CN215345293U

CN215345293U - Support plate device

Info

Publication number: CN215345293U
Application number: CN202121744580.7U
Authority: CN
Inventors: 陈斌斌; 曹硕; 任雪锋; 路晓波; 薛青颖; 刘文力; 贺程明; 高成钰
Original assignee: Changzhou Xingyu Automotive Lighting Systems Co Ltd
Current assignee: Changzhou Xingyu Automotive Lighting Systems Co Ltd
Priority date: 2021-07-29
Filing date: 2021-07-29
Publication date: 2021-12-28
Anticipated expiration: 2031-07-29

Abstract

The utility model relates to the field of PCB manufacturing and SMT (surface mount technology) mounting, and particularly discloses a carrier plate device which comprises a carrier, wherein the carrier is provided with an accommodating groove, at least one positioning column is arranged in the accommodating groove, the accommodating groove is used for accommodating a reinforcing plate and a soft plate, the reinforcing plate and the soft plate are fixed together through hot-pressing glue in the embodiment, at least one first positioning hole is formed in the soft plate, at least one second positioning hole is formed in the reinforcing plate, the second positioning hole is right opposite to the first positioning hole, the positioning column is matched with the first positioning hole and the second positioning hole, and the positioning column is matched with the first positioning hole and the second positioning hole, so that the position accuracy between the carrier and a raw material is improved, and the SMT welding accuracy is further improved.

Description

Support plate device

Technical Field

The utility model relates to the field of PCB manufacturing and SMT (surface mount technology) mounting, in particular to a carrier plate device.

Background

Along with the polytropic, the miniaturization of structure molding, FPC's use is more and more, and this paster to some small packaging component requires more and more high, and FPC is at the manufacturing process at present, and raw and other materials machining precision, the dimensional deviation between the tool is great, leads to the skew of SMT paster in-process components and parts, especially to the component interval is less, and the continuous tin phenomenon is more frequent, so need reduce the accumulative deviation in the course of working again, improve SMT welding qualification rate.

SUMMERY OF THE UTILITY MODEL

The utility model provides a carrier plate device, which aims to solve the problem that components are offset in an SMT (surface mount technology) chip mounting process due to large size deviation between raw material processing precision and a jig in the prior art.

The technical scheme adopted by the utility model is as follows:

a carrier board apparatus, comprising:

the flexible printed circuit board is provided with an electronic element, fixedly connected with the reinforcing plate and provided with at least one first positioning hole;

the reinforcing plate is provided with at least one second positioning hole, and the second positioning hole is over against the first positioning hole;

the carrier, the carrier is provided with the holding tank, be provided with at least one reference column in the holding tank, the soft board with place after the stiffening plate is fixed in the holding tank, the reference column with first locating hole with the cooperation of second locating hole.

Further, the second positioning hole on the reinforcing plate is 0.1mm larger than the first positioning hole on the soft plate.

Furthermore, still be provided with at least one first exhaust hole on the soft board, be provided with on the stiffening plate with the second exhaust hole that first exhaust hole corresponds.

Furthermore, Mark points are further arranged on the soft board and used for positioning the welding machine.

Furthermore, the soft board and the reinforcing board are fixedly connected by hot-pressing glue.

Further, the reinforcing plate comprises an aluminum sheet.

Further, the carrier comprises a magnetic carrier plate and a flexible steel sheet, wherein the magnetic carrier plate is provided with a containing groove, and the flexible steel sheet covers the magnetic carrier plate and the flexible plate.

Compared with the prior art, the utility model has the beneficial effects that:

1. the support plate device provided by the utility model comprises a carrier, wherein the carrier is provided with an accommodating groove, a positioning column is arranged in the accommodating groove, and the positioning column is matched with a first positioning hole on a soft plate and a second positioning hole on a reinforcing plate, so that the problem of offset of components in the SMT chip mounting process caused by large size deviation between raw material processing precision and a jig in the prior art is solved, the accumulated deviation in the processing process can be reduced, and the SMT welding qualification rate is improved.

2. The first positioning hole on the soft plate is smaller than the second positioning hole on the reinforcing plate in the support plate device provided by the utility model, and the carrier adopts the positioning hole on the soft plate for positioning, so that the problem that the positioning column cannot be inserted into the first positioning hole and the second positioning hole due to deviation generated in the reinforcing plate is avoided.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a flexible printed circuit board according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a reinforcing plate according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a carrier according to an embodiment of the present invention.

In the drawing, 1 is a flexible board, 101 is an electronic component, 102 is a first positioning hole, 103 is a Mark point, 104 is a first exhaust hole, 2 is a reinforcing plate, 201 is an aluminum sheet, 202 is a second positioning hole, 203 is a second exhaust hole, 204 is a hot-press adhesive, 3 is a carrier, 301 is a flexible steel plate, 302 is a positioning column, and 303 is a magnetic carrier plate.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.

Example (b):

the embodiment provides a support plate device, including carrier 3, carrier 3 is provided with the holding tank, be provided with at least one reference column 302 in the holding tank, the holding tank is used for placing stiffening plate and soft board 1, and stiffening plate and soft board 1 are together fixed through hot-pressing glue 204 in this embodiment, are provided with at least one first locating hole 102 on the soft board 1, are provided with at least one second locating hole 202 on the stiffening plate 2, second locating hole 202 is just right first locating hole 102, reference column 302 with first locating hole 102 with the cooperation of second locating hole 202, this embodiment is through reference column 302 and the cooperation of first locating hole 102 and second locating hole 202, improves the position accuracy between carrier 3 and the raw and other materials, and then improves SMT welding accuracy.

Furthermore, the second positioning hole 202 on the reinforcing plate is 0.1mm larger than the first positioning hole 102 on the soft plate 1, so that the carrier 3 can be conveniently positioned by adopting the positioning hole on the soft plate 1, the problem that the positioning column 302 cannot be inserted into the first positioning hole 102 and the second positioning hole 202 due to deviation generated in attaching of the reinforcing plate is avoided, the positioning between the soft plate 1 and the carrier 3 is ensured, and the stability of the soft plate 1 on the carrier 3 is ensured.

Further, still be provided with at least one first exhaust hole 104 on the soft board 1, be provided with on the stiffening plate 2 with the second exhaust hole 203 that first exhaust hole 104 corresponds prevents that soft board 1 from leading to the components and parts skew in welding process bubble production.

Furthermore, Mark points 103 are further arranged on the flexible printed circuit board 1 and used for positioning a welding machine, and when the flexible printed circuit board is subjected to surface mounting, the electronic component 2 is automatically absorbed through the Mark points 103 on the FPC and is mounted on a bonding pad, so that the surface mounting precision is improved, and the welding quality is ensured.

Furthermore, the soft plate 1 and the reinforcing plate 2 are fixedly connected by high-temperature-resistant and high-viscosity hot-pressing glue 204, so that the phenomenon of glue bubbles in the reflow soldering process is avoided, the strength between the soft plate 1 and the reinforcing plate in the assembling process is ensured, and the glue failure between the soft plate 1 and the reinforcing plate is prevented.

Specifically, stiffening plate 2 includes aluminum plate 201, and is transportation, the process non-deformable of installation, prevents that the stiffening plate from warping and leading to the welding face unevenness, specifically, stiffening plate 2 directly adopts aluminum plate 201 preparation or sets up aluminum plate 201 at the back of stiffening plate 2 in this embodiment, increases heat dispersion.

Further, the back of the reinforcing plate 2 can be provided with a heat dissipation aluminum sheet, so that the heat dissipation effect of raw materials is improved.

Further, carrier 3 includes magnetic carrier plate 303 and mild steel plate 301, be provided with the holding tank on the magnetic carrier plate 303, mild steel plate 301 covers magnetic carrier plate 303 with on the soft board 1, the mild steel plate 301 is increased through carrier 3 top to this embodiment, through the magnetism of mild steel plate 301 and magnetic carrier plate 303 inhale with, guaranteed the obedience of soft board 1 with carrier 3, thereby improved the problem that the flexible line way board appears undulation easily in process of production and leads to the printing badly.

In summary, the carrier board apparatus provided in this embodiment performs positioning through the first positioning hole 102 of the flexible board 1 and the carrier 3, so as to reduce the positioning error between the flexible board 1 and the reinforcement, and meanwhile, the Mark point 103 on the FPC automatically absorbs the electronic component 2 during mounting, so as to mount the electronic component on the pad, thereby improving the mounting precision and ensuring the welding quality.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims

1. A carrier board apparatus, comprising:

the flexible printed circuit board comprises a flexible printed circuit board (1), wherein an electronic element (101) is arranged on the flexible printed circuit board (1), the flexible printed circuit board (1) is fixedly connected with a reinforcing plate (2), and at least one first positioning hole (102) is formed in the flexible printed circuit board (1);

the reinforcing plate (2) is provided with at least one second positioning hole (202), and the second positioning hole (202) is opposite to the first positioning hole (102);

the carrier (3), the carrier (3) is provided with the holding tank, be provided with at least one reference column (302) in the holding tank, place after soft board (1) and stiffening plate (2) are fixed in the holding tank, reference column (302) with first locating hole (102) with second locating hole (202) cooperation.

2. The carrier plate arrangement according to claim 1, wherein the second positioning hole (202) on the stiffening plate is 0.1mm larger than the first positioning hole (102) on the flexible plate (1).

3. The carrier plate device according to claim 1, wherein the flexible board (1) is further provided with at least one first vent hole (104), and the stiffening plate (2) is provided with a second vent hole (203) corresponding to the first vent hole (104).

4. The carrier plate device of claim 1, wherein the flexible board (1) is further provided with Mark points (103) for positioning a welding machine.

5. The carrier board device according to claim 1, wherein the flexible board (1) and the stiffener (2) are fixedly connected by a hot-pressing adhesive (204).

6. The carrier plate arrangement according to claim 1, wherein the stiffening plate (2) comprises an aluminium sheet (201).

7. The carrier board apparatus according to claim 1, wherein the carrier (3) comprises a magnetic carrier board (303) and a flexible steel board (301), the magnetic carrier board (303) is provided with a receiving slot, and the flexible steel board (301) covers the magnetic carrier board (303) and the flexible board (1).