CN215529411U - Novel stabilize integrated circuit board - Google Patents
Novel stabilize integrated circuit board Download PDFInfo
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- CN215529411U CN215529411U CN202121774877.8U CN202121774877U CN215529411U CN 215529411 U CN215529411 U CN 215529411U CN 202121774877 U CN202121774877 U CN 202121774877U CN 215529411 U CN215529411 U CN 215529411U
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Abstract
The utility model discloses a novel stable integrated circuit board, which comprises a circuit board body, wherein the circuit board body comprises a substrate layer, the bottom of the substrate layer is bonded with a heat conduction layer through an adhesive, the bottom of the heat conduction layer is bonded with a heat dissipation layer through the adhesive, the top of the substrate layer is bonded with a reinforcing layer through the adhesive, the top of the reinforcing layer is bonded with an anti-static layer through the adhesive, the top of the anti-static layer is bonded with a waterproof layer through the adhesive, the reinforcing layer comprises a carbon fiber net layer, and the top of the carbon fiber net layer is bonded with an epoxy glass fiber cloth laminated plate layer through the adhesive. According to the utility model, through the matched use of the substrate layer, the heat conduction layer, the heat dissipation layer, the reinforcing layer, the carbon fiber net layer, the epoxy glass fiber cloth laminated plate layer, the antistatic layer and the waterproof layer, the circuit board body can have good heat dissipation performance, use strength, antistatic performance and waterproof performance, the circuit board body can have good stability, and the service life of the circuit board body is prolonged.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a novel stable integrated circuit board.
Background
The circuit board is named as a ceramic circuit board, an alumina ceramic circuit board, an aluminum nitride ceramic circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper plate, an impedance board, a PCB, an ultra-thin circuit board, a printed (copper etching technology) circuit board, and the like. The circuit board makes the circuit miniaturized, direct-viewing, plays important role to fixed circuit's batch production and optimization with electrical apparatus overall arrangement, but its stability of current circuit board is relatively poor, does not possess good service strength and heat dispersion to the stability of circuit board use has been reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a novel stable integrated circuit board which has the advantage of high stability, and solves the problems that the existing circuit board is poor in stability and does not have good use strength and heat dissipation performance, so that the use stability of the circuit board is reduced.
In order to achieve the purpose, the utility model provides the following technical scheme: a novel stable integrated circuit board comprises a circuit board body, wherein the circuit board body comprises a substrate layer, the bottom of the substrate layer is bonded with a heat conduction layer through an adhesive, the bottom of the heat conduction layer is bonded with a heat dissipation layer through the adhesive, the top of the substrate layer is bonded with a reinforcing layer through the adhesive, the top of the reinforcing layer is bonded with an anti-static layer through the adhesive, and the top of the anti-static layer is bonded with a waterproof layer through the adhesive;
the reinforcing layer comprises a carbon fiber net layer, and an epoxy glass fiber cloth laminated plate layer is bonded to the top of the carbon fiber net layer through an adhesive.
Preferably, the four corners of the surface of the circuit board body are provided with mounting holes, and the inner cavity of each mounting hole is provided with threads.
Preferably, the substrate layer is made of a flame-retardant copper foil-clad phenolic paper laminated board, and the heat conduction layer is made of a copper sheet.
Preferably, the heat dissipation layer is made of heat dissipation silica gel, and heat dissipation micropores are formed in the surface of the heat dissipation silica gel.
Preferably, the antistatic layer is made of an antistatic plate, and the waterproof layer is made of waterproof paint by spraying to form a film.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, through the matched use of the substrate layer, the heat conduction layer, the heat dissipation layer, the reinforcing layer, the carbon fiber net layer, the epoxy glass fiber cloth laminated plate layer, the antistatic layer and the waterproof layer, the circuit board body can have good heat dissipation performance, use strength, antistatic performance and waterproof performance, the circuit board body can have good stability, and the service life of the circuit board body is prolonged.
2. According to the utility model, the circuit board body can have good flame-retardant heat dissipation performance by adopting the base material layer made of the flame-retardant copper foil-coated phenolic paper laminated board, the circuit board body can have good heat conduction and dissipation performance by adopting the heat conduction layer made of the copper sheet, the circuit board body can have good heat dissipation performance by adopting the heat dissipation layer made of the heat dissipation silica gel, the circuit board body can have good use strength by adopting the reinforcing layer made of the carbon fiber net layer and the epoxy glass fiber cloth laminated board layer in a composite manner, the circuit board body can have good antistatic performance by adopting the antistatic layer made of the antistatic board, and the circuit board body can have good waterproof performance by spraying the waterproof layer made of the waterproof coating into a film.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the internal connection structure of the circuit board body;
FIG. 3 is a schematic view of the internal connection structure of the reinforcement layer of the present invention.
In the figure: 1. a circuit board body; 101. a substrate layer; 102. a heat conductive layer; 103. a heat dissipation layer; 104. a reinforcing layer; 1041. a carbon fiber mesh layer; 1042. an epoxy fiberglass cloth laminated ply; 105. an antistatic layer; 106. a waterproof layer; 2. and (7) installing holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The components of the present invention are all standard components or components known to those skilled in the art, and the structure and principle thereof can be known to those skilled in the art through technical manuals or through routine experimentation.
Referring to fig. 1-3, a novel stable integrated circuit board comprises a circuit board body 1, wherein four corners of the surface of the circuit board body 1 are provided with mounting holes 2, the inner cavity of the mounting holes 2 is provided with threads, the circuit board body 1 comprises a substrate layer 101, the substrate layer 101 is made of a flame-retardant copper-clad phenolic paper laminate, the heat conduction layer 102 is made of copper sheets, the bottom of the substrate layer 101 is bonded with the heat conduction layer 102 through an adhesive, the bottom of the heat conduction layer 102 is bonded with a heat dissipation layer 103 through an adhesive, the heat dissipation layer 103 is made of heat dissipation silica gel, the surface of the heat dissipation silica gel is provided with heat dissipation micropores, the top of the substrate layer 101 is bonded with a reinforcing layer 104 through an adhesive, the top of the reinforcing layer 104 is bonded with an antistatic layer 105 through an adhesive, the top of the antistatic layer 105 is bonded with a waterproof layer 106 through an adhesive, the antistatic layer 105 is made of an antistatic plate, and the waterproof layer 106 is made of waterproof paint by spraying and film-forming, the circuit board body 1 can have good flame-retardant heat dissipation performance by adopting the base material layer 101 made of the flame-retardant copper clad phenolic paper laminated board, the circuit board body 1 can have good heat conduction and dissipation performance by adopting the heat conduction layer 102 made of copper sheets, the circuit board body 1 can have good heat dissipation performance by adopting the heat dissipation layer 103 made of heat dissipation silica gel, the circuit board body 1 can have good heat dissipation performance by adopting the reinforcing layer 104 made of the carbon fiber mesh layer 1041 and the epoxy glass fiber cloth laminated board layer 1042 through compounding, the circuit board body 1 can have good use strength, the circuit board body 1 can have good antistatic performance by adopting the antistatic layer 105 made of an antistatic board, and the circuit board body 1 can have good waterproof performance by spraying the waterproof layer 106 made of a film through waterproof paint;
the reinforcing layer 104 comprises a carbon fiber mesh layer 1041, the top of the carbon fiber mesh layer 1041 is bonded with an epoxy glass fiber cloth laminated plate layer 1042 through an adhesive, and the circuit board body 1 can have good heat dissipation performance, use strength, antistatic performance and waterproof performance through the matched use of the substrate layer 101, the heat conduction layer 102, the heat dissipation layer 103, the reinforcing layer 104, the carbon fiber mesh layer 1041, the epoxy glass fiber cloth laminated plate layer 1042, the antistatic layer 105 and the waterproof layer 106, so that the circuit board body 1 can have good stability, and the service life of the circuit board body is prolonged.
When the anti-static circuit board is used, the circuit board body 1 can have good flame-retardant heat dissipation performance by the aid of the base material layer 101 made of the flame-retardant copper foil-coated phenolic paper laminated board, the circuit board body 1 can have good heat conduction and dissipation performance by the aid of the heat conduction layer 102 made of copper sheets, the circuit board body 1 can have good heat dissipation performance by the aid of the heat dissipation layer 103 made of heat dissipation silica gel, the circuit board body 1 can have good use strength by the aid of the reinforcing layer 104 made of the carbon fiber net layer 1041 and the epoxy glass fiber cloth laminated board layer 1042 in a composite mode, the circuit board body 1 can have good anti-static performance by the aid of the anti-static layer 105 made of the anti-static board, and the circuit board body 1 can have good waterproof performance by the aid of the waterproof layer 106 made of waterproof paint through spraying and film forming.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A novel stabilize integrated circuit board, includes circuit board body (1), its characterized in that: the circuit board body (1) comprises a substrate layer (101), the bottom of the substrate layer (101) is bonded with a heat conduction layer (102) through an adhesive, the bottom of the heat conduction layer (102) is bonded with a heat dissipation layer (103) through the adhesive, the top of the substrate layer (101) is bonded with a reinforcing layer (104) through the adhesive, the top of the reinforcing layer (104) is bonded with an antistatic layer (105) through the adhesive, and the top of the antistatic layer (105) is bonded with a waterproof layer (106) through the adhesive;
the reinforcing layer (104) comprises a carbon fiber net layer (1041), and an epoxy glass fiber cloth laminated plate layer (1042) is bonded to the top of the carbon fiber net layer (1041) through an adhesive.
2. A novel stabilized integrated circuit board according to claim 1, characterized in that: mounting holes (2) are formed in four corners of the surface of the circuit board body (1), and threads are arranged in inner cavities of the mounting holes (2).
3. A novel stabilized integrated circuit board according to claim 1, characterized in that: the base material layer (101) is made of a flame-retardant copper foil-coated phenolic paper laminated board, and the heat conduction layer (102) is made of a copper sheet.
4. A novel stabilized integrated circuit board according to claim 1, characterized in that: the heat dissipation layer (103) is made of heat dissipation silica gel, and heat dissipation micropores are formed in the surface of the heat dissipation silica gel.
5. A novel stabilized integrated circuit board according to claim 1, characterized in that: the anti-static layer (105) is made of an anti-static plate, and the waterproof layer (106) is made of waterproof paint through spraying and film forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121774877.8U CN215529411U (en) | 2021-08-02 | 2021-08-02 | Novel stabilize integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121774877.8U CN215529411U (en) | 2021-08-02 | 2021-08-02 | Novel stabilize integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215529411U true CN215529411U (en) | 2022-01-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121774877.8U Active CN215529411U (en) | 2021-08-02 | 2021-08-02 | Novel stabilize integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215529411U (en) |
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2021
- 2021-08-02 CN CN202121774877.8U patent/CN215529411U/en active Active
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