CN213026071U

CN213026071U - Small-diameter wafer cleaning box

Info

Publication number: CN213026071U
Application number: CN202022456405.XU
Authority: CN
Inventors: 朱中晓; 张凯剑
Original assignee: Beijing Crystal Photoelectric Science & Technology Inc
Current assignee: Beijing Crystal Photoelectric Science & Technology Inc
Priority date: 2020-10-29
Filing date: 2020-10-29
Publication date: 2021-04-20
Anticipated expiration: 2030-10-29

Abstract

The utility model discloses a small-diameter wafer cleaning box, which comprises a box body, a plurality of cleaning grooves and positioning holes, wherein the cleaning grooves and the positioning holes are arranged on the box body, a plurality of clamping grooves with cambered surfaces as inner walls are symmetrically arranged on two sides of each cleaning groove along the length direction of the cleaning groove, and adjacent clamping grooves on the same side of each cleaning groove are arranged at intervals; a plurality of water permeable holes are arranged on the box body positioned at the bottom of the cleaning tank along the length direction of the cleaning tank. When cleaning, the wafer is placed in the clamping groove, the distance exists between the adjacent wafers, the phenomenon of lamination is avoided, the cleaning requirement of a single wafer is guaranteed, the cleaning quality is high, meanwhile, the cleaning box is provided with the positioning hole, at least two cleaning boxes are allowed to be stacked together to realize combined cleaning, the cleaning quantity is large, the wafer placed in the opposite clamping groove in the cleaning process is covered by another cleaning box, and the phenomena of material running and material loss caused by small floating of the wafer are avoided.

Description

Small-diameter wafer cleaning box

Technical Field

The utility model belongs to the technical field of quartz wafer processing, concretely relates to minor diameter wafer washs box.

Background

With the rapid development of national economy, quartz wafers are widely applied to the technical field of electronic components, and in the production process, the quartz wafers need to undergo multiple processing procedures (such as grinding and polishing), and the surfaces of the quartz wafers are polluted by each procedure, so that the quartz wafers after being processed need to be cleaned. The conventional cleaning method, in which the wafers are stacked in a plastic basket, the plastic basket is placed in a container containing a cleaning solution (e.g., absolute ethanol), and the container is then placed in an ultrasonic cleaning machine for cleaning, has disadvantages in that: (1) the wafers are in a stacked state before being placed in the container, so that the wafers are easy to be laminated, and cannot be cleaned; (2) in the cleaning process, the wafer is in a floating state due to small volume and is easy to run, so that the wafer is lost.

Disclosure of Invention

The utility model aims to overcome the defects of the traditional cleaning method in cleaning the small-diameter wafer, and provides a small-diameter wafer cleaning box.

The utility model aims at adopting the following technical scheme to realize. According to the utility model, the small-diameter wafer cleaning box comprises a box body, a plurality of cleaning grooves and positioning holes, wherein the cleaning grooves and the positioning holes are arranged on the box body, a plurality of clamping grooves with cambered inner walls are symmetrically arranged on two sides of each cleaning groove along the length direction of the cleaning groove, and adjacent clamping grooves on the same side of the cleaning groove are arranged at intervals; a plurality of water permeable holes are arranged on the box body positioned at the bottom of the cleaning tank along the length direction of the cleaning tank.

Furthermore, a plurality of cleaning tanks are distributed in an array along the direction from the center of the box body to the edge of the box body.

Furthermore, one water permeable hole corresponds to two clamping grooves which are distributed oppositely.

Further, the bottom surface of the clamping groove is higher than the bottom surface of the cleaning groove.

Furthermore, the positioning holes are arranged at the center and the edge of the box body.

Furthermore, the material of box body is organic glass.

The utility model relates to a minor diameter wafer cleaning box has following advantage:

(1) the adjacent clamping grooves on the same side of the cleaning groove are arranged at intervals, so that the wafers are convenient to take by using tweezers, and the adjacent wafers have intervals, so that the phenomenon of lamination is avoided, the cleaning requirement of a single wafer is ensured, and the cleaning quality is high;

(2) the design of the positioning hole allows at least two cleaning boxes to be stacked together to realize combined cleaning, the cleaning quantity is large, wafers placed in opposite clamping grooves in the cleaning process are covered by the other cleaning box, and the phenomena of material leakage and material loss caused by the fact that the wafers float due to small size are avoided;

(3) the box body can be made of organic glass, so that the box body is convenient to purchase and manufacture, can be recycled for multiple times, and is economical and practical.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following preferred embodiments are described in detail with reference to the accompanying drawings.

Drawings

FIG. 1 is a schematic view of an embodiment of a small diameter wafer cleaning cassette according to the present invention.

FIG. 2 is a schematic diagram showing the positional relationship among the cleaning tank, the holding tank and the water permeable holes in the present embodiment.

[ reference numerals ]

1-box body 2-cleaning tank 3-positioning hole 4-clamping tank 5-water permeable hole

Detailed Description

The technical solution of the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.

Referring to fig. 1, an embodiment of a small diameter wafer cleaning box according to the present invention is shown. The embodiment comprises a box body 1, eight cleaning grooves 2 arranged on the box body and five positioning holes 3 arranged at the center and the corner of the box body.

The box body 1 is made of organic glass, so that the box body is convenient to purchase and manufacture, can be recycled for multiple times, and is economical and practical.

Referring to fig. 2, the eight cleaning tanks 2 are distributed in an array along the direction from the center of the box body to the edge of the box body, each cleaning tank 2 is square, a plurality of clamping grooves 4 are symmetrically arranged on two sides of each cleaning tank along the length direction of the cleaning tank, the inner wall of each clamping groove is an arc surface, when the wafer is placed in the two opposite clamping grooves, the edge of the wafer abuts against the inner wall of the clamping groove to form line contact, and the phenomenon that the surface of the wafer is contacted with the inner wall of the clamping groove to cause unclean cleaning is avoided; lie in the washing tank and be the interval setting with adjacent centre gripping groove 4 on the same side, be convenient for put into the wafer with tweezers on the one hand or take the centre gripping inslot out, on the other hand makes to place and has the interval between the adjacent wafer in same washing tank, avoids the appearance of lamination phenomenon, guarantees the washing needs of single wafer, the high quality of cleaning. Be located the length direction of the edge washing tank on the box body of washing tank bottom and be equipped with a plurality of holes 5 of permeating water, flow out the washing tank after supplying to wash the water droplet on the completion back wafer and drop. Furthermore, one water permeable hole corresponds to the two opposite clamping grooves, so that the cleaning efficiency is improved; the bottom surface of the clamping groove is higher than that of the cleaning groove, so that water drops falling from a certain wafer are prevented from polluting other wafers.

The design of the positioning holes allows at least two cleaning boxes to be stacked together to realize combined cleaning, the cleaning quantity is large, 305 multiplied by n pieces can be cleaned at one time (wherein 305 is the upper limit of the quantity of wafers which can be placed in a single cleaning box in the embodiment, and n is the quantity of the stacked cleaning boxes), and the wafers which are placed in the opposite clamping grooves in the cleaning process are covered by the other cleaning box, so that the phenomena of material leakage and material loss caused by the fact that the wafers float due to small size are avoided.

The utility model discloses an in other embodiments, the shape of washing tank can carry out corresponding adjustment according to the shape of box body, for example when the box body is circular, can establish the shape of washing tank into with the endocentric circular of box body, the locating hole can set up in the center and the edge of box body this moment.

The above description is only a preferred embodiment of the present invention, and any person skilled in the art can easily modify, change or modify the above embodiments according to the technical spirit of the present invention without departing from the scope of the present invention.

Claims

1. A small-diameter wafer cleaning box is characterized by comprising a box body, a plurality of cleaning grooves and positioning holes, wherein the cleaning grooves and the positioning holes are arranged on the box body; a plurality of water permeable holes are arranged on the box body positioned at the bottom of the cleaning tank along the length direction of the cleaning tank.

2. The small diameter wafer cleaning box of claim 1, wherein the plurality of cleaning tanks are distributed in an array along the center of the box body toward the edge of the box body.

3. A small-diameter wafer cleaning cartridge as defined in claim 1, wherein one water permeable hole corresponds to two holding grooves which are oppositely disposed.

4. The small diameter wafer cleaning box according to claim 1, wherein the bottom surface of the holding groove is higher than the bottom surface of the cleaning groove.

5. The small diameter wafer cleaning box of claim 1, wherein the positioning holes are disposed at the center and the edge of the box body.

6. A small diameter wafer cleaning box according to any one of claims 1 to 5, wherein the material of the box body is organic glass.