CN211030761U - Tool for slicing silicon material and adhesive plate thereof - Google Patents
Tool for slicing silicon material and adhesive plate thereof Download PDFInfo
- Publication number
- CN211030761U CN211030761U CN201921751716.XU CN201921751716U CN211030761U CN 211030761 U CN211030761 U CN 211030761U CN 201921751716 U CN201921751716 U CN 201921751716U CN 211030761 U CN211030761 U CN 211030761U
- Authority
- CN
- China
- Prior art keywords
- silicon material
- plate body
- bonding plate
- plate
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses a sticky plate for silicon material slicing, which comprises a sticky plate body and a pore part, wherein the sticky plate body is used for adhering a silicon material to be sliced; the pore part is partially or completely arranged in the sticky plate body which is contacted with the silicon material to be cut. Above-mentioned a sticky plate for silicon material is sliced sets up hole portion in sticky plate body, and hole portion does not influence the fixed of waiting to cut silicon material basically and section effect, but can reduce the cutting output of diamond wire to sticky plate body, reduces the wearing and tearing of diamond wire on the one hand, and on the other hand is favorable to the cutting to go on smoothly, can improve cutting speed to a certain extent. The utility model also discloses a frock including being used for the sliced flitch of silicon material.
Description
Technical Field
The utility model relates to the field of photovoltaic technology, especially, relate to a be used for sliced flitch of silicon material. The utility model discloses still relate to a frock that is used for sliced flitch of silicon material including the aforesaid.
Background
In a slicing step in a silicon wafer processing process, for example, when a silicon rod is sliced into silicon wafers, a sticky plate is required. The adhesive plate is used together with the dovetail seat for the silicon rod to be adhered and fixed, so that the silicon rod can be positioned and clamped, and the silicon rod and the cut silicon wafer can not fall off in the cutting process of the diamond wire.
In the above process, the sticking plate is cut along with the silicon rod, belonging to a loss part. In order to meet the fixing and slicing effects of the silicon rod, the thickness of the adhesive plate must meet certain conditions and cannot be randomly compressed, so that the cost of the adhesive plate is high, and in the cutting process, the diamond wire is high in wire consumption due to the fact that the cutting contact area of the diamond wire and the adhesive plate is large, and the cost of the diamond wire is further improved. In addition, when the diamond wire cutting is glued, the cutting efficiency is poor, the cutting time is long, the phenomenon that the cutting is not in place often appears, the gluing plate and the silicon rod need to be cut, and the cutting efficiency is influenced.
In summary, how to improve the cutting efficiency and reduce the cutting cost becomes a problem to be solved urgently by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a be used for sliced flitch of silicon material can improve cutting efficiency, reduces equipment cost. The utility model also aims at providing a frock that is used for sliced flitch of silicon material including the aforesaid.
In order to achieve the purpose, the utility model provides a sticky plate for silicon material slicing, which comprises a sticky plate body and a pore part, wherein the sticky plate body is used for adhering a silicon material to be sliced; the pore part is partially or completely arranged in the sticky plate body which is contacted with the silicon material to be cut.
Preferably, the aperture part is a through hole extending straight along the plate surface of the plate sticking body.
Preferably, the number of the through holes is multiple, and all the through holes are arranged in parallel in the plane of the adhesive plate body.
Preferably, the sticky plate body is rectangular; all the through holes are parallel to the length direction or the width direction of the sticky board body.
Preferably, the cross section of the through hole is rectangular, and the two pairs of side walls of the through hole are respectively parallel to the upper plate surface and the lower plate surface of the sticky plate body.
Preferably, the extending direction of the pore part is the same as the extending direction of the silicon material to be cut on the plate surface of the bonding plate body.
Preferably, the material of the sticky board body is plastic.
The utility model also provides a tool for slicing silicon materials, which comprises a dovetail seat and the sticky plate; the sticky plate is fixed on the dovetail seat through the viscose.
Compared with the prior art, the utility model provides a be used for sliced flitch of silicon material includes flitch body and hole portion. The sticking plate body is used for adhering and fixing the silicon material to be cut, for example, the silicon rod or the silicon block to be cut is adhered to the plate surface of the sticking plate body. The pore part is arranged in the bonding plate body, and when the silicon material to be cut is adhered to the surface of the bonding plate body, the pore part is partially or completely positioned in the bonding plate body contacted with the silicon material to be cut.
When adopting above-mentioned bonding plate to fix waiting to cut off silicon material, the diamond wire reduces the cutting total amount of bonding plate body during single cutting, and then can reduce the wearing and tearing of bonding plate body to the diamond wire, is favorable to prolonging the life of diamond wire, reduces silicon material sliced equipment cost. In addition, because the diamond wire is little in the position cutting area that the bonding plate body is equipped with the hole portion, consequently, can suitably improve the cutting speed of diamond wire and not influence the cutting effect of diamond wire to improve slicing speed and efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a bonding plate for silicon material slicing according to an embodiment of the present invention;
wherein, 1-sticking plate body and 2-pore part.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In order to make the technical field of the present invention better understand, the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a bonding plate for silicon material slicing according to an embodiment of the present invention.
The utility model provides a be used for sliced flitch of silicon material, including the flitch body 1 that is used for the adhesion to wait to cut the silicon material with set up in the hole portion 2 of flitch body 1.
The sticky board body 1 is used for sticking a silicon material to be cut, so that the positioning and clamping of the silicon material to be cut are realized. The common silicon material to be cut comprises a silicon rod and a silicon block, for example, after the silicon rod is adhered to the surface of the sticking plate body 1, the cutting equipment is started, the silicon rod is sliced along the radial direction by utilizing a diamond wire of the cutting equipment, and in the cutting process, the silicon rod and the sticking plate body 1 are both cut.
The part or the whole of the pore part 2 is arranged in the bonding plate body 1 which is contacted with the silicon material to be cut, and when a silicon wafer is cut, the diamond wire passes through the bonding plate body 1 which is provided with the pore part 2. It should be noted that, since the shape of the silicon material to be cut includes, but is not limited to, a regular shape, such as a round bar shape or a cube shape, the contact here can be understood as direct contact, and can also be understood as that the orthographic projection of the silicon material to be cut on the plate surface of the bonding plate body 1 overlaps with the bonding plate body 1.
The part of the pore part 2 is arranged in the bonding plate body 1 which is contacted with the bonding plate body 1 to be cut, so that the outline area of the outermost periphery of the projection formed by the pore part 2 on the plate surface of the bonding plate body 1 is larger than the area of the projection formed by the silicon material to be cut on the plate surface of the bonding plate body 1, and the silicon material to be cut is only adhered to the local part of the bonding plate body 1 provided with the pore part 2. The fact that the pore parts 2 are all arranged in the bonding plate body 1 to be contacted with the silicon material to be cut and the bonding plate body 1 can be understood that the outline area of the outermost periphery of the projection formed by the pore parts 2 on the plate surface of the bonding plate body 1 is not larger than the area of the projection formed by the silicon material to be cut on the plate surface of the bonding plate body 1, and the projection of the silicon material to be cut on the bonding plate body 1 is completely covered by the bonding plate body 1 provided with the pore parts 2.
After the silicon material to be cut is fixed through the adhesive plate for silicon material slicing, the adhesive plate is fixed relative to cutting equipment, and the process can be generally realized by adopting a dovetail seat; during cutting, the diamond wire of the cutting equipment is cut into along one side of the bonding plate and moves towards the silicon material to be cut until the diamond wire completely cuts off the silicon material to be cut.
The application provides a pore portion 2 of adhesion plate does not influence the adhesion of waiting to cut silicon material at adhesion plate body 1's face, nevertheless because of pore portion 2's existence, the diamond wire obviously reduces the cutting volume of adhesion plate body 1, compares in the adhesion plate that prior art adopted, and the adhesion plate that this application provided is few to the wearing and tearing volume of diamond wire when accomplishing equal silicon chip cutting volume, consequently can prolong the life of diamond wire, reduces cutting equipment's cost. In addition, because the diamond wire does not need to contact with the raw material of the bonding plate body 1 at the position of the pore part 2, the resistance that the diamond wire receives is small, the cutting speed of the diamond wire can be properly improved at the moment, the cutting effect is not influenced, and the efficiency of cutting a silicon wafer can be improved.
The specific arrangement form of the pore part 2 can be set according to the material of the sticky board body 1 and the forming process thereof. For example, the pore parts 2 are irregularly and irregularly arranged in the sticky board body 1, and the internal structure of the sticky board body 1 is similar to loofah or sponge. Of course, considering the material and processing characteristics of the adhesive sheet body 1, it is preferable to provide the aperture portion 2 as a through hole extending directly along the surface of the adhesive sheet body 1 to simplify the processing difficulty of the adhesive sheet body 1 and the aperture portion 2.
For example, the sticky board body 1 can be configured as a plastic board, and the sticky board body 1 and the through hole extending straight in the inner diameter thereof can be formed by injection molding.
The through holes are directly arranged in the bonding plate body 1, the upper end surface and the lower end surface of the bonding plate body 1 are kept complete, and the sticking of a silicon material to be cut is not influenced; the through holes arranged straightly can simplify the detachment of the die and the sticky plate body 1, namely the process of demoulding.
Obviously, the larger the size of the through hole is, the smaller the cutting amount of the diamond wire when the diamond wire is cut into the bonding plate body 1 is, and the smaller the abrasion degree of the diamond wire is, but the size of the through hole also affects the strength and rigidity of the bonding plate body 1, and further affects the positioning and clamping of the bonding plate body 1 on the silicon material to be cut, and affects the slicing effect.
Therefore, in order to increase the volume ratio of the through holes in the adhesive sheet body 1 by the feature that the adhesive sheet body 1 is mostly in a thin plate-like structure, a plurality of through holes may be provided in one adhesive sheet body 1. A plurality of through-holes are spaced each other, if glue 1 level of board body and place, then adjacent two through-holes form the bearing structure who distributes along vertical direction in gluing board body 1 to guarantee the face intensity of gluing board body 1.
Furthermore, all the through holes are arranged in parallel so as to simplify the structure of the mold and the difficulty of injection molding.
Illustratively, the sticky board body 1 is provided in a rectangular shape; all the through holes are arranged in parallel along the length direction of the sticky board body 1 or along the width direction of the sticky board body 1. The silicon material to be cut is usually pasted along the length direction or the width direction of the plate sticking body 1, for example, after the silicon rod is pasted along the length direction of the plate sticking body 1, the diamond wire is cut along the width direction of the plate sticking body 1 to cut off the silicon material to be cut, and if the through hole is arranged along the length direction of the plate sticking body 1 in the process, the cutting plane of the diamond wire is perpendicular to the axis of the through hole; on the contrary, if the through hole is arranged along the width direction of the bonding plate body 1, the cutting plane of the diamond wire is parallel to the axis of the through hole.
In the above embodiments, the through-hole may be provided as a rectangular through-hole, that is, the cross-section of the through-hole is provided as a rectangle. Two walls of any through hole which are oppositely arranged are respectively parallel to the upper plate surface and the lower plate surface of the sticky board body 1, and further all the through holes can be arranged at equal intervals so that the wall thicknesses of all the positions of the sticky board body 1 are close or even equal, thereby taking into account the strength of the sticky board body 1 and the total volume of all the through holes.
Besides the rectangular through holes, circular holes can be provided. Because the thickness of the sticky board body 1 is limited, the volume of the rectangular hole arranged in the limited thickness of the sticky board body 1 is larger than that of the round hole, so that the volume ratio of all the through holes to the sticky board body 1 is increased.
On the basis of any one of the above embodiments, the extending direction of the silicon material to be cut fixed on the bonding plate body 1 is the same as the extending direction of the pore part 2, the diamond wire is drawn in perpendicular to the extending direction of the pore part 2, the supporting and fixing effects of the silicon material to be cut by the bonding plate body 1 are not affected by the cutting position, and each cutting action is guaranteed to be smoothly carried out.
The utility model also provides a be used for sliced frock of silicon material, including dovetail tailstock and the aforesaid adhesive plate that is used for silicon material section, the adhesive plate passes through the viscose and pastes and dovetail tailstock. When the silicon material to be cut is cut, the silicon material to be cut is stuck on the adhesive plate, the dovetail seat is connected to the cutting equipment, and the adhesive plate and the silicon material to be cut on the adhesive plate are cut by the diamond wire of the cutting equipment to realize cutting.
It is right above the utility model provides a be used for sliced frock of silicon material and flitch thereof has carried out detailed introduction. The principles and embodiments of the present invention have been explained herein using specific examples, and the above descriptions of the embodiments are only used to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.
Claims (8)
1. The bonding plate for silicon material slicing is characterized by comprising a bonding plate body (1) for bonding a silicon material to be sliced and a pore part (2); the pore part (2) is partially or completely arranged in the bonding plate body (1) which is contacted with the silicon material to be cut.
2. The bonding plate for slicing silicon material according to claim 1, wherein the void part (2) is provided as a through hole extending straight along the plate surface of the bonding plate body (1).
3. The bonding plate for slicing silicon material according to claim 2, wherein the number of the through holes is multiple, and all the through holes are arranged in parallel in the plane of the bonding plate body (1).
4. The bonding plate for silicon material slices as claimed in claim 3, wherein the bonding plate body (1) is rectangular; all the through holes are parallel to the length direction or the width direction of the sticky board body (1).
5. The bonding plate for silicon material slicing according to claim 4, wherein the cross section of the through hole is rectangular, and two pairs of side walls of the through hole are respectively parallel to the upper plate surface and the lower plate surface of the bonding plate body (1).
6. The bonding plate for slicing silicon material according to any one of claims 1 to 5, wherein the extension direction of the pore part (2) is the same as the extension direction of the silicon material to be sliced on the plate surface of the bonding plate body (1).
7. The bonding plate for silicon material slices as claimed in claim 1, wherein the material of the bonding plate body (1) is plastic.
8. A tool for slicing silicon materials comprises a dovetail seat and is characterized by comprising the sticky plate of any one of claims 1 to 7; the sticky plate is fixed on the dovetail seat through the viscose.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921751716.XU CN211030761U (en) | 2019-10-17 | 2019-10-17 | Tool for slicing silicon material and adhesive plate thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921751716.XU CN211030761U (en) | 2019-10-17 | 2019-10-17 | Tool for slicing silicon material and adhesive plate thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211030761U true CN211030761U (en) | 2020-07-17 |
Family
ID=71568258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921751716.XU Active CN211030761U (en) | 2019-10-17 | 2019-10-17 | Tool for slicing silicon material and adhesive plate thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211030761U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112372863A (en) * | 2020-11-06 | 2021-02-19 | 江西中昱新材料科技有限公司 | Supporting plate for silicon ingot slicing and manufacturing method thereof |
-
2019
- 2019-10-17 CN CN201921751716.XU patent/CN211030761U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112372863A (en) * | 2020-11-06 | 2021-02-19 | 江西中昱新材料科技有限公司 | Supporting plate for silicon ingot slicing and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105086858B (en) | A kind of gum and processing mold group and its processing technology | |
| CN211030761U (en) | Tool for slicing silicon material and adhesive plate thereof | |
| CN210336481U (en) | Supporting plate for cutting photovoltaic silicon rod | |
| JP2017019052A (en) | Blade tool, and pattern adhesive body manufacturing method | |
| US20110061688A1 (en) | Device and method for cleaning wafers | |
| CN110712047B (en) | Rigid support method for thin-wall cavity part machining | |
| CN202895332U (en) | Cutting mould capable of discharging waste automatically | |
| CN215659367U (en) | Fixing tool for diamond single crystal wafer plane grinding and plane grinding device | |
| CN205017692U (en) | Gum and mold processing group thereof | |
| CN201988628U (en) | Side board die for outdoor unit of air conditioner | |
| CN210008035U (en) | A tool for fixing lamp plate | |
| CN210361990U (en) | Machining clamp for graphite cylinder slices | |
| JP2000334753A (en) | Method and mold for producing cylindrical rubber member | |
| CN112026024B (en) | Method for cutting ingot through guide frame in multi-wire mode | |
| CN210456566U (en) | Bowl-shaped silicon rubber sucker | |
| CN210549758U (en) | Robot ultrasonic wave anchor clamps for automatic cutout | |
| CN209778719U (en) | Special adhesive tape for cleaning electronic devices | |
| CN210909548U (en) | Straight flange machine rear press plate | |
| CN202842301U (en) | Plane shaping mould for food | |
| CN203752220U (en) | Light guide plate cutting auxiliary jig | |
| CN210147851U (en) | Clamping fixture for water cutting | |
| CN216682814U (en) | Lining plate, crystal support and slicing device | |
| CN216634951U (en) | Multi-line cutting clamp for crystal array | |
| CN110304452B (en) | Transfer robot and sucking disc device thereof | |
| CN108527902B (en) | Mould for manufacturing prismatic table-shaped lens |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230110 Address after: 334000 No. 16 Xingye Avenue, Shangrao Economic and Technological Development Zone, Shangrao City, Jiangxi Province Patentee after: Shangrao Zhongyu New Material Technology Co.,Ltd. Address before: No.16 Yuanquan Avenue, Shangrao Economic Development Zone, Shangrao City, Jiangxi Province 334100 Patentee before: JIANGXI ZHONGYU NEW MATERIAL TECHNOLOGY Co.,Ltd. |