CN215898298U

CN215898298U - C-band multi-channel T/R module

Info

Publication number: CN215898298U
Application number: CN202121901164.3U
Authority: CN
Inventors: 刘亮; 王希; 耿光宇; 祁晓静
Original assignee: Beijing Qixing Huachuang Microwave Electronic Technology Co ltd
Current assignee: Beijing Qixing Huachuang Microwave Electronic Technology Co ltd
Priority date: 2021-08-14
Filing date: 2021-08-14
Publication date: 2022-02-22
Anticipated expiration: 2031-08-14

Abstract

The utility model relates to the technical field of electricians and electronics, in particular to a C-band multichannel T/R module, which comprises a packaging base and a packaging cover, wherein an external lead groove is formed in the packaging base, an external lead hole is formed in the packaging base, a corresponding through hole is formed in the packaging cover, a heat conduction structure with a bidirectional heat dissipation function is arranged on the packaging base, the heat conduction structure is hermetically connected with the packaging base through a base plate, an installation frame is fixedly arranged on the heat conduction structure, an electronic element is arranged on the installation frame, and the heat conduction structure is connected in the external lead groove and the external lead hole; the packaging base and the packaging cover are packaged to form an integral module, the packaging base is provided with an open type outer leading groove and an outer leading hole for installing a radiating component so as to form a radiating channel, and a heat conducting structure is formed by a heat conducting plate, ribs, heat conducting columns and a heat absorbing rod and used for radiating the module and has a bidirectional radiating function.

Description

C-band multi-channel T/R module

Technical Field

The utility model relates to the technical field of electricians and electronics, in particular to a C-band multichannel T/R module.

Background

Currently, active phased array radars are the mainstream in radar development, and each active phased array radar comprises a plurality of T/R components, completes receiving tasks and transmitting tasks and performs phase scanning on an antenna. Each T/R component is equivalent to a tuner of a common radar, and comprises a transmitting power amplifier, a low-noise amplifier, a phase shifter, a beam control circuit and other functional circuits. With the higher and higher requirements of modern science and technology on the active phased array radar, higher requirements are also put forward on various performances of the T/R assembly, and the T/R assembly is high in integration level, good in consistency, small in size and light in weight, and can adapt to different working platforms and environments. The C wave band is the main use frequency band of the T/R module, and the application range is wide.

The existing T/R module is generally of a multi-channel structure in order to increase performance, generally adopts an encapsulation structure, has better air tightness, and can prevent dust, water mist and the like from entering the module to influence the service life of the module, but in the use process of the T/R module, a large amount of heat is easily generated inside the T/R module, the use of electronic elements can be influenced, and due to the fact that materials of all parts in the module are different, the T/R module has different heat conductivity and thermal expansion rates, mutual extrusion deformation is easy to occur under the high-temperature and low-temperature environment, and the service life of the module is shortened. In view of this, we propose a C-band multi-channel T/R module.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a C-band multi-channel T/R module to solve the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a C wave band multichannel T/R module, includes packaging base and encapsulation lid, packaging base is last to be provided with outer guide groove, and packaging base is last to be provided with outer guide hole, and the encapsulation is covered and is provided with corresponding through-hole, packaging base is last to be provided with the heat conduction structure that has two-way heat dissipation function, and the heat conduction structure carries out sealing connection through backing plate and packaging base, last fixed mounting of heat conduction structure has the installation frame, and installs electronic component on the installation frame, the heat conduction structural connection is in outer guide groove and outer guide hole.

Preferably, the packaging base and the packaging cover are both provided with mounting grooves, and the packaging base and the packaging cover are packaged to form a module shell.

Preferably, the outer lead groove penetrates through the bottom surface of the packaging base, and the outer lead hole penetrates through the side surface of the packaging base.

Preferably, the heat conducting structure is composed of a heat conducting plate, ribs, heat conducting columns and a heat absorbing rod.

Preferably, rib and heat-conducting plate are sheet metal, and the rib range is installed in the bottom surface of heat-conducting plate, the heat-conducting plate is installed in leading the groove outward, and the backing plate is connected between the last spacing panel and the encapsulation base of heat-conducting plate, the upper surface at the heat-conducting plate is installed to the heat conduction post, and the heat absorbing rod is arranged in leading the hole outward.

Preferably, the heat absorption rod is provided with fins in an annular shape, a liquid tank is arranged in the heat absorption rod, and cooling liquid is filled in the liquid tank.

Compared with the prior art, the utility model has the beneficial effects that:

1. the heat conducting plate is installed through the outer guide groove and can conduct heat rapidly, firstly, the heat conducting plate can lead the heat out from the bottom of the packaging base rapidly, the ribs can increase the heat dissipation area so as to increase the heat dissipation efficiency, meanwhile, the heat conducting plate can transmit the heat into the heat conducting columns and further lead the heat into the heat absorbing rod, and conducts the heat from the side surface of the packaging base, the fins can increase the heat dissipation area so as to increase the heat dissipation efficiency, and meanwhile, liquid with large specific heat capacity is pre-filled in the liquid tank of the heat absorption rod, so that heat can be stored, the heat absorption capacity of the heat absorption rod is increased, the low-temperature environment in the module can be effectively maintained through bidirectional heat dissipation, and the service life of the module is prolonged;

2. according to the utility model, the base plate is arranged between the heat conducting plate and the packaging base, and is a soft cushion layer, so that on one hand, the mounting gap can be eliminated, the sealing and dustproof effects are realized, the module is ensured to have good heat dissipation performance and meanwhile has sealing performance, and on the other hand, the base plate is used as an elastic supporting structure and has certain deformation capacity, so that a certain expansion space can be provided for elements on the base plate, mutual extrusion damage is prevented, and the service life of the module is further prolonged.

Drawings

FIG. 1 is a schematic front view of the structure of the present invention;

FIG. 2 is a schematic reverse side view of the structure of the present invention;

fig. 3 is an exploded view of the structure of the present invention.

In the figure: the packaging structure comprises a packaging base 1, a packaging cover 2, an external lead groove 3, an external lead hole 4, a base plate 5, a heat conduction plate 6, ribs 7, a mounting frame 8, heat conduction columns 9, heat absorption rods 10, fins 11 and a liquid tank 12.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 3, the present invention provides a technical solution: the utility model provides a C wave band multichannel T/R module, including packaging base 1 and encapsulation lid 2, packaging base 1 is last to be provided with outer lead groove 3, and packaging base 1 is last to be provided with outer lead hole 4, and packaging lid 2 is last to be provided with corresponding through-hole, packaging base 1 is last to be provided with the heat conduction structure that has two-way heat dissipation function, and the heat conduction structure carries out sealing connection through backing plate 5 and packaging base 1, last fixed mounting of heat conduction structure has installation frame 8, and install electronic component on the installation frame 8, the heat conduction structure is connected in outer lead groove 3 and outer lead hole 4.

Mounting grooves are formed in the packaging base 1 and the packaging cover 2, the packaging base 1 and the packaging cover 2 are packaged to form a module shell, and internal electronic elements are effectively protected through the packaging connection of the packaging base 1 and the packaging cover 2 to form an integral module;

the external lead through groove 3 is arranged on the bottom surface of the packaging base 1 in a penetrating manner, the external lead hole 4 is arranged on the side surface of the packaging base 1 in a penetrating manner, and the external lead through groove 3 and the external lead hole 4 are used for installing a heat dissipation assembly to form a heat dissipation channel;

the heat conducting structure consists of a heat conducting plate 6, ribs 7, heat conducting columns 9 and a heat absorbing rod 10;

the ribs 7 and the heat conducting plate 6 are made of metal plates, the ribs 7 are arranged on the bottom surface of the heat conducting plate 6, the heat conducting plate 6 is arranged in the outer guiding groove 3, the backing plate 5 is connected between the upper limiting panel of the heat conducting plate 6 and the packaging base 1, the heat conducting columns 9 are arranged on the upper surface of the heat conducting plate 6, the heat absorbing rods 10 are positioned in the outer guiding holes 4, the heat conducting structure takes the heat conducting plate 6 as a core, the heat conducting plate 6 is used for fixing the mounting frame 8, so that main heating elements are all arranged on the heat conducting plate 6, the heat conducting plate 6 can conduct heat rapidly, firstly, the heat conducting plate 6 penetrates through the outer guiding groove 3 to be mounted, the heat can be rapidly led out from the bottom of the packaging base 1, the ribs 7 can increase the heat dissipation area and further increase the heat dissipation efficiency, the backing plate 5 is arranged between the heat conducting plate 6 and the packaging base 1, the backing plate 5 is a cushion layer, on one hand, the mounting gap can be eliminated, the dustproof structure has the advantages that the dustproof structure plays a role in sealing and dust prevention, and on the other hand, the dustproof structure is used as an elastic supporting structure, has certain deformation capacity, can provide certain expansion space for elements on the elastic supporting structure, and prevents mutual extrusion damage;

fins 11 are annularly arranged on the heat absorption rod 10, a liquid tank 12 is arranged in the heat absorption rod 10, cooling liquid is filled in the liquid tank 12, meanwhile, the heat conducting plate 6 can transmit heat into the heat conducting columns 9 and further guide the heat conducting columns into the heat absorption rod 10, heat dissipation is carried out from the side face of the packaging base 1, the fins 11 can increase the heat dissipation area so as to increase the heat dissipation efficiency, meanwhile, liquid with large specific heat capacity is pre-filled in the liquid tank 12 of the heat absorption rod 10, heat storage can be carried out, and the heat absorption capacity of the heat absorption rod 10 is increased;

the working principle is as follows: firstly, the internal electronic components are effectively protected through the encapsulation connection of the encapsulation base 1 and the encapsulation cover 2 to form an integral module, the external lead through groove 3 and the external lead hole 4 are used for installing a heat dissipation component to form a heat dissipation channel, a heat conduction plate 6, a rib 7, a heat conduction column 9 and a heat absorption rod 10 form a heat conduction structure for heat dissipation of the module, the heat conduction structure has a bidirectional heat dissipation function, the heat conduction structure takes the heat conduction plate 6 as a core, the heat conduction plate 6 is used for fixing an installation frame 8, so that main heating components are all installed on the heat conduction plate 6, the heat conduction plate 6 can conduct heat quickly, firstly, the heat conduction plate 6 penetrates through the external lead through groove 3 to be installed, the heat can be quickly led out from the bottom of the encapsulation base 1, the rib 7 can increase the heat dissipation area to increase the heat dissipation efficiency, and a backing plate 5 is arranged between the heat conduction plate 6 and the encapsulation base 1, backing plate 5 is the cushion layer, on the one hand can eliminate the installation clearance, play sealed dirt-proof effect, on the other hand is as elastic support structure, it has certain deformability, can provide certain expansion space for the component above that, prevent mutual extrusion damage, heat-conducting plate 6 can spread into heat conduction post 9 with the heat simultaneously, and then with its leading-in to the hot rod 10 on, dispel the heat from packaging base 1's side, thereby fin 11 can increase heat radiating area and increase radiating efficiency, the liquid of big specific heat capacity is gone into in the cistern 12 of hot rod 10 to the while, can carry out thermal storage, the heat absorbing capacity of hot rod 10 has been increased.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a C wave band multichannel T/R module, includes encapsulation base (1) and encapsulation lid (2), its characterized in that: be provided with outer lead groove (3) on encapsulation base (1), and be provided with outer lead hole (4) on encapsulation base (1), and be provided with corresponding through-hole on encapsulation lid (2), be provided with the heat conduction structure that has the two-way heat dissipation function on encapsulation base (1), and the heat conduction structure carries out sealing connection through backing plate (5) and encapsulation base (1), the last fixed mounting of heat conduction structure has installation frame (8), and installs electronic component on installation frame (8), the heat conduction structure is connected in outer lead groove (3) and outer lead hole (4).

2. The C-band multichannel T/R module of claim 1, wherein: the packaging structure is characterized in that mounting grooves are formed in the packaging base (1) and the packaging cover (2), and the packaging base (1) and the packaging cover (2) are packaged to form a module shell.

3. The C-band multichannel T/R module of claim 1, wherein: the outer lead through groove (3) penetrates through the bottom surface of the packaging base (1), and the outer lead hole (4) penetrates through the side surface of the packaging base (1).

4. The C-band multichannel T/R module of claim 1, wherein: the heat conduction structure is composed of a heat conduction plate (6), ribs (7), heat conduction columns (9) and a heat absorption rod (10).

5. The C-band multichannel T/R module of claim 4, characterized in that: rib (7) and heat-conducting plate (6) are sheet metal, and arrange rib (7) and install the bottom surface at heat-conducting plate (6), heat-conducting plate (6) are installed in leading groove (3) outward, and backing plate (5) are connected between the last spacing panel and encapsulation base (1) of heat-conducting plate (6), heat conduction post (9) are installed at the upper surface of heat-conducting plate (6), and heat absorbing rod (10) are located and lead hole (4) outward.

6. The C-band multichannel T/R module of claim 5, characterized in that: fins (11) are annularly arranged on the heat absorption rod (10), a liquid tank (12) is arranged in the heat absorption rod (10), and cooling liquid is filled in the liquid tank (12).