CN216928522U

CN216928522U - Wafer box

Info

Publication number: CN216928522U
Application number: CN202220708129.8U
Authority: CN
Inventors: 钟伟; 刘颖; 段良飞; 朱帅; 董国庆; 文国昇
Original assignee: Jiangxi Zhao Chi Semiconductor Co Ltd
Current assignee: Jiangxi Zhao Chi Semiconductor Co Ltd
Priority date: 2022-03-29
Filing date: 2022-03-29
Publication date: 2022-07-08
Anticipated expiration: 2032-03-29

Abstract

The utility model provides a wafer box, which relates to the technical field of semiconductor processing equipment, and comprises: the base and locate the first draw-in groove board and the second draw-in groove board of base both sides respectively, all be equipped with a plurality of draw-in grooves on first draw-in groove board and the second draw-in groove board, draw-in groove on the draw-in groove board and the draw-in groove one-to-one on the second draw-in groove board are in order to place the wafer, and the base is used for bearing the wafer piece after the breakage, is equipped with the remaining liquid medicine of a plurality of meshes that run through on order to permeate the base on the base. When the wafer is broken, the base bears the broken wafer fragments of the wafer, the broken wafer fragments cannot sink into the liquid medicine tank, and after the semiconductor cleaning and etching process is completed, the fragments are taken out of the liquid medicine tank by the wafer box, so that the problem that the fragments pollute the liquid medicine is solved, the stability of the process is maintained, and the yield of products is improved.

Description

Wafer box

Technical Field

The utility model relates to the technical field of semiconductor processing equipment, in particular to a wafer box.

Background

With the development of the semiconductor industry, people have higher and higher requirements on the semiconductor wafer process, the semiconductor wafer processing process comprises the processes of cleaning, etching and the like, and in the cleaning and etching processes, the semiconductor wafer needs to be soaked in a liquid medicine humid environment, so that a wafer box for bearing the wafer needs to be placed in the liquid medicine humid environment to complete the cleaning and etching processes.

At present, a wafer box which is arranged in a relatively common liquid medicine placing box is provided with clamping grooves which correspond to each other one by one and are arranged in a hollowed-out mode at the bottom, liquid medicine can flow out of the lower portion of the wafer box conveniently, residual liquid medicine remained in the wafer box is removed, however, in the cleaning and etching processes, the thickness of a wafer is thin, the wafer is prone to breaking when being contacted with the liquid medicine for cleaning or etching, after the wafer breaks, the wafer can directly sink into a liquid medicine groove due to the hollowed-out arrangement at the bottom, the problem of liquid medicine pollution in the liquid medicine groove is caused, the service life of the liquid medicine is influenced, the stability of the wafer in the cleaning and etching processes is influenced, and therefore the yield of products is unstable.

Therefore, the existing wafer box generally has the technical problems that wafers are broken and sink into a liquid medicine tank, liquid medicine pollution is caused, and the yield of products is unstable.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model aims to provide a wafer box, aiming at solving the technical problems that in the prior art, wafers are broken and sink into a liquid medicine groove to cause liquid medicine pollution and cause unstable product yield.

The present invention provides a wafer cassette, comprising:

the base and locate respectively the first draw-in groove board and the second draw-in groove board of base both sides, first draw-in groove board with all be equipped with a plurality of draw-in grooves on the second draw-in groove board, draw-in groove on the first draw-in groove board with draw-in groove one-to-one on the second draw-in groove board is in order to place the wafer, the base is used for bearing the wafer piece after the breakage, be equipped with a plurality of meshes that run through on the base in order to permeate residual liquid medicine on the base.

Compared with the prior art, the utility model has the beneficial effects that: through the wafer box provided by the utility model, the base is arranged for bearing broken wafers, so that the problem of liquid medicine pollution caused by the fact that the broken wafers sink into the liquid medicine tank is avoided, and particularly, in the semiconductor cleaning and etching process, the wafer box with the wafers is placed in the liquid medicine tank for cleaning and etching, when the wafers are broken, the base bears the broken wafer fragments and cannot sink into the liquid medicine tank, meanwhile, the base is provided with a plurality of through meshes for permeating residual liquid medicine on the base, after the semiconductor cleaning and etching process is finished, the wafer fragments are taken out of the liquid medicine tank by the wafer box, so that the problem that the fragments pollute the liquid medicine is improved, the stability of the process is maintained, the yield of products is improved, the yield of the process is effectively improved, the wafer fragments are prevented from sinking into the liquid medicine tank, the liquid medicine tank needs to be cleaned and replaced manually, and the fragments are difficult to clean, time is consumed, and cost is increased, so that the technical problems that in the prior art, the wafer is broken and sinks into the liquid medicine groove, liquid medicine pollution is caused, and the product yield is unstable are solved.

Furthermore, the meshes are uniformly arranged at intervals, and the diameter of each mesh is 5-7 mm.

Further, the both sides of base are equipped with the first joint piece and the second joint piece of the even interval of a plurality of respectively, first joint piece include first joint portion and with the first joint round pin that first joint portion is connected, first joint round pin joint in on the first draw-in groove board, the second joint caking include second joint portion and with the second joint round pin that second joint portion is connected, second joint round pin joint in on the second draw-in groove board.

Further, first draw-in groove board is close to base one side is equipped with the first joint hole that a plurality of even intervals set up, second draw-in groove board is close to base one side is equipped with the second joint hole that a plurality of even intervals set up, first joint round pin passes first joint hole is in order to realize the base with the joint cooperation of first draw-in groove board, second joint round pin passes second joint hole is in order to realize the base with the joint cooperation of second draw-in groove board.

Further, first joint round pin with the joint in first joint hole is joined in marriage for swing joint, second joint round pin with the joint in second joint hole is joined in marriage for swing joint to in loading and unloading maintenance.

Furthermore, one side of the second clamping groove plate, which is far away from the base, is provided with a plurality of alignment pins for connecting other structural members.

Furthermore, one side of the first clamping groove plate, which is far away from the base, is provided with a plurality of alignment holes for connecting other structural members.

Furthermore, first draw-in groove board and second draw-in groove board are in being close to one side of base is equipped with a plurality of stoppers respectively, the stopper joint is fixed in the liquid medicine groove.

Furthermore, two sides of the first slot plate are respectively connected with the second slot plate through fixing plates, so that a cavity formed by the first slot plate and the second slot plate conforms to the size of the wafer.

Furthermore, the base is made of PP materials.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic diagram of a wafer pod from a first perspective in accordance with an embodiment of the present invention;

FIG. 2 is a schematic diagram of a second view of a wafer pod according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a base in an embodiment of the utility model;

the figure elements are illustrated in symbols:

the wafer box comprises a wafer box 10, a base 11, a first clamping groove plate 12, a second clamping groove plate 13, clamping grooves 14, limiting blocks 15, a fixing plate 16, meshes 110, a first clamping block 111, a first clamping portion 112, a first clamping pin 113, a second clamping block 114, a second clamping portion 115, a second clamping pin 116, alignment holes 120, a first clamping hole 121, an alignment pin 130 and a second clamping hole 131.

Detailed Description

To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Several embodiments of the utility model are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 3, a wafer cassette 10 according to an embodiment of the present invention is shown, the wafer cassette including a base 11, and a first slot board 12 and a second slot board 13 respectively disposed on two sides of the base 11; wherein, this base 11 is used for bearing broken wafer, and the shape of base 11 is the rectangle, and the colour is milk white, and the material of base 11 is the PP material, and the PP material is polypropylene, and polypropylene is nontoxic, odorless, tasteless milk white high crystalline polymer, and PP all has good resistant chemical corrosion nature in various acid and alkali, therefore base 11 is difficult to be corroded by the liquid medicine in the liquid medicine groove, and stability is better. Meanwhile, the PP has good impact strength, the wafer fragments fall onto the base 11 without damaging the base 11, and the service life of the base 11 is long.

When the wafer box 10 bears the wafer and is placed in the liquid medicine tank for cleaning and etching processes, the thickness of the wafer is thin, the wafer is easy to break when cleaning or etching is carried out by liquid medicine, after the wafer is broken, the wafer fragments fall onto the base 11, after the cleaning and etching processes are finished, the wafer fragments are taken out of the liquid medicine tank by the base 11, therefore, the liquid medicine in the liquid medicine tank is not easy to be polluted, the stability of the cleaning and etching processes is maintained, the yield of products is improved, the fragments are prevented from sinking into the liquid medicine tank to cause liquid medicine pollution, the stability of the processes is influenced, the yield of the products is unstable, the stop of the equipment caused by repeatedly cleaning the liquid medicine tank by manpower is reduced, the time is saved, the productivity of the processes is improved, in addition, the utilization rate of manpower is improved, the time consumed by cleaning the fragments of the liquid medicine tank when the equipment is maintained is reduced, the maintenance time of the equipment is shortened.

Wherein, run through on the base 11 and be equipped with a plurality of meshes 110 that run through, this mesh 110 is used for permeating base 11 and remains the liquid medicine, the shape of mesh 110 is circular, even interval sets up on base 11, the diameter of mesh 110 is 5-7mm to flow out the liquid medicine that remains on the base 11 to the liquid medicine groove in fast high efficiency, it needs to explain, when the diameter of mesh 110 exceeded 7mm, the wafer piece easily passes from mesh 110 and sinks in the liquid medicine groove, cause liquid medicine pollution in the liquid medicine groove, influence the stability of technology, thereby influence the yield of product. When the diameter of the mesh 110 is less than 5mm, the outflow speed of the residual liquid medicine on the base 11 is too slow, the time required for penetrating the residual liquid medicine on the base 11 is increased, the productivity of the process is reduced, and the process cost is increased.

In addition, the both sides of base 11 are equipped with 3 evenly spaced first joint piece 111 and second joint piece 114 respectively for connect first draw-in groove board 12 and second draw-in groove board 13, with fixed spacing base 11, this first joint piece 111 includes first joint portion 112 and the first joint round pin 113 of being connected with first joint portion 112, wherein, first joint portion 112's shape is the rectangle, base 11 extends 3 first joint portion 112 in the one side that is close to first draw-in groove board 12, first joint portion 112 extends first joint round pin 113 in the one side that is close to first draw-in groove board 12, first joint round pin 113 is the cylinder, first joint round pin 113 passes first joint hole 121 of first draw-in groove board 12, in order to realize base 11 and the joint cooperation of first draw-in groove board 12, thereby realize spacing to base 11.

Similarly, second joint piece 114 includes second joint portion 115 and the second joint round pin 116 of being connected with second joint portion 115, wherein, the shape of second joint portion 115 is the rectangle, and base 11 extends 3 second joint portions 115 in the one side that is close to second draw-in groove board 13, and second joint portion 115 extends second joint round pin 116 in the one side that is close to second draw-in groove board 13, and second joint round pin 116 is the cylinder, and second joint round pin 116 passes second joint hole 131 of second draw-in groove board 13 to further carry on spacingly to base 11. The first clamping pin 113 is movably connected with the first clamping hole 121 in a clamping matching mode, and the second clamping pin 116 is movably connected with the second clamping hole 131 in a clamping matching mode, so that the integrated design is convenient to assemble, disassemble and maintain, the cost is saved, the integrated design is prevented from being damaged, the integrated design needs to be replaced integrally, and the cost is increased.

First draw-in groove board 12 and second draw-in groove board 13 are connected respectively to 11 both sides of base, wherein, all be equipped with a plurality of draw-in grooves 14 on first draw-in groove board 12 and the second draw-in groove board 13, draw-in groove 14 one-to-one on first draw-in groove board 12 and the second draw-in groove board 13, be used for placing the wafer with forming a plurality of cavity, draw-in groove 14 sets up and is used for keeping apart the wafer, prevent wafer contact collision, cause the wafer damaged, in addition, damaged wafer can be kept apart in the setting of draw-in groove 14, prevent the adjacent complete wafer of wafer fragment fish tail. Wherein, one side that base 11 was kept away from to first draw-in groove board 12 is equipped with 2 counterpoint holes 120, the tip of first draw-in groove board 12 is located to this counterpoint hole 120 for be used for connecting other wafer box 10, first draw-in groove board 12 is equipped with 3 first joint holes 121 of even interval in the one side that is close to base 11, the position of first joint hole 121 corresponds with the first joint round pin 113 positions of base 11, pass first joint hole 121 through first joint round pin 113, realize base 11 and the being connected of first draw-in groove board 12. One side that first draw-in groove board 12 is close to base 11 is equipped with 2 stoppers 15, and stopper 15 is located the both ends of first draw-in groove board 12, and stopper 15 joint is in the liquid medicine groove to be fixed in the liquid medicine groove with wafer box 10, prevent that the removal of wafer box 10 from causing the wafer collision breakage in the liquid medicine groove, influence the production of product.

Wherein, one side of the second slot plate 13 far away from the base 11 is provided with 2 alignment pins 130, the alignment pin 130 is a cylinder, the alignment pin 130 is arranged at the end of the first slot plate 12 for connecting other wafer cassettes 10, specifically, the alignment pins 130 of other wafer cassettes 10 are clamped in the alignment holes 120 of the first slot plate 12, the alignment pins 130 of the second slot plate 13 are clamped in the alignment holes 120 of other wafer cassettes 10, and the wafer is vertically poured into other wafer cassettes 10, so that the wafer cassettes 10 can be replaced, the wafer cassette 10 can be prevented from being used for too long time, impurities can be stored, and the risk of wafer pollution can be caused. One side that second draw-in groove board 13 is close to base 11 is equipped with 2 stopper 15, and stopper 15 is located the both ends of second draw-in groove board 13, and stopper 15 joint is fixed in the liquid medicine groove to prevent that the removal of wafer box 10 in the liquid medicine groove from causing the wafer collision breakage, influence the production of product.

In addition, the two sides of the first card slot plate 12 are respectively connected with the second card slot plate 13 through the fixing plate 16, the first card slot plate 12 and the second card slot plate 13 are integrally formed to fix the first card slot plate 12 and the second card slot plate 13, the first card slot plate 12 and the second card slot plate 13 are limited, meanwhile, a cavity is formed between the first card slot plate 12 and the second card slot plate 13 through the fixing plate 16, the cavity is used for adapting to different sizes of wafers, the sizes of the common wafers are 2 inches, 4 inches, 6 inches, 8 inches and 12 inches, and the positions and the sizes of the first card slot plate 12, the second card slot plate 13 and the fixing plate 16 can be designed according to requirements so as to adapt to different product sizes.

In addition, the first slot plate 12 and the second slot plate 13 are made of PFA, the PFA is a copolymer of perfluoropropyl perfluorovinyl ether and polytetrafluoroethylene, and has chemical resistance, corrosion resistance to all chemicals, resistance to corrosion of the liquid medicine in the liquid medicine tank, no reaction with the liquid medicine, and will maintain the stability of the liquid medicine in the liquid medicine tank, and the PFA has good friction coefficient, is not easy to wear, can be recycled, and reduces the cost of the wafer cassette 10.

Compare in prior art, the wafer box that this embodiment provided, beneficial effect lies in: through the wafer box provided by the utility model, the base is arranged for bearing broken wafers, so that the problem of liquid medicine pollution caused by the fact that the broken wafers sink into the liquid medicine tank is avoided, and particularly, in the semiconductor cleaning and etching process, the wafer box with the wafers is placed in the liquid medicine tank for cleaning and etching treatment, when the wafers are broken, the base bears fragments and does not sink into the liquid medicine tank, meanwhile, a plurality of meshes which are arranged at intervals are arranged on the base in a penetrating manner to permeate residual liquid medicine on the base, after the semiconductor cleaning and etching process is finished, the fragments are taken out of the liquid medicine tank by the wafer box, so that the problem of liquid medicine pollution caused by the fragments is solved, the stability of the process is maintained, the yield of products is improved, the yield of the process is effectively improved, the problem that the manual wafers sink into the liquid medicine tank is avoided, the liquid medicine tank needs to be cleaned and replaced manually, the fragments are not easy to clean and consume time is solved, the cost is increased, and the technical problem that the yield of the product is unstable due to liquid medicine pollution caused by the fact that the wafer is broken and sinks into the liquid medicine groove in the prior art is solved.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A wafer cassette, comprising:

2. The wafer cassette according to claim 1, wherein the meshes are uniformly spaced, and the diameter of the meshes is 5-7 mm.

3. The wafer cassette of claim 1, wherein a plurality of first clamping blocks and second clamping blocks are respectively arranged on two sides of the base and are evenly spaced, each first clamping block comprises a first clamping portion and a first clamping pin connected with the first clamping portion, the first clamping pin is clamped on the first clamping groove plate, each second clamping block comprises a second clamping portion and a second clamping pin connected with the second clamping portion, and the second clamping pin is clamped on the second clamping groove plate.

4. The wafer cassette according to claim 3, wherein the first clamping groove plate is provided with a plurality of first clamping holes at uniform intervals on one side of the base, the second clamping groove plate is provided with a plurality of second clamping holes at uniform intervals on one side of the base, the first clamping pin penetrates through the first clamping holes to realize the clamping matching of the base and the first clamping groove plate, and the second clamping pin penetrates through the second clamping holes to realize the clamping matching of the base and the second clamping groove plate.

5. The wafer cassette of claim 4, wherein the first clamping pin is movably connected with the first clamping hole in a clamping manner, and the second clamping pin is movably connected with the second clamping hole in a clamping manner, so that the wafer cassette can be assembled and disassembled for maintenance.

6. The wafer cassette of claim 1, wherein a side of the second card slot plate away from the base is provided with a plurality of alignment pins for connecting other structural members.

7. The wafer cassette according to claim 1, wherein a plurality of alignment holes are formed in a side of the first card slot plate away from the base for connecting other structural members.

8. The wafer cassette of claim 1, wherein a plurality of limiting blocks are respectively disposed on one side of the first slot plate and one side of the second slot plate close to the base, and the limiting blocks are clamped and fixed in the liquid medicine tank.

9. The wafer cassette according to claim 1, wherein two sides of the first slot plate are respectively connected to the second slot plate through a fixing plate, so that a cavity formed by the first slot plate and the second slot plate conforms to a size of a wafer.

10. The wafer cassette according to claim 1, wherein the base is made of PP.