CN216634951U

CN216634951U - Multi-line cutting clamp for crystal array

Info

Publication number: CN216634951U
Application number: CN202122719543.7U
Authority: CN
Inventors: 丁言国; 武志龙; 汪新伟; 叶崇志
Original assignee: Shanghai Sim Crystals Material Technology Co ltd
Current assignee: Shanghai Sim Crystals Material Technology Co ltd
Priority date: 2021-11-08
Filing date: 2021-11-08
Publication date: 2022-05-31
Anticipated expiration: 2031-11-08

Abstract

The embodiment of the utility model relates to a crystal array multi-wire cutting clamp, which comprises: fixing a resin plate above the bottom plate; arranging a plurality of cutting seams above the resin plate along a preset axis; sleeving a clamp above the resin plate, placing a crystal to be cut above the clamp and perpendicular to the cutting seam, and cutting along the cutting seam; the bottom plate, the resin plate, the cutting seam, the clamp and other parts are adopted, the clamp is sleeved above the resin plate, the crystal to be cut is placed above the clamp and is perpendicular to the cutting seam, and cutting is carried out along the cutting seam. The problem of among the prior art, the crystal through the cutting of internal circle cutting machine, process into the wafer, later with the wafer adhesion together, cut perpendicular to wafer direction, obtain one-dimensional crystal array piece for the equipment of crystal array, when adopting internal circle cutting machine cutting one-dimensional crystal array piece traditionally, there is the loss big, inefficiency, the higher technical problem of crystal processing cost.

Description

Multi-line cutting clamp for crystal array

Technical Field

The embodiment of the utility model relates to a clamp, in particular to a crystal array multi-wire cutting clamp.

Background

The crystal is cut and processed into a wafer by an inner circle cutting machine, then the wafer is adhered together and cut in the direction vertical to the wafer to obtain a one-dimensional crystal array sheet for assembling the crystal array, and when the one-dimensional crystal array sheet is cut by the inner circle cutting machine in the prior art, the loss is large, the efficiency is low, and the crystal processing cost is high; when multi-wire cutting is adopted, the clamp which meets the precision requirement of multi-wire cutting is needed.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a clamp which can fix and position crystal pieces which are adhered together when a one-dimensional crystal array piece is cut and processed in a multi-line cutting mode.

In order to achieve the above object, an embodiment of the present invention provides a wafer array multi-wire sawing jig, including:

a bottom plate, a plurality of first connecting plates,

a resin plate fixed above the bottom plate;

the cutting seams are arranged above the resin plate along a preset axis;

and the clamp is sleeved above the resin plate, a crystal to be cut is placed above the clamp and is perpendicular to the cutting seam, and the crystal is cut along the cutting seam.

Furthermore, the bottom plate and the resin plate are square; one end of the bottom plate is aligned with one end of the resin plate.

Furthermore, a plurality of cutting seams are arranged in parallel; the cutting seams are equal to the intervals between the cutting seams.

Further, the clamp is of a square structure, and a platform is arranged above the clamp; hollowing out a plurality of grooves on the clamp; a crystal is placed in the groove; a groove platform is arranged on the periphery of the groove, and a reference surface is arranged between the groove and the groove.

Further, the platform coincides with the upper surface of the bottom plate, and the inner side surface of the platform coincides with the front end of the resin plate.

Furthermore, cushion blocks are filled below four corners of the reference surface, so that the clamp is suspended above the upper surface of the resin plate.

Furthermore, two handles are respectively arranged at two ends of the clamp.

Furthermore, a fabrication hole is arranged on the corner of the groove.

Further, the width of the cutting seam is between 0.2mm and 2 mm.

Further, the clamp material is polyethylene or pure aluminum.

Compared with the prior art, the crystal cutting machine adopts the components such as the bottom plate, the resin plate, the cutting seam, the clamp and the like, the clamp is sleeved above the resin plate, the crystal to be cut is placed above the clamp and is perpendicular to the cutting seam, and cutting is carried out along the cutting seam. The multi-line cutting clamp for the crystal array is relatively simple in structure, convenient to machine and manufacture, easy to operate for operators, low in learning cost and capable of providing the flow and standardization of multi-line cutting and machining production of the crystal array sheet. The crystal array wafer is processed by multi-line cutting, so that the size precision is high, the efficiency is high, the production cost can be effectively reduced, and the production efficiency is improved; the problem of among the prior art, the crystal through the cutting of internal circle cutting machine, process into the wafer, later with the wafer adhesion together, cut perpendicular to wafer direction, obtain one-dimensional crystal array piece for the equipment of crystal array, when adopting internal circle cutting machine cutting one-dimensional crystal array piece traditionally, there is the loss big, inefficiency, the higher technical problem of crystal processing cost.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a base plate and a resin plate;

FIG. 3 is a schematic view of the present invention after placement of the crystal;

FIG. 4 is a schematic view of the positioned crystal of FIG. 3 with the jig removed.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solutions claimed in the claims of the present application can be implemented without these technical details and with various changes and modifications based on the following embodiments.

The embodiment of the utility model relates to a crystal array multi-wire cutting clamp, as shown in fig. 1 and 2, comprising:

fixing a resin plate 2 above the base plate 1; the base plate 1 is used for fixing the resin plate 2, so that the base plate 1 and the resin plate 2 are integrated into a whole structure;

arranging a plurality of cutting seams 21 above the resin plate 2 along a preset axis; the cut slit 21 in the present embodiment is formed by cutting along the lateral direction of the resin sheet 2.

And the clamp 3 is sleeved above the resin plate 2, a crystal to be cut is placed above the clamp 3 and is perpendicular to the cutting seam, and the crystal is cut along the cutting seam 21.

The structure adopts the components such as the bottom plate 1, the resin plate 2, the cutting seam 21, the clamp 3 and the like, the clamp 3 is sleeved above the resin plate 2, the crystal to be cut is placed above the clamp 3 and is perpendicular to the cutting seam 21, and cutting is carried out along the cutting seam 21. The multi-line cutting clamp for the crystal array is relatively simple in structure, convenient to machine and manufacture, easy to operate for operators, low in learning cost and capable of providing the flow and standardization of multi-line cutting and machining production of the crystal array sheet. The crystal array wafer is processed by multi-line cutting, so that the size precision is high, the efficiency is high, the production cost can be effectively reduced, and the production efficiency is improved; the problem of among the prior art, the crystal through the cutting of internal circle cutting machine, process into the wafer, later with the wafer adhesion together, cut perpendicular to wafer direction, obtain one-dimensional crystal array piece for the equipment of crystal array, when adopting internal circle cutting machine cutting one-dimensional crystal array piece traditionally, there is the loss big, inefficiency, the higher technical problem of crystal processing cost.

In order to achieve the above technical effects, as shown in fig. 1 and 2, the bottom plate 1 and the resin plate 2 are square; one end of the base plate 1 is aligned with one end of the resin plate 2. This makes the bottom plate 1 and the resin plate 2 have a one-piece structure with one side flush.

In order to achieve the above technical effect, as shown in fig. 1 and fig. 2, a plurality of cutting seams 21 are arranged in parallel; the crystal array multi-line cutting fixture in the embodiment has equal spacing between the cutting seams 21 and the cutting seams 21. The thickness of the crystal thus cut can be ensured to a certain degree of accuracy.

In order to achieve the technical effects, as shown in fig. 1 and 2, the clamp 3 is in a square structure, and a platform 34 is arranged above the clamp 3; a plurality of grooves 35 are hollowed out on the clamp 3; a crystal is placed in the groove 35; a groove land 31 is provided around the groove 35 and a reference surface 33 is provided between the groove 35 and the groove 35.

As shown in fig. 1, 2 and 3, the above structure ensures that when the jig 3 is combined with the resin plate 2, the platform 34 coincides with the upper surface of the base plate 1, and the inner side surface of the platform 34 coincides with the front end of the resin plate 2. The assembling accuracy of the jig 3 and the resin board 2 is ensured.

In the multi-line cutting fixture for crystal array in this embodiment, the pads, not shown, are embedded under the four corners of the reference plane 33, so that the fixture 3 is suspended above the upper surface of the resin plate 2. Prevent anchor clamps 3 and resin board 2 because glue bonds, the unable drawing of patterns of anchor clamps.

As shown in fig. 1, 2 and 3, two handles 32 are provided at each end of the clip 3, and the handles 32 are mainly for facilitating the taking of the clip 3.

As shown in fig. 1, 2 and 3, a process hole 36 is provided at the corner of the recess 35 for the convenience of inserting the crystal.

In the crystal array multi-line cutting fixture in the embodiment, the width of the cutting slit 21 is between 0.2mm and 2 mm. The clamp 3 is made of polyethylene or pure aluminum.

It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the utility model, and that various changes in form and details may be made therein without departing from the spirit and scope of the utility model in practice.

Claims

1. A multi-wire cutting clamp for a crystal array is characterized by comprising:

a bottom plate, a plurality of first connecting plates,

a resin plate fixed above the bottom plate;

the cutting seams are arranged above the resin plate along a preset axis;

2. The multi-wire sawing fixture for crystal arrays according to claim 1, wherein the bottom plate and the resin plate are square; one end of the bottom plate is aligned with one end of the resin plate.

3. The multi-wire cutting fixture for crystal arrays according to claim 1, wherein a plurality of cutting seams are arranged in parallel; the cutting seams are equal to the intervals between the cutting seams.

4. The multi-wire sawing fixture for crystal arrays according to claim 1, wherein the fixture is in a square configuration, and a platform is disposed above the fixture; hollowing out a plurality of grooves on the clamp; a crystal is placed in the groove; a groove platform is arranged on the periphery of the groove, and a reference surface is arranged between the groove and the groove.

5. The multi-wire sawing fixture for crystal arrays according to claim 4, wherein the platform coincides with the upper surface of the base plate and the inner side of the platform coincides with the front end of the resin plate.

6. The multi-wire sawing fixture for a crystal array according to claim 4, wherein pads are embedded under the four corners of the reference surface to suspend the fixture above the upper surface of the resin plate.

7. The multi-wire saw fixture for crystal arrays as claimed in claim 4, wherein a handle is provided at each end of the fixture.

8. The multi-wire sawing jig for crystal arrays according to claim 4, wherein a fabrication hole is formed at a corner of the groove.

9. The multi-wire sawing fixture for crystal arrays according to claim 3, wherein the width of the dicing lines is between 0.2mm and 2 mm.

10. The multi-wire sawing fixture for crystal arrays according to claim 4, wherein the fixture material is polyethylene or pure aluminum.