CN210336481U

CN210336481U - Supporting plate for cutting photovoltaic silicon rod

Info

Publication number: CN210336481U
Application number: CN201920795133.0U
Authority: CN
Inventors: 张建军
Original assignee: Jiangyin Huayu Yicheng New Energy Technology Co Ltd
Current assignee: Jiangyin Huayu Yicheng New Energy Technology Co Ltd
Priority date: 2019-05-29
Filing date: 2019-05-29
Publication date: 2020-04-17
Anticipated expiration: 2029-05-29

Abstract

The utility model relates to a supporting plate for cutting a photovoltaic silicon rod, which comprises a supporting plate body, wherein the supporting plate body is provided with an upper plane and a lower plane as sticking surfaces; the sticking surfaces are parallel to each other; a plurality of through holes are longitudinally arranged in the supporting plate body. The cross-sectional shape of the through-hole may be rectangular, circular, triangular, or other shapes. For the utility model relates to a photovoltaic silicon rod is layer board for section adopts plastic pellet extrusion moulding to have the hollow flat board of through-hole, through setting up the through-hole, has alleviateed the weight of whole layer board, and can reduce the cutting resistance of buddha's warrior attendant line improves and surely goes out the quality.

Description

Supporting plate for cutting photovoltaic silicon rod

Technical Field

The utility model relates to a layer board device that needs to use when photovoltaic silicon rod is sliced, especially the layer board that plastics were made.

Background

The core element of the solar photovoltaic and solar power generation is a silicon wafer, a cylindrical silicon ingot is made of a silicon material, then the silicon ingot is cut to form a silicon rod which is nearly square, the silicon rod is sliced by a slicing machine, and then corresponding processing is carried out to form a solar photovoltaic cell which meets the requirements.

At present, silicon rods are sliced, a plurality of wound diamond wires are mainly adopted to drive mortar, slicing is realized, and the thickness of the cut silicon wafers is generally 0.1-0.3 mm. Because the diamond wire is adopted for cutting, the diamond wire can be stressed to form a certain radian after contacting the silicon rod, the silicon rod is basically square when being sliced, the silicon rod is required to be completely sliced, a cutting cushion block needs to be pasted on the last diamond wire cutting surface of the silicon rod, the silicon rod and the workbench are suspended, the diamond wire can be completely cut and penetrate through the silicon rod, the silicon chip after being cut completely can be still kept in an upright state, and the silicon chip can not be bent and toppled to cause cracking.

In the early production of photovoltaic trade, the cutting cushion generally adopts the glass substrate that is closer with the silicon rod material, then bonds through glue, ensures firm bonding, can not take place to become flexible at the section in-process, falls the stick even, influences production.

The cutting cushion block belongs to a consumable, is developed at any time in the photovoltaic industry, and forms a special industry, and the product is called a crystal supporting plate; with the further development of the industry, some novel crystal supporting plates are also appeared in the market, for example, a supporting plate of a silicon wafer cutting machine with Chinese patent publication No. CN102363325A, a partition plate is detachably arranged outside a supporting plate body, the partition plate is a ceramic plate, but in actual use, because diamond wires need to cut materials connected with silicon rods, the ceramic plate can be cut, and although the ceramic plate is convenient to replace, the manufacturing cost of the ceramic plate is very high, so the ceramic plate is not generally adopted in the market. In addition, a crystal support for cutting the silicon rod, which is disclosed in chinese patent publication No. CN102700020A, improves the amount of adhesive by providing a groove, so as to ensure firm adhesion, and the groove is filled with glue, so that the contact surface with the steel wire is reduced, the cutting of the steel wire is easier, but the amount of glue used can be fully ensured by the operation of workers, and the glass plate is provided with a plurality of grooves, which is too expensive and not beneficial to the popularization of the technology.

The further compression of the current photovoltaic market cost is combined, and further research on small crystal supporting plates is necessary, so that the cost is further reduced, the production efficiency is improved, the problems of wire clamping, jumping and the like of a steel wire in the cutting process are reduced, and the cutting quality is improved.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a supporting plate for slicing a photovoltaic silicon rod, which is characterized by comprising a supporting plate body, wherein the thickness of the supporting plate body is 8-20 mm; the supporting plate body is provided with an upper plane and a lower plane which are used as sticking surfaces; the sticking surfaces are parallel to each other;

a plurality of through holes are longitudinally arranged in the supporting plate body; the total area of the through holes accounts for 10% -70% of the cross section area of the whole supporting plate body; the minimum wall thickness between the adjacent 2 through holes is 1-3 mm; the minimum wall thickness of the through hole from the upper and lower pasting surfaces is 1-3 mm.

As a further improvement of the utility model, the cross-sectional shape of the through hole is a rectangle, and the width of the rectangle is 0.5-2 times of the height.

As a further improvement of the utility model, the cross-sectional shape of the through hole is circular.

As a further improvement of the utility model, the cross-sectional shape of the through hole is triangular.

Furthermore, the triangles of the adjacent 2 through holes are oppositely arranged.

As a further improvement of the utility model, the flatness of the pasting surface is controlled within 50 microns.

Furthermore, the surface roughness of the pasting surface is controlled to be 10-30 microns.

For the utility model relates to a photovoltaic silicon rod is layer board for section adopts plastic pellet extrusion moulding to have the hollow flat board of through-hole, through setting up the through-hole, has alleviateed the weight of whole layer board, and can reduce the cutting resistance of buddha's warrior attendant line improves and surely goes out the quality.

For the utility model relates to a photovoltaic silicon rod is layer board for section has following advantage for current layer board:

1. the plastic is adopted, so that the material is lighter, and the cutting resistance is smaller;

2. the design of the through holes is adopted, so that the material consumption is reduced, the weight is further reduced, and the cutting resistance is reduced;

3. the through holes can facilitate the flowing of cooling liquid to cool the supporting plate.

Drawings

Fig. 1 is a schematic overall structure diagram of a first embodiment of a supporting plate for slicing a photovoltaic silicon rod according to the present invention;

FIG. 2 is a front view of a first embodiment of a supporting plate for slicing a photovoltaic silicon rod according to the present invention;

FIG. 3 is a partial cross-sectional view of an embodiment of the supporting plate for slicing a photovoltaic silicon rod according to the present invention;

fig. 4 is a schematic overall structure diagram of a second embodiment of the supporting plate for slicing the photovoltaic silicon rod of the present invention;

FIG. 5 is a front view of a second embodiment of a supporting plate for slicing a photovoltaic silicon rod according to the present invention;

fig. 6 is a schematic overall structure diagram of a third embodiment of the supporting plate for slicing the photovoltaic silicon rod of the present invention;

fig. 7 is a front view of a third embodiment of the supporting plate for slicing the photovoltaic silicon rod of the present invention;

fig. 8 is a schematic view of a using state structure of a supporting plate for slicing a photovoltaic silicon rod according to the present invention;

reference numerals: 1. the device comprises a supporting plate, 2, a sticking surface, 3, a through hole, 4, glue, 5, a silicon rod, 6, a diamond wire, 7 and a guide wheel.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and specific embodiments.

The first embodiment is as follows:

as shown in fig. 1 to 3, which are schematic structural diagrams of a supporting plate for slicing a photovoltaic silicon rod of the present invention, the supporting plate 1 is made of plastic particles, especially PET, ABS, etc., which are resistant to temperatures above 90 ℃, and is extruded by a plastic extruder; the supporting plate 1 is in a long flat plate shape, and the width and the length of the supporting plate are determined by the specific size of the silicon rod to be adhered.

The thickness H of the supporting plate 1 is generally controlled to be more than 8mm, and is conventionally selected to be 10mm and 15 mm; with the thickness, the radian formed by resistance generated by cutting of the diamond wire by the silicon rod can be fully overcome. The thickness of the supporting plate 1 is too thin, so that the silicon rod cannot be cut; the thickness of the pallet 1 is too thick (more than 20 mm), which will increase the manufacturing cost of the pallet and the weight of the pallet.

The supporting plate 1 is provided with an upper smooth and flat sticking surface 2 and a lower smooth and flat sticking surface 2, and the upper sticking surface 2 and the lower sticking surface 2 are parallel to each other. When the supporting plate 1 is extruded and formed, the sticking surface 2 is generally affected by the shrinkage of the plastic material and the influence of a mold, and the surface is uneven; therefore, the whole bonding surface 2 needs to be polished by abrasive materials, the flatness of the bonding surface is controlled within 50 microns, and the bonding effect is affected by too poor flatness, so that the bonding is not smooth, and the bonding strength is affected. The surface roughness is controlled to be 10-30 microns, and the surface roughness is too smooth, so that the adhesive property of the glue is influenced, and the surface roughness is caused by too rough, so that the flatness is influenced.

The utility model discloses an important improvement lies in, adopts suitable extrusion tooling, makes the vertical equipartition in centre of layer board 1 has a plurality of through-holes 3, in this example the cross-section of through-hole 3 is rectangle or square. Through the arrangement of the through holes 3, on one hand, the material of the supporting plate 1 is saved on the premise of ensuring the strength of the whole structure; on the other hand, the cutting resistance of the diamond wire is reduced, and the cutting efficiency is improved.

In order to ensure the structural strength of the supporting plate 1, in the present embodiment, the thickness H of the supporting plate 1 is 10mm, wherein the height D of the through hole 3 is 6-7mm, and the through hole 3 is located in the middle of the cross section of the supporting plate 1, i.e., the thickness D1-D2-1.5-2 mm of the upper and lower wall of the corresponding supporting plate 1; in order to make the flow rate of the extrusion material uniform, the distance d3 between the adjacent 2 through holes 3 is d1 d 2.

In the present embodiment, the width L of the through-hole 3 is (0.5-2.5) × D; if the width L of the through hole 3 is too large, the upper surface and the lower surface of the supporting plate 1, namely the pasting surface 2, can be collapsed, and the surface flatness is influenced; if the width L of the through hole 3 is too small, extrusion difficulty is increased, extrusion is not uniform, and other quality defects are generated.

Example two:

as shown in fig. 4 and 5, a schematic structural view of a second implementation of the supporting plate for slicing a photovoltaic silicon rod of the present invention is mainly different in that the through hole 3 is a circular hole. By using the circular holes, the average thickness of the upper and lower wall thicknesses d1 and d2 can be increased, and the adhesive surface 2 can be supported more effectively. However, the round holes are also easy to cause uneven connection thickness of the materials, and after extrusion, the materials shrink to cause certain surface unevenness.

Example three:

as shown in fig. 6 and 7, a schematic structural view of a third embodiment of a supporting plate for slicing a photovoltaic silicon rod according to the present invention is mainly different in that the through holes 3 are triangles, and two adjacent triangles are oppositely disposed; due to the arrangement of the through holes 3, the wall thickness of the whole material of the supporting plate 1 is relatively uniform, and the connecting strength is high.

As shown in the first to third embodiments, the main innovation point of the present invention is that the through hole 3 is disposed in the middle of the supporting plate 1, and the material and cutting force are reduced through the through hole 3; the shape and size of the through hole 3 can be designed according to the specific material performance and the size specification requirement of the supporting plate 1; the through hole 3 is formed along with the integral extrusion of the supporting plate 1, and the shape of the through hole is naturally formed along with the extrusion; the pallet 1 is then subjected to dimensional correction, in particular grinding of the upper and lower surfaces, so as to form an adhesive surface 2 which meets the requirements for adhesion.

Furthermore, in the cross section, the area of the through hole 3 accounts for 10% -70% of the rectangular area of the cross section of the whole plate, so that the material consumption can be properly reduced, and the strength can be ensured; in order to ensure the strength fully, the minimum wall thickness between the adjacent 2 through holes 3 is 1-3 mm; the minimum wall thickness between the upper end and the lower end of the through hole 3 and the upper and the lower pasting surfaces 2 is 1-3mm, so that the integral strength of the plate can be effectively ensured, and the processing and the manufacturing are easy.

The arrangement of the through holes 3 can realize weight reduction and reduce consumption cost; in the silicon chip cutting process, can be right through-hole 3 pours into the coolant liquid into, right layer board 1 cools off, prevents to produce deformation because layer board 1 high temperature perhaps leads to pasting the intensity of glue and changing, influences the section safety.

The supporting plate 1 is made of plastics, a plurality of cutting grooves are formed in the surface of the supporting plate after cutting, the supporting plate can be recycled as plastic waste after removing glue, and the supporting plate 1 is manufactured again.

As shown in fig. 8, which is a schematic view of a using state structure of a supporting plate for slicing a photovoltaic silicon rod according to the present invention, a proper amount of glue 4 is coated on a pasting surface 2 of the supporting plate 1, and a silicon rod 5 to be sliced is pasted on the supporting plate 1; the silicon rod 5 and the supporting plate 1 are erected in a slicing machine, a cutting diamond wire 6 forms a cutting working edge under the support of a guide wheel 7, and the silicon rod 5 is cut; since the diamond wire 6 is very thin, it is forced to form a certain arc when cutting. When the silicon rod 5 is cut out by the diamond wire 6, in order to compensate the radian of the diamond wire 6, the diamond wire 6 is cut into the supporting plate 1, at the moment, because the supporting plate 1 is made of plastic and is provided with a plurality of through holes 3 in the middle, the cutting resistance is greatly reduced, so that the diamond wire 6 is smoother and smoother when cut out from the silicon rod 5, and the corner collapse is avoided.

While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the invention is not limited to the embodiments disclosed, but is capable of numerous equivalents and substitutions without departing from the spirit of the invention, the equivalents and substitutions being limited only by the scope of the appended claims.

Claims

1. The supporting plate for cutting the photovoltaic silicon rod is characterized by comprising a supporting plate body, wherein the thickness of the supporting plate body is 8-20 mm; the supporting plate body is provided with an upper plane and a lower plane which are used as sticking surfaces; the sticking surfaces are parallel to each other;

2. The photovoltaic silicon rod cutting blade according to claim 1, wherein the through-hole has a rectangular cross-sectional shape.

3. The photovoltaic silicon rod cutting blade according to claim 2, wherein the width of the rectangle is 0.5 to 2.5 times the height.

4. The photovoltaic silicon rod cutting blade according to claim 1, wherein the cross-sectional shape of the through-hole is circular.

5. The photovoltaic silicon rod cutting blade according to claim 1, wherein the cross-sectional shape of the through-hole is a triangle.

6. The photovoltaic silicon rod cutting blade according to claim 5, wherein the triangles of the adjacent 2 through holes are oppositely arranged.

7. The photovoltaic silicon rod cutting blade according to claim 1, wherein the flatness of the adhesive surface is controlled within 50 μm.

8. The photovoltaic silicon rod cutting blade according to claim 7, wherein the surface roughness of the adhesive surface is controlled to be 10 to 30 μm.