CN215872056U

CN215872056U - Adsorption jig

Info

Publication number: CN215872056U
Application number: CN202121916880.9U
Authority: CN
Inventors: 朱志强; 王铃文; 董建成
Original assignee: Fujian Qiangli Photoelectricity Co Ltd
Current assignee: Fujian Qiangli Photoelectricity Co Ltd
Priority date: 2021-08-16
Filing date: 2021-08-16
Publication date: 2022-02-18
Anticipated expiration: 2031-08-16

Abstract

The utility model discloses an adsorption jig which comprises a jig body, wherein a concave adsorption groove is formed in the top of the jig body, the periphery of the adsorption groove is closed, and at least one suction hole is formed in the bottom of the adsorption groove; the side of the jig body is matched with at least one air nozzle, and each air nozzle is communicated with at least one suction hole of the adsorption groove through an air flow channel in the jig body. The adsorption jig can adsorb the PCB and the PCB positioning jig, so that the PCB can be stably separated from a steel mesh when solder paste printing is carried out, and the solder paste printing process can be smoothly completed.

Description

Adsorption jig

Technical Field

The utility model relates to the field of PCBs (printed circuit boards), in particular to an adsorption jig for adsorbing PCBs.

Background

The PCB is also called a printed circuit board or a printed circuit board, and is an important electronic component. Smt (surface Mounted technology) is the most popular technology and process in the electronic assembly industry, and is a circuit connection technology in which surface-Mounted components (SMC/SMD, herein referred to as chip components) without pins or short leads are Mounted on the surface of a PCB or other substrates and soldered or assembled by reflow or dip soldering.

The SMT process flow sequentially comprises solder paste printing, part mounting and reflow soldering. In the solder paste printing process, a PCB is firstly placed in a PCB positioning jig for positioning, and the PCB positioning jig is provided with a through hole which penetrates through the PCB up and down so as to ensure that the PCB can be tightly close to the PCB positioning jig; then, the lifting workbench of the solder paste printer drives the PCB positioning jig to move upwards so that the PCB is tightly attached to the lower surface of the steel mesh; then, a scraper of the solder paste printer brushes the solder paste on the upper surface of the steel mesh, and the solder paste is attached to the PCB board through meshes of the steel mesh; after the solder paste is attached to the PCB, the lifting workbench drives the PCB positioning jig to descend again, so that the PCB is separated from the steel mesh.

There is a problem in current tin cream printing process, that is exactly the PCB board glues in the lower surface of steel mesh because of the influence of tin cream easily, can appear the condition that PCB board and steel mesh can not separate when elevating platform area PCB board positioning jig descends like this, lead to tin cream printing process unusual and influence subsequent part and paste the dress and go on of reflow soldering process.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an adsorption jig to overcome the defects in the prior art.

In order to achieve the above purpose, the solution of the utility model is:

an adsorption jig comprises a jig body, wherein a concave adsorption groove is formed in the top of the jig body, the periphery of the adsorption groove is closed, and at least one suction hole is formed in the bottom of the adsorption groove; the side of the jig body is matched with at least one air nozzle, and each air nozzle is communicated with at least one suction hole of the adsorption groove through an air flow channel in the jig body.

The bottom of the jig body is matched with a plurality of magnets.

The top side of the periphery of the adsorption groove is matched with an elastic gasket.

The jig body is made of bakelite.

The bottom of the jig body is provided with a plurality of reinforcing ribs and/or a plurality of reinforcing columns.

After the scheme is adopted, when the tin paste adsorption jig is used, the jig body of the adsorption jig is fixed on the lifting workbench of a tin paste printing machine, and the air nozzle of the adsorption jig is connected with an external air suction pump. When the PCB needs to be subjected to solder paste printing, the PCB is firstly placed on the PCB positioning jig and covers the through hole of the PCB positioning jig; then, the PCB positioning jig is placed on the jig body of the adsorption jig, so that the PCB positioning jig covers the opening of the adsorption groove of the jig body and the through hole of the PCB positioning jig is communicated with the adsorption groove of the jig body; then, the lifting workbench of the solder paste printer drives the jig body to move upwards so that the PCB is attached to the lower surface of the steel mesh; then, a scraper of the solder paste printer brushes the solder paste on the upper surface of the steel mesh, so that the solder paste is attached to the PCB through meshes of the steel mesh; then, an air suction pump connected with the air tap works, and the air suction pump sucks air in the adsorption groove of the jig body to adsorb the PCB and the PCB positioning jig on the jig body; and finally, the lifting workbench of the solder paste printer drives the jig body to move downwards, so that the PCB is separated from the steel mesh. The adsorption jig can adsorb the PCB and the PCB positioning jig, so that the PCB can be stably separated from the steel mesh, and the solder paste printing process can be smoothly completed.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a bottom view of the present invention;

FIG. 3 is a side view of the present invention;

description of reference numerals:

a jig body 1, an adsorption groove 11, a suction hole 111, a reinforcing rib 12, a reinforcing column 13,

the air tap 2 is provided with a nozzle body,

the magnetic force of the magnet (3),

an elastic washer 4.

Detailed Description

In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following specific examples.

As shown in fig. 1 to 3, the present invention discloses an adsorption jig, which includes a jig body 1, wherein a concave adsorption groove 11 is disposed at the top of the jig body 1, the periphery of the adsorption groove 11 is closed, and at least one suction hole 111 is disposed at the bottom of the adsorption groove 11; the side cooperation of tool body 1 has at least one air cock 2, and every air cock 2 is linked together through the air current passageway in the tool body 1 and at least one suction hole 111 of absorption groove 11, and air cock 2 is used for connecting the aspirator pump and makes the aspirator pump can suck the air in the absorption groove 11.

When the utility model is used, the fixture body 1 of the adsorption fixture is fixed on a lifting workbench of a solder paste printing machine, and the air nozzle 2 of the adsorption fixture is connected with an external air suction pump. When the PCB needs to be subjected to solder paste printing, the PCB is firstly placed on the PCB positioning jig and covers the through hole of the PCB positioning jig; then, the PCB positioning jig is placed on the jig body 1 of the adsorption jig again, so that the PCB positioning jig covers the opening of the adsorption groove 11 of the jig body 1 and the through hole of the PCB positioning jig is communicated with the adsorption groove 11 of the jig body 1; then, the lifting workbench of the solder paste printer drives the jig body 1 to move upwards so that the PCB is attached to the lower surface of the steel mesh; then, a scraper of the solder paste printer brushes the solder paste on the upper surface of the steel mesh, so that the solder paste is attached to the PCB through meshes of the steel mesh; then, an air suction pump connected with the air tap 2 works, and the air suction pump sucks air in the adsorption groove 11 of the jig body 1 to enable the PCB and the PCB positioning jig to be adsorbed on the jig body 1; and finally, the lifting workbench of the solder paste printer drives the jig body 1 to move downwards, so that the PCB is separated from the steel mesh. The adsorption jig can adsorb the PCB and the PCB positioning jig, so that the PCB can be stably separated from the steel mesh, and the solder paste printing process can be smoothly completed.

In the utility model, the jig body 1 can be made of bakelite, so that the jig body 1 has the advantages of good insulation, good heat resistance and corrosion resistance; as shown in fig. 1 to 3, the bottom of the jig body 1 can be provided with a plurality of reinforcing ribs 12 and a plurality of reinforcing columns 13, so as to effectively improve the overall structural strength of the jig body 1, and it should be noted that only one of the reinforcing ribs 12 and the reinforcing columns 13 is provided at the bottom of the jig body 1, so as to effectively improve the overall structural strength of the jig body 1.

As shown in fig. 1, the bottom of the adsorption groove 11 of the fixture body 1 may be provided with four suction holes 111, and the side of the fixture body 1 is provided with four air nozzles 2, and the four air nozzles 2 are respectively communicated with the four suction holes 111 of the adsorption groove 11 through the airflow channel in the fixture body 1.

As shown in fig. 2, a plurality of magnets 3 can be fitted at the bottom of the jig body 1, so that the jig body 1 can be fixed on a lifting workbench of a solder paste printing machine in a magnetic attraction manner, and people can very conveniently fix the jig body 1 on the lifting workbench of the solder paste printing machine; wherein the magnet 3 can be fixed on the reinforcing column 13 at the bottom of the jig body 1.

As shown in fig. 1, the top side of the periphery of the absorption groove 11 of the jig body 1 can be matched with an elastic gasket 4, and the elastic gasket 4 is used for buffering when contacting with a PCB positioning jig, so that the service life of the jig body 1 is prolonged; the elastic washer 4 may be bonded on the top side of the periphery of the adsorption groove 11.

The above embodiments and drawings are not intended to limit the form and style of the present invention, and any suitable changes or modifications thereof by those skilled in the art should be considered as not departing from the scope of the present invention.

Claims

1. The utility model provides an adsorb tool which characterized in that: the jig comprises a jig body, wherein a concave adsorption groove is formed in the top of the jig body, the periphery of the adsorption groove is closed, and at least one suction hole is formed in the bottom of the adsorption groove; the side of the jig body is matched with at least one air nozzle, and each air nozzle is communicated with at least one suction hole of the adsorption groove through an air flow channel in the jig body.

2. The absorption fixture according to claim 1, wherein: the bottom of the jig body is matched with a plurality of magnets.

3. The absorption fixture according to claim 1, wherein: the top side of the periphery of the adsorption groove is matched with an elastic gasket.

4. The absorption fixture according to claim 1, wherein: the jig body is made of bakelite.

5. An adsorption jig according to claim 1 or 4, characterized in that: the bottom of the jig body is provided with a plurality of reinforcing ribs and/or a plurality of reinforcing columns.