CN220545350U - Heat radiation structure of concentrator - Google Patents
Heat radiation structure of concentrator Download PDFInfo
- Publication number
- CN220545350U CN220545350U CN202321803253.3U CN202321803253U CN220545350U CN 220545350 U CN220545350 U CN 220545350U CN 202321803253 U CN202321803253 U CN 202321803253U CN 220545350 U CN220545350 U CN 220545350U
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- CN
- China
- Prior art keywords
- heat dissipation
- concentrator
- radiator
- heat
- shell
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- 230000005855 radiation Effects 0.000 title claims abstract description 11
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 8
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 8
- 239000004973 liquid crystal related substance Substances 0.000 claims description 7
- -1 polytetrafluoroethylene Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 53
- 238000001816 cooling Methods 0.000 abstract description 3
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the technical field of I-type concentrators, and particularly relates to a heat dissipation structure of a concentrator, which comprises an upper shell, a lower shell, a PCB (printed circuit board), a radiator and a buffer gasket, wherein the PCB is arranged in the lower shell, a chip is arranged on the PCB, the radiator is arranged on the PCB, a plurality of toothed heat dissipation grooves are formed in the top surface of the radiator, the buffer gasket is arranged between the chip and the radiator, a first heat dissipation hole is formed in the upper shell, a first waterproof and breathable film is arranged on the upper shell, a second heat dissipation hole is formed in the lower shell, a second waterproof and breathable film is arranged on the lower shell, and the first heat dissipation hole and the second heat dissipation hole are mutually corresponding and communicated; compared with the prior art, the toothed heat dissipation grooves on the top surface of the radiator can ensure enough heat dissipation surface area and air fluidity among a plurality of heat dissipation grooves, so that a good heat radiation channel can be formed in the shell, and the heat flow is facilitated; by adding a convection window on the front and back of the shell, air convection cooling is generated.
Description
Technical Field
The present utility model relates to concentrator type I, and more particularly, to a heat dissipation structure for a concentrator.
Background
The national grid company updates and releases the heat dissipation standard of the concentrator I in 2022, the installation environment of the concentrator I is different according to the different regional environments of China, and particularly, the heat dissipated by the long-time operation of the concentrator I in the coastal areas in the south is high in temperature and humidity, so that the heat dissipation of the concentrator I has important influence on circuit boards and components in the shell of the concentrator I.
Especially, if the heat dissipation performance of the concentrator is insufficient, heat generated by the chip working is accumulated in the shell, so that the temperature of the chip is increased; and once the temperature of the chip is too high, the service life and performance of the chip can be reduced, and even the concentrator cannot work normally.
Therefore, a heat dissipation structure of the upper shell of the concentrator with a heat dissipation function is urgently needed.
Disclosure of Invention
In view of the shortcomings of the prior art, an object of the present utility model is to provide a heat dissipation structure on a concentrator that solves the above-mentioned technical problems.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
a heat dissipation structure of a concentrator comprises an upper shell, a lower shell and a PCB board, wherein the PCB board is arranged in the lower shell, a chip is arranged on the PCB board, the heat dissipation structure comprises a radiator and a buffer gasket, the radiator is arranged on the PCB board, the buffer gasket is arranged between the chip and the radiator,
the upper shell is provided with a first heat dissipation hole, the upper shell is provided with a first waterproof breathable film for sealing the first heat dissipation hole, the lower shell is provided with a second waterproof breathable film for sealing the second heat dissipation hole, and the first heat dissipation hole and the second heat dissipation hole are mutually corresponding and communicated.
Further, the first waterproof breathable film and the second waterproof breathable film are polytetrafluoroethylene microporous films.
Further, the buffer gasket is a heat-conducting silica gel gasket.
Further, the heat sink is formed of a metal block having good thermal conductivity, such as copper, silver, aluminum, etc., and an embedded groove for receiving the chip is formed on the bottom surface of the heat sink.
Further, the concentrator also comprises a liquid crystal display screen, and the liquid crystal display screen is arranged on the radiator.
Further, a plurality of tooth-shaped heat dissipation grooves are formed in the top surface of the radiator, and the tooth-shaped heat dissipation grooves correspond to the second heat dissipation holes.
By adopting the technical scheme, the utility model has the beneficial effects that:
1. the plurality of tooth-shaped radiating grooves are arranged on the top surface of the radiator, so that not only can the sufficient radiating surface area be ensured, but also the air flowability among the plurality of radiating grooves can be ensured, so that a good heat radiation channel can be formed inside the shell, and the heat flow is facilitated;
2. the contact interface between the chip and the radiator is uneven, so that the heat-conducting silicone grease gasket is filled between the chip and the radiator, the damage caused by collision between the chip and the radiator is reduced, and the insulation effect is achieved;
3. in order to further improve the heat dissipation efficiency of the chip, a convection window (a first heat dissipation hole and a second heat dissipation hole) is added on the front side and the back side of the shell to generate air convection cooling;
4. in order to ensure the dust prevention and the water prevention of the I-shaped shell of the concentrator, PTFE films (polytetrafluoroethylene microporous films) are additionally arranged on the first heat dissipation holes and the second heat dissipation holes, and the PTFE films (polytetrafluoroethylene microporous films) are densely and uniformly provided with micropores which are waterproof and breathable, so that dust can be effectively blocked, the heat dissipation is realized, and the IP protection performance of the product is not reduced.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present utility model.
Fig. 2 is a schematic diagram of an explosion structure according to an embodiment of the present utility model.
Fig. 3 is a schematic cross-sectional structure of the cooperation of the heat sink and the PCB board.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
The concentrator comprises an upper shell 1, a lower shell 2, a PCB 3, a radiator 4, a buffer gasket 5, a liquid crystal display 6 and a PCB 3, wherein the PCB 3 is arranged in the lower shell 2, a chip 31 is arranged on the PCB 3, a heat dissipation structure comprises the radiator 4 and the buffer gasket 5, the buffer gasket 5 is a heat conduction silica gel gasket, the radiator 4 is arranged on the PCB 3, the buffer gasket 5 is arranged between the chip 31 and the radiator 4, the radiator 4 is composed of metal blocks made of silver, copper or aluminum and the like, an embedded groove 401 for accommodating the chip 31 is formed in the bottom surface of the radiator 4, and a plurality of toothed heat dissipation grooves 402 are formed in the top surface of the radiator 4; the liquid crystal display 6 is arranged on the radiator 4;
when the concentrator works, heat generated on the PCB 3 and the chip 31 is transferred out through the radiator 4, so that the heat dissipation of the PCB 3 and the chip 31 is realized; when the radiator 4 is arranged on the PCB 3, the chip 31 stretches into the embedded groove 401, so that the radiator 4 is attached to the PCB 3 and attached to the chip 31 at the same time, and then the radiating effect of the radiator and the chip is ensured; the heat conduction silica gel gasket is arranged between the chip 31 and the radiator 4, so that the chip 31 is not easy to be damaged due to extrusion force when the radiator 4 is assembled, and heat can be transferred out through the heat conduction silica gel gasket; the plurality of tooth-shaped heat dissipation grooves 402 can ensure enough heat dissipation surface area and air fluidity among the plurality of heat dissipation grooves 402, so that a good heat radiation channel can be formed inside the shell, and the heat flow is facilitated; the radiator 4 can also radiate heat at the liquid crystal display 6, so that efficient heat radiation inside the concentrator is realized.
The upper shell 1 is provided with a first heat dissipation hole 101, the upper shell 1 is provided with a first waterproof and breathable film for sealing the first heat dissipation hole 101, the lower shell 2 is provided with a second heat dissipation hole 102, the toothed heat dissipation grooves 402 correspond to the second heat dissipation hole 102, the lower shell 2 is provided with a second waterproof and breathable film for sealing the second heat dissipation hole 102, the first heat dissipation hole 101 and the second heat dissipation hole 102 correspond to each other and are communicated, and the first waterproof and breathable film and the second waterproof and breathable film are polytetrafluoroethylene microporous films;
during the working process of the concentrator, air can enter from the first heat dissipation holes 101 (the second heat dissipation holes 102) and be discharged from the second heat dissipation holes 102 (the first heat dissipation holes 101), so that heat in the concentrator shell is discharged; the convection windows (the first heat radiation holes 101 and the second heat radiation holes 102) are added on the front side and the back side of the shell to generate air convection cooling, so that heat radiation in the concentrator shell is realized; the polytetrafluoroethylene microporous membranes additionally arranged on the first heat dissipation holes 101 and the second heat dissipation holes 102 can effectively block dust while being waterproof and breathable, so that heat dissipation is achieved, and the IP protective performance of the product is not reduced.
The above description is only a preferred embodiment of the present utility model, and is not intended to limit the utility model, but one skilled in the art can make common changes and substitutions within the scope of the technical solution of the present utility model.
Claims (6)
1. The heat radiation structure of the concentrator comprises an upper shell, a lower shell and a PCB board, wherein the PCB board is arranged in the lower shell and is provided with a chip, the heat radiation structure is characterized by comprising a radiator and a buffer gasket, the radiator is arranged on the PCB board, the buffer gasket is arranged between the chip and the radiator,
the upper shell is provided with a first radiating hole, the upper shell is provided with a first waterproof breathable film for sealing the first radiating hole, the lower shell is provided with a second waterproof breathable film for sealing the second radiating hole, and the first radiating hole and the second radiating hole correspond to each other and are communicated.
2. The heat dissipating structure of a concentrator of claim 1, wherein said first water-resistant breathable film and said second water-resistant breathable film are polytetrafluoroethylene microporous films.
3. The heat dissipating structure of a concentrator of claim 1, wherein said buffer pad is a thermally conductive silicone pad.
4. A heat dissipating structure of a concentrator as claimed in claim 3, wherein said heat sink is formed of a metal block having good thermal conductivity, and an embedded groove for receiving a chip is formed in a bottom surface of said heat sink.
5. A heat dissipating structure for a concentrator as defined in claim 3, wherein said concentrator further comprises a liquid crystal display, said liquid crystal display being disposed on said heat sink.
6. The heat dissipating structure of the concentrator of claim 4, wherein the top surface of the heat sink has a plurality of tooth-shaped heat dissipating grooves, and wherein the tooth-shaped heat dissipating grooves correspond to the second heat dissipating holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321803253.3U CN220545350U (en) | 2023-07-11 | 2023-07-11 | Heat radiation structure of concentrator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321803253.3U CN220545350U (en) | 2023-07-11 | 2023-07-11 | Heat radiation structure of concentrator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220545350U true CN220545350U (en) | 2024-02-27 |
Family
ID=89974746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321803253.3U Active CN220545350U (en) | 2023-07-11 | 2023-07-11 | Heat radiation structure of concentrator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220545350U (en) |
-
2023
- 2023-07-11 CN CN202321803253.3U patent/CN220545350U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |