CN215991809U

CN215991809U - PCB element stacking and mounting structure of SMT micro-pitch ball grid array

Info

Publication number: CN215991809U
Application number: CN202122183898.9U
Authority: CN
Inventors: 刘豹
Original assignee: Suzhou Chenwang Electronic Technology Co ltd
Current assignee: Suzhou Chenwang Electronic Technology Co ltd
Priority date: 2021-09-10
Filing date: 2021-09-10
Publication date: 2022-03-08
Anticipated expiration: 2031-09-10

Abstract

The utility model belongs to the technical field of SMT paster, in particular to a PCB element stacking and pasting structure of an SMT micro-space ball grid array, aiming at the problem that a circuit board is not easy to shake during manual paster of the utility model and the error in the gluing and pasting process is avoided, the utility model provides a scheme which comprises an assembling frame, wherein the outer wall of the assembling frame is fixedly connected with a bearing plate, the outer wall of the bearing plate is provided with an installation groove, the inner wall of the installation groove is fixedly connected with a first U-shaped plate, the outer wall of the assembling frame is provided with a limiting hole, the inner wall of the limiting hole is provided with a threaded hole, the inner wall of the threaded hole is in threaded connection with a bolt, a fixing mechanism is arranged inside the installation groove, the fixing mechanism comprises a round rod, one end of the bolt is rotatably connected with the round rod, one end of the round rod is fixedly connected with a second U-shaped plate, the circuit board is not easy to shake during manual paster, the phenomenon that errors are easily caused in the dispensing and mounting process is avoided.

Description

PCB element stacking and mounting structure of SMT micro-pitch ball grid array

Technical Field

The utility model relates to the technical field of SMT paster, in particular to a PCB element stacking and mounting structure of an SMT micro-space ball grid array.

Background

The SMT paster is a circuit mounting and connecting technology which is characterized in that a pin-free or short-lead surface assembly component is mounted on the surface of a printed circuit board or the surface of other substrates and is welded and assembled by methods such as reflow soldering or dip soldering, and the SMT paster is divided into automatic, semi-automatic and manual pasters, wherein the automatic and semi-automatic pasters generally depend on industrial equipment, the manual pasters generally are manually manufactured by DIY (die bonding), and the manual pasters comprise glue dispensing, pasting (curing) and reflow soldering.

In the prior art, a circuit board is easy to shake during manual mounting, which causes errors in the dispensing and mounting processes, so that an SMT micro-pitch ball grid array PCB element stacking and mounting structure is provided for solving the problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defect that a circuit board is easy to shake during manual chip mounting, so that errors are easy to occur in the processes of dispensing and mounting, and provides a PCB element stacking and mounting structure of an SMT micro-pitch ball grid array.

In order to achieve the purpose, the utility model adopts the following technical scheme:

SMT fine-pitch ball grid array's PCB component piles up pastes dress structure, including the assembly frame, the outer wall fixedly connected with bearing plate of assembly frame, the mounting groove has been seted up to the outer wall of bearing plate, the first U template of inner wall fixedly connected with of mounting groove, spacing hole has been seted up to the outer wall of assembly frame, the inner wall of spacing hole sets up threaded hole, and the inner wall threaded connection of screw hole has the bolt, the inside of mounting groove is equipped with fixed establishment.

Preferably, the fixing mechanism comprises a round rod, one end of the bolt is rotatably connected with the round rod, one end of the round rod is fixedly connected with a second U-shaped plate, the outer walls of the first U-shaped plate and the second U-shaped plate are fixedly connected with rubber pads, a placing groove is formed in the outer wall of the bearing plate, a partition plate is fixedly connected inside the placing groove, a cover plate is rotatably connected to the outer wall of the bearing plate, and the circuit board is clamped through the rubber pads.

Preferably, four round holes are formed in the outer wall of the cover plate, first magnets are fixedly connected to the inner walls of the four round holes, and the circuit board is protected by the cover plate.

Preferably, four through holes are formed in the outer wall of the bearing plate, and the inner walls of the four through holes are fixedly connected with second magnets.

Preferably, the outer wall of the cover plate is provided with a square groove, the inner wall of the square groove is fixedly connected with a transparent plate, and the circuit of the circuit board is observed through the transparent plate.

Preferably, the outer wall of the bearing plate is provided with a sliding hole, and the inner wall of the sliding hole is connected with the outer wall of the round rod in a sliding manner.

Preferably, the outer wall of the cover plate is fixedly connected with a handle.

Compared with the prior art, the utility model has the advantages that:

(1) this scheme places the mounting groove with the circuit board in, the bolt rotates makes the round bar move left, it makes round bar and second U template move left to set up fixed establishment, second U template moves the certain distance back left, press from both sides tightly the circuit board through first U template and rubber pad, can place electronic component in the standing groove simultaneously when the paster, classify electronic component under the effect of baffle, rotatable apron when the operation of interrupting, cover the apron on the bearing board, carry out the rigidity to the apron through four first magnet and second magnet, and the circuit connection condition of circuit board is observed to the accessible transparent plate.

(2) The circuit board is not easy to shake during manual chip mounting, and errors in the processes of glue dispensing and chip mounting are avoided.

Drawings

FIG. 1 is a schematic cross-sectional view of a PCB stacking and mounting structure of SMT micro-pitch ball grid array according to the present invention;

FIG. 2 is an enlarged view of part A of FIG. 1 of a PCB stacking and mounting structure of SMT micro-pitch ball grid array according to the present invention;

fig. 3 is a structural diagram of a bolt and a second U-shaped board of the SMT micro-pitch ball grid array PCB component stacking and mounting structure according to the present invention.

In the figure: 1. assembling the frame; 2. a support plate; 3. mounting grooves; 4. a first U-shaped plate; 5. a limiting hole; 6. a round bar; 7. a bolt; 8. a second U-shaped plate; 9. a rubber pad; 10. a placement groove; 11. a partition plate; 12. a cover plate; 13. a first magnet; 14. a second magnet; 15. a transparent plate.

Detailed Description

Shown by figure 1 and figure 2, PCB component that relates to SMT microspur ball grid array piles up subsides dress structure, including assembly frame 1, assembly frame 1's outer wall fixedly connected with bearing board 2, four through-holes have been seted up to bearing board 2's outer wall, the equal fixedly connected with second magnet 14 of inner wall of four through-holes, mounting groove 3 has been seted up to bearing board 2's outer wall, the slide opening has been seted up to bearing board 2's outer wall, the inner wall of slide opening and the outer wall sliding connection of round bar 6, round bar 6 moves left and makes second U template 8 move left, the first U template 4 of inner wall fixedly connected with of mounting groove 3, spacing hole 5 has been seted up to assembly frame 1's outer wall, the square groove has been seted up to apron 12's outer wall, the inner wall fixedly connected with transparent plate 15 of square groove, the screw hole has been seted up to the inner wall of spacing hole 5, the inner wall threaded connection of screw hole has bolt 7, the inside of mounting groove 3 is equipped with fixed establishment.

As shown in fig. 1-3, the fixing mechanism includes a round bar 6, one end of a bolt 7 is rotatably connected with the round bar 6, one end of the round bar 6 is fixedly connected with a second U-shaped plate 8, the outer walls of the first U-shaped plate 4 and the second U-shaped plate 8 are fixedly connected with rubber pads 9, the outer wall of the cover plate 12 is fixedly connected with a handle, the rubber pads 9 clamp the circuit board tightly, the outer wall of the bearing plate 2 is provided with a placing groove 10, the inner fixed connection of the placing groove 10 is provided with a partition plate 11, the electronic components are classified under the action of the partition plate 11, the outer wall of the bearing plate 2 is rotatably connected with the cover plate 12, the cover plate 12 avoids dust falling onto the circuit board, the outer wall of the cover plate 12 is provided with four round holes, and the inner walls of the four round holes are fixedly connected with first magnets 13.

The working principle is as follows: put assembly frame 1 on the horizontal position, the circuit board of taking is placed in mounting groove 3, rotation bolt 7 makes round bar 6 move left, round bar 6 moves left and makes second U template 8 move left, second U template 8 moves left after the certain distance, press from both sides tightly the circuit board through first U template 4 and rubber pad 9, conveniently glue and paster operation to the circuit board, can place electronic component in standing groove 10 simultaneously when the paster, classify electronic component under the effect of baffle 11, rotatable apron 12 when the operation is interrupted, cover apron 12 on bearing plate 2, carry out the rigidity to apron 12 through four first magnet 13 and second magnet 14, avoid the dust to fall into on the circuit board, influence the circuit backward flow, and the circuit connection condition of circuit board is observed to accessible transparent plate 15.

The above descriptions are only preferred embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the scope of the present invention, and the technical solutions and the utility model concepts of the present invention are equivalent to, replaced or changed.

Claims

The PCB component of SMT microspur ball grid array piles up subsides dress structure, including assembly frame (1), its characterized in that, outer wall fixedly connected with bearing board (2) of assembly frame (1), mounting groove (3) have been seted up to the outer wall of bearing board (2), the first U template (4) of inner wall fixedly connected with of mounting groove (3), spacing hole (5) have been seted up to the outer wall of assembly frame (1), the inner wall of spacing hole (5) sets up threaded hole, and the inner wall threaded connection of screw hole has bolt (7), the inside of mounting groove (3) is equipped with fixed establishment.
2. The PCB component stacking and mounting structure of SMT micro-pitch ball grid array according to claim 1, wherein the fixing mechanism comprises a round bar (6), one end of the bolt (7) is rotatably connected with the round bar (6), one end of the round bar (6) is fixedly connected with a second U-shaped plate (8), the outer walls of the first U-shaped plate (4) and the second U-shaped plate (8) are fixedly connected with rubber pads (9), the outer wall of the bearing plate (2) is provided with a placing groove (10), the inner part of the placing groove (10) is fixedly connected with a partition plate (11), and the outer wall of the bearing plate (2) is rotatably connected with a cover plate (12).
3. An SMT micro-pitch ball grid array PCB component stacking and mounting structure according to claim 2, wherein four circular holes are formed in an outer wall of the cover plate (12), and first magnets (13) are fixedly connected to inner walls of the four circular holes.
4. An SMT micro-pitch ball grid array PCB component stacking and mounting structure according to claim 1, wherein four through holes are formed in an outer wall of the supporting plate (2), and second magnets (14) are fixedly connected to inner walls of the four through holes.
5. An SMT micro-pitch ball grid array PCB component stacking and mounting structure according to claim 2, wherein a square groove is formed in an outer wall of the cover plate (12), and a transparent plate (15) is fixedly connected to an inner wall of the square groove.
6. An SMT micro-pitch ball grid array PCB component stacking and mounting structure according to claim 2, wherein a sliding hole is formed in an outer wall of the supporting plate (2), and an inner wall of the sliding hole is slidably connected with an outer wall of the round rod (6).
7. An SMT micro-pitch ball grid array PCB component stacking and mounting structure according to claim 2, wherein a handle is fixedly attached to an outer wall of the cover plate (12).