JP2000277950A - Fitting structure for electric wire holding base - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve workability by fitting a first substrate in a chassis while it is stacked to a second substrate with a bent metal member plastic-deformed. SOLUTION: A first substrate 3 is fitted with a second substrate 4 through a metal wire 1, and the substrates 3 and 4 are provided with small-diameter holes 30 and 40. Solderable lands 8 are formed around the holes 30 and 40 on the rear surface of both substrates 3 and 4, and both end parts of each metal wire 1 are bent downward and inserted in the holes 30 and 40 of the first and second substrates 3 and 4 for soldering to the land 8. With a second through hole 42 provided near a notch 41 of the second substrate 4, a first through hole 32 and the second through hole 42 are stacked together, with both substrate 3 and 4 stacked together, which are placed on the upper surface of a boss 20, and a vis is screwed into the boss 20 for fixing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for attaching a base to a chassis in an electric apparatus provided with a base for holding a power supply wire.

[0002]

2. Description of the Related Art FIG. 7 is a sectional side view of a conventional chassis (2). A boss (20) provided by injection molding of a synthetic resin protrudes from the bottom surface of the chassis (2), and a substrate (3) is fixed to the boss (20) with a screw (90). A belt-like electric wire (7) for feeding power is attached through the substrate (3), and the band-like electric wire (7)
Of the cable does not become entangled with other electric wires (not shown) in the chassis (2). In recent years, it has been required to produce many types of such electric devices in small quantities, and depending on the type, due to the layout of other circuit components, etc.
(3) Some heights are high. However, if bosses (20) having different heights are manufactured for each model, the cost of manufacturing a mold for injection-molding the boss (20) increases. Therefore, as shown in FIG. 7, a spacer is provided between the upper surface of the boss (20) and the substrate (3).
In some cases, (9) is provided to adjust the height of the substrate (3). When attaching the substrate (3) to the boss (20), the spacer (9) is bonded to the substrate (3) in advance, and then the substrate (3) is attached to the boss (2).
0) Put it on the top and secure with screws (90).

[0003]

In the conventional structure, the spacer (9) is previously bonded to the substrate (3).
The bonding step was required, and the number of work steps was increased. If the adhesive strength of the spacer (9) is low, the substrate (3) is
At the time of attachment to (20), the spacer (9) may fall off from the substrate (3), and there was a problem in workability at the time of attachment.
SUMMARY OF THE INVENTION It is an object of the present invention to improve workability when a substrate is attached to a chassis via a member for height adjustment.

[0004]

A base for holding a power supply electric wire is mounted in a chassis (2) via a member for adjusting a height, and the base is formed of a first conductive pattern. One substrate (3), and the member for adjusting the height is a second substrate (4) connected to the first substrate (3) via a plastically deformable metal member. The first substrate (3) is mounted in the chassis (2) in a state where the bent metal member is plastically deformed and overlaps the second substrate (4).

[0005]

[Operation and Effect] The metal wire (1) is plastically deformed, and the first and second substrates (3) and (4) are kept overlapping each other. The first substrate (3) is attached to the chassis (2) with the second substrate (4) facing down. The first substrate (3) becomes higher by the thickness of the second substrate (4). The two boards (3) and (4) are kept overlapping each other, and the two boards (3) and (4) do not separate when being attached to the chassis (2). Therefore, the mounting workability is improved as compared with the conventional method in which the spacer (9) is attached to the substrate and then attached to the chassis (2).

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an example of the present invention will be described in detail with reference to the drawings. FIG. 4 is a plan view in which the cabinet (25) of the electric device is cut away. The electric device according to this example is a CD player, and a cabinet (25) is provided with a mechanism deck (6) having a pickup (60) and a turntable (61) on a chassis (2). . In the vicinity of the mechanism deck (6), there is a circuit board on which various electronic components are mounted.
(5) is provided, and the circuit board (5) and the mechanism deck are provided.
(6) is electrically connected by a strip-shaped electric wire (7). Power is supplied from the circuit board (5) to the mechanism deck (6) by the strip-shaped electric wire (7), and a signal from the mechanism deck (6) is transmitted to the circuit board.
It is transmitted to (5). A first substrate (3) is provided between the circuit board (5) and the mechanism deck (6), and the strip-shaped electric wire (7) is hooked on the first substrate (3), so that the band-shaped electric wire (7) is formed. Prevents entanglement with other wires (not shown) or pickup (60).

FIG. 1 shows a first substrate (3) and the first substrate (3).
FIG. 9 is a perspective view of a boss (20) for attaching the boss. The boss (20) projects from the chassis (2) of the mechanism deck (6).
A second substrate (4) is attached to the first substrate (3) via metal wires (1) (1), and each substrate (3) (4) has a small-diameter through hole.
(30) and (40) have been established. Both substrates (3) and (4) are formed of the same material as the circuit substrate (5), for example, paper phenol, and are formed around the through holes (30) and (40) on the back surfaces of the substrates (3) and (4). Is formed with a land (8) that can be soldered. Land (8)
As is well known, a part of the conductive patterns (not shown) formed on the substrates (3) and (4) is provided by peeling a resist. Both ends of each metal wire (1) are bent downward, and the first and second
It fits in the through holes (30) and (40) of the substrates (3) and (4) and is soldered to the lands (8).

On the right side of the first substrate (3), two notches (3
1) (31) are opened side by side, and each of the metal wires (1) covers the notch (31). Notches (41) and (41) are also formed in the second substrate (4), and the through holes (30) of the first substrate (3) are placed in a state where both substrates (3) and (4) overlap as described later. ) Are located in the notches (41) of the second substrate (4). First through holes (32) and (32) are formed near the notches (31) and (31) of the first substrate (3). Second
In the vicinity of the notches (41) and (41) of the substrate (4), a second through-hole (42)
When the substrate (42) is opened and the two substrates (3) and (4) overlap, the first through holes (32) and (32) and the second through holes (42) and (42) overlap and the boss (20) ). On the left side of the first substrate (3), horizontally long holding holes (33) and (33) are opened with their openings facing the side edges, and each holding hole (33) has a strip-shaped electric wire (7) (see FIG. 5). Fits. The opening-side end of the holding hole (33) is formed narrower than the inner part, and prevents the strip-shaped electric wire (7) from dropping out of the holding hole (33). On the first substrate (3), an elongated hole (34) is formed closer to the center of the substrate than the through holes (30) (30).

(Attaching Circuit Board to Chassis) First Board
To attach (3) to the boss (20) of the chassis (2), perform the following procedure. As shown in FIG. 1, the first substrate (3) and the second substrate (3)
The substrates (4) are arranged side by side, and metal wires are stretched over both substrates (3) and (4).
(1) is provided. Both ends of the metal wire (1) are inserted into the through holes (30) and (40) of both substrates (3) and (4). The lands (8) and (8) are soldered from the back surfaces of the substrates (3) and (4), and the metal wires (1) are fixed to the substrates (3) and (4).

[0010] Thereafter, as shown in FIG.
(1) is folded, and both substrates (3) and (4) are overlapped. The metal wire (1) is plastically deformed, and the two substrates (3) and (4) remain in an overlapping state. When attaching both boards (3) and (4) to the boss (20),
The two substrates (3) and (4) are not separated from each other, and the mounting workability is improved. FIG. 3A is a plan view of a state where both substrates (3) and (4) are overlapped, and FIG. 3B is a rear view. First substrate (3)
Is located in the notch (41) of the second substrate (4),
The through holes (40) of the second substrate (4) are notched (31) of the first substrate (3).
Located within. Notch at end of metal wire (1) (31) (41)
The end of the metal wire (1) does not contact the back surfaces of the first and second substrates (3) and (4). That is, metal wire
Since the end of (1) is in contact with the back surfaces of the substrates (3) and (4), there is no possibility that the thicknesses of the two substrates (3) and (4) overlapping each other will vary.

The substrates (3) and (4) are placed on the boss (20), and the first and second through holes (32) and (42) are overlapped with the hollow holes of the boss (20).
Screws (90) are screwed into the bosses (20) through the through holes (32) and (42), and the substrates (3) and (4) are fixed to the chassis (2). The first substrate (3) becomes higher by the thickness of the second substrate (4), and the second substrate (4) becomes a member for adjusting the height of the first substrate (3). Although the screw (90) is screwed into only one boss (20) in FIG. 2, the screw (90) is actually screwed into both bosses (20) and (20).
Thereafter, as shown in FIG. 5, the strip-shaped electric wire (7) is connected to the first substrate.
(3) Attach on top. FIG. 5 differs from FIG. 4 in the direction of 90 degrees. After fitting the strip-shaped electric wire (7) into both holding holes (33) and (33),
It is bent 90 degrees so as to project on the first substrate (3). The strip-shaped electric wire (7) extending rightward is fitted into the long hole (34) from above. First
The strip-shaped electric wire (7) that has come out below the substrate (3) is inserted into the first through hole (3).
2) It passes through the space between (32) and escapes outside the first substrate (3). The strip-shaped electric wire (7) is held by the holding holes (33) (33) and the long hole (34),
There is no inadvertent movement in the chassis (2) and no entanglement with other wires or pickups (60) in the chassis (2).

Metal wire connecting first and second substrates (3) and (4)
(1) is called a jumper wire, and is a circuit board (5) (see FIG. 4).
Widely used to connect between conductive patterns. That is, the metal wire (1) is a general-purpose component, and the procurement cost is low. However, if the procurement costs are equivalent, it is also possible to use an elongated metal band (not shown) instead of the metal wire (1). In this example, instead of the metal wire (1),
It is also conceivable to connect (3) and (4) with a covered electric wire. However, some contrivance is required so that the surfaces of the substrates 3 and 4 overlapping each other do not separate, and it is expected that this contrivance will be troublesome.

The first substrate (3) stops the strip-shaped electric wire (7), and the second substrate (4) adjusts the height of the first substrate (3). It is conceivable that 4) is not formed of the same material as the circuit board 5 but is formed by using, for example, a synthetic resin. However, the first and second substrates (3) and (4)
As shown in (1), it is provided by being cut out from one large substrate (50) together with the circuit substrate (5). That is, the first and second substrates
(3) and (4) use an extra portion after the circuit board (5) is cut out from the large board (50), and thus have an advantage that the manufacturing cost is reduced.

The description of the above embodiments is for the purpose of illustrating the present invention and should not be construed as limiting the invention described in the appended claims or reducing the scope thereof. Further, the configuration of each part of the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made within the technical scope described in the claims. In this example, a CD player is illustrated as an example of the electric device, but the present invention can be applied to other electric devices such as a VTR using a strip-shaped electric wire (7).

[Brief description of the drawings]

FIG. 1 is a perspective view of a first substrate and a boss.

FIG. 2 is an exploded perspective view of a first substrate and a boss overlapping a second substrate.

FIGS. 3A and 3B are diagrams showing a state in which first and second substrates are superposed, wherein FIG. 3A is a plan view and FIG.

FIG. 4 is a plan view in which a cabinet is broken.

FIG. 5 is a plan view of a first substrate to which a strip-shaped electric wire is attached.

FIG. 6 is a plan view of a large substrate.

FIG. 7 is a sectional side view of a conventional chassis.

[Explanation of symbols]

 (2) Chassis (3) First board (4) Second board (7) Strip-shaped electric wire (8) Land (50) Large board

Continued on front page F-term (reference) 4E352 AA02 AA03 AA04 BB02 BB03 BB04 CC02 CC12 DD02 DR19 DR46 GG15 5E348 AA02 AA07 AA28 AA32

Claims (4)

[Claims] 1. A structure for mounting a base for holding a power supply wire to a chassis (2) via a member for adjusting the height, wherein the base is a first substrate (3) on which a conductor pattern can be formed. ) And
The member for adjusting the height is a second substrate (4) connected to the first substrate (3) via a plastically deformable metal member, and the first substrate (3) is formed by bending the metal member. A mounting structure of an electric wire holding base to be mounted in the chassis (2) while being deformed and overlapping the second substrate (4). 2. A solderable land (8) (8) is formed on one surface of both substrates (3) (4), and a metal member is soldered to the land (8) (8). The mounting structure of the electric wire holding base according to claim 1. 3. In a state where both substrates (3) and (4) are overlapped, the surfaces on which the lands (8) and (8) are formed face each other, and on one of the substrates (3) and (4), 3. The mounting structure for an electric wire holding base according to claim 2, wherein notches (31) and (41) for preventing contact with a soldering portion on the land (8) of the mating substrate are formed. 4. The mounting structure for an electric wire holding base according to claim 1, wherein both substrates (3) and (4) are cut out from one large substrate (50).