KR20070033840A - speaker - Google Patents

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Publication number
KR20070033840A
KR20070033840A KR1020050088413A KR20050088413A KR20070033840A KR 20070033840 A KR20070033840 A KR 20070033840A KR 1020050088413 A KR1020050088413 A KR 1020050088413A KR 20050088413 A KR20050088413 A KR 20050088413A KR 20070033840 A KR20070033840 A KR 20070033840A
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South Korea
Prior art keywords
diaphragm
lead
pattern
voice coil
terminal
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KR1020050088413A
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Korean (ko)
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KR100774890B1 (en
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이재민
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에스텍 주식회사
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Priority to KR1020050088413A priority Critical patent/KR100774890B1/en
Publication of KR20070033840A publication Critical patent/KR20070033840A/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
    • H04R2307/025—Diaphragms comprising polymeric materials

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Manufacturing & Machinery (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

진동판의 중심으로부터 에지를 향하여 연장되는 다수개의 인출 도전패턴이 프린트 배선 방식으로 형성되고, 인출 도전패턴의 중심측 단부에는 보이스 코일의 인출 리드가 전기적으로 연결되는 개선된 필름형 진동판이 개시된다.Disclosed is an improved film type diaphragm in which a plurality of lead-out conductive patterns extending from the center of the diaphragm toward the edge are formed in a printed wiring manner, and at the center end of the lead-out conductive pattern, the lead leads of the voice coil are electrically connected.

진동판, 다이어프램, PCB, FPCB, 유연, 일체 Diaphragm, diaphragm, PCB, FPCB, flexible, integral

Description

개선된 필름 진동판{Improved Film Diaphragm}Improved Film Diaphragm

도 1은 종래의 보이스 코일이 결합된 필름 진동판의 구조를 보여주는 도면으로, 도 1a는 단면도를 나타내고, 도 1b는 평면도를 이면도를 나타낸다.1 is a view showing the structure of a film diaphragm combined with a conventional voice coil, Figure 1a shows a cross-sectional view, Figure 1b shows a plan view a rear view.

도 2는 본 발명의 일 실시예에 따른 보이스 코일이 결합된 필름 진동판을 나타내는 평면도이다.Figure 2 is a plan view showing a film diaphragm coupled to the voice coil according to an embodiment of the present invention.

본 발명은 개선된 필름 진동판에 관한 것으로, 구체적으로 플렉시블 인쇄회로(Flexible Print Circuit)를 구현한 진동판과 이에 부착되는 단자판을 일체화한 필름 진동판에 관한 것이다.The present invention relates to an improved film diaphragm, and more particularly, to a film diaphragm integrating a diaphragm implementing a flexible printed circuit and a terminal plate attached thereto.

잘 알려진 바와 같이, 필름 진동판(film diaphragm)은 보이스 코일(voice coil)과 연결되어 보이스 코일에 인가되는 전기적 신호를 음향신호로 변환하는 구성요소이다.As is well known, a film diaphragm is a component that is connected to a voice coil and converts an electrical signal applied to the voice coil into an acoustic signal.

도 1은 종래의 필름 진동판의 구조를 보여주는 도면으로, 도 1a는 단면도를 나타내고, 도 1b는 평면도를 이면도를 나타낸다.Figure 1 is a view showing the structure of a conventional film diaphragm, Figure 1a shows a cross-sectional view, Figure 1b shows a plan view a rear view.

도시된 바와 같이, 보이스 코일(20)을 진동판(10)의 이면에 접합하고, 보이스 코일(20)로부터 인출되는 한 쌍의 리드(22)를 포밍(forming)하여 진동판(10)에 밀착 고정한다.As shown, the voice coil 20 is bonded to the rear surface of the diaphragm 10, and a pair of leads 22 drawn out from the voice coil 20 is formed to fix the diaphragm 10 closely. .

이와 같이 진동판(10)에 고정된 리드(22)는 도시되지 않은 단자판(PCB)에 솔더링된다. In this way, the leads 22 fixed to the diaphragm 10 are soldered to a terminal plate PCB not shown.

그러나, 이러한 종래기술에 의하면 여러 가지의 문제점이 있다.However, according to this prior art, there are various problems.

먼저, 리드(22)를, 예를 들어, S자로 포밍하거나 진동판(10)에 고정하기 위한 별도의 공정이 필요하게 되어 작업공정 수가 증가한다.First, a separate process for forming the lead 22, for example, by S-shape or fixing the diaphragm 10 is required, thereby increasing the number of work steps.

또한, 포밍공정 중에 리드(22)가 단선되거나 이탈하는 문제가 발생한다.In addition, a problem occurs that the lead 22 is disconnected or dislodged during the forming process.

또한, 필연적으로 리드(22)를 단자판에 솔더링하는 별도의 공정이 필요하다.In addition, a separate process of soldering the lead 22 to the terminal plate is inevitably required.

따라서, 본 발명은 이러한 종래기술의 문제점들을 해결하기 위하여 제시되는 것으로, 본 발명의 목적은 보이스 코일로부터 인출되는 리드를 포밍하여 진동판에 고정하는 공정을 필요로 하지 않는 구조의 필름 진동판을 제공하는 것이다.Accordingly, the present invention has been made to solve the problems of the prior art, and an object of the present invention is to provide a film diaphragm having a structure that does not require a process of forming a lead drawn from the voice coil and fixing it to the diaphragm. .

본 발명의 다른 목적은 진동판을 단자판과 일체화하여 보이스 코일의 인출 리드에 대한 솔더링 공정을 필요로 하지 않는 구조의 필름 진동판을 제공하는 것이다.It is another object of the present invention to provide a film diaphragm having a structure in which the diaphragm is integrated with a terminal plate and does not require a soldering process for the lead lead of the voice coil.

본 발명의 또 다른 목적과 특징 및 이점들은 이하에 서술되는 실시예들로부터 보다 명확하게 이해될 것이다.Further objects, features and advantages of the present invention will be more clearly understood from the embodiments described below.

본 발명에 따르면, 진동판의 중심으로부터 에지를 향하여 연장되는 다수개의 인출 도전패턴이 프린트 배선 방식으로 형성되고, 인출 도전패턴의 중심측 단부에는 보이스 코일의 인출 리드가 전기적으로 연결되는 개선된 필름형 진동판이 개시된다.According to the present invention, a plurality of pull-out conductive patterns extending from the center of the diaphragm toward the edges are formed in a printed wiring manner, and an improved film-type diaphragm in which a lead lead of the voice coil is electrically connected to the center-side end of the pull-out conductive pattern. This is disclosed.

바람직하게, 진동판과 일체로 제작되고, 인출 도전패턴과 프린트 배선 방식으로 일체로 형성되는 단자패턴을 구비한 단자판을 추가로 포함할 수 있다.Preferably, the terminal plate may further include a terminal plate that is integrally formed with the diaphragm and has a terminal pattern that is integrally formed by the lead conductive pattern and the printed wiring method.

선택적으로, 진동판의 에지를 따라 인출 도전패턴에 대응하여 그 단부로부터 일체로 연장되는 확대패턴을 더 포함하며, 단자패턴을 구비한 단자판이 진동판에 결합되는 경우, 단자패턴은 확대패턴에 솔더링된다.Optionally, further comprising an enlarged pattern integrally extending from its end corresponding to the lead conducting pattern along the edge of the diaphragm, wherein the terminal pattern is soldered to the enlarged pattern when the terminal plate having the terminal pattern is coupled to the diaphragm.

바람직하게, 인출 도전패턴은 스파이럴 형상으로 형성된다.Preferably, the drawing conductive pattern is formed in a spiral shape.

이하, 첨부된 도면을 참조하여 본 발명의 일 실시예를 설명한다.Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention.

도 2는 본 발명의 일 실시예에 따른 필름 진동판을 나타내는 평면도이다.2 is a plan view showing a film diaphragm according to an embodiment of the present invention.

본 발명에 따른 진동판(100)과 단자판(300)은 플렉시블한 재질, 예를 들어, 폴리이미드를 이용하여 일체로 제작되며, 진동판(100)과 단자판(300)에는 각각 인출 도전패턴(110)과 단자패턴(310)이 프린트 배선 방식으로 형성되며, 바람직하게 진동판(100)과 단자판(300)에 매립된다. 인출 도전패턴(110)과 단자패턴(310)은, 예를 들어, 구리로 형성될 수 있다.The diaphragm 100 and the terminal plate 300 according to the present invention are integrally manufactured using a flexible material, for example, polyimide, and each of the diaphragm 100 and the terminal plate 300 has a lead conductive pattern 110 and The terminal pattern 310 is formed by a printed wiring method, and is preferably embedded in the diaphragm 100 and the terminal plate 300. The lead conductive pattern 110 and the terminal pattern 310 may be formed of, for example, copper.

도시된 바와 같이, 진동판(100)에는 중심으로부터 에지를 향하여 스파이럴 형상으로 다수개의 인출 도전패턴(110)이 형성된다. 바람직하게, 진동판(100)의 에지를 따라 인출 도전패턴(110)에 대응하여 그 단부로부터 일체로 연장되는 확대패턴(110a)이 형성될 수 있다.As shown, the diaphragm 100 is formed with a plurality of lead-out conductive patterns 110 in a spiral shape from the center toward the edge. Preferably, an enlarged pattern 110a may be formed along the edge of the diaphragm 100 so as to be integrally extended from the end thereof in correspondence with the lead conducting pattern 110.

단자판(300)에는 단자패턴(310)이 형성되며, 진동판(100)의 인출 도전패턴(110)과 전기적으로 연결된다. 따라서, 전체적으로 보면, 진동판(100)의 중심으로부터 단자판(300)까지 인출 도전패턴(110)이 연장되는 형상을 갖는다.A terminal pattern 310 is formed on the terminal plate 300, and is electrically connected to the lead conductive pattern 110 of the diaphragm 100. Therefore, as a whole, the lead conductive pattern 110 extends from the center of the diaphragm 100 to the terminal plate 300.

이러한 구성에 의하면, 보이스 코일(200)을 진동판(100)에 접합한 후, 보이스 코일(200)의 인출 리드(미도시)를, 예를 들어, 인출 도전패턴(112, 114)에 전기적으로 접합하면, 보이스 코일(200)의 인출 리드 - 인출 도전패턴(112, 114) - 단자판(300)의 단자패턴(312, 314)으로 이루어지는 도전경로를 형성하게 된다.According to such a structure, after joining the voice coil 200 to the diaphragm 100, the lead lead (not shown) of the voice coil 200 is electrically connected to the lead conducting patterns 112 and 114, for example. The conductive paths including the lead-out lead-out conductive patterns 112 and 114 of the voice coil 200 and the terminal patterns 312 and 314 of the terminal plate 300 are formed.

따라서, 보이스 코일로부터 인출되는 리드를 포밍하여 진동판에 고정할 필요가 없으며, 보이스 코일의 인출 리드를 단자판에 솔더링할 필요가 없다.Therefore, it is not necessary to form and fix the lead drawn out from the voice coil to the diaphragm, and it is not necessary to solder the lead lead of the voice coil to the terminal plate.

한편, 보이스 코일(200)의 인출 리드와 접속되는 인출 도전패턴(112, 114)을 제외한 나머지 도전패턴들은 진동판(100)의 강도를 증가시키는 역할을 한다.Meanwhile, the remaining conductive patterns except for the drawing conductive patterns 112 and 114 connected to the drawing lead of the voice coil 200 serve to increase the strength of the diaphragm 100.

이 실시예에서는 단자판(300)이 진동판(100)과 일체로 형성되는 것을 예로 들었으나, 이들을 별도로 제작하여 결합할 수도 있다.In this embodiment, the terminal plate 300 is an example of being formed integrally with the diaphragm 100, but they may be manufactured separately and combined.

즉, 진동판(100)과 단자판(300)을 별도로 제작한 후, 진동판(100)의 인출 도 전패턴(110)의 확대패턴(110a)에 단자판(300)의 단자패턴(312, 314)을 솔더링함으로써 전기적으로 접속할 수 있다. 이때, 확대패턴(110a)은 넓게 형성되어 단자판(300)의 위치 설정의 마진을 증가시킨다.That is, after the diaphragm 100 and the terminal plate 300 are separately manufactured, the terminal patterns 312 and 314 of the terminal plate 300 are soldered to the enlarged pattern 110a of the lead conduction pattern 110 of the diaphragm 100. The connection can be made electrically. At this time, the enlarged pattern 110a is wider to increase the margin of positioning of the terminal plate 300.

이 구성에 의하면, 보이스 코일의 인출 리드를 단자판에 솔더링하는 공정이 필요하지만, 보이스 코일로부터 인출되는 리드를 포밍하여 진동판에 고정할 필요가 없게 된다.According to this structure, although the process of soldering the lead lead of a voice coil to a terminal board is needed, it is not necessary to form the lead drawn out from a voice coil and fix it to a diaphragm.

이상에서는 본 발명의 바람직한 실시예를 중심으로 설명하였지만, 당업자의 수준에서 다양한 변경이나 변형이 가능한다. 예를 들어, 인출 도전패턴은 단순한 방사상으로 형성할 수 있다. Although the above has been described with reference to the preferred embodiment of the present invention, various changes and modifications are possible at the level of those skilled in the art. For example, the drawing conductive pattern may be formed in a simple radial shape.

따라서, 본 발명의 권리범위는 상기한 실시예에 한정되어 해석되어서는 안되며, 이하에 기재되는 특허청구범위에 의해 판단되어야 한다.Therefore, the scope of the present invention should not be construed as being limited to the above embodiment, but should be determined by the claims described below.

본 발명에 따르면, 보이스 코일로부터 인출되는 리드를 포밍하여 진동판에 고정하는 공정을 필요로 하지 않기 때문에 작업공정을 줄일 수 있고, 이에 따라 생산효율이 증가한다.According to the present invention, since the process of forming the lead drawn out from the voice coil and fixing to the diaphragm is not required, the work process can be reduced, thereby increasing the production efficiency.

또한, 진동판을 단자판과 일체화하면, 보이스 코일의 인출 리드에 대한 솔더링 공정을 필요로 하지 않아 생산효율이 증가한다.In addition, integrating the diaphragm with the terminal plate eliminates the need for a soldering process for the lead lead of the voice coil, thereby increasing production efficiency.

Claims (4)

필름형 진동판으로서,As a film diaphragm, 상기 진동판의 중심으로부터 에지를 향하여 연장되는 다수개의 인출 도전패턴이 프린트 배선 방식으로 형성되고, 상기 인출 도전패턴의 상기 중심측 단부에는 보이스 코일의 인출 리드가 전기적으로 연결되는 것을 특징으로 하는 개선된 필름형 진동판.Improved film, characterized in that a plurality of lead conductive patterns extending from the center of the diaphragm toward the edge is formed by a printed wiring method, the lead lead of the voice coil is electrically connected to the center end of the lead conductive pattern. Mold diaphragm. 청구항 1에 있어서,The method according to claim 1, 상기 진동판과 일체로 제작되고, 상기 인출 도전패턴과 프린트 배선 방식으로 일체로 형성되는 단자패턴을 구비한 단자판을 추가로 포함하는 것을 특징으로 하는 개선된 필름형 진동판.An improved film type diaphragm further comprising a terminal plate integrally manufactured with the diaphragm and having a terminal pattern integrally formed with the lead-out conductive pattern in a printed wiring manner. 청구항 1에 있어서,The method according to claim 1, 상기 진동판의 에지를 따라 상기 인출 도전패턴에 대응하여 그 단부로부터 일체로 연장되는 확대패턴을 더 포함하며,And an enlarged pattern integrally extending from an end portion of the diaphragm in correspondence with the lead-out conductive pattern. 단자패턴을 구비한 단자판이 상기 진동판에 결합되는 경우, 상기 단자패턴은 상기 확대패턴에 솔더링되는 것을 특징으로 하는 개선된 필름형 진동판. And when the terminal plate having a terminal pattern is coupled to the diaphragm, the terminal pattern is soldered to the enlarged pattern. 청구항 1에 있어서,The method according to claim 1, 상기 인출 도전패턴은 스파이럴 형상으로 형성되는 것을 특징으로 하는 개선된 필름형 진동판. The drawing conductive pattern is an improved film type diaphragm, characterized in that formed in a spiral shape.
KR1020050088413A 2005-09-22 2005-09-22 Film Type Diaphram KR100774890B1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100838125B1 (en) * 2006-12-01 2008-06-13 주식회사 이엠텍 A sound converter
KR101160770B1 (en) * 2010-11-04 2012-06-28 고주헌 A Speaker
CN114866926A (en) * 2022-04-29 2022-08-05 歌尔股份有限公司 Sound production device and audio equipment
CN114866921A (en) * 2022-04-29 2022-08-05 歌尔股份有限公司 Sound production device and audio equipment

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KR101515970B1 (en) * 2013-03-07 2015-05-04 주식회사 비에스이 diaphram assembly with lead pattern
KR102176421B1 (en) 2019-10-23 2020-11-11 삼원액트 주식회사 Film type diaphragm of micro speaker

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Publication number Priority date Publication date Assignee Title
JP3216338B2 (en) * 1993-07-20 2001-10-09 松下電器産業株式会社 Speaker diaphragm
JP2004129080A (en) * 2002-10-04 2004-04-22 Sanyo Electric Co Ltd Speaker unit
KR100570857B1 (en) * 2003-12-01 2006-04-12 삼성전기주식회사 Diaphragm for micro speak and micro speak having thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100838125B1 (en) * 2006-12-01 2008-06-13 주식회사 이엠텍 A sound converter
KR101160770B1 (en) * 2010-11-04 2012-06-28 고주헌 A Speaker
CN114866926A (en) * 2022-04-29 2022-08-05 歌尔股份有限公司 Sound production device and audio equipment
CN114866921A (en) * 2022-04-29 2022-08-05 歌尔股份有限公司 Sound production device and audio equipment

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