CN207766688U - A kind of adsorbent equipment for SMT substrates - Google Patents
A kind of adsorbent equipment for SMT substrates Download PDFInfo
- Publication number
- CN207766688U CN207766688U CN201820190183.1U CN201820190183U CN207766688U CN 207766688 U CN207766688 U CN 207766688U CN 201820190183 U CN201820190183 U CN 201820190183U CN 207766688 U CN207766688 U CN 207766688U
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- adsorption
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- smt
- substrate
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- Separation Of Gases By Adsorption (AREA)
Abstract
The utility model is related to a kind of adsorbent equipments for SMT substrates, belong to electronic technology field.The adsorbent equipment is provided with bottom plate, multiple connection through-holes are provided on the bottom plate, the upper surface of the bottom plate is provided with adsorption plate, the side of the adsorption plate is provided with horizontal positioned aspirating hole, multiple vertically disposed adsorption holes are provided on the upper surface of the adsorption plate, the upper end of the adsorption plate is provided with positioning plate, it is provided with positioning groove on the positioning plate, it is placed with substrate in the positioning groove, multiple upper through-holes are provided in the positioning groove, the upper through-hole is corresponded with the adsorption hole.The usefulness of the utility model is：Substrate is placed into positioning groove by pickup hand, then by exhaust tube to being vacuumized in aspirating hole, it will be in substrate adsorption to positioning groove by negative pressure, the pressure being subject to is detected in real time by multiple pressure sensors, to maintain the substrate at horizontality, the utility model structure novel, it is easy to operate.
Description
Technical field
The utility model is related to a kind of adsorbent equipments for SMT substrates, belong to electronic technology field.
Background technology
SMT is surface installation technique（Adsorption technology）（The abbreviation of Surface Mount Technology）, referred to as
Adsorption or surface mounting technique.It is a kind of most popular technology and technique in current electronic assembly industry.It is a kind of incites somebody to action
Without pin or short leg surface-assembled component（Abbreviation SMC/SMD, Chinese claim sheet component）Mounted on printed circuit board
（Printed Circuit Board, PCB）Surface or other substrates surface on, added by the methods of Reflow Soldering or immersed solder
With the circuit load technology of welding assembly.
SMT chip mounters are common a kind of equipment in SMT industries, and SMT chip mounters are the electronics that setting is bonded on substrate
Then element produces a complete circuit board, substrate must be attached to before fitting on chip mounter, existing fixation side
Method is relatively simple, is lifted, is fixed substrate by pressing plate, this method is more convenient, but meeting by cylinder band dynamic pressure plate
There is pressing plate not pressing tightly so as to cause substrate can be subjected to displacement and lead to occur waste product, or pressing plate occurs and excessively compress to lead
It causes substrate to be subject to crushing and also will appear waste product, so a kind of adsorbent equipment for SMT substrates is needed in industry, to solve in industry
Problems faced.
Invention content
Technical problem to be solved in the utility model is：A kind of adsorbent equipment for SMT substrates is provided, to solve to go
Problems faced in industry.
In order to solve the above-mentioned technical problem, the utility model is achieved through the following technical solutions：One kind being used for SMT bases
The adsorbent equipment of plate is provided with SMT chip mounters, and adsorbent equipment is provided on the SMT chip mounters, and the adsorbent equipment is used for base
The absorption of plate, the adsorbent equipment are provided with bottom plate, and multiple connection through-holes are provided on the bottom plate, and the bottom plate passes through connection
Through-hole is fixed on the SMT chip mounters, and the upper surface of the bottom plate is provided with adsorption plate, and the side of the adsorption plate is provided with
Horizontal positioned aspirating hole, is provided with multiple vertically disposed adsorption holes on the upper surface of the adsorption plate, the adsorption hole with
The aspirating hole is mutually communicated, and the upper end of the adsorption plate is provided with positioning plate, and positioning groove, institute are provided on the positioning plate
It states and is placed with substrate in positioning groove, multiple upper through-holes, the upper through-hole and the adsorption hole are provided in the positioning groove
It corresponds.
Preferably, being provided with lower groove between the upper through-hole, pressure sensor is placed in the lower groove.
Preferably, the quantity of the pressure sensor is at least nine.
Preferably, the rear and front end of the aspirating hole is respectively arranged with exhaust tube.
Compared with prior art, the usefulness of the utility model is：Substrate is placed into positioning groove by pickup hand
In, then by exhaust tube to being vacuumized in aspirating hole, by negative pressure by substrate adsorption to positioning groove, pass through multiple pressure
Sensor detects the pressure being subject in real time, to maintain the substrate at horizontality, the utility model structure novel, operation side
Just.
Description of the drawings：
The utility model is further illustrated below in conjunction with the accompanying drawings.
Fig. 1 is the installation diagram of the utility model.
Fig. 2 is the exploded view of the utility model.
In figure：Adsorbent equipment 1；Substrate 2；Bottom plate 3；Connect through-hole 4；Adsorption plate 5；Aspirating hole 6；Adsorption hole 7；Positioning plate 8；
Positioning groove 9；Upper through-hole 10；Lower groove 11；Pressure sensor 12.
Specific implementation mode：
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments：According to Fig. 1 to shown in Fig. 2
A kind of adsorbent equipment for SMT substrates is provided with SMT chip mounters, and adsorbent equipment 1 is provided on the SMT chip mounters, described
Adsorbent equipment 1 is used for the absorption of substrate 2, and the adsorbent equipment 1 is provided with bottom plate 3, and it is logical that multiple connections are provided on the bottom plate 3
Hole 4, the bottom plate 3 are fixed to by connecting through-hole 4 on the SMT chip mounters, and the upper surface of the bottom plate 3 is provided with adsorption plate
5, the side of the adsorption plate 5 is provided with horizontal positioned aspirating hole 6, and multiple hang down is provided on the upper surface of the adsorption plate 5
The adsorption hole 7 being directly arranged, the adsorption hole 7 are mutually communicated with the aspirating hole 6, and the upper end of the adsorption plate 5 is provided with positioning
Plate 8 is provided with positioning groove 9 on the positioning plate 8, substrate 2 is placed in the positioning groove 9, is set in the positioning groove 9
Multiple upper through-holes 10 are equipped with, the upper through-hole 10 is corresponded with the adsorption hole 7.
In order to facilitate placement force sensor 12, further, it is provided with lower groove 11 between the upper through-hole 10,
Pressure sensor 12 is placed in the lower groove 11.
In order to accurately measure, further, the quantity of the pressure sensor 12 is at least nine.
In order to vacuumize, further, the rear and front end of the aspirating hole 6 is respectively arranged with exhaust tube.
In use, substrate 2 is placed into the positioning groove 9 on positioning plate 8 by pickup hand first, positioning groove 9 with
The appearance and size of substrate 2 is consistent, can be achieved with the accurate positionin of substrate 2 in this way, according to various sizes of substrate 2, selection and more
The corresponding positioning plate 8 of commutation, so that substrate 2 is corresponded with positioning plate 8, when substrate 2 is placed into positioning groove 9,
Vacuumize process is carried out in exhaust tube aspirating hole 6 by 6 left and right sides of aspirating hole, such substrate 2 is absorbed into positioning
In groove 9, when substrate 2 is adsorbed in positioning groove 9, substrate 2 will be pressed onto on pressure sensor 12, pass through pressure
Sensor 12 detects the pressure being subject in real time, sees all pressure sensors 12 whether by identical pressure, if by phase
Same pressure, illustrates that substrate 2 is to illustrate substrate 2 if the pressure that pressure sensor 12 is subject to is uneven in horizontality
It is tiltedly to be placed into positioning groove 9, at this moment with regard to needing to be adjusted, to prevent waste product.
It is emphasized that：The above is only the preferred embodiment of the present utility model, not appoints to the utility model
What formal limitation, any simple modification made by the above technical examples according to the technical essence of the present invention, etc.
With variation and modification, it is still within the scope of the technical solutions of the present invention.
Claims (4)
1. a kind of adsorbent equipment for SMT substrates is provided with SMT chip mounters, adsorbent equipment is provided on the SMT chip mounters
（1）, the adsorbent equipment（1）For substrate（2）Absorption, it is characterised in that：The adsorbent equipment（1）It is provided with bottom plate（3）,
The bottom plate（3）On be provided with multiple connection through-holes（4）, the bottom plate（3）By connecting through-hole（4）It is pasted fixed to the SMT
On piece machine, the bottom plate（3）Upper surface be provided with adsorption plate（5）, the adsorption plate（5）Side be provided with it is horizontal positioned
Aspirating hole（6）, the adsorption plate（5）Upper surface on be provided with multiple vertically disposed adsorption holes（7）, the adsorption hole（7）
With the aspirating hole（6）It is mutually communicated, the adsorption plate（5）Upper end be provided with positioning plate（8）, the positioning plate（8）On set
It is equipped with positioning groove（9）, the positioning groove（9）In be placed with substrate（2）, the positioning groove（9）In be provided on multiple
Through-hole（10）, the upper through-hole（10）With the adsorption hole（7）It corresponds.
2. the adsorbent equipment according to claim 1 for SMT substrates, it is characterised in that：The upper through-hole（10）Between
It is provided with lower groove（11）, the lower groove（11）In be placed with pressure sensor（12）.
3. the adsorbent equipment according to claim 2 for SMT substrates, it is characterised in that：The pressure sensor（12）
Quantity be at least nine.
4. the adsorbent equipment according to claim 1 for SMT substrates, it is characterised in that：The aspirating hole（6）It is front and back
Both ends are respectively arranged with exhaust tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820190183.1U CN207766688U (en) | 2018-02-05 | 2018-02-05 | A kind of adsorbent equipment for SMT substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820190183.1U CN207766688U (en) | 2018-02-05 | 2018-02-05 | A kind of adsorbent equipment for SMT substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207766688U true CN207766688U (en) | 2018-08-24 |
Family
ID=63179749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820190183.1U Expired - Fee Related CN207766688U (en) | 2018-02-05 | 2018-02-05 | A kind of adsorbent equipment for SMT substrates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207766688U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110420865A (en) * | 2019-07-15 | 2019-11-08 | 中导光电设备股份有限公司 | ULED screen substrate detection/backlight of measuring device detects/measures objective table |
| WO2020034143A1 (en) * | 2018-08-16 | 2020-02-20 | 深圳华大智造科技有限公司 | Handle device, positioning device, loading device and gene sequencer |
-
2018
- 2018-02-05 CN CN201820190183.1U patent/CN207766688U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020034143A1 (en) * | 2018-08-16 | 2020-02-20 | 深圳华大智造科技有限公司 | Handle device, positioning device, loading device and gene sequencer |
| CN110420865A (en) * | 2019-07-15 | 2019-11-08 | 中导光电设备股份有限公司 | ULED screen substrate detection/backlight of measuring device detects/measures objective table |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180824 Termination date: 20200205 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |