CN215345646U - Spliced radiating fin structure capable of improving heat conduction efficiency - Google Patents
Spliced radiating fin structure capable of improving heat conduction efficiency Download PDFInfo
- Publication number
- CN215345646U CN215345646U CN202121590361.8U CN202121590361U CN215345646U CN 215345646 U CN215345646 U CN 215345646U CN 202121590361 U CN202121590361 U CN 202121590361U CN 215345646 U CN215345646 U CN 215345646U
- Authority
- CN
- China
- Prior art keywords
- heat sink
- heat dissipation
- heat
- spliced
- structure capable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 44
- 230000003014 reinforcing effect Effects 0.000 claims description 14
- 238000009434 installation Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本实用新型公开了散热片技术领域的能够提高导热效率的拼接式散热片结构,包括散热片底座,散热片底座的四角均开设有预留安装孔,散热片底座的顶部等距离开设有多个卡槽,卡槽内部设有相适配的卡块,卡块的顶部一体设有散热片本体,散热片本体的顶部开设有散热槽,散热片本体的前后两端面均开设有与散热槽相通的散热孔,散热片本体的前后两端面均设有散热柱,本实用新型通过倒T型卡槽和倒T型卡块的配合设置方便散热片本体的安装和拆卸,通过预留安装孔方便散热片底座的拆装,从而方便实际拆装使用,便于运输。
The utility model discloses a spliced heat sink structure capable of improving heat conduction efficiency in the technical field of heat sinks, comprising a heat sink base, four corners of the heat sink base are provided with reserved mounting holes, and the top of the heat sink base is provided with a plurality of equidistant distances. The card slot, the inside of the card slot is provided with a matching card block, the top of the card block is integrally provided with a heat sink body, the top of the heat sink body is provided with a heat sink slot, and the front and rear ends of the heat sink body are provided with a heat sink that communicates with the heat sink. The heat dissipation holes are provided on the front and rear end surfaces of the heat sink body. The utility model facilitates the installation and disassembly of the heat sink body through the cooperation of the inverted T-shaped slot and the inverted T-shaped block, and the reserved mounting holes are convenient The disassembly and assembly of the heat sink base, so as to facilitate the actual disassembly and assembly, and facilitate transportation.
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121590361.8U CN215345646U (en) | 2021-07-14 | 2021-07-14 | Spliced radiating fin structure capable of improving heat conduction efficiency |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121590361.8U CN215345646U (en) | 2021-07-14 | 2021-07-14 | Spliced radiating fin structure capable of improving heat conduction efficiency |
Publications (1)
Publication Number | Publication Date |
---|---|
CN215345646U true CN215345646U (en) | 2021-12-28 |
Family
ID=79566364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202121590361.8U Active CN215345646U (en) | 2021-07-14 | 2021-07-14 | Spliced radiating fin structure capable of improving heat conduction efficiency |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN215345646U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116510942A (en) * | 2023-04-28 | 2023-08-01 | 东莞市万亨达热传科技有限公司 | Radiator processing carrier and radiator processing method |
-
2021
- 2021-07-14 CN CN202121590361.8U patent/CN215345646U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116510942A (en) * | 2023-04-28 | 2023-08-01 | 东莞市万亨达热传科技有限公司 | Radiator processing carrier and radiator processing method |
CN116510942B (en) * | 2023-04-28 | 2024-01-19 | 东莞市万亨达热传科技有限公司 | Radiator processing carrier and radiator processing method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN215345646U (en) | Spliced radiating fin structure capable of improving heat conduction efficiency | |
US20240085769A1 (en) | Projector with thermal superconducting material for heat dissipation | |
CN201336012Y (en) | Combined type heat-radiating shell and embedded computer | |
CN203706120U (en) | Efficient CPU radiator | |
CN217238762U (en) | Double-fan strong pressure type CPU radiator | |
CN115576402A (en) | Air-cooled liquid-cooled coupling heat radiation structure of board card chip | |
CN214206200U (en) | Novel heat dissipation device | |
CN210241752U (en) | Splicable radiating fin structure | |
CN211601662U (en) | Thin corrugated plate type heat exchanger | |
CN112437590A (en) | Novel heat dissipation device | |
CN111556693A (en) | Radiator and installation composition structure thereof | |
CN220208203U (en) | Vertical rolling heat radiation module | |
CN221098544U (en) | Water-cooling UV lamp group | |
CN217955966U (en) | Lithium battery protection board convenient to heat dissipation | |
CN220871543U (en) | Plate heat exchanger with multidirectional heat exchange mechanism | |
CN222940362U (en) | Heat dissipation device and optical device of erbium-doped optical fiber amplifier | |
CN215582489U (en) | Aluminum sheet structure with good heat dispersion | |
CN220669581U (en) | Porous plate radiator | |
CN215068117U (en) | Integrated cooling system of server | |
CN221057243U (en) | Radiator for projector internal transformer | |
CN212962975U (en) | Heat radiator for conducting strip | |
CN217383940U (en) | Radiator with high thermal conductivity | |
CN216205478U (en) | High-efficient compound die-casting aluminium radiator | |
CN214746424U (en) | Heat radiation structure for heating and ventilation air conditioner | |
CN214502170U (en) | Plate radiator of high-efficient heat conduction |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20250305 Address after: 300000 meters west of the entrance of Xiaobeijiangu Village, Dabeijiangu Town, Ninghe District, Tianjin City Patentee after: Tianjin Ninghe District Hengding Metal Products Co.,Ltd. Country or region after: China Address before: 215000 group 5, hydropower station village, Xinmao Town, Taicang City, Suzhou City, Jiangsu Province Patentee before: Suzhou Kairuisi Precision Machinery Technology Co.,Ltd. Country or region before: China |