CN211467022U - Plastic plate for diamond wire cutting - Google Patents
Plastic plate for diamond wire cutting Download PDFInfo
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- CN211467022U CN211467022U CN201922211951.4U CN201922211951U CN211467022U CN 211467022 U CN211467022 U CN 211467022U CN 201922211951 U CN201922211951 U CN 201922211951U CN 211467022 U CN211467022 U CN 211467022U
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- diamond wire
- plastic plate
- plastic
- wire cutting
- plastic slab
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Abstract
The utility model discloses a buddha's warrior attendant is plastic slab for wire-electrode cutting, it includes the plastic slab body, is equipped with on the plastic slab body and glues excellent face, glues excellent face and is used for bonding crystal bar, glues excellent face and is equipped with the bar groove along the perpendicular to cutting direction, is equipped with a plurality of cavitys along the perpendicular to cutting direction in the plastic slab body. The utility model discloses a plastic slab for diamond wire-electrode cutting is through this internal a plurality of cavity that set up along the perpendicular to cutting direction at the plastic sheet, cuts into the plastic sheet at diamond wire originally internal and get into after the cavity, effectively reduces the area of contact with diamond wire, reduces and to the adhering to and wearing and tearing of diamond wire, improves the sand-carrying ability of diamond wire, and then improves cutting ability, increases life. Meanwhile, after glue is smeared on the crystal bar, hot bubbles can be generated in the glue reaction process during the bonding process of the crystal bar, the bubbles can be discharged through the strip-shaped grooves, and the strip-shaped grooves can solidify and store redundant glue to enable the crystal bar to be bonded smoothly.
Description
Technical Field
The utility model relates to a crystal bar processing technology field, concretely relates to buddha's warrior attendant is plastic slab for wire-electrode cutting.
Background
With the increasingly mature diamond wire cutting technology, the thinning of the gold steel wire is gradually developed from 80um in diameter to 45um at present, and even the gold steel wire is thinner later, which puts higher requirements on the cutting technology, and after the gold steel wire is thinned, the problems of wire breakage, high wire consumption and the like are easily caused, which directly leads to the increase of the cost.
The existing cutting mainly uses common plastic plates, resin plates and the like, after thin lines are used, the line consumption can not be reduced, the line breakage ratio is increased, the integral processing cost is increased, and the plastic plates and the resin plates can not be smoothly guided into a production line, so that the existing common plastic plates and the existing resin plates can not meet the production requirements of enterprises.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects in the prior art and provide a plastic plate for diamond wire cutting, which has reasonable structure and reduces wire consumption. The technical scheme is as follows:
the utility model provides a buddha's warrior attendant is plastic slab for wire-electrode cutting, its includes the plastic slab body, be equipped with on the plastic slab body and glue excellent face, it is used for bonding the crystal bar to glue excellent face, it is equipped with the bar groove along the perpendicular to cutting direction to glue excellent face, this internal edge perpendicular to cutting direction of plastic slab is equipped with a plurality of cavity cavitys.
As a further improvement of the utility model, the cross section of the hollow cavity is triangular.
As a further improvement of the utility model, the vertex angles of two adjacent triangular shapes are respectively arranged upwards and downwards.
As a further improvement of the utility model, the plurality of hollow cavities are arranged at equal intervals.
As a further improvement of the utility model, the distance between two adjacent hollow cavities is 15-20 mm.
As a further improvement of the utility model, the distance from the hollow cavity to the stick sticking surface is 1-4 mm.
As a further improvement of the utility model, the strip-shaped groove is V-shaped.
As a further improvement of the utility model, the width of the strip-shaped groove is 4-6mm, and the depth is 2-4 mm.
As a further improvement, the width of the strip-shaped groove is 5mm, and the depth is 3 mm.
As a further improvement of the utility model, the thickness of the plastic plate body is 10-14 mm.
The utility model has the advantages that:
the utility model discloses a plastic slab for diamond wire-electrode cutting is through this internal a plurality of cavity that set up along the perpendicular to cutting direction at the plastic sheet, cuts into the plastic sheet at diamond wire originally internal and get into after the cavity, effectively reduces the area of contact with diamond wire, reduces and to the adhering to and wearing and tearing of diamond wire, improves the sand-carrying ability of diamond wire, and then improves cutting ability, increases life.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic view of the overall structure of a plastic plate for wire cutting of diamond in an embodiment of the present invention;
fig. 2 is a sectional view of a plastic plate for diamond wire cutting in an embodiment of the present invention.
Description of the labeling: 10. a plastic panel body; 11. sticking the bar surface; 12. a strip-shaped groove; 13. a hollow cavity.
Detailed Description
The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
As shown in fig. 1-2, for the embodiment of the utility model provides a plastic slab for diamond wire cutting, it includes plastic slab body 10, is equipped with on the plastic slab body 10 and glues excellent face 11, glues excellent face 11 and is used for bonding the crystal bar, glues excellent face 11 and is equipped with bar groove 12 along the perpendicular to cutting direction, is equipped with a plurality of cavity cavitys 13 along the perpendicular to cutting direction in the plastic slab body 10. Preferably, the thickness of the plastic plate body 10 is 10-14 mm.
After glue is smeared, hot bubbles can be generated in the crystal bar in the bonding process through glue reaction, the bubbles can be discharged through the strip-shaped grooves 12, and the strip-shaped grooves 12 can solidify and store redundant glue to enable the crystal bar to be bonded smoothly.
In this embodiment, the strip-shaped grooves 12 are V-shaped, the number of the strip-shaped grooves 12 is two, and the two strip-shaped grooves 12 are symmetrically arranged.
Preferably, the width of the strip-shaped groove 12 is 4-6mm and the depth is 2-4 mm. More preferably, the width of the grooves 12 is 5mm and the depth is 3 mm.
In this embodiment, the cross section of the hollow cavity 13 is triangular, which is advantageous for preventing the plastic plate body 10 from deforming due to the existence of the hollow cavity 13 because the triangular stability is better.
Preferably, the vertex angles of two adjacent triangles are respectively arranged upwards and downwards, and the two adjacent triangles are matched to further prevent the deformation of the plastic plate body 10.
In one embodiment, the hollow cavities 13 are disposed at equal intervals. Preferably, the distance between two adjacent hollow cavities 13 is 15-20mm, and the distance between the hollow cavity 13 and the stick surface 11 is 1-4 mm.
When using, the crystal bar bonds in gluing excellent face 11 through glue, and the buddha's warrior attendant line can cut through certain degree of depth in the plastic slab body 10 when cutting the crystal bar, cuts through to the cavity 13 promptly in, cuts into in the plastic slab body 10 and gets into cavity 13 at the buddha's warrior attendant line after, effectively reduces buddha's warrior attendant line and plastic slab body 10's area of contact, reduces plastics to the adnexed and wearing and tearing of diamond line, improves the sand carrying capacity of diamond line, and then improves cutting ability, increases life.
The above embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (10)
1. The utility model provides a buddha's warrior attendant is plastic slab for wire-electrode cutting, its characterized in that, includes the plastic slab body, be equipped with on the plastic slab body and glue excellent face, it is used for bonding the crystal bar to glue excellent face, it is equipped with the bar groove along the perpendicular to cutting direction to glue excellent face, this internal edge perpendicular to cutting direction of plastic slab is equipped with a plurality of cavity cavitys.
2. A plastic plate for diamond wire cutting according to claim 1, wherein the cross-section of the hollow cavity is triangular.
3. A plastic plate for diamond wire cutting according to claim 2, wherein the vertex angles of two adjacent triangles are respectively set upward and downward.
4. A plastic plate for diamond wire cutting according to claim 1, wherein the plurality of hollow cavities are arranged at equal intervals.
5. A plastic plate for diamond wire cutting according to claim 4, wherein the distance between two adjacent hollow cavities is 15-20 mm.
6. A plastic plate for diamond wire cutting according to claim 1, wherein the distance from the hollow cavity to the stick face is 1-4 mm.
7. A plastic plate for diamond wire cutting according to claim 1, wherein the strip groove is V-shaped.
8. A plastic plate for diamond wire cutting according to claim 1, wherein the width of the stripe groove is 4-6mm and the depth is 2-4 mm.
9. A plastic plate for diamond wire cutting according to claim 8, wherein the width of the stripe groove is 5mm and the depth is 3 mm.
10. A plastic plate for diamond wire cutting according to claim 1, wherein the thickness of the plastic plate body is 10 to 14 mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201922211951.4U CN211467022U (en) | 2019-12-11 | 2019-12-11 | Plastic plate for diamond wire cutting |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201922211951.4U CN211467022U (en) | 2019-12-11 | 2019-12-11 | Plastic plate for diamond wire cutting |
Publications (1)
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CN211467022U true CN211467022U (en) | 2020-09-11 |
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CN201922211951.4U Active CN211467022U (en) | 2019-12-11 | 2019-12-11 | Plastic plate for diamond wire cutting |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113752402A (en) * | 2021-09-16 | 2021-12-07 | 广东金湾高景太阳能科技有限公司 | Method for solving scratch bright line of large-size silicon wafer lifting material |
CN116852563A (en) * | 2023-07-31 | 2023-10-10 | 安徽华晟新材料有限公司 | Crystal bar processing method |
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2019
- 2019-12-11 CN CN201922211951.4U patent/CN211467022U/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113752402A (en) * | 2021-09-16 | 2021-12-07 | 广东金湾高景太阳能科技有限公司 | Method for solving scratch bright line of large-size silicon wafer lifting material |
CN113752402B (en) * | 2021-09-16 | 2022-07-12 | 广东金湾高景太阳能科技有限公司 | Method for solving scratch bright line of large-size silicon wafer lifting material |
WO2023040739A1 (en) * | 2021-09-16 | 2023-03-23 | 广东金湾高景太阳能科技有限公司 | Method for solving scratches and bright lines in large-size silicon wafers when material lifting |
CN116852563A (en) * | 2023-07-31 | 2023-10-10 | 安徽华晟新材料有限公司 | Crystal bar processing method |
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Address after: 223399 plant 1, No. 898 Bihua Road, high tech Industrial Development Zone, Tongzhou District, Nantong City, Jiangsu Province Patentee after: Qiangxin Technology (Nantong) Co.,Ltd. Address before: 223399 first floor of 11, 14 and 15 plants in Electronic Information Industrial Park (Intelligent Manufacturing Industrial Park) of Huai'an Industrial Park, Jiangsu Province Patentee before: Strong core technology (Huai'an) Co.,Ltd. |