CN205767101U - The encapsulating mould of power module - Google Patents
The encapsulating mould of power module Download PDFInfo
- Publication number
- CN205767101U CN205767101U CN201620454525.7U CN201620454525U CN205767101U CN 205767101 U CN205767101 U CN 205767101U CN 201620454525 U CN201620454525 U CN 201620454525U CN 205767101 U CN205767101 U CN 205767101U
- Authority
- CN
- China
- Prior art keywords
- power module
- lower bolster
- lead frame
- pin
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
nullA kind of encapsulating mould of power module，Including top mold frame、Upper ejection system、Upper insert assembly、Lead frame、Lower mold holder、Lower ejection system、Lower insert assembly and running gate system，The through hole that the wiring board that lead frame is provided with in hole, some location and power module is put into，The lead frame at through hole edge is provided with some pins，Each Pin locations and each pin pad one_to_one corresponding on wiring board，The storage chamber put into for lead frame it is provided with between cope match-plate pattern in upper insert assembly and the lower bolster in lower insert assembly，Some bar-shaped troughs put into for pin are offered on lower bolster end face，Upper groove and low groove is had respectively on cope match-plate pattern bottom surface and lower bolster end face，Upper groove inner chamber enclosed with low groove is identical with the shell dimension of power module，Connection low groove and the runner of barrel in running gate system is had on lower bolster end face，Equipped with some locating pins that can be inserted in hole, location on lower bolster.This utility model production efficiency is high, it is possible to the quality of production of power module is effectively ensured.
Description
Technical field:
This utility model relates to the manufacture manufacture field of power module, is especially a kind of for sealing power module semi-finished product
The mould of dress.
Background technology:
Power module be a kind of can be directly against dress power supply unit on a printed circuit, it has buffer action, anti-interference
Ability is strong, carries defencive function, it is simple to integrated, be used for mobile communication, microwave communication, optical transport, router, automobile,
The fields such as Aero-Space.Normal power supplies module generally comprises wiring board and installs some electronic components in the circuit board and coil,
For protection circuit plate, electronic component and coil, outside it, all can encapsulate a housing, only expose electrically connect with wiring board defeated
Entering and output pin, wiring board, electronic component and coil are all rolled in inside by the housing after encapsulation, serve protective effect.
At present, prior art, when packaging power module semi-finished product, is the most all to be packaged one by one or same by a limited number of
Time be packaged, early stage, by manual pendulum material, will connect the power supply having electronic component, coil, input pin and output pin
Module semi-finished product are manual to be well placed one by one, and the later stage is packaged housing to it, packing forms many employings glue pouring machine encapsulating or simply note
Packaged by plastic form, by manually taking out finished product one by one after encapsulation, is finally completed the manufacture of power module, it can be seen that, this encapsulation
Mode production capacity is the lowest, and when manual pendulum material, it is easy to power module semi-finished product are given pendulum partially, will when causing mould matched moulds
Electronic component damages by pressure or causes pin severe bends to deform, and quality is very difficult to control.Along with power module every year with more than two
The growth of numeral, above-mentioned packing forms has been difficult to meet the market demand again, has been on the verge of to eliminate edge.
Utility model content:
It is high that the technical problems to be solved in the utility model is to provide a kind of production efficiency, it is possible to the power supply of the quality of production is effectively ensured
The encapsulating mould of module.
Technical solution of the present utility model is to provide the encapsulating mould of a kind of power module with following structure, including on
Mould bases, upper ejection system, upper insert assembly, lower mold holder, lower ejection system, lower insert assembly and running gate system, wherein,
Also include lead frame, lead frame offers the through hole that the wiring board in hole, some location and power module is put into, logical
The lead frame at edge, hole is provided with some pins, each Pin locations and each pin pad one_to_one corresponding on wiring board, upper edge
The storage chamber put into for lead frame, lower bolster end face it is provided with between cope match-plate pattern in embedding assembly and the lower bolster in lower insert assembly
On offer some bar-shaped troughs put into for pin, cope match-plate pattern bottom surface and lower bolster end face offer some and wiring board phase respectively
Corresponding upper groove and low groove, upper groove inner chamber enclosed with low groove is identical with the shell dimension of power module, lower bolster end face
On offer the runner of barrel in connection low groove and running gate system, equipped with some locating pins that can be inserted in hole, location on lower bolster.
The encapsulating mould of power module described in the utility model, wherein, the width of bar-shaped trough and the degree of depth are slightly less than pin respectively
Width and thickness.
The encapsulating mould of power module described in the utility model, wherein, cope match-plate pattern bottom surface is provided with a circle around storage chamber close
Seal, cope match-plate pattern offers the bleed-off passage communicated with storage chamber, and bleed-off passage one end communicates for being connected with vacuum pump.
The encapsulating mould of power module described in the utility model, wherein, lower bolster is provided with some retaining screws, and retaining screw abuts in
The periphery of lead frame.
The encapsulating mould of power module described in the utility model, wherein, the cast gate between low groove and runner is arranged on power supply mould
At the eccentric position of block semi-finished product, cast gate right opposite should be without electronic component and coil.
The encapsulating mould of power module described in the utility model, wherein, sealing ring top is arranged on cope match-plate pattern bottom surface setting
In annular groove, annular groove medial surface is formed slopely barb inwards.
After using above structure, compared with prior art, the encapsulating mould of this utility model power module has the advantage that
Before encapsulation, connection can be had the wiring board of some electronic components and coil to be placed into offer on lead frame logical by direct labor in advance
In hole, and being welded on pin pad by the pin of through hole edge, so, power module semi-finished product are just put up with lead frame
Being an entirety, more than the number of openings on lead frame, the corresponding power module semi-finished product quantity installed is the most more；Envelope
During dress, connection is had the lead frame of some power module semi-finished product to be put on lower bolster by direct labor, locating pin position,
Matched moulds encapsulation subsequently, after molding and solidification, power module finished product is taken out in die sinking.Thus being not difficult to find out, this utility model often closes
Mould and die sinking the most just can encapsulate out some power module finished products simultaneously, and therefore, production efficiency is the highest, additionally, due to this reality
With novel, semi-finished product cell source module is welded on lead frame by pin in advance, becomes on an entirety, pin and wiring board
Pin pad one_to_one corresponding, be difficult to that bias phenomenon occurs, and when direct labor is placed on lower bolster, have again
Locating pin positions, and therefore, this utility model can effectively ensure that the quality of production of power module.
The width of bar-shaped trough and the degree of depth are slightly less than width and the thickness of pin respectively, have an advantage in that: when this utility model matched moulds,
Whole bar-shaped trough can by the slight squeeze of bolster, thus all be filled full by the pin being positioned at bar-shaped trough, and then effectively keeps away
Exempt from when encapsulating housing, in part sizing material enters into bar-shaped trough, cause pin surface to adhere to sizing material.
After external vacuum pump is connected on bleed-off passage, the air in storage chamber, upper groove and low groove can be extracted out so that it is
Forming vacuum state, this is when encapsulating housing, it is simple to fill punching in sizing material upwards groove and low groove, under suction function, it is to avoid
Housing filling is discontented and produces the phenomenons such as bubble, thus is further ensured that the quality of production of power module.
Some retaining screws abut in lead frame periphery can form a placing range, when current lead frame is taken away by direct labor
After, it is simple to the placement of next lead frame.
Cast gate between low groove and runner is arranged at the eccentric position of power module semi-finished product, and advantage is: during encapsulating housing,
Sizing material can be reduced to electronic component and the impact of coil, it is to avoid it deforms, thus is further ensured that the quality of power module.
Annular groove medial surface is formed slopely barb inwards and can be prevented effectively from sealing ring and deviate from annular groove.
Accompanying drawing illustrates:
Fig. 1 be the encapsulating mould of this utility model power module under the drive of press table, die sinking ejects power module and lead-in wire
Sectional structure schematic diagram during framework；
Fig. 2 be this utility model power module encapsulating mould in cope match-plate pattern look up structure for amplifying schematic diagram；
Fig. 3 be this utility model power module encapsulating mould in cope match-plate pattern master when not installing sealing ring regard structure for amplifying and illustrate
Figure；
Fig. 4 be this utility model power module encapsulating mould in upper ejection system and lower ejection system eject simultaneously lead frame and
Structure for amplifying schematic diagram during power module；
Fig. 5 be this utility model power module encapsulating mould in the vertical view structure for amplifying schematic diagram of lead frame.
Detailed description of the invention:
With detailed description of the invention, the encapsulating mould of this utility model power module is described in further detail below in conjunction with the accompanying drawings:
As shown in Figure 1, Figure 4 and Figure 5, in this embodiment, the encapsulating mould of this utility model power module includes
Top mold frame 1, upper ejection system 3, upper insert assembly 2, lead frame 5, lower mold holder 7, lower ejection system 8, lower insert assembly
6 and running gate system 9, lead frame 5 offers the wiring board 43 in hole, some location 50 and some power module 4
The through hole 51 put into, the lead frame 5 at each through hole 51 edge is equipped with some pins 41, the position of each pin 41 and circuit
Each pin pad one_to_one corresponding on plate 43, the cope match-plate pattern 20 in upper insert assembly 2 and the lower bolster in lower insert assembly 6
It is provided with the storage chamber put into for lead frame 5 between 60, lower bolster 60 end face offers some bar shapeds put into for pin 41
Groove 603, the width of bar-shaped trough 603 is slightly less than the width of pin 41, and the degree of depth of bar-shaped trough 603 is slightly less than the thickness of pin 41,
Cope match-plate pattern 20 bottom surface with offer some upper grooves 201 corresponding with wiring board 43 and low groove on lower bolster 60 end face respectively
604, upper groove 201 inner chamber enclosed with low groove 604 is equivalently-sized with the housing 40 of power module 4, on lower bolster 60 end face
Offering connection low groove 604 and the runner of barrel 91 in running gate system 9, the cast gate between low groove 604 and runner is arranged on
At the eccentric position of power module semi-finished product 42, cast gate right opposite should be without electronic component and coil, equipped with some on lower bolster 60
Can be inserted into the locating pin 602 in hole 50, location, lower bolster 60 is also equipped with some retaining screws 601, retaining screw 601 abuts in lead-in wire
The periphery of framework 5.
As shown in Figures 2 and 3, cope match-plate pattern 20 bottom surface is provided with a circle sealing ring 202 around storage chamber, on sealing ring 202
Portion is arranged on cope match-plate pattern 20 bottom surface in the annular groove 204 arranged, and annular groove 204 medial surface is formed slopely barb inwards
205, cope match-plate pattern 20 offers the bleed-off passage 203 communicated with storage chamber, bleed-off passage 203 one end is for (scheming with vacuum pump
Not shown in) connect communicate.
After this utility model matched moulds, storage chamber, upper groove 201 and low groove 604 can be sealed up by sealing ring 202,
This is when it is bled by external vacuum pump, it is easy to be formed for vacuum state, injects sizing material in running gate system 9 and (typically adopts
With thermosetting plastics) when carrying out encapsulating housing 40, melted thermosetting plastics upwards can fill punching in groove 201 and low groove 604,
Thus under suction function, it is to avoid housing 40 filling after encapsulation is discontented and produces the phenomenons such as bubble, thus is further ensured that electricity
The quality of production of source module 4.
Before manufacturing power module 4, first some electronic components and coil are connected on some wiring boards 43, are formed some
Power module semi-finished product 42, then set out some through holes 51 put into for wiring board 43 on lead frame 5, and each logical
Some pins 41 integral with lead frame 5 are set on the lead frame 5 at edge, hole 51, it is ensured that the position of each pin 41
Power module semi-finished product 42 are finally put in through hole 51 by each pin weld locations one_to_one corresponding with on wiring board 43, and
Weld on each pin pad of each pin 41 to wiring board 43 successively, more than through hole 51 quantity on lead frame 5, accordingly
The quantity of the power module semi-finished product 42 installed is the most more.Next encapsulation flow process is entered, by this utility model top mold frame
1 and lower mold holder 7 be respectively installed on press upper table surface 100 and following table 200, die sinking also clears up mould, it is ensured that die face is clean,
Connection is had the lead frame 5 of some power module semi-finished product 42 to be put on lower bolster 60 (here can also by direct labor subsequently
The mechanical hand in package system is used automatically to place), locating pin 602 carry out being directed into position, in barrel 91, put into heat
Solidity plastics, subsequently matched moulds, vacuum pump starts to extract the air in storage chamber, upper groove 201 and low groove 604 out so that it is shape
Become vacuum state, running gate system 9 action, the melting heat solidity plastic warp cast gate in barrel 91 is injected into upper groove 201 and under
In groove 604, die sinking after forming and hardening, upper ejection system 3 and lower ejection system 8 are simultaneously by lead frame 5 and power module
4 eject, and by the artificial or mechanical hand feeding of package system, remove runner defective material by the unit that removes photoresist in package system subsequently,
Carry out rib cutting molding of bending through Rib-cutting die again, finally give independent power module finished product, continue to repeat said process and complete
The encapsulation work of the power module semi-finished product 42 pressed down.Owing to the every matched moulds of this utility model and die sinking the most all can encapsulate out simultaneously
Some power modules 4, therefore, production efficiency is the highest.
Embodiment described above is only to be described preferred implementation of the present utility model, not to of the present utility model
Scope is defined, and on the premise of without departing from this utility model design spirit, those of ordinary skill in the art are to this utility model
The various deformation made of technical scheme and improvement, all should fall in the protection domain that this utility model claims determine.
Claims (6)
1. an encapsulating mould for power module, including top mold frame (1), upper ejection system (3), upper insert assembly (2), under
Mould bases (7), lower ejection system (8), lower insert assembly (6) and running gate system (9), it is characterised in that: also include lead-in wire
Framework (5), described lead frame (5) offers the wiring board (43) in hole, some location (50) and power module
The through hole (51) put into, the lead frame (5) at through hole (51) edge is provided with some pins (41), each pin (41) position
Put with wiring board (43) on each pin pad one_to_one corresponding, the cope match-plate pattern (20) in described upper insert assembly (2) with under
Being provided with the storage chamber put into for lead frame (5) between lower bolster (60) in insert assembly (6), lower bolster (60) pushes up
Some bar-shaped troughs (603) put into for pin (41), cope match-plate pattern (20) bottom surface and lower bolster (60) end face is offered on face
Upper offer some upper grooves (201) corresponding with wiring board (43) and low groove (604), upper groove (201) respectively
Equivalently-sized with the housing of power module (40) with low groove (604) enclosed inner chamber, the company of offering on lower bolster (60) end face
Catharsis groove (604) and the runner of barrel (91) in running gate system (9), lower bolster (60) is determined equipped with some can be inserted into
Locating pin (602) in hole, position (50).
The encapsulating mould of power module the most according to claim 1, it is characterised in that: the width of described bar-shaped trough (603)
Degree and the degree of depth are slightly less than width and the thickness of pin (41) respectively.
The encapsulating mould of power module the most according to claim 2, it is characterised in that: on described cope match-plate pattern (20) bottom surface
Being provided with a circle sealing ring (202) around storage chamber, described cope match-plate pattern offers, on (20), the bleed-off passage communicated with storage chamber
(203), bleed-off passage (203) one end communicates for being connected with vacuum pump.
The encapsulating mould of power module the most according to claim 3, it is characterised in that: described lower bolster (60) is upper to be installed
Some retaining screws (601), described retaining screw (601) is had to abut in the periphery of lead frame (5).
The encapsulating mould of power module the most according to claim 4, it is characterised in that: low groove (604) and runner it
Between cast gate be arranged at the eccentric position of power module semi-finished product, cast gate right opposite should be without electronic component and coil.
The encapsulating mould of power module the most according to claim 5, it is characterised in that: described sealing ring (202) top
Being arranged on cope match-plate pattern (20) bottom surface in the annular groove (204) arranged, described annular groove (204) medial surface inclines inwards
Oblique one-tenth barb (205).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620454525.7U CN205767101U (en) | 2016-05-17 | 2016-05-17 | The encapsulating mould of power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620454525.7U CN205767101U (en) | 2016-05-17 | 2016-05-17 | The encapsulating mould of power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205767101U true CN205767101U (en) | 2016-12-07 |
Family
ID=58118640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620454525.7U Expired - Fee Related CN205767101U (en) | 2016-05-17 | 2016-05-17 | The encapsulating mould of power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205767101U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108480809A (en) * | 2018-03-02 | 2018-09-04 | 河北中瓷电子科技有限公司 | A kind of package casing soldering mold and method for welding |
| CN109228127A (en) * | 2018-10-24 | 2019-01-18 | 安徽大华半导体科技有限公司 | Substrate class wrapper mold |
-
2016
- 2016-05-17 CN CN201620454525.7U patent/CN205767101U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108480809A (en) * | 2018-03-02 | 2018-09-04 | 河北中瓷电子科技有限公司 | A kind of package casing soldering mold and method for welding |
| CN109228127A (en) * | 2018-10-24 | 2019-01-18 | 安徽大华半导体科技有限公司 | Substrate class wrapper mold |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10573537B2 (en) | Integrated circuit package mold assembly | |
| CN102203927B (en) | Method for device plastic packaging and packaging structure | |
| CN203674200U (en) | ESOP8L leading wire framework capable of preventing material overflowing of exposed radiation fin | |
| CN205767101U (en) | The encapsulating mould of power module | |
| KR20010087175A (en) | Electronic component, method of sealing electronic component with resin, and apparatus therefor | |
| CN107379397B (en) | Forming process of antenna partition strip and electronic equipment | |
| CN108878299A (en) | The preparation method of frame clsss integrated circuit Plastic Package is carried out by laser | |
| JP2006269786A (en) | Resin sealing metal mold, and resin sealing metal apparatus and resin sealing method using it | |
| CN203134786U (en) | Lead frame bar for semiconductor packaging and mold therefor | |
| CN208164166U (en) | A kind of mechanism for QFN encapsulation | |
| CN107399041B (en) | A kind of LED packaging technology of riveted sealing | |
| CN202846820U (en) | Thin-plate product in package (PIP) sealing and cutting device | |
| CN207800552U (en) | A kind of integrated circuit packaging mould that modularization is replaceable | |
| CN205069596U (en) | Seal lead frame mould in advance | |
| CN102157398B (en) | Resin seal device for metal die | |
| WO2009005257A2 (en) | Method for manufacturing led package | |
| CN205969759U (en) | Mould injection mold in mould | |
| CN103985693A (en) | Packaging structure of brushless direct-current motor integrated drive circuit and packaging method thereof | |
| CN109545759A (en) | A kind of power module architectures and its manufacturing method | |
| CN105161479B (en) | Lead frame item and the method for packaging semiconductor for using the lead frame item | |
| CN204333019U (en) | A kind of simple and easy sealed in unit with vacuum plant | |
| JPH09219412A (en) | Device for encapsulating electronic component with resin and manufacture | |
| KR102071561B1 (en) | Molding apparatus for semiconductor package | |
| CN106783636A (en) | The preparation method of integrated circuit Plastic Package | |
| CN217822851U (en) | Laminating formula LED-MODING packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161207 Termination date: 20190517 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |