CN215578601U - Paster type anti-UV high-temperature-resistant plastic support - Google Patents

Paster type anti-UV high-temperature-resistant plastic support Download PDF

Info

Publication number
CN215578601U
CN215578601U CN202121292220.8U CN202121292220U CN215578601U CN 215578601 U CN215578601 U CN 215578601U CN 202121292220 U CN202121292220 U CN 202121292220U CN 215578601 U CN215578601 U CN 215578601U
Authority
CN
China
Prior art keywords
base
cavity
heat dissipation
resistant
resistant plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202121292220.8U
Other languages
Chinese (zh)
Inventor
唐勇
林启程
曾剑峰
余海清
邱国梁
谭琪琪
刘辉煌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yonglin Electronics Co Ltd
Original Assignee
Yonglin Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yonglin Electronics Co Ltd filed Critical Yonglin Electronics Co Ltd
Priority to CN202121292220.8U priority Critical patent/CN215578601U/en
Application granted granted Critical
Publication of CN215578601U publication Critical patent/CN215578601U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Led Device Packages (AREA)

Abstract

The utility model discloses a patch type anti-UV high temperature resistant plastic support, which comprises: the chip welding device comprises a base, a bracket main body, a chip welding disc, a heat dissipation seat and a glass cover; the base is provided with a plurality of electrode lead angles, the bracket main body is provided with a first cavity and an identification unfilled corner, and the bracket main body and the base are glued through glue; the chip welding disc is arranged in the first cavity and is a welding disc consisting of UV-resistant plastic and copper-copper base, the heat dissipation seat is provided with a plurality of heat dissipation holes, and the heat dissipation frame is connected with the bracket main body in a gluing mode; the glass cover is arranged in the second cavity and is connected with the heat dissipation frame in a gluing mode.

Description

Paster type anti-UV high-temperature-resistant plastic support
Technical Field
The utility model relates to the technical field of chips, in particular to a patch type anti-UV high-temperature-resistant plastic support.
Background
The surface mount type LED has the advantages of long service life, small volume, high brightness, low heat and the like, and is widely applied to the field of illumination. The conventional surface mount type LED generally comprises a support fixedly provided with a metal electrode, a wafer and packaging glue, wherein a lamp groove is formed in a support main body. During production, a single LED patch needs to be cut, the LED patch is generally cut by a high-speed full-automatic cutting machine at present, and the use cost is greatly increased due to the high requirement of the process on the cutting machine; the existing product has a complex structure and a complex processing technology, a piece of support is a whole, the support can be divided into single products only by cutting, the cutting cost is high, the efficiency is low, and the products are easy to damage in the cutting process, so that the defects are caused.
Accordingly, there is a need for a patch-type UV resistant high temperature plastic stent that solves one or more of the problems set forth above.
SUMMERY OF THE UTILITY MODEL
In order to solve one or more problems in the prior art, the present invention provides a patch type UV resistant high temperature resistant plastic stent, including: the base is made of plastic insulation materials, a plurality of positive electrode pins and a plurality of negative electrode pins are arranged on one side of the upper portion of the base, the same positive electrode pins and the same negative electrode pins are arranged on the other side of the base, the positive electrode pins on one side are connected with the positive electrode pins on the other side, the negative electrode pins on one side are connected with the negative electrode pins on the other side
Figure BDA0003108660710000011
Figure BDA0003108660710000012
The middle part of the bracket main body is provided with a first cavity; the chip welding disc comprises a welding plate and a copper base, wherein the copper base is made of red copper, and a coating is arranged on the surface layer of the copper base; the welding disc is also provided with a barrier belt which separates the copper base into a plurality of areas and is used for preventing the overflow of soldering tin during welding; the middle part of the upper surface of the heat dissipation seat is provided with a second cavity and a third cavity communicated with the second cavity, the third cavity is bowl-shaped, the third cavity is provided with a reflective coating, and the third cavity is filled with transparent environment-friendly resin, so that light rays are gathered more, the brightness of the light rays is higher, and the irradiation distance is longer; the heat dissipation seat is provided with heat dissipation through holes which are mutually vertical; the glass cover is made of quartz, and has high temperature resistance, high strength and high light transmittance; the glass cover is arranged in the second cavity of the heat dissipation frame;
further, the bracket main body is connected with the base through pressure and adhesive;
further, the chip welding disc is arranged in the first cavity and fixedly connected with the support main body;
further, the bottom of the heat dissipation seat is connected with the bracket main body in a gluing mode;
furthermore, the glass cover is arranged in the second cavity and is connected with the heat dissipation seat in a gluing mode. The novel UV-resistant LED packaging support has the advantages that the novel UV-resistant LED packaging support is formed by connecting the base, the support main body, the chip welding disc, the heat dissipation seat, the glass cover and the like together and using the UV-resistant characteristic of the plastic material and the excellent heat-conducting property of the red copper heat dissipation seat to package an LED. The utility model has the advantages of UV resistance, high temperature resistance, simple structure, low production cost and convenient production and processing, thereby greatly improving the practical value of the utility model.
Drawings
FIG. 1 is an exploded view of a patch-type UV-resistant and high-temperature-resistant plastic stent of the present invention;
FIG. 2 is a perspective view of a patch-type UV-resistant and high-temperature-resistant plastic bracket according to the present invention;
FIG. 3 is a view of a portion of a patch-type UV-resistant and high-temperature-resistant plastic stent of the present invention;
FIG. 4 is a perspective view of a heat sink of the patch-type UV-resistant and high-temperature-resistant plastic bracket of the present invention;
FIG. 5 is a perspective view of a chip soldering pan of a patch-type UV-resistant high-temperature-resistant plastic bracket according to the present invention
FIG. 6 is a perspective view of a main body of the patch type UV-resistant and high temperature-resistant plastic stent of the present invention;
FIG. 7 is a perspective view of a base of a patch-type UV-resistant and high-temperature-resistant plastic bracket according to the present invention.
[ reference numerals ]
10. a base, 11. a right lead, 12. a left lead;
20. the bracket main body, 21. the first cavity and 22. the mark unfilled corner;
30. chip bonding pads, 31. bonding pads, 32. copper, 33. barrier tape;
40. a heat dissipation seat, 41. a second cavity, 42. a third cavity, 43. a first heat dissipation through hole and 42. a second heat dissipation through hole;
50. glass lid.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
As shown in fig. 1 to 7, the present invention discloses a patch type UV-resistant high temperature-resistant plastic stent, which comprises: a base 10: the base 10 is provided with a plurality of electrode pins;
specifically, the base 10 is made of a plastic insulating material, a plurality of pins are arranged on two sides of the base 10, the pin on the left side is an anode pin 12, the pin on the right side is a cathode pin 11, the pin on one side and the pin in the deviating direction are homopolar, and the homopolar pins are connected. The holder main body 20: the bracket main body 20 is made of UV-resistant plastic insulating material;
specifically, the bracket main body 20 is provided with a mark unfilled corner 22, the middle part of the bracket main body 20 is provided with a first cavity 21, and the bracket main body 20 is connected with the base 10 through pressure and adhesive in an adhesive manner.
Chip bonding pad 30: the chip bonding pad 30 is connected to the holder main body 20;
specifically, the chip bonding pad 30 includes a bonding pad 31 and a copper base 32, the copper base 32 is made of red copper, and a plating layer is arranged on the surface layer of the copper base 32; the bonding pads 30 are also provided with a barrier strip 33, the barrier strip 33 separating the copper base 32 into a plurality of regions.
The heat radiation seat 40: the heat dissipation base 40 is made of an anti-UV plastic insulating material.
Specifically, the middle part above the heat dissipation seat 40 is equipped with the second cavity 41 and with the communicating third cavity 42 of second cavity 41, the third cavity 42 is bowl form, the third cavity 42 is equipped with the reflection of light coating, the third cavity is supported the resin with transparent ring and is filled, makes light gather more to luminous luminance is higher, and the irradiation distance is farther, the heat dissipation seat 40 is equipped with heat dissipation through-hole 43, the heat dissipation seat 40 with the support main part 20 veneer is connected.
The glass cover 50 is made of quartz, and the glass cover 50 is disposed in the second cavity 41 of the heat sink 40 and is bonded to the heat sink 40.
Specifically, the glass cover 50 has the characteristics of high strength, high temperature resistance, high light transmittance and the like.
In conclusion, the novel UV-resistant LED packaging support is formed by connecting the base, the support main body, the chip welding disc, the heat dissipation seat, the glass cover and the like together and combining the UV-resistant characteristic of the plastic material and the excellent heat-conducting property of the red copper heat dissipation seat, so that LED packaging is carried out; the utility model has the advantages of UV resistance, high temperature resistance, simple structure, low production cost and convenient production and processing, thereby greatly improving the practical value of the utility model.
The above-described examples merely represent one or more embodiments of the present invention, which are described in greater detail and detail, but are not to be construed as limiting the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the spirit of the utility model, which falls within the scope of the utility model. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (6)

1. The utility model provides a resistant high temperature resistant plastic support of paster type anti UV which characterized in that, a resistant high temperature resistant plastic support of paster type UV includes: the heat dissipation device comprises a base, a bracket main body, a chip welding disc and a heat dissipation seat;
base: the base is provided with a plurality of electrode pins;
the support main part: the bracket main body is made of UV-resistant plastic insulating materials;
chip bonding pad: the chip welding disc is connected with the bracket main body;
a heat dissipation seat: the heat dissipation seat is made of UV-resistant plastic insulation materials.
2. The patch type plastic support with UV resistance and high temperature resistance as claimed in claim 1, wherein the base is made of plastic insulating material, and both sides of the base are provided with even number of positive pins and even number of negative pins.
3. The patch type UV-resistant high-temperature-resistant plastic bracket as claimed in claim 1, wherein the bracket body is provided with a mark unfilled corner, the middle part of the bracket body is provided with a first cavity, and the bracket body is connected with the base by adhesive.
4. The patch type UV-resistant high-temperature-resistant plastic support according to claim 1, wherein the chip soldering pad comprises a soldering board and a copper base, the soldering board is made of UV-resistant plastic insulating materials, the copper base is made of red copper, and a plating layer is arranged on the surface layer of the copper base; and a barrier belt is arranged on the copper base, the copper base is divided into a plurality of independent cells by the barrier belt, and the copper base is connected with the welding plate in a gluing mode.
5. The patch type UV-resistant high-temperature-resistant plastic support according to claim 1, wherein a second cavity and a third cavity communicated with the second cavity are arranged in the middle of the upper surface of the heat dissipation base, the third cavity is in a bowl shape with a large upper part and a small lower part, a reflective coating is arranged on the third cavity, and the third cavity is filled with transparent environment-friendly resin; the heat dissipation seat is provided with a plurality of heat dissipation through holes and is connected with the support main body in a gluing mode.
6. The patch type UV-resistant high-temperature-resistant plastic support according to claim 1, further comprising a glass cover, wherein the glass cover is made of quartz, and the glass cover is disposed in the second cavity of the heat sink and is bonded to the heat sink.
CN202121292220.8U 2021-06-09 2021-06-09 Paster type anti-UV high-temperature-resistant plastic support Active CN215578601U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121292220.8U CN215578601U (en) 2021-06-09 2021-06-09 Paster type anti-UV high-temperature-resistant plastic support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121292220.8U CN215578601U (en) 2021-06-09 2021-06-09 Paster type anti-UV high-temperature-resistant plastic support

Publications (1)

Publication Number Publication Date
CN215578601U true CN215578601U (en) 2022-01-18

Family

ID=79867515

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121292220.8U Active CN215578601U (en) 2021-06-09 2021-06-09 Paster type anti-UV high-temperature-resistant plastic support

Country Status (1)

Country Link
CN (1) CN215578601U (en)

Similar Documents

Publication Publication Date Title
TWI418063B (en) Led package and method for manufacturing the same
US20080258162A1 (en) Package for a high-power light emitting diode
US20090114937A1 (en) Resin-sealed light emitting device and its manufacturing method
CN213242589U (en) Ultraviolet LED device with adjustable light-emitting angle
CN203134860U (en) Packaging structure for small-medium power LED paster
CN100552992C (en) The technology of high power luminous element encapsulation
CN101132041A (en) Packaging structure for improving luminous efficiency of power LED
CN215578601U (en) Paster type anti-UV high-temperature-resistant plastic support
CN202282384U (en) LED high density integration packaging high reflection aluminum base circuit board
CN112133815A (en) LED support, lamp bead, conductive base, light-emitting unit module and device
CN207883721U (en) A kind of LED light bar with excellent heat dispersion performance
CN207602620U (en) A kind of stent for LED encapsulation
CN206480621U (en) A kind of LED chip inverted structure
CN201303008Y (en) Led packaging structure
CN212750923U (en) Novel middle-high power LED bracket with heat sink RGBW (red, green, blue, white) penta crystals
CN212907791U (en) LED support, LED lamp pearl, module and illuminator
CN211045476U (en) L ED lamp bead of die bond paster
CN210668366U (en) LED flexible lamp strip
CN209912892U (en) COB light source
CN210429803U (en) Flip-chip COB light source with reflector structure
CN209418556U (en) A kind of high reliability adopting surface mounted LED light source
CN110649006A (en) High power density COB device
CN218568871U (en) High light efficiency flip-chip COB packaging structure
CN210123753U (en) Light-emitting diode packaging structure capable of increasing thermal conductivity of silicon crystal substrate based on lamp
CN211789082U (en) Light-emitting component

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant