CN101022684B - Modified microphone packaged structure - Google Patents
Modified microphone packaged structure Download PDFInfo
- Publication number
- CN101022684B CN101022684B CN 200710013668 CN200710013668A CN101022684B CN 101022684 B CN101022684 B CN 101022684B CN 200710013668 CN200710013668 CN 200710013668 CN 200710013668 A CN200710013668 A CN 200710013668A CN 101022684 B CN101022684 B CN 101022684B
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- Prior art keywords
- microphone
- printed substrate
- appendix
- wiring board
- circuit board
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Abstract
An improved packaging-structure of microphone is prepared as using microphone shell and microphone printed circuit board to from closed space for erecting electronic elements, arranging conductive electrode for outputting digital signal on surface of said circuit board, arranging additional portion of said circuit board along plane of said circuit board and extending additional portion towards outside, unifying said circuit board and said additional portion to be an integral unit and setting a leading-out electrode connected to said conductive electrode on said additional portion.
Description
Technical field
The present invention relates to a kind of microphone with new packaged type.
Background technology
As Fig. 4, shown in Figure 5, the printed substrate (PCB) of existing microphone is rounded or square, form the enclosure space that the microphone electronic devices and components are installed with microphone case 1, the microphone electronic devices and components are to be pressed in the housing by the in-flanges of microphone case 1 and PCB, traditional electret microphone has only two electrodes, when making Φ 4mm, it still is feasible placing two electrodes in Φ 2.8mm.And when making Φ 4mm and following digitlization microphone, the digitlization microphone PCB has 4 electrodes or 5 electrodes, 4 or 5 electrodes of arrangement are very difficult in this area, electrode pads must be less than Φ 0.6mm in the circle of requirement in Φ 2.8mm, distance between the solder joint is just less than 0.2mm, the client is easy to cause the short circuit of interpolar in use like this, and influence is used, and the layout of electrode also becomes the technical barrier that influences the digitlization microphone.
Summary of the invention
Technical problem to be solved by this invention provides that a kind of encapsulation pressure is controlled, arrangement of electrodes rationally, the signal transmission accurately, install and fix improved easily microphone package.
For solving the problems of the technologies described above, technical scheme of the present invention is: improved microphone package, comprise microphone case, be installed in the sound electric signal transducer in the described microphone case, form the microphone printed substrate of the enclosure space that the microphone electronic devices and components are installed with described microphone case, the outer surface of described microphone printed substrate is provided with the conductive electrode for the microphone output signal, described printed substrate is provided with along the outward extending wiring board appendix of described printed wire board plane, described printed substrate and described wiring board appendix are integral structure, described wiring board appendix is provided with the extraction electrode that is electrically connected with described conductive electrode, described microphone case is provided with the edge sealing of fixing described microphone printed substrate, also is provided with on the described microphone case for the outward extending opening of described wiring board appendix.
As optimized technical scheme, described sound electric signal transducer is the electret transducer.
As optimized technical scheme, described wiring board appendix is two, is symmetricly set on the both sides of described printed substrate respectively.
Owing to adopted technique scheme, improved microphone package, comprise microphone case, be installed in the sound electric signal transducer in the described microphone case, the analog signal conversion that described sound electric signal transducer is produced is the A/D converter of digital signal, form the microphone printed substrate of the enclosure space that the microphone electronic devices and components are installed with described microphone case, the outer surface of described microphone printed substrate is provided with the conductive electrode for microphone output digital signal, described printed substrate is provided with along the outward extending wiring board appendix of described printed wire board plane, described printed substrate and described wiring board appendix are integral structure, and described wiring board appendix is provided with the extraction electrode that is electrically connected with described conductive electrode; The setting of wiring board appendix, make the layout of a plurality of conductive electrodes become very easy, interelectrode distance is unrestricted, makes, installs simple, overcome former microphone fully because of the nearer short circuit that causes of conductive electrode anode-cathode distance, the technology of digital microphone is applied; The present invention simultaneously makes reflow soldering process become easy, feasible in the microphone process is installed.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention;
Fig. 2 is the electrode schematic diagram of embodiment of the invention PCB;
Fig. 3 is the schematic diagram of embodiment of the invention microphone case (not flange);
Fig. 4 is the structural representation of background technology PCB of the present invention;
Fig. 5 is the structural representation of background technology microphone of the present invention.
Embodiment
As Fig. 1, Fig. 2, shown in Figure 3, improved microphone package, comprise microphone case 1, be installed in the sound electric signal transducer in the described microphone case, form the microphone printed substrate 2 of the enclosure space that the microphone electronic devices and components are installed with described microphone case 1, the outer surface of described microphone printed substrate 2 is provided with the conductive electrode 31 for the microphone output signal, described printed substrate 2 is provided with along the outward extending wiring board appendix 21 in described printed substrate 2 planes, described printed substrate 2 is an integral structure with described wiring board appendix 21, described wiring board appendix 21 is provided with the extraction electrode 32 that is electrically connected with described conductive electrode 31, described microphone case 1 is directly inwardly sealed PCB by special-purpose edge banding apparatus and is gone up formation edge sealing 11, also be provided with on the described microphone case 1 for described wiring board appendix 21 outward extending openings 12,12 couples of PCB of described opening also play the effect of location.
Described sound electric signal transducer is the electret transducer, as the common engineers and technicians in present technique field, adopts for example silicon Mike of other forms of transducer, also is fine.
Described wiring board appendix 21 is two, is symmetricly set on the both sides of described printed substrate 2 respectively, and this structure circuit is provided with simply, installs easy to make, and comparatively firm on equipment after installing, shock resistance is stronger; Certainly, adopt 1 or 3,4 appendix 21 also can solve technical problem of the present invention, also within protection scope of the present invention.
As shown in Figure 5, common reflux-resisting welded microphone is taken turns roller-compaction to the edge sealing of metal shell with edge sealing, reaches the purpose of encapsulation.In improved microphone package, owing to adopted above special-shaped pcb board, so original with the rotation of edge sealing wheel roll edge sealing since be subjected to special-shaped PCB extention influence and can't edge sealing, lateral opening for this shell, opening part passes for the appendix 21 of PCB, and edge sealing also no longer adopts original edge sealing wheel rotation to roll, but direct press seal.
Claims (3)
1. improved microphone package, comprise microphone case (1), be installed in the sound electric signal transducer in the described microphone case, with described microphone case (1) the microphone printed substrate (2) of the enclosure space of microphone electronic devices and components form to be installed, the outer surface of described microphone printed substrate (2) is provided with the conductive electrode (31) for the microphone output signal, it is characterized in that: described printed substrate (2) is provided with along described printed substrate (2) the outward extending wiring board appendix in plane (21), described printed substrate (2) is an integral structure with described wiring board appendix (21), described wiring board appendix (21) is provided with the extraction electrode (32) that is electrically connected with described conductive electrode (31), described microphone case (1) is provided with the edge sealing (11) of fixing described microphone printed substrate (2), also is provided with on the described microphone case (1) for the outward extending opening of described wiring board appendix (21) (12).
2. improved microphone package as claimed in claim 1 is characterized in that: described sound electric signal transducer is the electret transducer.
3. improved microphone package as claimed in claim 1 is characterized in that: described wiring board appendix (21) is two, is symmetricly set on the both sides of described printed substrate (2) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710013668 CN101022684B (en) | 2007-03-07 | 2007-03-07 | Modified microphone packaged structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710013668 CN101022684B (en) | 2007-03-07 | 2007-03-07 | Modified microphone packaged structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101022684A CN101022684A (en) | 2007-08-22 |
| CN101022684B true CN101022684B (en) | 2011-06-22 |
Family
ID=38710301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710013668 Expired - Fee Related CN101022684B (en) | 2007-03-07 | 2007-03-07 | Modified microphone packaged structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101022684B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019125815A1 (en) * | 2019-09-25 | 2021-03-25 | USound GmbH | Sound transducer unit for generating and / or detecting sound waves in the audible wavelength range and / or in the ultrasonic range |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0942628A2 (en) * | 1998-03-13 | 1999-09-15 | Siemens Hearing Instruments, Inc. | Microphone assembly and calibration method |
| CN2388790Y (en) * | 1999-07-26 | 2000-07-19 | 程滋颐 | Electret anti-noise pick-up |
| CN2826881Y (en) * | 2005-09-16 | 2006-10-11 | 潍坊共达电讯有限公司 | Electret capacitor microphone |
| CN2872777Y (en) * | 2005-09-16 | 2007-02-21 | 潍坊共达电讯有限公司 | Printing circuit board of loundspeaker |
| CN201018662Y (en) * | 2007-03-07 | 2008-02-06 | 潍坊共达电讯有限公司 | Improved microphone packaging structure |
-
2007
- 2007-03-07 CN CN 200710013668 patent/CN101022684B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0942628A2 (en) * | 1998-03-13 | 1999-09-15 | Siemens Hearing Instruments, Inc. | Microphone assembly and calibration method |
| CN2388790Y (en) * | 1999-07-26 | 2000-07-19 | 程滋颐 | Electret anti-noise pick-up |
| CN2826881Y (en) * | 2005-09-16 | 2006-10-11 | 潍坊共达电讯有限公司 | Electret capacitor microphone |
| CN2872777Y (en) * | 2005-09-16 | 2007-02-21 | 潍坊共达电讯有限公司 | Printing circuit board of loundspeaker |
| CN201018662Y (en) * | 2007-03-07 | 2008-02-06 | 潍坊共达电讯有限公司 | Improved microphone packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101022684A (en) | 2007-08-22 |
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| C14 | Grant of patent or utility model | ||
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Address after: 261200 Weifang, Shandong Province Feng Shan Road, No. 68, Fangzi Patentee after: Gongda Electroacoustics Co., Ltd. Address before: 261200 No. 69, Longquan street, Fangzi District, Shandong, Weifang Patentee before: Shandong Gettop Acoustic Co.,Ltd. |
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| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110622 Termination date: 20200307 |
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| CF01 | Termination of patent right due to non-payment of annual fee |