JP3423244B2 - Wire holding base mounting structure - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for attaching a base to a chassis in an electric device provided with a base for holding electric wires for power supply.

[0002]

2. Description of the Related Art FIG. 7 is a sectional side view of a conventional chassis (2). A boss (20) provided by injection molding of synthetic resin projects from the bottom surface of the chassis (2), and the substrate (3) is fixed to the boss (20) with a screw (90). A strip-shaped electric wire (7) for feeding is attached through the substrate (3), and the strip-shaped electric wire (7) is attached.
Prevents the wires from getting entangled with other electric wires (not shown) in the chassis (2). In recent years, such electric devices are required to produce many models little by little, and depending on the model, due to the arrangement of other circuit parts, etc.
Some of the heights of (3) are high. However, if the bosses (20) having different heights are manufactured, the cost of making a mold for injection molding the bosses (20) is high. Therefore, as shown in FIG. 7, a spacer is provided between the upper surface of the boss (20) and the substrate (3).
In some cases, (9) is provided to adjust the height of the substrate (3). When attaching the substrate (3) to the boss (20), the spacer (9) is bonded to the substrate (3) in advance, and then the substrate (3) is attached to the boss (2).
Place it on 0) and fasten the screw (90).

[0003]

In the conventional structure, since the spacer (9) is bonded to the substrate (3) in advance,
The adhering step is required, and the number of work steps is increasing. Also, if the spacer (9) has a weak adhesive strength, the substrate (3) will not be bossed.
The spacer (9) may fall off from the substrate (3) when it is attached to the (20), which causes a problem in workability during attachment.
It is an object of the present invention to improve workability when mounting a substrate on a chassis via a height adjusting member.

[0004]

According to a first aspect of the present invention, there is provided a structure in which a base for holding a power supply wire is attached to a chassis (2) through a member for adjusting a height, the base being capable of forming a conductive wire pattern. One substrate (3), and the height adjusting member is the second substrate (4) connected to the first substrate (3) via a plastically deformable metal member. The first board (3) is mounted in the chassis (2) in a state where the bent metal member is plastically deformed and overlaps with the second board (4). One of both boards (3) and (4)
Each surface has solderable lands (8) (8) formed on it.
Is, the metal member is soldered to a land (8) (8), the two substrates
Lands (8) and (8) are formed with (3) and (4) overlapping.
The opposite surfaces are facing each other and on one substrate (3) (4)
Is in contact with the soldering spot on the land (8) of the mating board.
Notches (31) (41) are formed to prevent the above.

[0005]

[Operation and effect] The metal wire (1) is plastically deformed, and the first and second substrates (3) and (4) are kept in a state of being overlapped with each other. The first substrate (3) is attached to the chassis (2) with the second substrate (4) facing down. The first substrate (3) is raised by the thickness of the second substrate (4). The two boards (3) and (4) are kept in a state of being overlapped with each other, and the two boards (3) and (4) are not separated when mounted on the chassis (2). Therefore, as compared with the conventional method in which the spacer (9) is attached to the substrate and then attached to the chassis (2), the attachment workability is improved.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION An example of the present invention will be described in detail below with reference to the drawings. FIG. 4 is a plan view in which the cabinet (25) of the electric device is cut away. The electric device according to this example is a CD player, and a mechanism deck (6) having a pickup (60) and a turntable (61) is provided on a chassis (2) in a cabinet (25). . A circuit board mounted with various electronic parts near the mechanism deck (6)
(5) is provided, the circuit board (5) and mechanism deck
(6) is electrically connected by a strip-shaped electric wire (7). Power is supplied from the circuit board (5) to the mechanism deck (6) by the strip-shaped electric wire (7), and the signal from the mechanism deck (6) is sent to the circuit board.
It is transmitted to (5). A first board (3) is provided between the circuit board (5) and the mechanism deck (6), and the belt-like electric wire (7) is hooked on the first board (3) to form the belt-like electric wire (7). Prevent it from getting entangled with other electric wires (not shown) or the pickup (60).

FIG. 1 shows a first substrate (3) and the first substrate (3).
FIG. 5 is a perspective view of a boss (20) for attaching the. The boss (20) projects from the chassis (2) of the mechanism deck (6).
The second substrate (4) is attached to the first substrate (3) through the metal wires (1) (1), and each substrate (3) (4) has a small diameter through hole.
(30) (40) have been opened. Both boards (3) and (4) are made of the same material as the circuit board (5), for example, paper phenol, and on the back surface of both boards (3) and (4) around the through holes (30) and (40). Has solderable lands (8) formed. Land (8)
As is well known, a part of a conductive pattern (not shown) formed on the substrates (3) and (4) is provided by removing the resist. Both ends of each metal wire (1) are bent downward to form the first and second
It fits into the through holes (30) (40) of the boards (3) and (4) and is soldered to the land (8).

On the right side of the first substrate (3) are two notches (3
1) (31) are opened side by side, and the metal wires (1) are covered with the notches (31). Notches (41) (41) are also formed in the second substrate (4), and the through holes (30) of the first substrate (3) are formed in a state where both the substrates (3) and (4) are overlapped as will be described later. ) Is located in the notch (41) of the second substrate (4). First through holes (32) and (32) are formed near the notches (31) and (31) of the first substrate (3). Second
The second through hole (42) is provided in the vicinity of the notches (41) (41) of the substrate (4).
When (42) is opened and both substrates (3) and (4) are overlapped, the first through holes (32) and (32) and the second through holes (42) and (42) are overlapped, and the boss (20 ) Is placed on the upper surface. On the left side of the first substrate (3), oblong holding holes (33) (33) are opened with their openings facing the side edges, and the holding wires (7) (see FIG. 5) are provided in each holding hole (33). Fits in. The opening-side end of the holding hole (33) is formed narrower than the inner part, and prevents the strip-shaped electric wire (7) from falling out of the holding hole (33). On the first substrate (3), a long hole (34) is formed on the substrate center side of the through holes (30) (30).

(Installation of circuit board to chassis) First board
To attach (3) to the boss (20) of the chassis (2), follow the procedure below. As shown in FIG. 1, the first substrate (3) and the second substrate (3)
The substrate (4) is lined up and the metal wires are laid across both substrates (3) and (4).
Provide (1). Both ends of the metal wire (1) are inserted into the through holes (30) and (40) of both substrates (3) and (4). The metal wires (1) are fixed to the boards (3) and (4) by soldering the lands (8) and (8) from the back surfaces of the boards (3) and (4).

After this, as shown in FIG.
Bend (1) and stack both substrates (3) and (4). The metal wire (1) is plastically deformed, and the two substrates (3) and (4) are kept in an overlapping state. When attaching both boards (3) and (4) to the boss (20),
Both boards (3) and (4) are not separated, and the mounting workability is improved. FIG. 3A is a plan view of both substrates 3 and 4 in a superposed state, and FIG. 3B is a back view. First substrate (3)
The through hole (30) is located in the notch (41) of the second substrate (4),
The through hole (40) of the second substrate (4) is provided with the notch (31) of the first substrate (3).
Located inside. Notch (31) (41) at the end of the metal wire (1)
Since it is located inside, the ends of the metal wire (1) do not contact the back surfaces of the first and second substrates (3) and (4). That is, metal wire
The edges of (1) are in contact with the back surfaces of the substrates (3) and (4), and there is no risk of variations in the thickness of the overlapping substrates (3) and (4).

Both substrates (3) and (4) are placed on the boss (20), and the first and second through holes (32) and (42) are overlapped with the hollow holes of the boss (20).
The screws (90) are screwed into the boss (20) through the through holes (32) and (42) to fix the two substrates (3) and (4) to the chassis (2). The first substrate (3) is increased by the thickness of the second substrate (4), and the second substrate (4) serves as a height adjusting member for the first substrate (3). Although the screw (90) is screwed only to one boss (20) in FIG. 2, the screw (90) is actually screwed to both bosses (20) and (20).
Then, as shown in FIG. 5, attach the strip-shaped wire (7) to the first substrate.
(3) Mount on top. The orientation of FIG. 5 differs from that of FIG. 4 by 90 degrees. After fitting the strip-shaped electric wire (7) into both the holding holes (33) (33),
It is projected onto the first substrate (3) and bent at 90 degrees. The strip-shaped electric wire (7) extending rightward is fitted into the elongated hole (34) from above. First
The strip-shaped electric wire (7) that is pulled out to the lower side of the substrate (3) is connected to the first through hole (3
2) It passes through between (32) and goes out of the first substrate (3). The strip-shaped electric wire (7) is held in the holding holes (33) (33) and the long hole (34),
It does not move carelessly in the chassis (2) and is not entangled with other electric wires in the chassis (2) or the pickup (60).

A metal wire connecting the first and second substrates (3) and (4)
Circuit board (5) (1) is called jumper wire (see Fig. 4)
Widely used to connect between conductive patterns of. That is, the metal wire (1) is a general-purpose component and the procurement cost is low. However, if the procurement costs are the same, an elongated metal strip (not shown) can be used instead of the metal wire (1). In this example, instead of the metal wire (1), both substrates
It is also conceivable to connect (3) and (4) with a covered electric wire. However, it is necessary to devise some means so that the surfaces of both substrates (3) and (4) overlapping each other do not separate, and it is expected that this devise will take time.

Since the first board (3) stops the strip-shaped electric wire (7) and the second board (4) adjusts the height of the first board (3), both boards (3) ( It is conceivable that 4) is not formed of the same material as the circuit board 5 but is formed of, for example, a synthetic resin. However, the first and second substrates (3) and (4) are shown in FIG.
As shown in (1), it is cut out and provided together with the circuit board (5) from one large board (50). That is, the first and second substrates
(3) and (4) utilize the extra part after the circuit board (5) is cut out from the large board (50), and have an advantage that the manufacturing cost is low.

The above description of the embodiments is for explaining the present invention, and should not be construed as limiting the invention described in the claims or reducing the scope. The configuration of each part of the present invention is not limited to the above-mentioned embodiment, and it goes without saying that various modifications can be made within the technical scope described in the claims. In this example, the CD player is illustrated as the electric device, but the electric device can be applied to other electric devices such as a VTR using the band-shaped electric wire (7).

[Brief description of drawings]

FIG. 1 is a perspective view of a first substrate and a boss.

FIG. 2 is an exploded perspective view of a boss and a first substrate overlapping a second substrate.

FIG. 3 is a diagram showing a state in which the first and second substrates are superposed, (a) is a plan view, and (b) is a back view.

FIG. 4 is a plan view in which a cabinet is cut away.

FIG. 5 is a plan view of the first substrate to which the band-shaped electric wire is attached.

FIG. 6 is a plan view of a large substrate.

FIG. 7 is a sectional side view of a conventional chassis.

[Explanation of symbols]

(2) Chassis (3) First substrate (4) Second substrate (7) Band-shaped electric wire (8) Land (50) Large substrate

Continuation of the front page (56) Reference JP 59-31090 (JP, A) JP 10-293915 (JP, A) JP 6-283829 (JP, A) JP 8-172246 (JP , A) JP 3-22489 (JP, A) JP 7-111376 (JP, A) JP 10-190238 (JP, A) JP 7-263822 (JP, A) 62-80385 (JP, U) Actually open 49-28155 (JP, U) Actually open 59-4691 (JP, U) Actually open 51-35661 (JP, U) Actually open 5-20361 (JP, U) Actual development Sho 56-32474 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H05K 7/14 H05K 1/00-1/02 H05K 7/00

Claims (2)

(57) [Claims] 1. A structure in which a base holding an electric wire for power feeding is attached to a chassis (2) through a member for adjusting a height, and the base is a first substrate (3) on which a conductive wire pattern can be formed. )
The member for adjusting the height is the second substrate (4) connected to the first substrate (3) via the plastically deformable metal member, and the first substrate (3) is a bent metal. The member is mounted in the chassis (2) in a state of being plastically deformed and overlapped with the second substrate (4), and solderable solder is attached to one surface of each of the substrates (3) and (4).
Band (8) (8) is formed and the metal member is attached to the land (8) (8).
The land (8) (8) is shaped with both substrates (3) (4) being soldered and overlapping.
The formed surfaces face each other, and one of the substrates (3) (4)
Above the soldering points on the land (8) of the mating board
Attachment structure of the wire holding base with notches (31) (41) formed to prevent contact . 2. The electric wire holding base mounting structure according to claim 1, wherein both boards (3) and (4) are formed by cutting out from one large board (50).