CN220326154U - SMT paster packaging system - Google Patents
SMT paster packaging system Download PDFInfo
- Publication number
- CN220326154U CN220326154U CN202321852766.3U CN202321852766U CN220326154U CN 220326154 U CN220326154 U CN 220326154U CN 202321852766 U CN202321852766 U CN 202321852766U CN 220326154 U CN220326154 U CN 220326154U
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- Prior art keywords
- baffle
- packaging
- board
- adsorption
- air suction
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 45
- 238000001179 sorption measurement Methods 0.000 claims abstract description 33
- 238000010521 absorption reaction Methods 0.000 claims abstract description 15
- 239000000428 dust Substances 0.000 abstract description 15
- 238000005538 encapsulation Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003434 inspiratory effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses an SMT patch packaging system. Relates to the technical field of electronic components, and comprises: the packaging seat is provided with an adsorption cavity, the adsorption cavity is provided with an opening, and a suction fan is arranged in the adsorption cavity; the baffle is arranged at the top of the packaging seat, the inner side walls of the two opposite sides of the baffle are respectively provided with an air suction opening, the inner parts of the two sides of the baffle are provided with air suction cavities, the air suction openings are communicated with the adsorption cavities through the air suction cavities, and the bottom of the baffle is provided with a slot; placing the board setting and adsorbing the opening part in chamber, and the baffle setting is placing around the board, placing and setting up a plurality of absorption holes on the board, every absorption hole all communicates with adsorbing the chamber. According to the utility model, the suction fan is matched with the adsorption hole, so that adsorption type fixation is realized, the packaging circuit board is uniformly stressed, the packaging circuit board is reliable and safe, the phenomenon of deformation or deviation during packaging of the packaging circuit board can be effectively avoided, and the working efficiency is improved; through setting up suction fan and inlet scoop cooperation, realize the absorption to debris such as dust, avoid the encapsulation circuit board to receive the influence, the security is high.
Description
Technical Field
The utility model relates to the technical field of electronic components, in particular to an SMT (surface mounted technology) patch packaging system.
Background
SMT patch refers to a short for serial process flow of processing on the basis of PCB circuit board, and is a technique and process most popular in the electronic assembly industry. The electronic circuit surface assembling technology is a circuit connecting technology for mounting electronic components without pins or short leads on the surface of a printed circuit board or the surface of other base plates and welding and assembling by reflow soldering or dip soldering and other methods. In the process of chip packaging, a PCB circuit board or other substrates are placed on a plane first, and spot welding packaging is performed after the PCB circuit board or other substrates are stably fixed. Because there is a certain adhesion after soldering tin melts in the spot welding process, the substrate may be offset and misplaced while the soldering pen is lifted, so it is important to ensure a fixed packaging structure platform.
The existing patch packaging structure has two fixing modes of adsorption type and clamping type on the packaging circuit board, the adsorption type is better in fixing effect, the influence on the packaging circuit board is small, but the structure of adding heat dissipation and dust removal is inconvenient, meanwhile, dust is easily adsorbed on the packaging circuit board due to the adsorption type fixation, the packaging circuit board is damaged, and the safety is low; the structure of adopting the fixed heat dissipation of adding of centre gripping class and dust removal is convenient, but causes the influence to encapsulation circuit board easily, and paster encapsulation efficiency is not high.
Therefore, how to provide an SMT patch packaging system with good fixing effect for packaging a circuit board, convenient heat dissipation and dust removal, and high operation safety is a problem that needs to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, the utility model provides an SMT patch packaging system which can realize good fixing effect on a packaging circuit board, is convenient to dissipate heat and remove dust and has higher operation safety.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
an SMT patch package system, comprising:
the packaging seat is provided with an adsorption cavity, the adsorption cavity is provided with an opening, and a suction fan is arranged in the adsorption cavity;
the baffle is arranged at the top of the packaging seat in a surrounding manner, air suction ports are formed in the inner side walls of the two opposite sides of the baffle, air suction cavities are formed in the two sides of the baffle, the air suction ports are communicated with the adsorption cavities through the air suction cavities, and a slot is formed in the bottom of the baffle;
place the board, place the board setting and be in the opening part in absorption chamber, just the baffle sets up place around the board, place and set up a plurality of absorption holes on the board, every absorption hole all with absorption chamber intercommunication.
Further, the device further comprises a taking groove, wherein the taking groove is arranged on one side of the baffle, and the bottom of the taking groove and the top of the placing plate are located on the same plane.
Further, the device further comprises an insulating pad, the insulating pad is arranged on the placing plate, a plurality of through holes are formed in the insulating pad, and each through hole is arranged corresponding to the adsorption hole.
Further, the adsorption device further comprises a C-shaped plate, wherein the C-shaped plate is detachably arranged in the slot, and the C-shaped plate is in contact with the opening of the adsorption cavity.
Further, a filter screen is arranged on the C-shaped plate, and the filter screen separates the air suction cavity from the adsorption cavity.
Further, still include the mounting panel, the mounting panel sets up a plurality ofly, every the mounting panel all with the lateral wall of encapsulation seat is connected, every all set up the mounting hole on the mounting panel.
Compared with the prior art, the SMT chip packaging system provided by the utility model has the advantages that the suction fan is matched with the suction holes to realize suction type fixation, the fixation is carried out immediately after the suction holes are placed, the packaging circuit board is uniformly stressed, the fixation is reliable and safe, the phenomenon that the packaging circuit board deforms or deviates during packaging can be effectively avoided, and the working efficiency of SMT chip packaging is improved; by arranging the suction fan to be matched with the air suction inlet, the dust and other sundries are absorbed, the dust content of the air in and around the packaging system is effectively reduced, the packaging circuit board is prevented from being influenced, and the safety is improved; the adsorption and dust removal functions are controlled by the suction fan, so that the matching use effect is better; set up the filter screen and filter the separation to dust and the gaseous in the inlet scoop inspiratory air, it is convenient to remove dust, protects the suction fan simultaneously and does not receive the influence, through setting up the filter screen on the C template, can dismantle the setting and conveniently change and clear up the filter screen.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present utility model, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an SMT patch package system provided by the present utility model;
FIG. 2 is a cross-sectional view of an SMT chip package system according to the present utility model;
FIG. 3 is a schematic top view of an SMT chip package system according to the present utility model;
fig. 4 is a schematic structural view of the filter screen and the C-shaped plate provided by the present utility model.
Wherein: 1 is a packaging seat; 2 is an adsorption cavity; 3 is a suction fan; 4 is a baffle; 5 is an air suction port; 6 is an air suction cavity; 7 is a slot; 8 is a placing plate; 9 is an adsorption hole; 10 is a taking groove; 11 is an insulating pad; 12 is a through hole; 13 is a C-shaped plate; 14 is a filter screen; 15 is a mounting plate; 16 are mounting holes.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, an embodiment of the present utility model discloses an SMT patch package system, comprising:
the packaging seat 1 is provided with an adsorption cavity 2, the adsorption cavity 2 is provided with an opening, a suction fan 3 is arranged in the adsorption cavity 2, and the suction fan 3 can suck air in the adsorption cavity 2 to form negative pressure;
the baffle 4 is arranged at the top of the packaging seat 1 in a surrounding way, the inner side walls of the two opposite sides of the baffle 4 are respectively provided with an air suction opening 5, the inner parts of the two sides of the baffle 4 are provided with an air suction cavity 6, the air suction openings 5 are communicated with the adsorption cavity 2 through the air suction cavities 6, the bottom of the baffle 4 is provided with a slot 7, and the air suction fan 3 is matched with the air suction openings 5 to realize the absorption of sundries such as dust, so that the dust content of the air in and around the packaging system is effectively reduced, the influence of a packaging circuit board is avoided, and the safety is improved;
placing the board 8, placing the board 8 and setting up in the opening part of adsorbing the chamber 2, and baffle 4 sets up around placing the board 8, placing and setting up a plurality of absorption holes 9 on the board 8, every absorption hole 9 all communicates with adsorbing the chamber 2, through setting up suction fan 3 and absorption hole 9 cooperation, realize adsorbing type fixation, put and fix immediately after, the encapsulation circuit board evenly atress, fixed reliable safety can effectively avoid the phenomenon that takes place the skew when encapsulation circuit board deformation or encapsulation, has improved SMT paster encapsulation's work efficiency;
in this embodiment, the packaging circuit board is further provided with a taking groove 10, the taking groove 10 is arranged on one side of the baffle 4, the bottom of the taking groove 10 and the top of the placing plate 8 are located on the same plane, and the packaging circuit board is taken through the taking groove 10.
In this embodiment, the packaging circuit board further comprises an insulating pad 11, the insulating pad 11 is arranged on the placing plate 8, a plurality of through holes 12 are formed in the insulating pad 11, each through hole 12 is arranged corresponding to the adsorption hole 9, and the insulating pad 11 is arranged to perform insulation protection on the packaging circuit board.
In this embodiment, the adsorption device further comprises a C-shaped plate 13, wherein the C-shaped plate 13 is detachably arranged in the slot 7, and the C-shaped plate 13 is contacted with the opening of the adsorption cavity 2.
In the embodiment, the filter screen 14 is arranged on the C-shaped plate 13, the filter screen 14 separates the suction cavity 6 from the adsorption cavity 2, the filter screen 14 is arranged to filter and separate dust and gas in the air sucked by the suction port 5, dust removal is convenient, and the suction fan 3 is protected from being influenced; through setting up filter screen 14 on C template 13, C template 13 can dismantle the setting, conveniently changes and clear up filter screen 14.
In this embodiment, the packaging structure further comprises mounting plates 15, the mounting plates 15 are arranged in plurality, each mounting plate 15 is connected with the side wall of the packaging seat 1, each mounting plate 15 is provided with a mounting hole 16, and bolts are used for sequentially penetrating through the mounting holes 16 to lock and fix the packaging seat 1 through the mounting plates 15 and the mounting holes 16.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (6)
1. An SMT patch package system, comprising:
the packaging seat is provided with an adsorption cavity, the adsorption cavity is provided with an opening, and a suction fan is arranged in the adsorption cavity;
the baffle is arranged at the top of the packaging seat in a surrounding manner, air suction ports are formed in the inner side walls of the two opposite sides of the baffle, air suction cavities are formed in the two sides of the baffle, the air suction ports are communicated with the adsorption cavities through the air suction cavities, and a slot is formed in the bottom of the baffle;
place the board, place the board setting and be in the opening part in absorption chamber, just the baffle sets up place around the board, place and set up a plurality of absorption holes on the board, every absorption hole all with absorption chamber intercommunication.
2. The SMT patch package system of claim 1, further comprising a pick up groove disposed on one side of said baffle, a bottom of said pick up groove being in a same plane as a top of said placement plate.
3. The SMT patch package system of claim 1, further comprising an insulating pad disposed on said placement plate, said insulating pad having a plurality of through holes disposed thereon, each of said through holes being disposed in correspondence with said suction holes.
4. The SMT patch package system of claim 1, further comprising a C-shaped board removably disposed within said socket and in contact with the opening of said suction cavity.
5. An SMT patch package system according to claim 4, wherein a screen is provided on the C-board, the screen separating the suction cavity from the suction cavity.
6. The SMT patch package system of claim 1, further comprising a plurality of mounting plates, each mounting plate being coupled to a side wall of said package base, each mounting plate having a mounting hole disposed thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321852766.3U CN220326154U (en) | 2023-07-14 | 2023-07-14 | SMT paster packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321852766.3U CN220326154U (en) | 2023-07-14 | 2023-07-14 | SMT paster packaging system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220326154U true CN220326154U (en) | 2024-01-09 |
Family
ID=89408942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321852766.3U Active CN220326154U (en) | 2023-07-14 | 2023-07-14 | SMT paster packaging system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220326154U (en) |
-
2023
- 2023-07-14 CN CN202321852766.3U patent/CN220326154U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |