CN2872777Y - Printing circuit board of loundspeaker - Google Patents
Printing circuit board of loundspeaker Download PDFInfo
- Publication number
- CN2872777Y CN2872777Y CN 200520087173 CN200520087173U CN2872777Y CN 2872777 Y CN2872777 Y CN 2872777Y CN 200520087173 CN200520087173 CN 200520087173 CN 200520087173 U CN200520087173 U CN 200520087173U CN 2872777 Y CN2872777 Y CN 2872777Y
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- CN
- China
- Prior art keywords
- electrode
- circuit board
- microphone
- board insulating
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a printed circuit board for microphone, which comprises a circular circuit board insulating layer, a wiring pattern formed on one surface of the circuit board insulating layer, and surface-mounted electrodes disposed on another surface of the circuit board insulating layer for surface-mounting between the microphone and other printed circuit boards. One electrode is a central electrode located at center position of the circuit board insulating layer, another electrode is an annular electrode disposed around and concentric with the central electrode. The annular electrode has conductive strip extending to periphery of the circuit board insulating layer. Circuits on two sides of the circuit board insulating layer are electrically connected via plated hole disposed on the circuit board. The inventive structure can realize mass and industrialized application of microphone, lower production cost, guarantee low-cost electronic product for general public, and create condition for adapting microphone to surface-mounting assembling process.
Description
Technical field
The utility model relates to a kind of transducer that is used to receive sound wave with the signal of telecommunication that converts the expression sound wave to, relates in particular to a kind of printed substrate of microphone.
Background technology
Microphone has in the modern life widely to be used, but because technology limitation, can not equally with other components and parts form element and host printed circuit board (PCB) welding through reflow soldering process, and can only be as an independent device, carry out the manual single-piece welding, labor productivity is extremely low, and the electronic product reliability after the welding can not get ensureing.Wherein, the printed substrate of the suitable paster assembly technology (SMT) of design becomes a technical barrier.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of simple in structure and be applicable to the microphone printed substrate of paster assembly technology (SMT).
For achieving the above object, the technical solution of the utility model is: the microphone printed substrate, comprise circular wiring board insulating barrier, a wiring diagram that the surface forms of wiring board insulating barrier, another surface of described wiring board insulating barrier is provided with the patch electrode that can supply microphone and other printed substrate to mount, wherein, an electrode is the central electrode that is positioned at wiring board insulating barrier home position, and another electrode is around the central electrode setting and is the ring electrode concentric with central electrode; The conductive strips that extend to wiring board insulating barrier edge that described ring electrode has; Be electrically connected by the plated-through hole that is provided with in the circuit board between the circuit on the two sides of wiring board insulating barrier.
The ring electrode of described printed substrate is provided with air communication channel.
The height of described patch electrode is less than 0.3mm.
Owing to adopt technique scheme, the microphone printed substrate, comprise circular wiring board insulating barrier, a wiring diagram that the surface forms of wiring board insulating barrier, another surface of described wiring board insulating barrier is provided with the patch electrode that can supply microphone and other printed substrate to mount, wherein, an electrode is the central electrode that is positioned at wiring board insulating barrier home position, and another electrode is around the central electrode setting and is the ring electrode concentric with central electrode; The conductive strips that extend to wiring board insulating barrier edge that described ring electrode has; Be electrically connected by the plated-through hole that is provided with in the circuit board between the circuit on the two sides of wiring board insulating barrier.Design feature of the present utility model can realize microphone application in enormous quantities, industrialized, has reduced production cost, provides assurance for the public uses electronic product at a low price; Another outstanding advantage of the present utility model is to have created condition for making microphone be fit to the paster assembly technology.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the vertical view of Fig. 1; Dash area is represented the electrode and the extension thereof of projection among the figure;
Fig. 3 is the upward view of Fig. 1; Dash area is represented the wiring diagram of printed substrate among the figure.
Embodiment
As Fig. 1, Fig. 2, shown in Figure 3, the microphone printed substrate, comprise circular wiring board insulating barrier 1, a wiring diagram 2 that the surface forms of wiring board insulating barrier 1, there are microphone electronic devices and components 3 to be welded on the wiring diagram 2, another surface of described wiring board insulating barrier 1 is provided with the patch electrode 4 that can supply microphone and other printed substrate to mount, 5, wherein, an electrode is the central electrode 4 that is positioned at wiring board insulating barrier 1 home position, another electrode is around the central electrode setting and is the ring electrode 5 concentric with central electrode, this setup of electrode can satisfy the positioning requirements of paster technique, no matter how microphone rotates, and does not influence the welding of microphone; The conductive strips 6 that extend to wiring board insulating barrier edge that described ring electrode 5 has; Be electrically connected by the plated-through hole 8 that is provided with in the circuit board between the circuit on the two sides of wiring board insulating barrier 1.The ring electrode 5 of described printed substrate is provided with air communication channel 5a, can guarantee the discharge of gas in the welding process, guarantees welding quality.
The height of described patch electrode 4,5 is preferably in 0.2mm less than 0.3mm, and the manufacture craft of printed substrate can be better like this.
Claims (3)
1. microphone printed substrate, comprise circular wiring board insulating barrier (1), a wiring diagram (2) that the surface forms of wiring board insulating barrier (1), it is characterized in that: another surface of described wiring board insulating barrier (1) is provided with the patch electrode (4,5) that can supply microphone and other printed substrate to mount, wherein, an electrode is for being positioned at the central electrode (4) of wiring board insulating barrier (1) home position, and another electrode is around the central electrode setting and is the ring electrode (5) concentric with central electrode; The conductive strips that extend to wiring board insulating barrier edge (6) that described ring electrode (5) has; Be electrically connected by the plated-through hole (8) that is provided with in the circuit board between the circuit on the two sides of wiring board insulating barrier (1).
2. microphone printed substrate as claimed in claim 1 is characterized in that: the ring electrode of described printed substrate (5) is provided with air communication channel (5a).
3. microphone printed substrate as claimed in claim 1 is characterized in that: the height of described patch electrode (4,5) is less than 0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520087173 CN2872777Y (en) | 2005-09-16 | 2005-09-16 | Printing circuit board of loundspeaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520087173 CN2872777Y (en) | 2005-09-16 | 2005-09-16 | Printing circuit board of loundspeaker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2872777Y true CN2872777Y (en) | 2007-02-21 |
Family
ID=37741117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520087173 Expired - Lifetime CN2872777Y (en) | 2005-09-16 | 2005-09-16 | Printing circuit board of loundspeaker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2872777Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101022684B (en) * | 2007-03-07 | 2011-06-22 | 山东共达电声股份有限公司 | Modified microphone packaged structure |
| CN101516161B (en) * | 2009-03-16 | 2012-02-29 | 深圳市同发鑫电路科技有限公司 | Manufacturing method of projection PCB circuit board |
| CN102595292A (en) * | 2012-03-19 | 2012-07-18 | 美特科技(苏州)有限公司 | Electret capacitor microphone |
-
2005
- 2005-09-16 CN CN 200520087173 patent/CN2872777Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101022684B (en) * | 2007-03-07 | 2011-06-22 | 山东共达电声股份有限公司 | Modified microphone packaged structure |
| CN101516161B (en) * | 2009-03-16 | 2012-02-29 | 深圳市同发鑫电路科技有限公司 | Manufacturing method of projection PCB circuit board |
| CN102595292A (en) * | 2012-03-19 | 2012-07-18 | 美特科技(苏州)有限公司 | Electret capacitor microphone |
| CN102595292B (en) * | 2012-03-19 | 2014-05-28 | 美特科技(苏州)有限公司 | Electret capacitor microphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 69, Longquan street, Fangzi District, Shandong, Weifang Province, 261200 Patentee after: Shandong Gettop Acoustic Co.,Ltd. Address before: 69, Longquan street, Fangzi District, Shandong, Weifang Province, 261200 Patentee before: Weifang Gongda Telecommunications Co., Ltd. |
|
| C56 | Change in the name or address of the patentee |
Owner name: SHANDONG GONGDA ELECTROACOUSTIC CO., LTD. Free format text: FORMER NAME: WEIFANG GONGDA TELECOMMUNICATION CO., LTD. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20070221 |
|
| EXPY | Termination of patent right or utility model |