CN216064559U

CN216064559U - Silicon wafer cleaning frame

Info

Publication number: CN216064559U
Application number: CN202122723772.6U
Authority: CN
Inventors: 卢娇
Original assignee: Wuxi Saisiyi Technology Co ltd
Current assignee: Wuxi Saisiyi Technology Co ltd
Priority date: 2021-11-08
Filing date: 2021-11-08
Publication date: 2022-03-18
Anticipated expiration: 2031-11-08

Abstract

The utility model relates to the technical field of cleaning equipment, and provides a silicon wafer cleaning frame which comprises a frame body, wherein a plurality of limiting plates which are uniformly and equidistantly arranged are arranged on the inner walls of two sides of the frame body, a plurality of third holes are formed in a gap between the limiting plates, two bases are arranged at a corner of the bottom of the frame body, two ends of each base are connected to two side walls of the frame body, a limiting block which can be connected with the side walls of the frame body is connected onto each base, a plurality of baffles which are connected to the bottom wall of the frame body are arranged between the two bases, a plurality of first holes are formed in the gap between each base and each baffle, and a plurality of second holes are formed in the gap between the baffles. The silicon wafer clamping device overcomes the defects of the prior art, is reasonable in design and compact in structure, and can enable the limiting block to be attached to the silicon wafer more tightly by arranging the triangular limiting block and enabling the limiting block to correspond to the inclination angle of the silicon wafer, so that the silicon wafer is replaced into a butting mode in a clamping mode, and the probability of damage to the silicon wafer is reduced.

Description

Silicon wafer cleaning frame

Technical Field

The utility model relates to the technical field of cleaning equipment, in particular to a silicon wafer cleaning frame.

Background

The silicon wafer is a milestone of scientific and technical progress, the silicon wafer plays an indispensable function role in a plurality of fields in life when being applied, the silicon wafer must be strictly cleaned in the production of semiconductor devices, the pollutant on the surface of the silicon wafer is cleaned, the use failure of the devices caused by trace pollution is avoided, and the silicon wafer cleaning frame is mostly adopted for cleaning in physics;

when an existing silicon wafer cleaning frame is used for cleaning, the impact force on a silicon wafer is increased, the silicon wafer is prone to damage, and the clamping position of the silicon wafer is prone to damage in a clamping mode.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Aiming at the defects of the prior art, the silicon wafer cleaning frame provided by the utility model overcomes the defects of the prior art, is reasonable in design and compact in structure, the limit block corresponds to the inclination angle of a silicon wafer through the triangular limit block, the limit block can be attached to the silicon wafer more tightly, the limit block is replaced into a collision mode in a clamping mode, the probability of damage to the silicon wafer is reduced, the baffle plate can block the impact force of a part of solution through the baffle plate, the silicon wafer is prevented from being impacted and broken by the solution, the integrity of the silicon wafer is ensured, the holes are formed in the periphery of the silicon wafer through the holes, so that bubbles which tumble after entering the solution directly reach the surface of the silicon wafer, the contact surface area between the solution and the silicon wafer is increased, the impact force on the silicon wafer is reduced, and the silicon wafer is cleaned more fully.

(II) technical scheme

In order to achieve the purpose, the utility model is realized by the following technical scheme:

the utility model provides a silicon chip washs frame, the fruit pick-up device comprises a frame body, be provided with the limiting plate that a plurality of even equidistance were arranged on the inner wall of framework both sides, a plurality of third holes have been seted up in the space between the limiting plate, the bottom contained angle department of framework is provided with two bases, the both ends of base are connected on the both sides wall of framework, be connected with the stopper that can be connected with the lateral wall of framework on the base, be provided with a plurality of baffles of connection at the framework diapire between two bases, the first hole of a plurality of has been seted up in the space between base and the baffle, a plurality of second hole has been seted up in the space between a plurality of baffles.

Preferably, the limiting block is triangular, and the inclination angle of the base is the same as the tangent plane angle of the silicon wafer.

Preferably, the baffle is the rectangle, and the baffle is the same with the quantity of limiting plate, the high adaptation of the height of baffle and limiting plate, and with have certain space between two bases.

Preferably, the base is rectangular.

Preferably, the gaps between the plurality of limiting plates are the same as the gaps between the plurality of baffles.

Preferably, clamping blocks are mounted on two sides of the frame body.

(III) advantageous effects

The embodiment of the utility model provides a silicon wafer cleaning frame. The method has the following beneficial effects:

1. through the triangular limiting block, the limiting block corresponds to the inclination angle of the silicon wafer, so that the limiting block is attached to the silicon wafer more tightly, the mode of clamping is replaced by a conflicting mode, and the probability of damage to the silicon wafer is reduced.

2. Through the baffle that sets up, the impact force of some solution can be blockked to the baffle, prevents that solution from striking the fracture with the silicon chip, guarantees the complete degree of silicon chip.

3. Through the holes, the holes are formed around the silicon wafer, so that bubbles which tumble after entering the solution directly reach the surface of the silicon wafer, the contact surface area of the solution and the silicon wafer is increased, the impact force on the silicon wafer is reduced, and the silicon wafer is more fully cleaned.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic side cross-sectional view of the present invention;

FIG. 3 is another side view of the present invention.

In the figure: 1. a frame body; 11. a clamping block; 2. a limiting plate; 3. a base; 31. a limiting block; 4. a baffle plate; 5. a first hole; 6. a second hole; 7. and a third aperture.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to the attached drawings 1-3, a silicon wafer cleaning frame comprises a frame body 1, wherein a plurality of limiting plates 2 which are uniformly and equidistantly arranged are arranged on the inner walls of two sides of the frame body 1, a silicon wafer can be inserted between the limiting plates 2, the distance between the limiting plates 2 is matched with the thickness of the silicon wafer, the silicon wafer can be prevented from falling off from the limiting plates 2, a plurality of third holes 7 are arranged in gaps between the limiting plates 2, a solution on the side edge of the frame body 1 can be guided to the space between the limiting plates 2 through the third holes 7, the water flow direction of the side edge of the silicon wafer is ensured, two bases 3 are arranged at a included angle at the bottom of the frame body 1, two ends of each base 3 are connected to two side walls of the frame body 1, each base 3 supports the bottom of the silicon wafer, a limiting block 31 which can be connected with the side wall of the frame body 1 is connected to enable the limiting block 31 to be tightly attached to the silicon wafer, and the silicon wafer is replaced into a butting mode in a clamping mode, reduce the probability that the silicon chip damaged, be provided with a plurality of baffles 4 of connection at 1 diapire of framework between two bases 3, baffle 4 can block the impact force of some solution, prevent that solution from striking the silicon chip and splitting, guarantee the complete degree of silicon chip, a plurality of first hole 5 has been seted up on the space between base 3 and the baffle 4, a plurality of second hole 6 has been seted up in the space between a plurality of baffles 4, and the solution that first hole 5 and second hole 6 can guide 1 bottoms of framework enters into in the framework 1, first hole 5 can guide the solution to erode from the both sides of the bottom of silicon chip, and second hole 6 can guide the solution to erode from the silicon chip bottom, make the silicon chip erode cleaner.

In this embodiment, the stopper 31 is triangular, the inclination angle of the base 3 is the same as the tangent plane angle of the silicon wafer, and the tangent angle of the silicon wafer can tightly abut against the stopper 31 to prevent the silicon wafer from falling off.

In this embodiment, baffle 4 is the rectangle, and rectangle baffle 4 can protect silicon chip center department not to receive too big pressure, protects the silicon chip, and baffle 4 is the same with limiting plate 2's quantity, the height of baffle 4 and limiting plate 2's high adaptation, and the silicon chip can be inserted and establish in a plurality of baffles 4, and with two bases 3 between have certain space, the space of existence can increase the area of contact of silicon chip and solution for abluent more thoroughly.

In this embodiment, the base 3 is rectangular, and can be used for conveniently placing a plurality of silicon wafers.

In this embodiment, the size of the gap between the plurality of limiting plates 2 is the same as the size of the gap between the plurality of baffles 4, so that the solution entering the frame body 1 flows uniformly.

In this embodiment, the clamping blocks 11 are installed on two sides of the frame body 1, and the clamping blocks 11 can be placed in the cleaning machine in cooperation with the clamp.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A silicon wafer cleaning frame comprises a frame body (1), wherein a plurality of limiting plates (2) which are uniformly and equidistantly arranged are arranged on the inner walls of two sides of the frame body (1);

the method is characterized in that: a plurality of third holes (7) are formed in a gap between the limiting plates (2), two bases (3) are arranged at the included angle at the bottom of the frame body (1), two ends of each base (3) are connected to two side walls of the frame body (1), and the bases (3) are connected with limiting blocks (31) which can be connected with the side walls of the frame body (1);

be provided with a plurality of baffle (4) of connection in framework (1) diapire between two base (3), seted up on the space between base (3) and baffle (4) a plurality of first hole (5), seted up a plurality of second hole (6) in the space between a plurality of baffle (4).

2. The silicon wafer cleaning frame as claimed in claim 1, wherein: the limiting block (31) is triangular, and the inclination angle of the base (3) is the same as the tangent plane angle of the silicon wafer.

3. The silicon wafer cleaning frame as claimed in claim 1, wherein: the baffle (4) is rectangular, the number of the baffle (4) is the same as that of the limiting plates (2), the height of the baffle (4) is matched with that of the limiting plates (2), and a certain gap is reserved between the baffle and the two bases (3).

4. The silicon wafer cleaning frame as claimed in claim 1, wherein: the base (3) is rectangular.

5. The silicon wafer cleaning frame as claimed in claim 1, wherein: the size of the gaps among the plurality of limiting plates (2) is the same as that of the gaps among the plurality of baffles (4).

6. The silicon wafer cleaning frame as claimed in claim 1, wherein: clamping blocks (11) are arranged on two sides of the frame body (1).