CN213424941U

CN213424941U - Semiconductor cleaning device

Info

Publication number: CN213424941U
Application number: CN202022808494.XU
Authority: CN
Inventors: 徐皓; 许亮
Original assignee: Chongqing Vocational Institute of Engineering
Current assignee: Chongqing Vocational Institute of Engineering
Priority date: 2020-11-27
Filing date: 2020-11-27
Publication date: 2021-06-11
Anticipated expiration: 2030-11-27

Abstract

The utility model discloses a semiconductor cleaning device, which comprises a shell, wherein a filter tank is formed on the upper end surface of the shell; the supporting rods are vertically arranged on two sides of the shell; the cleaning assembly comprises a spraying head and water spraying pipes, the bottom of the spraying head is arranged on the shell, the spraying end of the spraying head is positioned right above the accommodating piece, the spraying range of the spraying head covers the accommodating piece, the water spraying pipes are arranged at four corners of the end surface of the shell, the spraying ends of the water spraying pipes point to the bottom of the accommodating piece, and the spraying ranges of the four water spraying pipes cover the bottom of the accommodating piece; the accommodating piece is divided into a plurality of independent accommodating grooves by the baffle plate. The utility model discloses a set up the holding piece and realize treating the regional clearance of the branch that washs the article, the storage tank of holding piece passes through the mutual intercommunication in through-hole realization space simultaneously, has increased rivers washing capacity in implementing the cleaning process, further promotion washing effect.

Description

Semiconductor cleaning device

Technical Field

The utility model relates to a drip washing technical field specifically is a semiconductor cleaning device.

Background

At present, the semiconductor is generally cleaned in a mode of adding a cleaning agent by ultrasonic waves, a cleaned product needs to be loaded by a carrier and then put into a cleaning tank, the carrier which is commonly used at present is a material box or a material frame, and due to the structure of the material frame or the material box, the semiconductor element cannot be fully contacted with the cleaning agent, so that the semiconductor element is not cleaned completely, and the subsequent processing quality of the semiconductor element is influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor cleaning device to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

a semiconductor cleaning device comprises a shell, wherein a filter tank is formed on the upper end surface of the shell; the supporting rods are vertically arranged on two sides of the shell, the accommodating piece is arranged between the two supporting rods, and the accommodating piece has a preset height from the filter tank; the cleaning assembly comprises a spraying head and water spraying pipes, the bottom of the spraying head is arranged on the shell, the spraying end of the spraying head is positioned right above the accommodating piece, the spraying range of the spraying head covers the accommodating piece, the water spraying pipes are arranged at four corners of the end surface of the shell, the spraying ends of the water spraying pipes point to the bottom of the accommodating piece, and the spraying ranges of the four water spraying pipes cover the bottom of the accommodating piece; the accommodating piece is divided into a plurality of independent accommodating grooves by a baffle plate, the openings of the accommodating grooves face upwards, and a plurality of through holes are formed in the baffle plate to communicate with the adjacent accommodating grooves.

The bottom of the containing groove is provided with a drain hole.

The accommodating piece is arranged in a strip shape, and the accommodating grooves are arranged side by side along the length direction of the accommodating piece.

Every all install two rubber clamping pieces that set up relatively in the storage tank, two form the grip region who is used for the centre gripping article between the rubber clamping piece.

Two the rubber clamping piece is vertical and relative parallel arrangement.

And a groove is vertically formed in the front end face of the rubber clamping piece.

The filter is installed to the bottom dismantlement formula of filter tank, and has seted up the filtration pore on this filter.

The shell is also internally provided with a water tank which is communicated with the filter tank through the filter holes.

According to the technical scheme, the utility model realizes the regional cleaning of the object to be cleaned by arranging the accommodating part, and the accommodating groove of the accommodating part realizes the mutual communication of the spaces through the through hole, thereby increasing the water flow flushing amount in the cleaning process and further improving the flushing effect; meanwhile, the adopted cleaning component can spray the objects in all directions respectively in the upper direction and the lower direction, so that the cleaning agent can be fully contacted with the objects, and the cleaning effect is improved.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a side sectional view of the present invention;

fig. 3 is an enlarged view of a partial structure of the present invention.

In the figure: 1 shell, 2 support rods, 3 spray pipes, 4 filter tanks, 5 filter plates, 51 filter holes, 6 holding pieces, 61 holding tanks, 611 drain holes, 62 baffles, 621 through holes, 63 rubber clips, 631 grooves, 632 connecting parts, 7 spray heads, 8 water tanks and 9 connecting shafts.

Detailed Description

The present invention will be further explained with reference to the accompanying drawings:

referring to fig. 1-3, a semiconductor cleaning apparatus is provided in the present application, which clamps and places semiconductor articles in different regions through each receiving groove 61 of a receiving member 6, and can effectively clean the semiconductor articles by combining the arrangement of a cleaning assembly, specifically:

this semiconductor cleaning device is including casing 1, holding piece 6 and washing subassembly, wherein, the up end of casing 1 is formed with filter cell 4, and this filter cell 4 is square groove structure, arranges under holding piece 6, washs the spray in-process to the article in the implementation, and filter cell 4 can effectual collection spray the back cleaner and flush fluid. It should be pointed out that, in order to effectively play the separation to the part tiny impurity after washing, still install detachable filter 5 in the bottom that lies in filter tank 4, filter 5 on be provided with filtration pore 51, simultaneously, still be formed with basin 8 in casing 1's inside, this basin 8 lies in filter tank 4 under, and pass through filter pore 51 with filter tank 4 intercommunication, after carrying out spray cleaning, cleaner and liquid all can fall to filter tank 4 in, the part that contains impurity then can't pass through filtration pore 51 and be detained on filter 5, cleaner and liquid flow to in the basin 8, in this embodiment, filter 5 connect in filter tank 4 in the dismantlement formula, can conveniently take out filter 5 after the washing and clear up impurity.

The support rods 2 are vertically arranged on two sides of the shell 1, the accommodating piece 6 is arranged between the two support rods 2, and the distance between the accommodating piece 6 and the filter tank 4 is preset. Here, as will be understood by those skilled in the art, the support rod 2 is used for installing and connecting the accommodating member 6 and has the effect of horizontal and stable placement, and in practice, the support rod 2 is fixedly connected at two ends of the accommodating member 6 at the inner side thereof through the connecting shaft 9.

A cleaning component which comprises a spray head 7 and a spray pipe 3, wherein the bottom of the spray head 7 is arranged on the shell 1, the spraying end is positioned right above the containing piece 6, the spraying range of the spraying head 7 covers the containing piece 6, the water spraying pipes 3 are arranged at four corners of the end surface of the shell 1, the spraying end of the water spray pipe is directed to the bottom of the containing piece 6, the spraying range of the four water spray pipes 3 covers the bottom of the containing piece, it should be pointed out here that, when the spray range of the sprinkler pipe 3 covers the bottom of said housing 6, the spraying of multiple angles can be realized by matching with the spraying head 7, the spraying and cleaning effect is effectively improved, and because the water column in the spraying process is in a diffusion type, namely, the spray pipe 3 can cover the sprayed water column above the accommodating part 6 in the spraying process, thereby further cooperating with the spray head 7 to realize spraying. The position layout of the water spray pipes 3 can effectively improve the coverage range in the spraying process, and the spraying water column sputtering range is arranged on the inner side of the filter tank 4.

It should be noted that the accommodating member 6 is divided by a baffle 62 into a plurality of independent accommodating grooves 61, the accommodating grooves 61 are opened upward, and the baffle 62 is provided with a plurality of through holes 621 for communicating with the adjacent accommodating grooves 61. Independent storage tank 61 can provide good spraying and wash the space, and is further, still be provided with rubber clamping piece 63, specific do, every locating in storage tank 61 all install the rubber clamping piece 63 of two relative settings in the storage tank 61, two form the clamping area who is used for the centre gripping article between the rubber clamping piece 63, what need understand here is, and the effect that adopts rubber clamping piece 63 has two, and is first, adopts the rubber material can prevent the damage to the article in the centre gripping process, and the second, the stable effect of article after the centre gripping can effectually be guaranteed to the centre gripping of rubber clamping piece 63 through relative setting up, avoids the article that leads to in the cleaning process to rock adverse factor such as in storage tank 61.

Further, in the vertical recess 631 of having seted up of preceding terminal surface of rubber clamping piece 63, here, need explain that the setting of recess 631 is used for realizing the further centre gripping stable effect to the article, owing to the adoption be the rubber material, when the article centre gripping back in recess 631, realizes the centre gripping to the article through the deformation of this rubber clamping piece 63 to promote its firm effect, the setting of recess 631 can be further the restriction article relative the clamping effect of its clamping face, promote the firm degree of centre gripping.

The above-mentioned embodiments are only for describing the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and improvements made by those skilled in the art without departing from the design spirit of the present invention should fall into the protection scope defined by the claims of the present invention.

Claims

1. A semiconductor cleaning apparatus, comprising:

the filter comprises a shell, wherein a filter tank is formed on the upper end surface of the shell;

the supporting rods are vertically arranged on two sides of the shell, the accommodating piece is arranged between the two supporting rods, and the accommodating piece has a preset height from the filter tank;

the cleaning assembly comprises a spraying head and water spraying pipes, the bottom of the spraying head is arranged on the shell, the spraying end of the spraying head is positioned right above the accommodating piece, the spraying range of the spraying head covers the accommodating piece, the water spraying pipes are arranged at four corners of the end surface of the shell, the spraying ends of the water spraying pipes point to the bottom of the accommodating piece, and the spraying ranges of the four water spraying pipes cover the bottom of the accommodating piece;

the accommodating piece is divided into a plurality of independent accommodating grooves by a baffle plate, the openings of the accommodating grooves face upwards, and a plurality of through holes are formed in the baffle plate to communicate with the adjacent accommodating grooves.

2. A semiconductor cleaning apparatus according to claim 1, wherein: the bottom of the containing groove is provided with a drain hole.

3. A semiconductor cleaning apparatus according to claim 1, wherein: the accommodating piece is arranged in a strip shape, and the accommodating grooves are arranged side by side along the length direction of the accommodating piece.

4. A semiconductor cleaning apparatus according to claim 1, wherein: every all install two rubber clamping pieces that set up relatively in the storage tank, two form the grip region who is used for the centre gripping article between the rubber clamping piece.

5. The semiconductor cleaning apparatus according to claim 4, wherein: two the rubber clamping piece is vertical and relative parallel arrangement.

6. The semiconductor cleaning apparatus according to claim 4, wherein: and a groove is vertically formed in the front end face of the rubber clamping piece.

7. A semiconductor cleaning apparatus according to claim 1, wherein: the filter is installed to the bottom dismantlement formula of filter tank, and has seted up the filtration pore on this filter.

8. The semiconductor cleaning apparatus according to claim 7, wherein: the shell is also internally provided with a water tank which is communicated with the filter tank through the filter holes.