing grinding head main body 235, or the elastic installation space is formed in each of the clamping device 234 and the polishing grinding head main body 235, the elastic supporting body 231 is mainly wrapped by the clamping device 234 for illustration, and in a detachable structural design, the clamping device 234 is wrapped by an elastic filler (the elastic supporting body 231) and connected with the polishing grinding head main body 235 through a clamping shell 236, so that the clamping shell 236 can be detachably sleeved on the clamping device 234 and the polishing grinding head main body 235, and particularly can be realized through a step structure, for example, and the following embodiments will be described in detail.
The polishing grinding head 23 in the above embodiment, by configuring the polishing grinding head 23 with the elastic supporting body 231 and designing the detachable structure of the clamping device 234 and the clamping housing 236, the configured elastic supporting body 231 can also have a certain buffer when the polishing grinding head 23 is used for polishing a metal mirror such as a free-form surface/an aspheric surface, and the polishing grinding head 23 can be elastically filled and deformed by increasing the pressure, so that the polishing grinding head 23 is ensured to be in close matching contact with the surface to be processed, the polishing effect on the surface to be processed is improved, and the flexibility and applicability of practical application are improved; in addition, the detachable installation of the polishing grinding head 23 can be realized, so that the corresponding wearing parts can be replaced conveniently, and the corresponding parts can be reused, thereby reducing the use cost of materials.
In one embodiment, as shown in fig. 4 and 5, at least a portion of polishing grater body 235 is configured in a stepped cylindrical structure, i.e., polishing grater body 235 may be partially or fully configured in a stepped cylindrical structure; specifically, the stepped cylindrical structure includes a first cylinder 235a, a second cylinder 235b, and a third cylinder 235c connected in sequence, and outer diameters of the first cylinder 235a, the second cylinder 235b, and the third cylinder 235c are reduced in sequence, wherein:
The clamping device 234 is provided with an elastic installation space, the bottom of the clamping device 234 is configured to be capable of penetrating through the third column 235c and abutting against the second column 235b, the clamping shell 236 is configured to be capable of penetrating through the clamping device 234 and the polishing grinding head main body 235, and the inner cavity of the clamping shell 236 is in clamping connection with the outer wall of the clamping device 234 and the outer wall of the polishing grinding head main body 235.
In actual installation, the elastic supporting body 231 may be installed in an elastic installation space provided in the clamping device 234, the clamping device 234 wrapped with the elastic supporting body 231 may be installed on the polishing grinding head main body 235, and then the clamping shell 236 may be correspondingly sleeved on the clamping device 234 and the polishing grinding head main body 235. For easy assembly and disassembly, as a preferred embodiment, the clamping housing 236 may be configured as a split structure, for example, as two split parts, and the two split parts are combined by a structure such as a bolt or a screw to form the clamping housing 236, so that the clamping housing 236 is conveniently sleeved on the clamping device 234 and the polishing grinding head main body 235 and disassembled.
In the above embodiment, the structures of the polishing grinding head main body 235, the clamping device 234 and the clamping housing 236 are further disclosed, so that the detachable installation of the polishing grinding head 23 is realized, and the flexibility of the application and the convenience of maintenance of the polishing grinding head 23 are improved.
In one embodiment, the elastic support body 231 in the above embodiment may be a filler material having elasticity, or may be a buffer spring or the like. Specifically, the filling material may be, for example, a hard sponge, that is, the hard sponge may be filled into the elastic installation space of the chucking device 234; it can be appreciated that the hard sponge has the advantages of good support, air permeability and rebound resilience, and the like, and has extremely large tensile force, long-term non-deformation, difficult aging, water washing resistance, and the like, so that the maintenance period of the polishing grinding head 23 can be obviously reduced, and the manpower frequent replacement and the material cost are reduced.
In one embodiment, as shown in fig. 3 and 4, the polishing head 23 further includes a polishing pad 232, the polishing pad 232 may be configured as a soft material, and at least a portion of the chucking device 234 is spherical, i.e., a portion or all of the chucking device 234 may be configured as a sphere, and the polishing pad 232 is fitted on the spherical portion of the chucking device 234. The polishing pad 232 may be adhered to the ball-shaped portion of the chucking device 234 by, for example, disposing a glue.
In practical application, the polishing pad 232 may be made of a material with micropores, such as a soft material like polyurethane, so that not only the polishing solution mentioned in the following embodiments can be satisfied, but also a micro storage space can be provided for polished particles, and in addition, the polishing effect can be improved through configured spherical attachment.
Based on the configuration of the above-described embodiment, in one embodiment, as shown in fig. 3, 4 and 6, the polishing head main body 235 and the chucking device 234 are further provided with a guide groove 233 therethrough for the transfer of the polishing liquid, wherein:
the flow guide groove 233 is divided into a first outer diameter passage 233a provided on the polishing head body 235 for inputting the polishing liquid, a circular stepped passage 233b communicating with the first outer diameter passage 233a, and a second outer diameter passage 231a provided on the chucking device 234 communicating with the circular stepped passage 233b, the second outer diameter passage 231a being for outputting the polishing liquid, the diameter of the first outer diameter passage 233a being larger than the diameter of the second outer diameter passage 231 a. As a preferred embodiment, the flow guide grooves 233 may be provided along the axial center of the polishing head 23 to facilitate balancing the weight and to facilitate more uniform distribution of the polishing liquid on the polishing head 23.
The structure similar to the funnel inversion or the infusion bottle is arranged on the flow guide groove 233 of the polishing grinding head 23 in the embodiment, and the principle of atmospheric pressure and hydrostatic pressure is actually utilized, so that the polishing liquid has a certain buffering effect in the flow guide groove, namely, through the arrangement of the axial small-area through design on the axis of the polishing grinding head 23, the flow of the polishing liquid and the control of local polishing temperature are facilitated, the rapid shape-keeping and tool mark removal polishing of a metal mirror is facilitated, and in the polishing process of the metal mirror with an optical element A such as a free-form surface, the polishing liquid is added through the polishing liquid flow guide groove 233, and the rapid shape-keeping polishing of the optical element A is realized by the rapid rotation of a main shaft.
In the polishing head 23 provided in the first aspect of the present invention, compared with the conventional asphalt polishing film, the polishing head 23 is suitable for aspheric/freeform optical elements a with large deviation and high steepness because the polishing head 23 is configured to be made of soft material and is internally provided with the elastic supporting body 231, the polishing can make the deformation mode be elastic deformation, and the degree of fit of the polishing head 23 with the optical element a to be processed is good through the polishing pad 232; secondly, compared with the revolution and rotation mode of the traditional asphalt polishing film, the polishing grinding head 23 can be configured to adopt a pure rotation mode, and can be configured to work at the rotating speed of 800 RPM-1200 RPM in the actual polishing process, so that the defect of lower rotating speed in the revolution and rotation mode is overcome, and the smoothing effect in the polishing process is greatly improved; in addition, the small axial area through design of the polishing grinding head 23 is further beneficial to controlling the flow of polishing liquid and the local polishing temperature, is further beneficial to realizing the rapid shape-preserving and tool mark removing polishing of the metal mirror, and can be conveniently detached and replaced by being provided with a corresponding detachable structure. In a tested image display, the polishing effect can be achieved as shown in fig. 10, the PV value (peak valley) and RMS value (root mean square) of fig. 10 are significantly more advantageous than the corresponding comparative values shown in fig. 1, and the corresponding processing trace is significantly reduced, so that the polishing effect is significantly improved.
Example 2
The second aspect of the present invention also provides a polishing and in-situ inspection apparatus for iterative processing and inspection of optical elements, in one embodiment, as shown in fig. 7 to 9, in particular, the polishing and in-situ inspection apparatus comprises a polishing mechanism 20, a table 10, an in-situ inspection apparatus 30 provided on the table 10, and an inspection positioning apparatus 40, the polishing mechanism 20 comprises a connecting apparatus 21 for connecting a moving mechanism, a polishing spindle 22, and a polishing grinding head 23 according to any one of the above embodiments 1, the polishing grinding head 23 is mounted on the polishing spindle 22, wherein:
The workbench 10 is used for placing and fixing an optical element A to be processed;
The polishing spindle 22 is mounted on the connecting device 21, and the polishing grinding head 23 polishes the optical element A to be processed on the workbench 10 through an external movement mechanism and linkage of the polishing spindle 22.
It is specifically noted that, based on the beneficial effects of the polishing grinding head 23 in the above embodiment 1, the polishing and in-situ detection device in this embodiment includes the polishing grinding head 23 in the above embodiment 1, so that the polishing and in-situ detection device in this embodiment also has at least corresponding technical effects, and in order to avoid redundancy, the description thereof will not be repeated here.
The in-situ detection device 30 comprises a detection bracket 31 arranged on the workbench 10, a stripe display device 32 arranged on the detection bracket 31 and an image pickup device 33, when the optical element A on the workbench 10 is detected, the in-situ detection device 30 can be repeatedly positioned on the detection positioning device 40, and specifically can be realized by setting fixed point overturning or integral reverse buckling and other structures, the stripe display device 32 can reflect the displayed stripe to the optical element A, and the image pickup device 33 is used for picking up the optical element A with the reflected stripe so as to perform in-situ detection.
In an actual application scenario, for example, when in-situ detection is required to be performed on the optical element a (that is, detection on an original processing position is performed without moving the position of the optical element a), based on the fact that the in-situ detection device 30 can be turned over and arranged on the workbench 10, the in-situ detection device 30 can be positioned on the detection positioning device 40, the stripe display device 32 on the detection support 31, such as a display screen, is used for displaying straight stripes with equal intervals, the straight stripes are deformed through modulation of the three-dimensional surface shape of the optical element a to be detected, and after the deformed stripes are imaged through the image capturing device 33, such as a camera, the surface shape errors of the mirror surface to be detected can be obtained through demodulation from the deformed stripes carrying the three-dimensional surface shape information, so that in-situ detection is realized. The configuration mode is not affected by the A surface type of the optical element to be tested, and is applicable to planes, spherical surfaces, aspherical surfaces and free curved surfaces. In addition, if more flexible adjustment is required for the aspheric/freeform optical elements a with different surface types, the adjustment can be achieved by matching with a specific fine adjustment structure, and then the high-precision detection of the different surface types of optical elements a can be achieved according to the positions of the screen and the camera of the element to be detected, which will be described in the following embodiments.
The polishing and in-situ detecting device of the embodiment can realize the rapid in-situ detection of the optical element A in the iterative process of processing and detecting the same optical element A by integrating the in-situ detecting device 30 and the high-precision detecting and positioning device 40 on the workbench 10, thereby greatly improving the iterative speed of processing and detecting and being suitable for large-scale batch manufacturing of the optical element A.
In one embodiment, as shown in fig. 9, in particular, the in situ detection device 30 further includes a first position adjustment mechanism 34 and a second position adjustment mechanism 35, wherein:
the stripe display device 32 is arranged on the detection bracket 31 through a first position fine adjustment mechanism 34, and the first position fine adjustment mechanism 34 can at least adjust the pitching and twisting angles of the stripe display device 32;
The image capturing device 33 is disposed on the detecting bracket 31 through a second position fine adjustment mechanism 35, and the second position fine adjustment mechanism 35 can adjust at least the displacement in the XYZ directions and the pitch and yaw angles of the image capturing device 33, that is, the second position fine adjustment mechanism 35 can adjust at least the displacement in the X direction, the Y direction, and the Z direction and the pitch and yaw angles of the image capturing device 33.
In the above embodiment, the optical element a for plane, sphere, aspheric surface and free-form surface can be applied by the position fine adjustment mechanism correspondingly configured to the in-situ detection device 30, so that the in-situ detection device 30 is not affected by the surface type of the optical element a to be detected, and flexibility and applicability of application are provided.
In one embodiment, as shown in fig. 7-9, the in-situ detection device 30 and the detection positioning device 40 may be disposed in a reversible manner, specifically in a fixed-point reversible manner;
The detection positioning device 40 comprises a first positioning module 41 and a second positioning module 42 which are arranged on the workbench 10 at intervals, and the in-situ detection device 30 comprises a first positioning rod 36 and a second positioning rod 37 which are arranged on the detection bracket 31, wherein:
The first positioning module 41 and the second positioning module 42 are respectively provided with a plurality of positioning balls with high precision, the bottom of the first positioning rod 36 is provided with a first positioning ball, the bottom of the second positioning rod 37 is provided with a second positioning ball, and when the in-situ detection device 30 is turned over and positioned on the detection positioning device 40 (i.e. the in-situ detection device 30 is turned over and buckled on the detection positioning device 40 of the workbench 10), the bottom of the first positioning rod 36 and the bottom of the second positioning rod 37 are respectively matched and positioned with the plurality of positioning balls corresponding to the first positioning module 41 and the second positioning module 42.
In an actual application scene, the first positioning module 41 and the second positioning module 42 can be provided with 3 high-precision positioning balls correspondingly, so that the first positioning ball at the bottom of the first positioning rod 36 is matched and positioned with the 3 high-precision positioning balls of the first positioning module 41, and the second positioning ball at the bottom of the second positioning rod 37 is matched and positioned with the 3 high-precision positioning balls of the second positioning module 42, so that the repeated positioning precision of the in-situ detection device 30 on the workbench 10 is improved.
In order to improve the accuracy of the turning positioning, in one embodiment, as shown in fig. 7 and 8, the in-situ detection device 30 further includes a connecting rod 38 connected to the detection support 31, and a positioning member 50 for matching with the turning of the in-situ detection device 30 is further provided on the workbench 10, where the positioning member 50 can be understood as a positioning reference point, and may be specifically configured as a positioning rod or a positioning column, and the connecting rod 38 and the positioning member 50 may be configured in a turning manner, that is, the in-situ detection device 30 is turned over on the workbench 10 by the connecting rod 38 and the positioning member 50 being configured in a turning manner;
Or to further enhance the flexibility of facilitating adjustment of the in situ detection device 30, in one embodiment, it may also be achieved in an indirect manner, and in particular, as shown in fig. 7 and 8, the polishing and in situ detection device further includes a hinge mechanism 60, with the connecting rod 38 and the positioning member 50 being reversible via the hinge mechanism 60. In an actual application scenario, one end of the hinge mechanism 60 may be connected with the positioning piece 50 on the workbench 10 through a screw, the other end of the hinge mechanism 60 may be connected with the connecting rod 38 on the detection support 31 of the in-situ detection device 30 through a screw, and the first positioning module 41 and the second positioning module 42 included in the positioning device may be connected with the workbench 10 through screws.
In one embodiment, as shown in fig. 7 and 8, in particular, the polishing and in-situ detection device may further include a multi-axis motion mechanism 70, wherein the multi-axis motion mechanism 70 may be a five-axis numerically controlled machining center or at least an industrial robot having six degrees of freedom, preferably, an industrial robot having six degrees of freedom may be selected, and the multi-axis motion mechanism 70 is used to drive the polishing spindle 22 on the connection device 21 to perform multi-axis motion.
The multi-axis motion mechanism 70 in the above embodiment is configured with a robot having at least six degrees of freedom, and the configured robot has advantages of higher degrees of freedom, smaller occupied area, and the like compared with a conventional machine tool, and therefore, it is suitable for the complex aspheric/freeform optical element a to improve the applicability of the practical application scenario.
Example 3
The third aspect of the present invention also provides a polishing method, based on the polishing and in-situ detection apparatus in the above embodiment, the polishing method being applied to the polishing and in-situ detection apparatus in any one of the above embodiments 2, the polishing method comprising:
s10: based on the optical element a placed on the table 10, the polishing mechanism 20 is controlled to polish the optical element a;
S20: when the polished optical element a is required to be inspected, the in-situ inspection device 30 is positioned on the inspection positioning device 40 at the processing position of the optical element a, the stripe display device 32 reflects the displayed stripe onto the optical element a, and the image pickup device 33 picks up the optical element a reflected with the stripe to perform in-situ inspection.
The polishing processing method in the above embodiment, based on the polishing and in-situ detection device in the above embodiment 2, can enable in-situ polishing processing and detection to be realized, and can quickly realize an iterative process of polishing and detecting a workpiece a without moving an optical element a in the process, thereby greatly improving the iterative speed of processing detection, and being suitable for large-scale batch manufacturing of the optical element a.
In one embodiment, step S10 controls polishing mechanism 20 to polish optical element a, specifically comprising:
Based on the optical element a to be processed placed on the table 10, the polishing head 23 of the polishing and in-situ detecting device is controlled to squeeze-polish the optical element a, and at the same time, the external polishing liquid is controlled to be inputted into the guide groove 233 of the polishing head 23.
According to the polishing method in the embodiment, based on the polishing and in-situ detection device in the embodiment, the optical element A to be polished is placed on the workbench 10, the connecting device 21 is connected with the interface of the machine tool/mechanical arm and other movement mechanisms through screws, elastic filling deformation is caused by increasing pressure, so that the purpose-made polishing pad 232 is ensured to be in close matching contact with the surface to be processed, polishing liquid is added through the polishing liquid guide groove 233, and rapid conformal polishing of the optical element A is realized by rapid rotation of the main shaft.
In one embodiment, the "polishing head 23 of the control polishing and in-situ detecting device performs squeeze polishing on the optical element a" in the above embodiment, specifically includes:
The polishing head 23 is controlled to perform spin polishing at a rotation speed of 800RPM to 1200 RPM.
Compared with the revolution and rotation mode of the traditional asphalt polishing film, the polishing grinding head 23 adopts the pure rotation mode, and in practical application, the polishing grinding head 23 is controlled to work at the rotating speed of 800-1200 RPM, so that the defect of lower rotating speed in the revolution and rotation mode can be overcome, and the smoothing effect in the polishing process is greatly improved; in addition, the small-area through design based on the axial direction of the polishing grinding head 23 is also beneficial to controlling the flow of the polishing solution and the local polishing temperature, so that the polishing method by using the polishing and in-situ detection device is more beneficial to realizing the rapid shape-preserving and tool mark-removing polishing of the metal mirror, thereby improving the polishing effect on the optical element A.
After finishing processing the optical element a or when the optical element a in the processing process needs to be detected, the step S20 of detecting in situ to confirm whether the polishing effect meets the standard or not can be further performed through real-time detection, which specifically includes:
determining whether the optical element A meets the preset parameters, and when the optical element A does not meet the preset parameter requirements, continuing polishing the optical element A until the optical element A meets the preset parameter requirements. That is, by the polishing and in-situ detecting device in the above embodiment 2, the repeated iterative processing method of polishing and detecting the optical element a can be realized, so that the polishing and the detecting can be performed simultaneously, and the iterative processing of polishing and detecting can be further improved, so as to further improve the polishing efficiency.
While embodiments of the present invention have been illustrated and described above, it will be appreciated that the above described embodiments are illustrative and should not be construed as limiting the invention. Variations, modifications, alternatives and variations of the above-described embodiments may be made by those of ordinary skill in the art within the scope of the present invention.
The above embodiments of the present invention do not limit the scope of the present invention. Any other corresponding changes and modifications made in accordance with the technical idea of the present invention shall be included in the scope of the claims of the present invention.
Claims (6)
1. The polishing and in-situ detection device is characterized by comprising a polishing mechanism, a workbench, an in-situ detection device and a detection positioning device, wherein the in-situ detection device and the detection positioning device are arranged on the workbench and can be arranged in a turnover way; the polishing mechanism comprises a connecting device for connecting the motion mechanism, a polishing main shaft and a polishing grinding head, wherein the polishing grinding head is installed on the polishing main shaft, and the polishing main shaft comprises:
the polishing grinding head comprises a clamping device, an elastic support body, a polishing grinding head main body and a clamping shell, wherein:
The clamping device is connected with the polishing grinding head main body, an elastic installation space is arranged in the clamping device and/or the polishing grinding head main body, and the elastic supporting body is arranged between the clamping device and the polishing grinding head main body through the corresponding elastic installation space;
the clamping shell is detachably sleeved on the clamping device and the polishing grinding head main body;
The polishing grinding head is used for processing an optical element, and the optical element is made of a metal material; the polishing grinding head further comprises a polishing pad, the polishing pad is made of soft materials, at least the part of the clamping device is spherical, and the polishing pad is attached to the spherical part of the clamping device;
the polishing grinding head main body and the clamping device are further provided with a diversion trench in a penetrating mode, wherein the diversion trench is used for conveying polishing liquid, and the diversion trench is formed by:
The diversion trench is divided into a first outer diameter channel which is arranged on the polishing grinding head main body and used for inputting polishing liquid, a circular trapezoid-shaped channel which is communicated with the first outer diameter channel, and a second outer diameter channel which is arranged on the clamping device and is communicated with the circular trapezoid-shaped channel, wherein the diameter of the first outer diameter channel is larger than that of the second outer diameter channel;
the workbench is used for placing and fixing the optical element to be processed;
the polishing main shaft is arranged on the connecting device, and the polishing grinding head is used for polishing the optical element on the workbench through the external movement mechanism and the linkage of the polishing main shaft;
The in-situ detection device comprises a detection bracket arranged on the workbench, a stripe display device and an image pickup device, wherein the stripe display device is arranged on the detection bracket, when an optical element on the workbench needs to be detected, the in-situ detection device can be overturned and positioned on the detection positioning device, the stripe display device can reflect a displayed stripe to the optical element, and the image pickup device is used for picking up the optical element reflected with the stripe so as to perform in-situ detection;
The in-situ detection device further comprises a first position fine adjustment mechanism and a second position fine adjustment mechanism, wherein:
the stripe display device is arranged on the detection support through the first position fine adjustment mechanism, and the first position fine adjustment mechanism can adjust the pitching and torsion angles of the stripe display device;
the image pickup device is arranged on the detection bracket through the second position fine adjustment mechanism, and the second position fine adjustment mechanism can adjust displacement in three directions of XYZ of the image pickup device and pitching and torsion angles;
The detection positioning device comprises a first positioning module and a second positioning module which are arranged on the workbench at intervals, and the in-situ detection device comprises a first positioning rod and a second positioning rod which are arranged on the detection support, wherein:
The device comprises a first positioning module, a second positioning module, a first positioning rod, a second positioning rod, a first positioning ball, a second positioning ball, an in-situ detection device, a first positioning rod, a second positioning rod, a first positioning module and a second positioning module, wherein the first positioning module and the second positioning module are respectively provided with a plurality of positioning balls with high precision, the first positioning ball is arranged at the bottom of the first positioning rod, the second positioning ball is arranged at the bottom of the second positioning rod, and when the in-situ detection device is turned and positioned on the detection positioning device, the bottom of the first positioning rod and the bottom of the second positioning rod are respectively matched and positioned with the plurality of positioning balls corresponding to the first positioning module and the second positioning module.
2. The polishing and in-situ inspection apparatus of claim 1, wherein,
At least the portion of the polishing head body is configured as a stepped cylindrical structure including a first cylinder, a second cylinder, and a third cylinder connected in sequence, and the outer diameters of the first cylinder, the second cylinder, and the third cylinder are reduced in sequence, wherein:
the clamping device is internally provided with an elastic installation space, the bottom of the clamping device is configured to be capable of penetrating through the third cylinder and being abutted to the second cylinder, the clamping shell is configured to be capable of penetrating through the clamping device and the polishing grinding head main body, and the inner cavity of the clamping shell is clamped with the outer wall of the clamping device and the outer wall of the polishing grinding head main body.
3. The polishing and in-situ detection device according to claim 2, further comprising a connecting rod connected to the detection bracket, wherein a positioning piece for being matched with the in-situ detection device to turn over is further arranged on the workbench, and the connecting rod and the positioning piece can be turned over;
The polishing and in-situ detection device further comprises a hinge mechanism, and the connecting rod and the positioning piece can be overturned through the hinge mechanism.
4. A polishing and in-situ inspection apparatus as claimed in any one of claims 1-3, further comprising a multi-axis motion mechanism comprising a robot having six degrees of freedom for driving the polishing spindle on the attachment means for multi-axis motion.
5. A polishing method, wherein the polishing method is applied to the polishing and in-situ detecting apparatus according to any one of claims 1 to 4, the method comprising:
controlling the polishing mechanism to polish the optical element based on the optical element placed on the workbench;
When the polished optical element is required to be detected, the optical element is positioned on a processing position, the in-situ detection device is positioned on the detection positioning device, the stripe display device reflects the displayed stripe to the optical element, and the image pickup device picks up the optical element reflected with the stripe so as to perform in-situ detection;
And determining whether the optical element meets preset parameters, and continuing polishing the optical element until the optical element meets the preset parameter requirements when the optical element does not meet the preset parameter requirements.
6. The polishing method according to claim 5, wherein controlling the polishing mechanism to polish the optical element comprises:
and controlling the polishing grinding head to conduct autorotation polishing at a rotating speed of 800RPM-1200 RPM.
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