CN218388521U

CN218388521U - High efficiency SMT paster packaging structure

Info

Publication number: CN218388521U
Application number: CN202221981439.3U
Authority: CN
Inventors: 陈海泉; 林永强; 拉斐尔; 维克; 符冠元; 章军
Original assignee: Liance Youte Semiconductor Dongguan Co ltd
Current assignee: Liance Youte Semiconductor Dongguan Co ltd
Priority date: 2022-07-29
Filing date: 2022-07-29
Publication date: 2023-01-24
Anticipated expiration: 2032-07-29

Abstract

The utility model discloses a high efficiency SMT paster packaging structure, including encapsulation base and encapsulation platform, the fixed encapsulation platform that is provided with in middle part on encapsulation base top, the negative chamber of inhaling has been seted up to the inside of encapsulation platform, and the positive one side of encapsulation platform is fixed to be provided with and the negative communicating pressure release pipeline of inhaling intracavity portion, and the positive opposite side of encapsulation platform is fixed to be provided with and the negative communicating exhaust duct of inhaling intracavity portion, and the paster draw-in groove has been seted up at the middle part on encapsulation platform top, and the insulating rubber pad has been laid to the bottom of paster draw-in groove inner wall, the utility model relates to a high efficiency SMT paster packaging structure, this paster packaging structure can cooperate with the gas circuit system of encapsulation equipment, and the circuit substrate that adopts atmospheric pressure absorption to treat the paster fixes, directly puts and can fix fast, and fixed back is steady reliable, the even atress of multipoint mode to can effectively avoid the phenomenon of skew when circuit board deformation or paster encapsulation, improved SMT paster encapsulation's work efficiency, the practicality is strong.

Description

High efficiency SMT paster packaging structure

Technical Field

The utility model relates to a semiconductor paster encapsulation technical field specifically is a high efficiency SMT paster packaging structure.

Background

SMT paster refers to the abbreviation of a series of process flows processed on the basis of a PCB circuit board, and is one of the most popular techniques and technologies in the electronic assembly industry. The surface mounting technology for electronic circuit is a circuit mounting technology in which electronic components without pins or short leads are mounted on the surface of a printed circuit board or other substrates and then soldered and mounted by means of reflow soldering, dip soldering or the like. In the process of surface mounting packaging, a PCB or other substrates can be placed on a plane firstly, and spot welding packaging is carried out after the PCB or other substrates are fixed stably. Because certain adhesion force exists after the soldering tin is melted in the spot welding process, the substrate can be deviated and dislocated when the welding pen is lifted, and whether a fixed packaging structure platform is important is judged. At present current paster packaging structure, like application number 201921534590.0's a SMT paster packaging structure, it adopts the tight mode in middle part extrusion top to fix the base plate, because partial circuit base plate material is softer, this mode can cause protruding deformation in base plate middle part, increases the work degree of difficulty of paster encapsulation.

The fixed process inefficiency of current paster packaging structure to packaging circuit board, and the tight extruded mode in middle part top is locked fixedly, easily causes packaging substrate middle part extrusion deformation, increases the degree of difficulty of paster encapsulation, and paster packaging efficiency is not high.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high efficiency SMT paster packaging structure to the current paster packaging structure who proposes among the solution above-mentioned background art is inefficient to the fixed process of packaging line board, and the tight extruded mode in middle part top locks fixedly, easily causes packaging substrate middle part extrusion deformation, increases the degree of difficulty of paster encapsulation, problem that paster packaging efficiency is not high.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high efficiency SMT paster packaging structure, includes encapsulation base and encapsulation platform, the fixed encapsulation platform that is provided with in middle part on encapsulation base top, the negative suction chamber has been seted up to the inside of encapsulation platform, the positive one side of encapsulation platform is fixed be provided with the negative communicating pressure release pipeline of inhaling intracavity portion, the positive opposite side of encapsulation platform is fixed be provided with the negative communicating exhaust duct of inhaling intracavity portion, the paster draw-in groove has been seted up at the middle part on encapsulation platform top, the insulating rubber mat has been laid to the bottom of paster draw-in groove inner wall, a plurality of negatives are inhaled the through-hole on has been seted up on the surface of insulating rubber mat, adopt the absorbent mode of atmospheric pressure to fix the circuit substrate of treating the paster, directly put can fix fast, fixed back is steady reliable, the even atress of multipoint mode to the phenomenon that squints when can effectively avoid circuit board deformation or paster encapsulation, improved SMT paster encapsulation's work efficiency, the practicality is strong.

Preferably, the pressure relief pipeline is fixedly provided with a pressure relief valve in the middle, the air exhaust pipeline is fixedly provided with a suction valve in the middle, and the pressure relief pipeline is good in controllability and simple and convenient to operate.

Preferably, the annular rubber mat is fixedly arranged on the inner side wall of the patch clamping groove, so that the circuit board can be prevented from being scratched.

Preferably, one side of the top end of the packaging table is provided with a taking buckle groove communicated with the patch clamping groove, so that the circuit board can be taken conveniently after packaging is finished, and the working efficiency is improved.

Preferably, locking screw holes have all been seted up to four corners on encapsulation base top, for packaging structure's quick locking is fixed provides convenience, reliable and stable.

Preferably, a plurality of the bottom of the negative suction through hole is fixedly communicated with the inside of the negative suction cavity, so that negative pressure is formed at the bottom of the chip mounting clamping groove, the fixation of a circuit board to be packaged is quickly realized, and the packaging efficiency is improved.

Compared with the prior art, the beneficial effects of the utility model are that: this paster packaging structure can fix with the gas circuit system cooperation of encapsulation equipment, adopts the adsorbed mode of atmospheric pressure to treat the circuit base plate of paster, directly puts and to fix fast, and fixed back is steady reliable, the even atress of multipoint mode to the phenomenon that squints when can effectively avoiding circuit board deformation or paster encapsulation has improved the work efficiency of SMT paster encapsulation, and the practicality is strong.

Drawings

Fig. 1 is an external view of the package structure of the present invention;

fig. 2 is a front cross-sectional view of the package structure of the present invention;

FIG. 3 is a top cross-sectional view of the package structure of the present invention;

fig. 4 is an enlarged view of a portion a of the present invention.

In the figure: 1. a package base; 2. a packaging stage; 3. a patch card slot; 4. a pressure relief duct; 5. a pressure relief valve; 6. an air extraction pipeline; 7. a suction valve; 8. taking the fastening groove; 9. an annular rubber pad; 10. a negative suction through hole; 11. locking the screw hole; 12. an insulating rubber pad; 13. a negative suction chamber.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Please refer to fig. 1-4, the utility model provides a high efficiency SMT paster packaging structure, including encapsulation base 1 and encapsulation platform 2, the fixed encapsulation platform 2 that is provided with in middle part on encapsulation base 1 top, negative suction chamber 13 has been seted up to the inside of encapsulation platform 2, encapsulation platform 2 positive one side is fixed be provided with negative suction chamber 13 inside communicating pressure release pipeline 4, encapsulation platform 2 positive opposite side is fixed be provided with negative suction chamber 13 inside communicating exhaust duct 6, paster draw-in groove 3 has been seted up at the middle part on encapsulation platform 2 top, insulating cushion 12 has been laid to the bottom of paster draw-in groove 3 inner wall, a plurality of negative suction through-holes 10 have been seted up on insulating cushion 12's surface, pressure release pipeline 4's middle part fixed mounting has pressure release valve 5, exhaust duct 6's middle part fixed mounting has suction valve 7, paster 3's inside wall is fixed be provided with cyclic annular cushion 9, one side on encapsulation platform 2 top has been seted up with paster draw-in communicating catching groove 8 of taking, locking screw 11 has all been seted up to four corners on encapsulation base 1 top, the bottom of a plurality of negative suction through-holes 10 all communicates with the inside fixed suction chamber 13's inside, it communicates to adopt the fixed mode of absorption chamber 13 to adsorb the fixed point type that the fixed circuit board that the atmospheric pressure goes on the fixed mode of SMT carries out, thereby can the stable fixed the fixed point type of the effective phenomenon of the fixed line that the SMT can be carried out, thereby the stable fixed the effective efficiency of the SMT can be carried out, the effective fixed point type of the stable fixed circuit board, thereby the stable fixed efficiency of the stable fixed point type of the SMT can be improved, thereby the SMT efficiency of the effective work, the stable back of the SMT can be carried out, the effective phenomenon.

When the embodiment of the application is used: put paster packaging structure on spot welding encapsulation equipment, it can to use the screw to pass locking screw 11 in proper order and fix packaging structure, then put air circuit system switch-on of air exhaust pipeline 6 and spot welding equipment, before work, can close pressure release valve 5 earlier, open suction valve 7, will treat that the circuit board of encapsulation steadily puts in paster draw-in groove 3, at this moment under the suction of air circuit system, the gas in negative suction chamber 13 will be lasted the suction, and form the negative pressure at negative suction through-hole 10 department, because the effect of pressure difference, the circuit board will firmly be fixed in paster draw-in groove 3 can this moment, the staff normally carries out paster encapsulation can, after the encapsulation finishes, close suction valve 7 and open pressure release valve 5, external gas can get into negative suction chamber 13 through pressure release pipeline 4 this moment, make the pressure in the negative suction chamber 13 resume, the staff can relax along taking catching groove 8, the circuit board after the encapsulation that adopts the absorbent mode to come the paster to fix, directly can fix fast, it is reliable to treat steadily to treat the paster, thereby the even deformation of multipoint type, the SMT phenomenon of the work of avoiding effectively the circuit board of encapsulation, the skew phenomenon has improved.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a high efficiency SMT paster packaging structure, includes packaging base (1) and encapsulation platform (2), its characterized in that: encapsulation base (1) the fixed encapsulation platform (2) that is provided with in middle part on top, encapsulation platform (2) inside has been seted up the burden and has been inhaled chamber (13), encapsulation platform (2) positive one side is fixed to be provided with and the burden inhales chamber (13) inside communicating pressure release pipeline (4), encapsulation platform (2) positive opposite side is fixed to be provided with and the burden inhales chamber (13) inside communicating exhaust duct (6), paster draw-in groove (3) have been seted up at the middle part on encapsulation platform (2) top, insulating cushion (12) have been laid to the bottom of paster draw-in groove (3) inner wall, a plurality of negatives have been seted up on the surface of insulating cushion (12) and have been inhaled through-hole (10).

2. A high efficiency SMT patch package structure according to claim 1, wherein: the middle part fixed mounting of pressure release pipeline (4) has pressure release valve (5), the middle part fixed mounting of bleed-off pipe (6) has suction valve (7).

3. A high efficiency SMT patch package assembly as recited in claim 1 wherein: and an annular rubber pad (9) is fixedly arranged on the inner side wall of the patch clamping groove (3).

4. A high efficiency SMT patch package assembly as recited in claim 1 wherein: and one side of the top end of the packaging table (2) is provided with a taking buckle groove (8) communicated with the patch clamping groove (3).

5. A high efficiency SMT patch package assembly as recited in claim 1 wherein: locking screw holes (11) are formed in four corners of the top end of the packaging base (1).

6. A high efficiency SMT patch package structure according to claim 1, wherein: the bottom ends of the negative suction through holes (10) are fixedly communicated with the inside of the negative suction cavity (13).