CN215527708U - Circuit substrate for double-sided plastic package electronic device - Google Patents
Circuit substrate for double-sided plastic package electronic device Download PDFInfo
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- CN215527708U CN215527708U CN202121459002.9U CN202121459002U CN215527708U CN 215527708 U CN215527708 U CN 215527708U CN 202121459002 U CN202121459002 U CN 202121459002U CN 215527708 U CN215527708 U CN 215527708U
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- circuit substrate
- strip
- glue injection
- plastic
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- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model relates to the technical field of electronic components, and discloses a circuit substrate which is used in a double-sided plastic package electronic device. Compared with the prior art, the strip-shaped glue injection through hole is formed in the circuit substrate, so that the plastic glue can flow in the vertical direction simultaneously during plastic package to form two plastic cover surfaces, the injection molding effect of molding 2 plastic cover surfaces at one time is achieved, the damage of electronic elements caused by multiple times of injection molding is reduced, the production efficiency is improved, the phenomena of glue overflow and unbalanced mold flow during vertical simultaneous injection molding are fundamentally solved, and the product quality is improved.
Description
Technical Field
The utility model relates to the technical field of electronic elements, in particular to a circuit substrate formed by double-sided plastic package in one step.
Background
In the electronic industry, especially SIP (system in package) package module power supplies and LED modules, in order to ensure the life and reliability of products, it is often necessary to cover components such as ICs, electronic components, resistors, etc. on the surface of a substrate with epoxy resin. Traditional packaging technology, under high pressure environment, use traditional mould (the design of moulding the front cover at every turn one) will be heated epoxy resin fully to cover on the product surface, but because the design of base plate and the particularity of product, the base plate does not have the trompil earlier stage, need mould the front cover through 2 times plastic envelope shaping 2, reduce production efficiency greatly, and cause the harm to the base plate at the plastic envelope in-process easily, lead to producing the property ability unstability, influence the outward appearance and the reliability of product, still can increase 2 extra processing costs simultaneously.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention provides a circuit substrate for a double-sided plastic package electronic device, which can improve the injection molding effect of the product, reduce the replacement cost of the mold, improve the production efficiency, and avoid the defects of the conventional package, i.e., avoid the deformation of the circuit board during the package.
In order to solve the technical problem, the utility model provides a circuit substrate for a double-sided plastic package electronic device, which is used in the double-sided plastic package electronic device, wherein the circuit substrate is provided with a plastic package area, and one side of the plastic package area is provided with a strip-shaped glue injection through hole for the circulation of a plastic glue solution.
Preferably, the number of the strip-shaped glue injection through holes is multiple, the strip-shaped glue injection through holes are arranged at intervals, and the length of each strip-shaped glue injection through hole is greater than the distance between every two adjacent strip-shaped glue injection through holes.
Preferably, the strip-shaped glue injection through holes are arranged at intervals along the length direction of the circuit substrate, and the strip-shaped glue injection through holes are on the same straight line.
Preferably, the number of the strip-shaped glue injection through holes is more than 4, and the strip-shaped glue injection through holes are the same in size.
Compared with the prior art, the utility model has the following beneficial effects:
(1) by arranging the strip-shaped glue injection through hole, the injection glue can flow to the upper die cavity and the lower die cavity simultaneously during injection molding, so that the glue overflow risk caused by the vertical difference of the flow direction of the glue during injection molding is prevented, the subsequent production cost is reduced, and the working efficiency is improved;
(2) the strip glue injection through holes are distributed on one side of the plastic package area at intervals, and the length of each strip glue injection through hole is larger than the distance between two adjacent strip glue injection through holes, so that the mold flow balance during injection molding is ensured, and the damage of an electronic original and the filling of the bottom of a part are not easily caused;
(3) because each strip injecting glue through-hole is on same straight line, each size of strip injecting glue through-hole is the same to can improve the gas pocket that produces in the process of moulding plastics effectively and overflow to glue, the pressure differential of mould intracavity about the balanced circuit substrate, promote the probability of circuit substrate two-sided plastic envelope one shot forming, eliminate the adverse effect that secondary packaging brought.
Drawings
FIG. 1 is a schematic view of a circuit substrate according to the present invention;
fig. 2 is a schematic structural view of the circuit substrate placed in a mold for plastic packaging.
Detailed Description
For a better understanding and practical application of the present design, the improved circuit substrate structure of the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
Referring to fig. 1 and 2, the present invention provides a circuit substrate 1 for use in a double-sided plastic package electronic device, the circuit substrate 1 is provided with a plastic package region 11, and one side of the plastic package region 11 is provided with a strip-shaped glue injection through hole 12 for flowing a plastic glue solution.
In this embodiment, the number of the strip-shaped glue injection through holes 12 is plural, the number of the strip-shaped glue injection through holes 12 is set according to the length of the circuit substrate 1, and is usually more than 4, and the size of each strip-shaped glue injection through hole 12 is the same.
Each strip injecting glue through-hole 12 is arranged along the length direction of the circuit substrate 1 at intervals, each strip injecting glue through-hole 12 is on the same straight line, and the length of each strip injecting glue through-hole 12 is greater than the distance between two adjacent strip injecting glue through-holes 12.
During injection molding, one part of plastic liquid flows to the upper mold cavity 21 of the mold 2, and the other part of plastic liquid flows to the lower mold cavity 22 of the mold 2 through the strip-shaped glue injection through holes 12, so that the circuit substrate 1 can realize synchronous plastic package of the upper surface and the lower surface.
According to the circuit substrate 1, the strip-shaped glue injection through holes 12 are formed, so that the injection glue solution flows to the upper mold cavity and the lower mold cavity simultaneously during injection molding, the risk of glue overflow caused by the vertical difference of the flow direction of the glue solution during injection molding is effectively prevented, the subsequent production cost is reduced, and the working efficiency is improved.
According to the circuit substrate 1, under the condition that injection molding is not influenced, the sizes of the strip-shaped glue injection through holes 12 need to be the same, and the positions of the strip-shaped glue injection through holes 12 need to be the same as those of the mold glue injection through holes, so that the flow direction of the plastic glue solution is controlled, and the pressures of the upper mold cavity surface and the lower mold cavity surface of the circuit substrate 1 are balanced.
The appearance of burrs and offset phenomena is controlled on the surface of the strip-shaped glue injection through hole 12, so that the deformation of the substrate and the overflow risk caused by the pattern of the glue injection through hole in the injection molding process are guaranteed.
In summary, the following steps: compared with the traditional substrate design, the circuit substrate 1 disclosed by the utility model is completely different from the traditional substrate design, and the size and the number of the strip-shaped glue injection through holes 12 are adjusted, so that the smoothness of the circuit substrate 1 is ensured, and the problem of deformation of the circuit substrate 1 caused by two times of plastic package in the plastic package process is avoided.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be construed as the protection scope of the present invention.
Claims (4)
1. A circuit substrate for double-sided plastic package electronic device is characterized in that: the circuit substrate is provided with a plastic packaging area, and one side of the plastic packaging area is provided with a strip-shaped glue injection through hole for circulation of plastic cement.
2. The circuit substrate for use in a double sided plastic encapsulated electronic device as recited in claim 1, wherein: the number of the strip glue injection through holes is multiple, the strip glue injection through holes are arranged at intervals, and the length of each strip glue injection through hole is larger than the distance between every two adjacent strip glue injection through holes.
3. The circuit substrate for use in a double sided plastic encapsulated electronic device as recited in claim 2, wherein: the strip-shaped glue injection through holes are arranged at intervals along the length direction of the circuit substrate and are on the same straight line.
4. The circuit substrate for use in a double sided plastic encapsulated electronic device as recited in claim 2, wherein: the number of the strip-shaped glue injection through holes is more than 4, and the size of each strip-shaped glue injection through hole is the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121459002.9U CN215527708U (en) | 2021-06-29 | 2021-06-29 | Circuit substrate for double-sided plastic package electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121459002.9U CN215527708U (en) | 2021-06-29 | 2021-06-29 | Circuit substrate for double-sided plastic package electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215527708U true CN215527708U (en) | 2022-01-14 |
Family
ID=79811037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121459002.9U Active CN215527708U (en) | 2021-06-29 | 2021-06-29 | Circuit substrate for double-sided plastic package electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215527708U (en) |
-
2021
- 2021-06-29 CN CN202121459002.9U patent/CN215527708U/en active Active
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